Multilayer circuit structure and preparation method thereof

By adopting the design of a rough surface flexible conductive layer and a flexible insulating layer in the multilayer circuit structure, combined with vacuum bonding technology, the problems of low manufacturing yield and high manufacturing cost of multilayer circuit structures in the prior art are solved, and higher mechanical stability and lower manufacturing cost are achieved.

CN119767517AActive Publication Date: 2025-04-04GUANGDONG ZECHENG TECHNOLOGY CO., LTD +1
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Patent Information

Application Number
CN202510173904.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2025-04-04
Estimated Expiration
2045-02-18

AI Technical Summary

Technical Problem

In the prior art, when manufacturing multi-layer circuit structures, the yield rate is low and the manufacturing cost is high, especially the lack of flexibility of PP materials and the high cost of ABF materials have become bottlenecks.

Method used

A multi-layer circuit structure design is adopted, including a substrate, an integrated circuit, a flexible insulating layer and a flexible conductive layer. One side of the flexible conductive layer has a rough surface in contact with the flexible insulating layer to improve adhesion. This structure realizes interlayer connection through vacuum bonding technology.

Benefits of technology

It significantly improves the mechanical stability and manufacturing yield of the circuit structure, reduces the manufacturing cost, reduces the risks of stratification and peeling, and maintains stable performance under thermal cycles and mechanical stress.

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Abstract

The invention provides a multilayer circuit structure and a preparation method thereof.The multilayer circuit structure comprises a substrate and integrated circuits arranged on the two sides of the substrate, each integrated circuit comprises a flexible insulating layer and two flexible conducting layers arranged on the two sides of the flexible insulating layer, each flexible conducting layer is provided with a rough face and a smooth face, and the rough face and the smooth face are arranged on the substrate. And each rough surface is connected with the flexible insulating layer. One side of the flexible conductive layer is provided with the rough surface, and the rough surface is in contact with the flexible insulating layer, so that the contact area can be obviously increased, and the adhesive force between the flexible conductive layer and the flexible insulating layer is improved. This design contributes to reducing the risk of delamination and peeling, enhancing the mechanical stability of the circuit structure, and particularly maintaining stable performance when subjected to thermal cycling and mechanical stress in the manufacturing process. The multilayer circuit structure is made of a material with certain flexibility and can bear stress from mechanical operation in the manufacturing process, and the multilayer circuit structure and the material are combined, so that the manufacturing yield of the multilayer circuit structure is improved.
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