Component automatic chip mounter and processing technology thereof
By designing an automatic component patch machine, using multiple negative pressure suction nozzles to simultaneously adsorb and quickly install components, the processing time extension caused by sequential patches in the prior art is solved, and efficient component installation is achieved.
CN119730229APending Publication Date: 2025-03-28苏州弘瀚光电有限公司
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Patent Information
- Application Number
- CN202411907293.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
Existing chipsets patch components on the circuit board in turn, resulting in extended processing time and inefficient efficiency.
Method used
An automatic component patch machine is designed, using multiple negative pressure suction nozzles to absorb components at the same time, and the driving components and cylinder system are used to realize the rapid movement and installation of the negative pressure suction nozzle, so as to realize the simultaneous installation of components.
Benefits of technology
By installing multiple components simultaneously, the patch time is significantly shortened and the processing efficiency and installation quality of the circuit board are improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of chip mounters, in particular to a component automatic chip mounter and a processing technology thereof.The component automatic chip mounter comprises a machine case, a conveying assembly is arranged on the machine case, a feeding assembly is arranged on the machine case, a material taking base is arranged in the machine case and located above a circuit board in a sliding mode, and a driving assembly for driving the material taking base to slide is arranged on the machine case; a plurality of material taking plates are arranged on the material taking base in the horizontal direction, negative pressure suction nozzles are vertically arranged on the material taking plates in a sliding mode, the negative pressure suction nozzles are communicated with hoses, the ends, opposite to the negative pressure suction nozzles, of the hoses are communicated with a negative pressure machine, the negative pressure machine is electrically connected to a control system, and sliding pieces for driving the negative pressure suction nozzles to slide are arranged on the material taking plates. A recognition lens electrically connected to the control system is arranged on the material taking base in a sliding mode, the recognition lens is used for recognizing components adsorbed on the negative pressure suction nozzle, and a recognition piece for driving the recognition lens to slide is arranged on the material taking base. The circuit board has the effect of improving the installation efficiency of the components on the circuit board.
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