Preparation method of low-temperature high-thermal-conductivity nano-silver adhesive

By preparing low-temperature high-thermal nanosilver adhesives, the problem of insufficient thermal conductivity and bonding strength of existing packaging materials under high temperature or high irradiation conditions is solved, and the combination of high thermal conductivity and high bonding strength is achieved, which is suitable for semiconductor packaging in high temperature service.

CN119799171AInactive Publication Date: 2025-04-11SICHUAN WALL TECH CO LTD
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Patent Information

Application Number
CN202510088288.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2025-04-11
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing semiconductor packaging materials are difficult to meet the requirements of high thermal conductivity, low thermal resistance and high bonding strength under high temperature or high irradiation conditions, and their performance is unstable under mechanical vibration and thermal mechanical stress.

Method used

Using the preparation method of low-temperature and high-thermal conductivity nanosilver adhesive, nanosilver particles with high thermal conductivity and bond strength are prepared by mixing high-purity silver powder with dispersant and solvent to form nanosilver particles of 20nm-150nm. Combined with high-speed stirring or ultrasonic dispersion technology, nanosilver adhesives with high thermal conductivity and bond strength are prepared.

Benefits of technology

It realizes the combination of high thermal conductivity and high bonding strength under low temperature conditions, and is suitable for semiconductor packaging in high temperature service, improving the durability and performance stability of packaging materials.

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Abstract

The invention discloses a preparation method of a low-temperature high-thermal-conductivity nano-silver adhesive, which comprises the following steps: dissolving a dispersing agent in a solvent, and uniformly stirring to form a stable dispersion liquid; high-purity silver powder is added into the dispersion liquid, a high-speed stirrer or an ultrasonic disperser is used for mixing to obtain the low-temperature high-thermal-conductivity nano-silver adhesive, and the average particle size of the high-purity silver powder is 20-150 nm. Compared with a traditional welding material, the low-temperature high-thermal-conductivity nano-silver adhesive has the advantages of being low in stress, low in thermal expansion coefficient, high in thermal conductivity, high in electric conductivity, large in bonding strength, low in halogen heteroion content, free of lead metal content and environmentally friendly in packaging application.
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