Light-emitting module based on CSP-LED lamp beads, preparation method thereof, backlight module, and display device

Abstract

The present invention discloses a light-emitting module based on CSP-LED lamp beads, a preparation method thereof, a backlight module, and a display device, and relates to the field of semiconductor optoelectronic devices. The preparation method includes: arranging CSP-LED lamp beads on a substrate; forming lens glue, and performing a first preliminary curing to form a first preliminary cured body that can be deformed under the action of an applied force; applying an applied force to the upper surface of the first preliminary cured body to cause the top of the first preliminary cured body to flow and deform toward its surroundings to form a second preliminary cured body; performing a second preliminary curing to shape the second preliminary cured body to form a third preliminary cured body; wherein the cross-section of the third preliminary cured body is a curved surface structure, the curved surface structure includes a downwardly concave concave section and an upwardly arched arched section provided on both sides of the concave section, the orthographic projection of the concave section in the thickness direction of the CSP-LED lamp beads at least partially overlapping with the CSP-LED lamp beads; and curing the third preliminary cured body. Implementation of the present invention can increase the light-emitting angle of the light-emitting module.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic devices, and in particular to a light-emitting module based on CSP-LED lamp beads, a preparation method thereof, a backlight module, and a display device. Background Art

[0002] Conventional LED lamp beads are generally composed of brackets, LED chips, wires, and fluorescent glue. They have good directionality, with strong light in the center and low light intensity around them. The luminous angle can usually reach about 120°.

[0003] The backlight module based on the conventional LED lamp beads generally includes a PCB board 1a, LED lamp beads 2a, a lens 3a and a diffusion sheet 4a (see Figure 1 Lens 3a is manufactured through injection molding using a mold, typically made of acrylic (polymethyl methacrylate) or PC (polycarbonate). The primary function of the lens is to disperse light and improve light mixing uniformity. This lens 3a is typically mechanically connected to PCB 1a.

[0004] For the aforementioned backlight module, due to the small emitting angle of the LED lamp beads, the light directly in front of the LED lamp beads is strong, while the light intensity at the edges is weak, resulting in alternating bright and dark, that is, uneven light mixing. To this end, the spacing between the LED lamp beads is generally reduced so that the emitting edges of the two LED lamp beads overlap to achieve the same luminous intensity as directly above the LED. When the spacing between the LED lamp beads is reduced, a larger number of LED lamp beads are required. When the emitting angle of the LED lamp beads is small, in order to obtain a uniform light mixing effect without reducing the spacing between the LED lamp beads, it is necessary to increase the distance between the LED lamp beads and the diffuser so that the light emitted from the edges of the LED lamp beads overlaps at a farther distance. In this case, the backlight module will be thicker. These methods are not conducive to the development of display devices in the direction of light and thinness. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for preparing a light-emitting module based on CSP-LED lamp beads, wherein the prepared lamp beads have a large light-emitting angle.

[0006] Another technical problem to be solved by the present invention is to provide a light-emitting module based on CSP-LED lamp beads.

[0007] Another technical problem to be solved by the present invention is to provide a backlight module.

[0008] Another technical problem to be solved by the present invention is to provide a display device.

[0009] In order to solve the above problems, the present invention discloses a method for preparing a light-emitting module based on CSP-LED lamp beads, which comprises:

[0010] Arrange the CSP-LED lamp beads on the substrate;

[0011] forming a lens glue on the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body, thereby obtaining a first intermediate body; wherein the first preliminary cured body has a dome-shaped cross-section and is deformable under the action of a force;

[0012] Applying a force to the upper surface of the first preliminary solidified body to cause the top of the first preliminary solidified body to flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body;

[0013] performing a second preliminary solidification on the second preliminary solidified body to solidify the second preliminary solidified body to form a third preliminary solidified body, thereby obtaining a third intermediate body;

[0014] The third preliminary solidified body is solidified to form a lens body on the surface of the CSP-LED lamp bead; wherein the cross-section of the lens body has a curved surface structure, and the curved surface structure includes a downwardly concave section and an upwardly arched section provided on both sides of the concave section, and the orthographic projection of the concave section in the thickness direction of the CSP-LED lamp bead at least partially overlaps with the CSP-LED lamp bead.

[0015] As an improvement of the above technical solution, the lens glue is silica gel with a viscosity of 5000 to 15000 mPa·s and a thixotropic coefficient of 1.5 to 3.5.

[0016] As an improvement to the above technical solution, in the step of forming a lens glue on the top of the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body to obtain a first intermediate, the lens glue is subjected to a first preliminary curing by baking, the temperature of the first preliminary curing is 60 to 100° C., and the time of the first preliminary curing is 30 to 60 seconds; and / or

[0017] In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and form a third preliminary solidified body to obtain a third intermediate body, the second preliminary solidification is performed by baking or hot air, the temperature of the second preliminary solidification is 60 to 100° C., and the time of the second preliminary solidification is 200 to 600 seconds.

[0018] As an improvement of the above technical solution, in the step of curing the third preliminary solidified body, the third preliminary solidified body is cured by baking, the baking temperature is 150° C. to 160° C., and the baking time is 2 to 4 hours.

[0019] As an improvement to the above technical solution, in the step of applying a force to the upper surface of the first preliminary solidified body to cause the top of the first preliminary solidified body to flow and deform toward its surroundings to form a second preliminary solidified body and obtain a second intermediate body, a blowing device is used to blow air on the first preliminary solidified body above the CSP-LED lamp bead to cause the top of the first preliminary solidified body to flow and deform toward its surroundings; the blowing device includes an air blowing pipe, and a guide edge is provided at the outlet of the air blowing pipe to cause gas with a preset volume ratio to flow toward the surroundings of the air blowing pipe;

[0020] The temperature of the gas blown by the blowing device is 20-35°C, and the flow rate is 5-15m 3 / h;

[0021] When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.1 to 0.2 m; during the blowing process, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.01 to 0.05 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m.

[0022] As an improvement to the above technical solution, in the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and forming a third preliminary solidified body to obtain a third intermediate body, an air blowing device is used to blow air on the second preliminary solidified body to shape the second preliminary solidified body;

[0023] The temperature of the gas blown by the blowing device is 60-100°C, and the flow rate is 3-5m 3 / h;

[0024] When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m; during the blowing process, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.005 to 0.01 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.03 to 0.1 m.

[0025] As an improvement of the above technical solution, the blowing device includes a main air pipe, a heating module, a cooling module and a blowing pipe;

[0026] The heating module and the cooling module are arranged on the outside of the main air pipe to heat or cool the gas in the main air pipe; a plurality of the air blowing pipes are connected to the main air pipe and are arranged in a one-to-one correspondence with the CSP-LED lamp beads.

[0027] Correspondingly, the present invention also discloses a light-emitting module based on CSP-LED lamp beads, which is prepared by the above-mentioned method for preparing a light-emitting module based on CSP-LED lamp beads.

[0028] Correspondingly, the present invention also discloses a backlight module, which includes the above-mentioned light-emitting module based on CSP-LED lamp beads and a diffusion sheet.

[0029] Correspondingly, the present invention also discloses a display device, which includes the above-mentioned backlight module.

[0030] The implementation of the present invention has the following beneficial effects:

[0031] In one embodiment of the present invention, a method for preparing a light-emitting module based on CSP-LED lamp beads involves first forming encapsulation adhesive on the CSP-LED lamp beads. After a primary curing, a force is applied to deform the beads, followed by a secondary primary curing to define the shape, and finally curing. This method allows the formation of a lens on the surface of the CSP-LED lamp beads, with a curved cross-section comprising a downwardly concave section and upwardly arched sections located on either side of the section. The orthographic projections of the sections along the thickness of the CSP-LED lamp beads at least partially overlap with the CSP-LED lamp beads. This lens shape can increase the light-emitting angle, specifically, to approximately 170°. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural diagram of a backlight module in the prior art;

[0033] Figure 2 This is a flow chart of a method for preparing a light-emitting module based on CSP-LED lamp beads in one embodiment of the present invention;

[0034] Figure 3 This is a schematic structural diagram of a first intermediate body and a heating plate in one embodiment of the present invention;

[0035] Figure 4 Schematic diagram of the interaction between the first intermediate and the blowing device in step S3 in one embodiment of the present invention;

[0036] Figure 5 Schematic diagram of the interaction between the second intermediate and the blowing device in step S4 in one embodiment of the present invention;

[0037] Figure 6 1 is a schematic structural diagram of a light-emitting module based on CSP-LED lamp beads in one embodiment of the present invention;

[0038] Figure 7 is a structural diagram of a backlight module in one embodiment of the present invention;

[0039] In the figure, 1a is a PCB board, 2a is an LED lamp bead, 3a is a lens, 4a is a diffuser, 100 is a substrate, 200 is a CSP-LED lamp bead, 300 is a lens body, 310 is a raised section, 320 is a recessed section, 400 is a diffuser, 500 is a first preliminary solidification body, 600 is a heating plate, 700 is an air blowing device, 710 is an air blowing pipe, 711 is a guide edge, 720 is a main air pipe, 730 is a heating module, 740 is a cooling module, and 800 is a third preliminary solidification body. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are merely used to explain the present application and are not intended to limit the present application.

[0041] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0044] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0045] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use scenarios of other materials.

[0046] As a first aspect of the present invention, see Figure 2 The present invention provides a packaging method for flip-chip LED lamp beads, which includes the following steps:

[0047] S1: Arrange CSP-LED lamp beads on the substrate;

[0048] Specifically, the CSP-LED lamp bead 200 refers to a chip-level packaged LED lamp bead, which is obtained by bonding a fluorescent film and / or protective material on the five sides of the LED chip. Its overall size is no more than 1.2 times the size of the LED chip, which is conducive to making the display device thin and light.

[0049] Preferably, in some embodiments, the CSP-LED lamp bead 200 is a single-sided light-emitting type CSP-LED lamp bead 200. Although its light-emitting angle is relatively small, its light color uniformity and color temperature uniformity are better, which is conducive to improving the display effect.

[0050] Specifically, the substrate 100 may be an aluminum substrate, a steel substrate, or a PCB substrate, but is not limited thereto. Preferably, in some embodiments, the substrate is a PCB substrate.

[0051] Specifically, the CSP-LED lamp bead 200 is electrically connected to the substrate 100, and the electrical connection can be formed by soldering, but is not limited thereto. Preferably, in some embodiments, solder paste is first applied to the substrate 100, and then the CSP-LED lamp bead 200 is reflow soldered. The reflow soldering temperature is 230-280°C and the time is 30-60 seconds.

[0052] S2: forming a lens glue on the top of the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body to obtain a first intermediate;

[0053] Specifically, the lens glue can be formed on the CSP-LED lamp bead 200 by a screen printing process, a dispensing process, etc., but is not limited thereto. Since the lens glue is generally made of an organic material, which is different from the material of the substrate 100, the lens glue will form a dome or quasi-dome shape on the surface of the substrate 100 due to the effect of surface tension.

[0054] Specifically, the lens glue can be epoxy resin or silicone commonly used in the art, but is not limited thereto. Preferably, in some embodiments of the present invention, the lens glue is silicone, which has stronger heat resistance and high transparency. More preferably, the lens glue is silicone, with a viscosity of 5000 to 15000 mPa·s and a thixotropic coefficient of 1.5 to 3.5. Based on this type of silicone, the blowing device 700 can be used to subsequently complete the molding of the lens body 300 of a specific shape.

[0055] It should be noted that after dispensing, although the lens glue will form a dome or a dome-like shape under the action of surface tension, it will still diffuse on the surface of the substrate 100 if it is not initially cured. To this end, the present invention performs a first preliminary curing on the lens glue so that the lens glue does not diffuse on the surface of the substrate 100, and is initially shaped, but not completely cured. It can be deformed under a smaller force, laying a good foundation for subsequent molding. Specifically, the first preliminary curing can be performed by light curing or heat curing, but is not limited to this. Preferably, in some embodiments, the lens glue is cured by baking to form a first preliminary cured body 500. The temperature of the first preliminary curing is 60 to 100°C and the time is 30 to 60s. After curing based on this baking process, the first preliminary cured body 500 has a certain fluidity and can be further deformed under the action of force.

[0056] Specifically, the substrate 100 after dispensing can be loaded into a baking device as a whole for a first preliminary curing, but is not limited thereto. Preferably, in some embodiments, see Figure 3 , heating can be performed by a heating plate 600 attached below the substrate 100 to achieve a first preliminary curing to simplify the operation.

[0057] S3: applying a force to the upper surface of the first preliminary solidified body to cause the top of the first preliminary solidified body to flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body;

[0058] Specifically, the first preliminary solidified body 500 may be pressed down by a mold of a specific shape to apply a force to deform the first preliminary solidified body 500, but the present invention is not limited thereto. Figure 4 The air blowing device 700 blows air onto the first preliminarily solidified body 500, exerting a compressive force thereon, thereby causing the top portion of the first preliminarily solidified body 500 to flow and deform toward the surrounding area. Specifically, by selecting a silicone with a specific viscosity and thixotropic coefficient, the air blowing can be used to achieve shaping, transforming the first preliminarily solidified body 500 into a second preliminarily solidified body of a specific shape.

[0059] Specifically, in order to obtain a second preliminary solidified body of a specific shape by blowing, the temperature of the gas blown by the blowing device 700 is controlled to be 20-35°C and the flow rate is 5-15m 3 / h; and when blowing starts, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.1~0.2m; during the blowing process, the blowing pipe 710 moves toward the direction approaching the CSP-LED lamp bead 200, and the moving rate is 0.01~0.05m / min; after the blowing is completed, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.08~0.19m.

[0060] Specifically, to facilitate the molding of the first preliminarily solidified bodies 500 on multiple CSP-LED lamp beads 200, the air blowing device 700 may include multiple air blowing tubes 710, each corresponding to a CSP-LED lamp bead 200. The axis of each air blowing tube 710 coincides with the centerline of the CSP-LED lamp bead 200. Furthermore, to optimize the molding effect, a guide edge 711 is provided at the outlet of the air blowing tube 710 to direct gas at a preset volume ratio toward the periphery of the air blowing tube 710.

[0061] More specifically, see Figure 4 、 Figure 5 The blowing device 700 includes a main air pipe 720, a heating module 730, a cooling module 740, and an air blowing pipe 710. The heating module 730 and the cooling module 740 are located outside the main air pipe 720 to heat or cool the air within the main air pipe 720. Multiple air blowing pipes 710 are connected to the main air pipe 720. The installation of the heating module 730 and the cooling module 740 allows for better control of the blowing temperature, enhancing the molding and curing effects.

[0062] S4: performing a second preliminary solidification on the second preliminary solidified body to solidify the second preliminary solidified body to form a third preliminary solidified body, thereby obtaining a third intermediate body;

[0063] Specifically, the second preliminary curing can be performed by light curing or heat curing, but is not limited thereto. Preferably, in some embodiments, see Figure 5 , using the blowing device 700 to blow air on the second preliminary solidified body to shape the second preliminary solidified body; wherein the temperature of the gas blown by the blowing device 700 is 60-100°C, and the flow rate is 3-5m 3 / h; at the start of air blowing, the distance between the outlet of the air blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.08-0.19m; during the air blowing process, the air blowing pipe 710 moves toward the CSP-LED lamp bead 200 at a speed of 0.005-0.01m / min; after the air blowing ends, the distance between the outlet of the air blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.03-0.1m. Based on this second preliminary curing, the second preliminary cured body can be fully shaped to form a third preliminary cured body 800.

[0064] Specifically, the third preliminarily solidified body 800 has a curved cross-section, comprising a downwardly concave recessed section 320 and upwardly arched sections 310 disposed on either side of the recessed section 320. The orthographic projection of the recessed section 320 along the thickness direction of the CSP-LED lamp bead 200 at least partially overlaps with the CSP-LED lamp bead 200. This shape significantly improves the light-emitting angle. Preferably, in some embodiments, the lowest point of the recessed section 320 is located on an extension of the centerline of the CSP-LED lamp bead 200. This arrangement further improves the light-emitting angle.

[0065] S5: curing the third preliminary solidified body to form a lens on the surface of the CSP-LED lamp bead;

[0066] Specifically, curing can be performed by light curing or heat curing, but is not limited thereto. Preferably, in some embodiments, the third preliminary cured body 800 is cured by baking at a temperature of 150° C. to 160° C. for 2 to 4 hours.

[0067] Specifically, after the above-mentioned preparation method, the cross-section of the obtained lens body 300 presents a curved surface structure, and the curved surface structure includes a downwardly concave section 320 and an upwardly arched section 310 provided on both sides of the concave section 320. The orthographic projection of the concave section 320 in the thickness direction of the CSP-LED lamp bead 200 at least partially overlaps with the CSP-LED lamp bead 200.

[0068] In summary, based on the preparation method of the light-emitting module based on the CSP-LED lamp bead 200 in this embodiment, a lens body 300 with a high periphery and a concave middle can be set on the surface of the CSP-LED lamp bead 200, thereby greatly improving the light-emitting angle. Specifically, the light-emitting angle can be increased to about 170°.

[0069] Accordingly, as a second aspect of the present invention, see Figure 6 The present invention discloses a light-emitting module, which is prepared by the above-mentioned method for preparing a light-emitting module based on CSP-LED lamp beads.

[0070] Accordingly, as the third aspect of the present invention, see Figure 7 The present invention discloses a backlight module comprising a light-emitting module and a diffuser plate 400. The light-emitting module of the present invention eliminates the need for separately molded lenses in conventional backlight modules and increases the spacing between CSP-LED lamp beads 200, thereby reducing the number of CSP-LED lamp beads 200 used and lowering production costs. Furthermore, the light mixing distance can be shortened, reducing the distance between the diffuser plate 400 and the CSP-LED lamp beads 200, resulting in a thinner backlight module.

[0071] Correspondingly, as a fourth aspect of the present invention, the present invention further discloses a display device, which includes a display screen and the above-mentioned backlight module. This application can effectively reduce the thickness of the display device and optimize its display effect.

[0072] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0073] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for preparing a light-emitting module based on CSP-LED lamp beads, characterized in that: include: Arrange the CSP-LED lamp beads on the substrate; forming a lens glue on the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body, thereby obtaining a first intermediate body; wherein the first preliminary cured body has a dome-shaped cross-section and is deformable under the action of a force; Applying a force to the upper surface of the first preliminary solidified body to cause the top of the first preliminary solidified body to flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body; performing a second preliminary solidification on the second preliminary solidified body to solidify the second preliminary solidified body to form a third preliminary solidified body, thereby obtaining a third intermediate body; The third preliminary solidified body is solidified to form a lens body on the surface of the CSP-LED lamp bead; wherein the cross-section of the lens body has a curved surface structure, and the curved surface structure includes a downwardly concave section and an upwardly arched section provided on both sides of the concave section, and the orthographic projection of the concave section in the thickness direction of the CSP-LED lamp bead at least partially overlaps with the CSP-LED lamp bead.

2. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 1, characterized in that: The lens glue is silica gel with a viscosity of 5000 to 15000 mPa·s and a thixotropic coefficient of 1.5 to 3.

5.

3. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 2, characterized in that: In the step of forming a lens adhesive on the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body to obtain a first intermediate, the lens adhesive is subjected to a first preliminary curing by baking, the first preliminary curing temperature is 60 to 100° C., and the first preliminary curing time is 30 to 60 seconds; and / or In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and form a third preliminary solidified body to obtain a third intermediate body, the second preliminary solidification is performed by baking or hot air, the temperature of the second preliminary solidification is 60 to 100° C., and the time of the second preliminary solidification is 200 to 600 seconds.

4. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 2, characterized in that: In the step of curing the third preliminary cured body, the third preliminary cured body is cured by baking, the baking temperature is 150° C. to 160° C., and the baking time is 2 to 4 hours.

5. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 1 or 3, characterized in that: In the step of applying a force to the upper surface of the first preliminary solidified body so that the top of the first preliminary solidified body flows and deforms toward its surroundings to form a second preliminary solidified body and obtain a second intermediate body, a blowing device is used to blow air on the first preliminary solidified body above the CSP-LED lamp bead so that the top of the first preliminary solidified body flows and deforms toward its surroundings; the blowing device includes an air blowing pipe, and a guide edge is provided at the outlet of the air blowing pipe so that gas with a preset volume ratio flows toward the surroundings of the air blowing pipe; The temperature of the gas blown by the blowing device is 20-35°C, and the flow rate is 5-15m 3 / h; When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.1 to 0.2 m; during the blowing process, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.01 to 0.05 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m.

6. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 5, characterized in that: In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and forming a third preliminary solidified body to obtain a third intermediate body, an air blowing device is used to blow air on the second preliminary solidified body to shape the second preliminary solidified body; The temperature of the gas blown by the blowing device is 60-100°C, and the flow rate is 3-5m 3 / h; When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m; during the blowing process, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.005 to 0.01 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.03 to 0.1 m.

7. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 5, characterized in that: The air blowing device includes a main air pipe, a heating module, a cooling module and an air blowing pipe; The heating module and the cooling module are arranged on the outside of the main air pipe to heat or cool the gas in the main air pipe; a plurality of the air blowing pipes are connected to the main air pipe and are arranged in a one-to-one correspondence with the CSP-LED lamp beads.

8. A light-emitting module based on CSP-LED lamp beads, characterized in that: The light-emitting module is prepared by the preparation method of the CSP-LED lamp bead-based light-emitting module according to any one of claims 1 to 7.

9. A backlight module, characterized in that: It comprises a light-emitting module based on CSP-LED lamp beads and a diffuser as described in claim 8.

10. A display device, characterized in that: Comprising the backlight module as claimed in claim 9.

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