Preparation method of 248nm photoresist resin containing tertiary amine
By introducing tertiary amine group monomers in the photoresist resin synthesis process, a 248nm photoresist resin containing tertiary amine is formed, the problems of high metal impurities content and photoacid diffusion in the photoresist are solved, and the etching accuracy and the stability of the resin are improved.
Patent Information
- Application Number
- CN202411969346.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-04-04
AI Technical Summary
The existing photoresist has a high content of metal impurities, and the photo-produced acid diffuses after light decomposition, resulting in a decrease in etching accuracy, making it difficult to meet the requirements of high-precision integrated circuits.
During the resin synthesis process, the tertiary amine group monomer is introduced as a styrene derivative, and a synthetic resin solution is obtained through free radical polymerization, and multiple steps of impurity removal and solvent replacement are carried out to form a 248nm photoresist resin containing tertiary amine.
The diffusion of photoacids is inhibited, the performance of the photoresist is improved, the etching accuracy is improved, and the tertiary amine groups are synthesized on the resin and will not evaporate, maintaining the basic structure and performance of the resin.