Bidirectional transmission integrated LED display screen and manufacturing method thereof

Abstract

The invention discloses a two-way transmission integrated LED display screen and a manufacturing method thereof, and relates to the technical field of LED display, the two-way transmission integrated LED display screen comprises a circuit layer and a covering layer; metal bonding pads are distributed on the two faces of the circuit layer, a metalized through hole is formed in the circuit layer, and the metal bonding pads on the two faces can be connected through the metalized through hole. The covering layer and the circuit layer are positioned and pressed to cover other parts except the metal bonding pad, and the interiors of the second pin and the fifth pin are communicated, so that copper foil is saved in the design of electronic connection, data transmission can be carried out at any end of the transmission direction of the display screen, a breakpoint resuming function is supported, and the service life of the display screen is prolonged. Therefore, the upstream and the downstream can achieve a better display effect by using one pin position, the processing cost is greatly reduced, and the utilization rate of the lamp bead / display screen is also improved.

Description

Technical Field

[0001] The invention relates to the technical field of LED display, and more particularly to an integrated LED display screen with bidirectional transmission and a manufacturing method thereof. Background Art

[0002] During the manufacturing process of traditional integrated LED display screens, the pin functions of each lamp bead are relatively fixed, usually including input pins, output pins and power pins. However, this fixed pin function design leads to waste of copper foil, because in actual applications, not all pins will be fully utilized. In addition, traditional display screens are also limited in the direction of data transmission, and usually data can only be transmitted in a fixed direction, which limits the flexibility and application scope of the display screen. For example, one of the pins 2 and 5 inside the lamp bead is an empty pin and has no function, which leads to waste of copper wire on the PCB board and increases production costs. At the same time, this design also limits the utilization rate of the lamp bead and reduces the overall performance of the display screen.

[0003] Based on this, we provide an integrated LED display screen with bidirectional transmission and a manufacturing method thereof. Summary of the invention

[0004] In order to solve the problems raised in the above background technology, the present invention provides an integrated LED display screen with bidirectional transmission and a manufacturing method thereof.

[0005] The present invention provides an integrated LED display screen with bidirectional transmission, which adopts the following technical solution:

[0006] An integrated LED display screen with bidirectional transmission comprises a circuit layer and a covering layer; metal pads are distributed on both sides of the circuit layer, metallized through holes are opened inside the circuit layer, and the metallized through holes can connect the metal pads on both sides; the covering layer is positioned and pressed with the circuit layer to cover other parts except the metal pads.

[0007] A method for manufacturing a bidirectional transmission integrated LED display screen, which is applicable to the above-mentioned bidirectional transmission integrated LED display screen, comprises:

[0008] S1. Prepare a circuit layer, form a plurality of metal pads on both sides of the circuit layer by etching, and open a metallized through hole inside the circuit layer, wherein the metallized through hole penetrates both sides of the circuit layer and connects the metal pads on both sides accordingly;

[0009] S2, preparing a covering layer, wherein the covering layer is formed by hot pressing after mixing epoxy resin and glass fiber material;

[0010] S3. Combine the cover layer and the circuit layer through a positioning and pressing process so that the cover layer covers the area of the circuit layer except for the metal pads.

[0011] S4. Six metallized vias are correspondingly arranged on each metal pad, which are sequentially defined as the 1st to 6th metallized vias. At the same time, five functional areas are divided on the surface of the metal pad, which are sequentially the 1st to 5th functional areas. Among them, the 2nd functional area is connected to the 2nd metallized via and the 5th metallized via through an electroplating process.

[0012] S5. Fix the chip / IC on the packaged circuit layer and achieve electrical connection through the metallized vias. Finally, use epoxy resin glue for insulation protection.

[0013] Preferably, it further includes a cutting mechanism. The cutting mechanism includes a processing table; a placement plate arranged on the top of the processing table for placing the PCB board; a driving component arranged inside the processing table for driving the placement plate to rotate; a fixing component arranged on the side of the processing table for fixing the PCB board on the placement plate; a cutting component arranged on the top of the processing table for cutting the side of the PCB board. Among them, the fixing component includes a U-shaped bracket connected to the driving component. An electric push rod 1 is arranged on the top of the U-shaped bracket, and a pressing plate is assembled at the output end of the electric push rod 1. The pressing plate is arranged in the central area of the placement plate.

[0014] Preferably, the driving component includes a rotating tube rotatably arranged inside the processing table. The placement plate is arranged at the top end of the rotating tube. The bottom end of the U-shaped bracket is fixedly arranged on the rotating tube. A driven gear is arranged at the bottom of the rotating tube. A driving gear is rotatably arranged inside the processing table. The driving gear is meshed with the driven gear, and the driving gear is equipped with a driving motor.

[0015] Preferably, an electric push rod 2 is fixedly arranged inside the processing table. The placement plate is inserted into the top end of the rotating tube through a socket. The telescopic end of the electric push rod 2 is rotatably connected to the socket.

[0016] Preferably, the cutting component includes a pair of laser cutters, and the two laser cutters are symmetrically arranged on the top of the processing table.

[0017] Preferably, a pair of discharge ports are opened at the position of the processing table relative to the laser cutters. A discharge plate is hingedly arranged at the position of the inside of the processing table relative to the discharge ports.

[0018] Preferably, an incomplete gear is fixedly arranged in the middle of the rotating tube. A pair of push rods are slidably arranged inside the processing table through vertical plates. One ends of the two push rods are fixedly provided with rack plates. The two rack plates are meshed with the incomplete gear. The other ends of the two push rods are provided with push blocks, and the two push blocks are both in contact with the corresponding discharge plate. A cushion plate is fixedly arranged in the middle of the push rod, and a spring is arranged on the push rod at the position between the vertical plate and the cushion plate.

[0019] In summary, the present invention includes the following beneficial technical effects:

[0020] 1. By connecting the inside of pin 2 and pin 5, the design of electronic assembly saves copper foil. Data can be transmitted at any end in the transmission direction of the display screen, and the function of resuming transmission from breakpoint is supported, so that the upstream and downstream can use one kind of pin position to achieve a better display effect, greatly reducing the processing cost, improving the utilization rate of lamp beads / display screens, and at the same time, the effect of bidirectional transmission can be achieved by using one kind of lamp bead. Using the same kind of lamp bead can achieve the effect of bidirectional transmission, simplifying the design and production process, improving the production efficiency, and reducing the waste of wire body switching, materials and labor.

[0021] 2. By pushing the pressing plate down by the first electric push rod, the pressing plate contacts the PCB board, thus completing the fixation of the PCB board. Then, the two sides of the PCB board are cut by the cutting assembly. Then, the placement plate is driven to rotate by 90 degrees by the driving assembly, so that the other two sides of the PCB board are aligned with the cutting assembly, and the cutting assembly cuts the other sides. Through this structural design, the stable fixation of the PCB board is realized. This fixation method can effectively prevent the PCB board from shifting during the cutting process, thus ensuring the accuracy and precision of cutting.

[0022] 3. By driving the driving gear to rotate by the motor, the driven gear rotates accordingly. The rotation of the driven gear makes the rotating tube rotate, so that the U-shaped bracket and the placement plate rotate synchronously. Through this structural design, it is convenient to rotate the PCB board to change sides for cutting after it is fixed.

[0023] 4. When the rotating tube rotates, the incomplete gear will rotate, thus driving the two rack plates to move away from each other, and driving the push blocks to push the discharge plate to rotate through the corresponding push rods. And when the incomplete gear does not contact the rack plates, the compressed spring will stretch, so as to drive the push block away from the discharge plate. Through this structural design, the discharge plate can be shaken, so that the waste materials remaining on the discharge plate fall off.

[0024] The above summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings

[0025] Figure 1 is a schematic structural diagram of a circuit layer in an embodiment of the present invention;

[0026] Figure 2 is a schematic structural diagram of a covering layer in an embodiment of the present invention;

[0027] Figure 3 is a schematic structural diagram of a metallized via and a functional area in an embodiment of the present invention;

[0028] Figure 4 is a circuit diagram of an integrated LED display screen with two-way transmission in an embodiment of the present invention;

[0029] Figure 5 is a schematic structural diagram of a cutting mechanism in an embodiment of the present invention;

[0030] Figure 6 is a schematic structural diagram of the other side of the cutting mechanism in an embodiment of the present invention;

[0031] Figure 7 is a schematic structural diagram of the inside of the cutting mechanism in an embodiment of the present invention;

[0032] Figure 8 is a schematic top view structural diagram of the cutting mechanism in an embodiment of the present invention;

[0033] Fig. 9 is a schematic structural diagram of the inside of a rotating tube in an embodiment of the present invention.

[0034] Description of Reference Numerals: 1. Circuit layer; 2. Covering layer; 3. Metal pad; 4. Metallized via; 5. Processing table; 6. Placing plate; 7. Driving assembly; 700. Rotating tube; 701. Driven gear; 702. Driving gear; 703. Second electric push rod; 8. Fixing assembly; 800. C-shaped bracket; 801. First electric push rod; 802. Pressing disc; 9. Cutting assembly; 900. Laser cutting machine; 10. Discharge plate; 11. Incomplete gear; 12. Push rod; 13. Rack plate; 14. Pushing block; 15. Spring. Detailed Embodiments

[0035] The following further describes the present invention in detail Figures 1 to 9 with reference to the accompanying drawings.

[0036] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0037] Embodiment 1

[0038] The embodiment of the present invention discloses an integrated LED display screen with bidirectional transmission. Figure 1 to Figure 2 , an integrated LED display screen with bidirectional transmission, comprising a circuit layer 1 and a cover layer 2; metal pads 3 are distributed on both sides of the circuit layer 1, metalized through holes 4 are opened inside the circuit layer 1, and the metalized through holes 4 can connect the metal pads 3 on both sides; the cover layer 2 is positioned and pressed with the circuit layer 1 to cover other parts except the metal pads 3.

[0039] Embodiment 2

[0040] A method for manufacturing a bidirectional transmission integrated LED display screen, which is applicable to the above-mentioned bidirectional transmission integrated LED display screen, comprises:

[0041] S1, preparing a circuit layer 1, forming a plurality of metal pads 3 on both sides of the circuit layer 1 by etching process, and opening a metallized through hole 4 inside the circuit layer 1, the metallized through hole 4 passes through both sides of the circuit layer 1, and correspondingly connects the metal pads 3 on both sides;

[0042] S2, preparing a covering layer 2, wherein the covering layer 2 is formed by hot pressing after mixing epoxy resin and glass fiber material;

[0043] S3, combining the cover layer 2 and the circuit layer 1 through a positioning and pressing process, so that the cover layer 2 covers the area of ​​the circuit layer 1 except the metal pad 3;

[0044] S4, six metallized through holes 4 are correspondingly arranged on each metal pad 3, which are defined as metallized through holes No. 1 to No. 6 in sequence, and five functional areas are divided on the surface of the metal pad 3, which are functional areas No. 1 to No. 5 in sequence, among which functional area No. 2 is connected to metallized through hole No. 2 and metallized through hole No. 5 by electroplating process;

[0045] S5. Fix the chip / IC on the packaged circuit layer 1 and realize electrical connection through the metallized through-hole 4. Finally, use epoxy resin glue for insulation protection.

[0046] Specifically, Figure 3As shown, a single unit has 6 metallized through holes, which are connected to the metal pad 3 on the back, and 5 functional areas are built in. Functional area 2 is connected to metallized through holes 2 and 5, so that pins 2 and 5 are connected in the package. Metallized through hole 4 is plugged with solder mask ink, which can effectively prevent the side pins from being exposed and reflecting light and metal oxidation. Except for the functional area, other parts are covered by the cover layer 2.

[0047] like Figure 4 As shown, it is a design diagram of a bidirectional transmission LED display circuit, in which VDD / GND is connected to the back side of the PCB through a metallized through-hole 4, and power is supplied through the back side.

[0048] The circuit designed on the market connects pin 2 and pin 5 on the PCB board, while one of the pins 2 / 5 in the lamp bead is an empty pin (without any function), resulting in a waste of PCB copper wire, and the function of the lamp bead package pin is not effectively utilized. The LED display screen uses the integrated LED with bidirectional transmission of the present application to connect pin 2 and pin 5 internally, so that the design of the electronic assembly saves copper foil, and data can be transmitted at either end of the transmission direction of the display screen, and supports the breakpoint resume function, so that the upstream and downstream can use one pin position to achieve a better display effect, which greatly reduces the processing cost and improves the utilization rate of the lamp bead / display screen;

[0049] Through this structural design, the thrust of the lamp beads is greater after electronic assembly; the flat pins used in the lamp beads make the side reflection of the display screen less and the display effect is better; the internal structure of the lamp beads is 2 / 5 connected, reducing the waste of copper wire; at the same time, one type of lamp bead can achieve the effect of two-way transmission; the production efficiency is higher, reducing the waste of line switching, materials and labor; the lamp beads are more reliable and have better heat dissipation.

[0050] Specifically, the pins are defined as follows: pins 1 / 4 are I / O pins (bidirectional transmission), pins 2 / 5 are main input pins (DIN), and pins 3 / 6 are power pins (VDD / GND);

[0051] The external 2 / 5 pin connecting copper wire is eliminated in the PCB design, and the 2-5 pin conduction characteristics inside the lamp bead are used to enable the signal to be transmitted in any direction (forward or reverse);

[0052] When a certain lamp bead fails, the signal can bypass through the I / O pin of the adjacent lamp bead to ensure continuous display.

[0053] Embodiment 3

[0054] This embodiment is further optimized on the basis of the above-mentioned embodiment 2, and the same parts as the above-mentioned technical solution will not be repeated here. Figure 5 and Figure 6As shown below, for better implementation of the present invention, the following setting method is particularly adopted: In this embodiment, it further includes a cutting mechanism, which includes a processing table 5, a placing plate 6, a driving component 7, a fixing component 8, and a cutting component 9; the processing table 5; the placing plate 6 is arranged on the top of the processing table 5 and is used for placing the PCB board; the driving component 7 is arranged inside the processing table 5 and is used for driving the placing plate 6 to rotate; the fixing component 8 is arranged on the side of the processing table 5 and is used for fixing the PCB board on the placing plate 6; the cutting component 9 is arranged on the top of the processing table 5 and is used for cutting the side edges of the PCB board; wherein, the fixing component 8 includes a U-shaped bracket 800 connected to the driving component 7, an electric push rod 801 is arranged on the top of the U-shaped bracket 800, a pressing disc 802 is assembled at the output end of the electric push rod 801, the pressing disc 802 is arranged in the central area of the placing plate 6, and a rubber gasket is arranged on the top of the placing plate 6.

[0055] Specifically, during the cutting operation, all the cutting operations need to be completed at one time. Otherwise, when one side of the PCB board is cut, the PCB board will lose the limit of the card slot, and the PCB board will shift during processing. This shift may lead to a decrease in cutting accuracy and even damage to the PCB board.

[0056] By placing the prepared PCB board on the top of the placing plate 6, and then pushing the pressing disc 802 down by the electric push rod 801, so that the pressing disc 802 contacts the PCB board, thus completing the fixation of the PCB board. Then, the two side edges of the PCB board are cut by the cutting component 9. Then, the driving component 7 drives the placing plate 6 to rotate by 90 degrees, so that the other two sides of the PCB board are aligned with the cutting component 9, and the cutting component 9 cuts the other side edges. Through this structural design, stable fixation of the PCB board is achieved. This fixation method can effectively prevent the PCB board from shifting during the cutting process, thus ensuring the accuracy and precision of the cutting.

[0057] As Figure 6 and Figure 7 shown, the driving component 7 includes a rotating tube 700 rotatably arranged inside the processing table 5, the placing plate 6 is arranged at the top end of the rotating tube 700, the bottom end of the U-shaped bracket 800 is fixedly arranged on the rotating tube 700, a driven gear 701 is arranged at the bottom of the rotating tube 700, a driving gear 702 is rotatably arranged inside the processing table 5, the driving gear 702 is meshed and connected with the driven gear 701, and the driving gear 702 is equipped with a driving motor.

[0058] Specifically, for the use of the driving component 7, the driving gear 702 is rotated by the motor, so that the driven gear 701 rotates. The rotation of the driven gear 701 makes the rotating tube 700 rotate, so that the U-shaped bracket 800 and the placing plate 6 rotate synchronously. Through this structural design, it is convenient to rotate the PCB board to change sides for cutting after fixation.

[0059] like Fig. 9 As shown, a second electric push rod 703 is fixedly arranged inside the processing table 5, and the placement plate 6 is plugged into the top of the rotating tube 700 through a socket, and the telescopic end of the second electric push rod 703 is rotatably connected to the socket.

[0060] Specifically, when the PCB board is taken, the placement plate 6 is pushed upward by the electric push rod 703, thereby facilitating the taking of the cut PCB board. The placement plate 6 is plugged into the rotating tube 700 through the plug sleeve. When the rotating tube 700 rotates, the placement plate 6 can be driven to rotate through the plug sleeve.

[0061] like Figure 5 , Figure 6 and Figure 7 As shown, the cutting assembly 9 includes a pair of laser cutting machines 900 , and the two laser cutting machines 900 are symmetrically arranged on the top of the processing table 5 .

[0062] Specifically, the laser cutting machine 900 is arranged on the top of the processing table 5 through a lateral moving mechanism, and the lateral moving mechanism can drive the laser cutting machine 900 to move back and forth. The two laser cutting machines 900 work synchronously, thereby completing the cutting of both sides of the PCB board at one time.

[0063] like Figure 6 As shown, a pair of discharge ports are provided on the processing table 5 relative to the laser cutting machine 900 , and a discharge plate 10 is hingedly provided inside the processing table 5 relative to the discharge ports.

[0064] Specifically, the cut waste can be discharged through the discharge plate 10.

[0065] like Figure 8 As shown, an incomplete gear 11 is fixedly provided in the middle of the rotating tube 700, a pair of push rods 12 are slidably provided inside the processing table 5 through the vertical plate, and a rack plate 13 is fixedly provided at one end of the two push rods 12, and the two rack plates 13 are meshingly connected with the incomplete gear 11, and a push block 14 is provided at the other end of the two push rods 12, and the two push blocks 14 are in contact with the corresponding discharge plate 10, a pad is fixedly provided in the middle of the push rod 12, and a spring 15 is passed through the middle of the push rod 12 between the vertical plate and the pad.

[0066] Specifically, considering that waste may accumulate on the discharge plate 10, when the rotating tube 700 rotates, the incomplete gear 11 will rotate, thereby driving the two rack plates 13 to move away from each other, and the corresponding push rod 12 drives the push block 14 to push the discharge plate 10 to rotate, and when the incomplete gear 11 does not contact the rack plate 13, the compressed spring 15 will extend, thereby driving the push block 14 away from the discharge plate 10. Through this structural design, the discharge plate 10 can be shaken to make the waste remaining on the discharge plate 10 fall off.

[0067] Specifically, the control method of the present invention is controlled by a controller, and the control circuit of the controller can be realized by simple programming by technicians in this field, and the control method and circuit connection will not be explained in detail here.

[0068] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0069] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0070] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0073] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0074] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated LED display screen with bidirectional transmission, characterized in that: Including: A circuit layer (1) and a covering layer (2); Metal pads (3) are distributed on both sides of the circuit layer (1), a metallized via hole (4) is formed inside the circuit layer (1), and the metallized via hole (4) can connect the metal pads (3) on both sides; The covering layer (2) is positioned and pressed with the circuit layer (1) to cover other parts except the metal pads (3).

2. A manufacturing method of a bidirectional transmission integrated LED display screen, applicable to the bidirectional transmission integrated LED display screen described in claim 1, the manufacturing method of the bidirectional transmission integrated LED display screen includes: S1. Prepare the circuit layer (1), form a plurality of metal pads (3) on both sides of the circuit layer (1) through an etching process, and form a metallized via hole (4) inside the circuit layer (1). The metallized via hole (4) penetrates both sides of the circuit layer (1) and correspondingly connects the metal pads (3) on both sides; S2. Prepare the covering layer (2), and the covering layer (2) is formed by hot pressing after mixing epoxy resin and glass fiber materials; S3. Combine the covering layer (2) and the circuit layer (1) through a positioning and pressing process, so that the covering layer (2) covers the area of the circuit layer (1) except the metal pads (3); S4. Six metallized via holes (4) are correspondingly arranged on each metal pad (3), which are sequentially defined as the 1st to 6th metallized via holes. At the same time, five functional areas are divided on the surface of the metal pad (3), which are sequentially the 1st to 5th functional areas. Among them, the 2nd functional area is connected to the 2nd metallized via hole and the 5th metallized via hole through an electroplating process; S5. Fix the chip / IC on the packaged circuit layer (1), realize electrical connection through the metallized via hole (4), and finally use epoxy resin glue for insulation protection.

3. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 2, characterized in that: It further includes a cutting mechanism, and the cutting mechanism includes: A processing table (5); A placement plate (6), arranged on the top of the processing table (5) for placing a PCB board; A driving component (7), arranged inside the processing table (5) for driving the placement plate (6) to rotate; A fixing component (8), arranged on the side of the processing table (5) for fixing the PCB board on the placement plate (6); A cutting component (9), arranged on the top of the processing table (5) for cutting the side of the PCB board; Wherein, the fixing component (8) includes a U-shaped bracket (800) connected to the driving component (7), a first electric push rod (801) is arranged on the top of the U-shaped bracket (800), and a pressing disc (802) is assembled at the output end of the first electric push rod (801). The pressing disc (802) is arranged in the central area of the placement plate (6).

4. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 3, characterized in that: The driving component (7) includes a rotating tube (700) rotatably arranged inside the processing table (5). The placing plate (6) is arranged at the top of the rotating tube (700). The bottom end of the U-shaped bracket (800) is fixedly arranged on the rotating tube (700). A driven gear (701) is arranged at the bottom of the rotating tube (700). A driving gear (702) is rotatably arranged inside the processing table (5). The driving gear (702) is meshed with the driven gear (701), and the driving gear (702) is equipped with a driving motor.

5. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 4, characterized in that: A second electric push rod (703) is fixedly arranged inside the processing table (5). The placing plate (6) is inserted into the top of the rotating tube (700) through a socket. The telescopic end of the second electric push rod (703) is rotatably connected to the socket.

6. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 1, characterized in that: The cutting component (9) includes a pair of laser cutting machines (900). The two laser cutting machines (900) are symmetrically arranged at the top of the processing table (5).

7. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 6, characterized in that: A pair of discharge ports are formed at the position of the processing table (5) relative to the laser cutting machine (900). A discharge plate (10) is hingedly arranged at the position of the inside of the processing table (5) relative to the discharge port.

8. The method for manufacturing a bidirectional transmission integrated LED display screen according to claim 7, characterized in that: An incomplete gear (11) is fixedly arranged in the middle of the rotating tube (700). A pair of push rods (12) are slidably arranged inside the processing table (5) through a vertical plate. One ends of the two push rods (12) are fixedly provided with rack plates (13). The two rack plates (13) are meshed with the incomplete gear (11). The other ends of the two push rods (12) are both provided with push blocks (14). The two push blocks (14) are both in contact with the corresponding discharge plate (10). A cushion plate is fixedly arranged in the middle of the push rod (12). A spring (15) is arranged through the position between the vertical plate and the cushion plate in the middle of the push rod (12).

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