Bidirectional transmission integrated LED display screen and manufacturing method thereof
By achieving internal connectivity between 2-pin and 5-pin LEDs in an integrated LED display, the problems of copper foil waste and limited data transmission direction in traditional designs are solved, improving LED utilization and display flexibility, simplifying the production process and reducing costs.
Patent Information
- Application Number
- CN202510198377.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-22
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2045-02-22
AI Technical Summary
The fixed pin functions of traditional integrated LED displays lead to copper foil waste and limited data transmission direction, reducing the utilization rate of LED beads and the flexibility of the display.
The integrated LED display design with bidirectional transmission achieves internal connectivity between pins 2 and 5 by distributing metal pads on both sides of the circuit layer and connecting them with metallized vias, combined with a cover layer to cover the non-metallic pad area. External connecting copper lines are eliminated on the PCB board, supporting signal transmission in any direction.
It saves copper foil material, improves the utilization rate of LED beads and display screen, supports breakpoint resume function, simplifies the production process, reduces processing costs, and improves display effect and production efficiency.
Smart Images

Figure CN119811225B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of LED display, more particularly to a bidirectional transmission integrated LED display screen and a manufacturing method thereof. BACKGROUND
[0002] In the manufacturing process of the conventional integrated LED display screen, the pin functions of each lamp bead are relatively fixed, usually including input pins, output pins and power pins, etc. However, this fixed pin function design leads to waste of copper foil, because in actual application, not all pins will be fully utilized. In addition, the conventional display screen also has limitations in data transmission direction, usually only in one fixed direction for data transmission, which limits the flexibility and application range of the display screen. For example, 2-pin and 5-pin have a pin inside the lamp bead which is empty and does not have any function, which leads to waste of copper wire on the PCB and increases the production cost. At the same time, this design also limits the utilization rate of the lamp bead and reduces the overall performance of the display screen.
[0003] Based on this, we provide a bidirectional transmission integrated LED display screen and a manufacturing method thereof. SUMMARY
[0004] In order to solve the problems raised in the background art, the present application provides a bidirectional transmission integrated LED display screen and a manufacturing method thereof.
[0005] The bidirectional transmission integrated LED display screen provided by the present application adopts the following technical scheme:
[0006] A bidirectional transmission integrated LED display screen, comprising a circuit layer and a covering layer; the circuit layer is distributed with metal pads on both sides, the circuit layer is internally provided with a metallized through hole, and the metallized through hole can connect the metal pads on both sides; the covering layer is positioned and pressed with the circuit layer, covering other parts except the metal pads.
[0007] A manufacturing method of a bidirectional transmission integrated LED display screen, applicable to the bidirectional transmission integrated LED display screen described above, the manufacturing method of the bidirectional transmission integrated LED display screen comprises:
[0008] S1, preparing a circuit layer, forming a plurality of metal pads on both sides of the circuit layer through an etching process, and opening a metallized through hole in the circuit layer, the metallized through hole penetrating through both sides of the circuit layer and connecting the metal pads on both sides correspondingly;
[0009] S2, preparing a covering layer, the covering layer is formed by hot pressing a mixture of epoxy resin and glass fiber material;
[0010] S3, combining the covering layer and the circuit layer through a positioning and pressing process, so that the covering layer covers the area of the circuit layer except the metal pads;
[0011] S4, six metallized vias are arranged on each metal pad in correspondence, sequentially defined as No. 1 to No. 6 metallized vias, and five functional areas are divided on the surface of the metal pad, sequentially as No. 1 to No. 5 functional areas, wherein the No. 2 functional area is connected with the No. 2 and No. 5 metallized vias through an electroplating process;
[0012] S5, fixing the chip / I C on the completed packaging circuit layer, and realizing electrical connection through the metallized vias, and finally using epoxy resin glue for insulation protection.
[0013] Preferably, it also includes a cutting mechanism, the cutting mechanism includes a machining table; a placing plate arranged on the top of the machining table for placing the PCB board; a driving assembly arranged inside the machining table for driving the placing plate to rotate; a fixing assembly arranged on the side of the machining table for fixing the PCB board on the placing plate; a cutting assembly arranged on the top of the machining table for cutting the side edge of the PCB board; wherein the fixing assembly includes a U-shaped support connected to the driving assembly, the top of the U-shaped support is provided with an electric push rod one, the output end of the electric push rod one is equipped with a pressing disc, and the pressing disc is arranged in the central area of the placing plate.
[0014] Preferably, the driving assembly includes a rotating pipe rotatably arranged inside the machining table, the placing plate is arranged at the top end of the rotating pipe, the bottom end of the U-shaped support is fixedly arranged on the rotating pipe, the bottom of the rotating pipe is provided with a driven gear, the inside of the machining table is rotatably provided with a driving gear, the driving gear is meshed and connected with the driven gear, and the driving gear is provided with a driving motor.
[0015] Preferably, an electric push rod two is fixedly arranged inside the machining table, the placing plate is inserted into the top end of the rotating pipe through a sleeve, and the telescopic end of the electric push rod two is rotatably connected with the sleeve.
[0016] Preferably, the cutting assembly includes a pair of laser cutting machines, and the two laser cutting machines are symmetrically arranged on the top of the machining table.
[0017] Preferably, a pair of discharge openings are arranged on the position of the machining table relative to the laser cutting machines, and a discharge plate is hingedly arranged inside the machining table relative to the position of the discharge openings.
[0018] Preferably, an incomplete gear is fixedly installed in the middle of the rotating tube, a pair of push rods are slidably installed inside the processing table via a vertical plate, and a rack plate is fixedly installed at one end of each of the two push rods. The two rack plates are meshed with the incomplete gear, and a push block is installed at the other end of each of the two push rods. The two push blocks are in contact with the corresponding discharge plate. A pad is fixedly installed in the middle of the push rod, and a spring is inserted through the middle of the push rod at the position between the vertical plate and the pad.
[0019] In summary, the present invention has the following beneficial technical effects:
[0020] 1. By connecting pins 2 and 5 internally, the electronic assembly design saves copper foil, allowing data transmission from either end of the display screen's transmission direction. It also supports breakpoint resume functionality, enabling upstream and downstream components to achieve better display effects using a single pin configuration. This significantly reduces processing costs and improves the utilization rate of LED chips / display screens. Furthermore, it allows for bidirectional transmission using a single LED chip, simplifying the design and production process, improving production efficiency, and reducing waste in line switching, materials, and labor.
[0021] 2. The pressing plate is moved downwards by the electric push rod, making it contact the PCB board, thus fixing the PCB board. Next, the cutting assembly cuts two sides of the PCB board. Then, the drive assembly rotates the placement plate 90 degrees, aligning the other two sides of the PCB board with the cutting assembly, which then cuts the other sides. This structural design achieves stable fixing of the PCB board. This fixing method effectively prevents the PCB board from shifting during the cutting process, thus ensuring the precision and accuracy of the cutting.
[0022] 3. The motor drives the drive gear to rotate, which in turn causes the driven gear to rotate. The rotation of the driven gear causes the rotating tube to rotate, which in turn causes the C-shaped bracket and the placement board to rotate synchronously. This structural design makes it easy to rotate the PCB board after it is fixed for cutting on different sides.
[0023] 4. When the rotating tube rotates, the incomplete gear will rotate, which will drive the two rack plates to move away from each other. This will drive the push block to rotate the discharge plate through the corresponding push rod. When the incomplete gear is not in contact with the rack plate, the compressed spring will extend, thereby driving the push block away from the discharge plate. Through this structural design, the discharge plate can be shaken, causing the waste material remaining on the discharge plate to fall off.
[0024] The above summary is intended to illustrate only and is not intended to limit the application in any way. Further aspects, embodiments and features of the application will be apparent from the detailed description that follows, taken in conjunction with the accompanying drawings and the description of the state of the art. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 is a structural schematic diagram of a circuit layer in an embodiment of the application;
[0026] Figure 2 is a structural schematic diagram of a covering layer in an embodiment of the application;
[0027] Figure 3 is a structural schematic diagram of a metallized via and a functional area in an embodiment of the application;
[0028] Figure 4 is a circuit diagram of an integrated LED display screen for bidirectional transmission in an embodiment of the application;
[0029] Figure 5 is a structural schematic diagram of a cutting mechanism in an embodiment of the application;
[0030] Figure 6 is a structural schematic diagram of the other side of a cutting mechanism in an embodiment of the application;
[0031] Figure 7 is a structural schematic diagram of the inside of a cutting mechanism in an embodiment of the application;
[0032] Figure 8 is a structural schematic diagram of the top view of a cutting mechanism in an embodiment of the application;
[0033] Figure 9 is a structural schematic diagram of the inside of a rotating tube in an embodiment of the application.
[0034] BRIEF DESCRIPTION OF DRAWINGS 1, circuit layer; 2, covering layer; 3, metal pad; 4, metallized via; 5, processing table; 6, placement plate; 7, driving assembly; 700, rotating tube; 701, driven gear; 702, driving gear; 703, electric push rod two; 8, fixing assembly; 800, U-shaped support; 801, electric push rod one; 802, pressing disc; 9, cutting assembly; 900, laser cutting machine; 10, discharge plate; 11, incomplete gear; 12, push rod; 13, rack plate; 14, push block; 15, spring. DETAILED DESCRIPTION
[0035] The following will be described in detail below in conjunction with the accompanying drawings Figures 1 to 9 The application will be described in further detail.
[0036] Note that the drawings are schematic and not drawn to scale. The relative dimensions and proportions of the parts of the drawings shown are exaggerated or reduced for the sake of clarity and convenience in the drawings and are not limiting. It is also to be understood that the specific structural and functional details illustrated represent exemplary embodiments and that the specification is supported by a range of alternative embodiments.
[0037] Embodiment one
[0038] The embodiment of the present application discloses a bidirectional transmission integrated LED display screen. Referring to Figures 1 to 2 A bidirectional transmission integrated LED display screen, comprising a circuit layer 1 and a cover layer 2; the circuit layer 1 is distributed with metal pads 3 on both sides, and the circuit layer 1 is internally provided with metallized through holes 4, and the metallized through holes 4 can connect the metal pads 3 on both sides; the cover layer 2 is positioned and compressed with the circuit layer 1, and covers other parts except the metal pads 3.
[0039] Embodiment two
[0040] A manufacturing method of a bidirectional transmission integrated LED display screen, suitable for the bidirectional transmission integrated LED display screen, the manufacturing method of the bidirectional transmission integrated LED display screen comprises:
[0041] S1, preparing a circuit layer 1, forming a plurality of metal pads 3 on both sides of the circuit layer 1 through an etching process, and internally providing the circuit layer 1 with metallized through holes 4, the metallized through holes 4 penetrating both sides of the circuit layer 1 and connecting the metal pads 3 on both sides correspondingly;
[0042] S2, preparing a cover layer 2, the cover layer 2 being formed by hot pressing after mixing epoxy resin and glass fiber material;
[0043] S3, combining the cover layer 2 and the circuit layer 1 through a positioning and compression process, so that the cover layer 2 covers the area of the circuit layer 1 except the metal pads 3;
[0044] S4, six metallized through holes 4 are arranged on each metal pad 3, and are sequentially defined as No. 1 to No. 6 metallized through holes, and five functional areas are divided on the surface of the metal pad 3, and are sequentially No. 1 to No. 5 functional areas, wherein the No. 2 functional area is connected with the No. 2 metallized through hole and the No. 5 metallized through hole through an electroplating process;
[0045] S5, fixing a chip / I C on the packaged circuit layer 1, and realizing electrical connection through the metallized through holes 4, and finally using epoxy resin glue for insulation protection.
[0046] Specifically, as Figure 3As shown, the single unit has 6 metalized through holes connected with the metal pads 3 on the back, and 5 functional areas are built in, among which the No. 2 functional area is connected with the No. 2 and No. 5 metalized through holes, so that the No. 2 and No. 5 pins are connected within the package. The metalized through hole 4 is plugged with solder resist ink, which can effectively prevent the side pin from being exposed to light and metal oxidation. Except for the functional areas, other parts are covered by the cover layer 2.
[0047] As shown in the design diagram of the LED display circuit for bidirectional transmission, the VDD / GND is connected to the back of the PCB through the metalized through hole 4, and the power supply is provided through the back. Figure 4
[0048] The design circuit on the market connects the No. 2 pin and the No. 5 pin on the PCB, while the No. 2 / 5 pin in the lamp bead is a pin without any function, which causes the waste of PCB copper wire, and the function of the lamp bead package pin is not effectively utilized. The integrated LED for bidirectional transmission of the LED display screen connects the No. 2 pin and the No. 5 pin internally, so that the design of electronic assembly saves the copper foil, can transmit data at any end of the display screen, and supports the function of breakpoint continuation, so that the upstream and downstream can use one pin to achieve better display effect, greatly reduces the processing cost, and improves the utilization rate of the lamp bead / display screen.
[0049] Through the structure design, the electronic assembly of the lamp bead has greater thrust; the use of flat pins of the lamp bead makes the display screen have less side reflection and better display effect; the internal structure 2 / 5 of the lamp bead is connected, reducing the waste of copper wire; at the same time, one lamp bead can achieve the effect of bidirectional transmission; the production efficiency is higher, the waste of line switching, materials and labor is reduced, the reliability of the lamp bead is higher, and the heat dissipation is better.
[0050] Specifically, the pin definition is as follows: the No. 1 / 4 pin is an I / O pin (bidirectional transmission), the No. 2 / 5 pin is a main input pin (DIN), and the No. 3 / 6 pin is a power pin (VDD / GND);
[0051] In the PCB design, the external No. 2 / 5 pin connecting copper wire is cancelled, and the internal No. 2-5 pin conduction characteristic is utilized, so that the signal can be transmitted in any direction (forward or reverse);
[0052] When a lamp bead fails, the signal can bypass through the I / O pin of the adjacent lamp bead to ensure the continuity of the display picture.
[0053] Embodiment three
[0054] This embodiment is further optimized on the basis of the above-mentioned embodiment two, and the same parts as the foregoing technical solutions will not be described here again, as Figure 5 and Figure 6 As shown, further, to better achieve the present application, particularly using the following manner of setting: the embodiment also includes cutting mechanism, cutting mechanism includes processing table 5, 6, placing plate, drive assembly 7, fixed assembly 8 and cutting assembly 9; processing table 5; placing plate 6 is arranged on the top of processing table 5, for placing PCB board; drive assembly 7 is arranged in the inside of processing table 5, for driving placing plate 6 to rotate; fixed assembly 8 is arranged on the side of processing table 5, for fixing the PCB board on placing plate 6; cutting assembly 9 is arranged on the top of processing table 5, for cutting the side edge of PCB board; wherein, fixed assembly 8 includes connected on the drive assembly 7 on the top of the U-shaped bracket 800, the U-shaped bracket 800 is provided with electric push rod one 801, the output end of electric push rod one 801 is equipped with pressing disc 802, pressing disc 802 is arranged in the central region of placing plate 6, the top of placing plate 6 is provided with rubber pad.
[0055] Specifically, in the cutting operation, all cutting operations need to be completed at one time, otherwise when one side of the PCB board is cut, the PCB board loses the limiting of the slot, so that the PCB board will be offset during processing, which may cause the cutting precision to decrease, and even damage the PCB board;
[0056] By placing the prepared PCB board on the top of placing plate 6, then pushing pressing disc 802 down by electric push rod one 801, so that pressing disc 802 contacts the PCB board, thereby completing the fixation of the PCB board, then cutting the two side edges of the PCB board by cutting assembly 9, then driving placing plate 6 to rotate by ninety degrees by drive assembly 7, so that the other two sides of the PCB board are aligned with cutting assembly 9, and the other side edges are cut by cutting assembly 9, through the structure design, the stable fixation of the PCB board is realized. This fixation mode can effectively prevent the PCB board from being offset during cutting, thereby ensuring the cutting precision and accuracy.
[0057] As shown in the figure, Figure 6 With Figure 7 As shown, drive assembly 7 includes rotating tube 700 rotatingly arranged in the inside of processing table 5, placing plate 6 is arranged on the top end of rotating tube 700, the bottom end of U-shaped bracket 800 is fixedly arranged on rotating tube 700, the bottom of rotating tube 700 is provided with driven gear 701, and the inside of processing table 5 is provided with driving gear 702 rotatingly arranged, driving gear 702 is meshingly connected with driven gear 701, and driving gear 702 is provided with driving motor.
[0058] Specifically, for the use of drive assembly 7, driving gear 702 is driven to rotate by motor, thereby driving driven gear 701 to rotate, driven gear 701 rotating drives rotating tube 700 to rotate, thereby driving U-shaped bracket 800 and placing plate 6 to synchronously rotate, through the structure design, the PCB board is convenient to rotate for edge changing cutting after being fixed.
[0059] As Figure 9 shown, the inside of the processing table 5 is fixedly provided with an electric push rod two 703, and the placement plate 6 is inserted into the top end of the rotating pipe 700 through a sleeve, and the telescopic end of the electric push rod two 703 is rotationally connected with the sleeve.
[0060] Specifically, when the PCB is taken, the placement plate 6 is pushed upward by the electric push rod two 703, so that the cut PCB is conveniently taken. The placement plate 6 is inserted into the rotating pipe 700 through the sleeve, and when the rotating pipe 700 rotates, the placement plate 6 can be driven to rotate by the sleeve.
[0061] As Figure 5 , Figure 6 and Figure 7 shown, the cutting assembly 9 includes a pair of laser cutting machines 900, and the two laser cutting machines 900 are symmetrically arranged on the top of the processing table 5.
[0062] Specifically, the laser cutting machine 900 is arranged on the top of the processing table 5 through a horizontal moving mechanism, the horizontal moving mechanism can drive the laser cutting machine 900 to reciprocate, and the two laser cutting machines 900 work synchronously, so that the cutting of both sides of the PCB can be completed at one time.
[0063] As Figure 6 shown, a pair of discharge ports are arranged on the processing table 5 relative to the position of the laser cutting machine 900, and a discharge plate 10 is hingedly arranged inside the processing table 5 relative to the position of the discharge port.
[0064] Specifically, the cut waste can be discharged through the discharge plate 10.
[0065] As Figure 8 shown, the middle part of the rotating pipe 700 is fixedly provided with an incomplete gear 11, and a pair of push rods 12 are slidingly arranged inside the processing table 5 through a vertical plate, and one end of each of the two push rods 12 is fixedly provided with a rack plate 13, the two rack plates 13 are meshingly connected with the incomplete gear 11, the other end of each of the two push rods 12 is provided with a push block 14, and the two push blocks 14 are in contact with the corresponding discharge plates 10. The middle part of the push rod 12 is fixedly provided with a pad, and the spring 15 is arranged between the vertical plate and the pad.
[0066] Specifically, considering that waste materials can be accumulated on the discharge plate 10, when the rotating tube 700 rotates, the incomplete gear 11 rotates, thereby driving the two rack plates 13 to move away from each other, and through the corresponding push rod 12, the push block 14 drives the discharge plate 10 to rotate, and when the incomplete gear 11 does not contact the rack plate 13, the compressed spring 15 expands, thereby driving the push block 14 away from the discharge plate 10, through the structure design, thereby the discharge plate 10 can be shaken, so that the waste materials remaining on the discharge plate 10 fall off.
[0067] Specifically, the control mode of the present application is controlled by a controller, and the control circuit of the controller can be realized by simple programming by those skilled in the art, and the control mode and circuit connection are not explained in detail here.
[0068] The standard parts used in the present application can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings, and the specific connection mode of each part adopts the conventional means such as bolts, rivets and welding in the prior art, the mechanical parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection mode in the prior art, which will not be described in detail here.
[0069] In the description of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0070] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0071] In the present disclosure, unless specifically defined otherwise, a first feature "on" or "under" a second feature can mean that the first and second features are directly in contact with each other, or that the first and second features are indirectly in contact with each other through an intermediate medium. Also, a first feature "over", "above" and "on top of" a second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. A first feature "under", "below" and "underneath" a second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.
[0072] In the description of the present disclosure, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. The illustrative description of the above terms in the present disclosure does not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present disclosure and the features of the different embodiments or examples, without contradiction.
[0073] In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can be referred to the general design. In the case of no conflict, the same embodiment and different embodiments of the present disclosure can be combined with each other.
[0074] Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. An integrated LED display screen with bidirectional transmission, characterized in that, include: Line layer (1) and shielding layer (2); The circuit layer (1) has metal pads (3) distributed on both sides. Metallized vias (4) are opened inside the circuit layer (1), and the metallized vias (4) can connect the metal pads (3) on both sides. The cover layer (2) is positioned and pressed together with the circuit layer (1) to cover the parts other than the metal pad (3); The manufacturing method of a bidirectional transmission integrated LED display includes: S1. Prepare a circuit layer (1). Form multiple metal pads (3) on both sides of the circuit layer (1) by etching process, and open metallized vias (4) inside the circuit layer (1). The metallized vias (4) penetrate both sides of the circuit layer (1) and connect the metal pads (3) on both sides accordingly. S2. Prepare the covering layer (2). The covering layer (2) is formed by hot pressing after mixing epoxy resin and glass fiber material. S3. The masking layer (2) and the circuit layer (1) are combined by positioning and pressing process so that the masking layer (2) covers the area of the circuit layer (1) except for the metal pads (3). S4. Six metallized vias (4) are set on each metal pad (3), which are defined as metallized vias No. 1 to No. 6 in sequence. At the same time, five functional areas are divided on the surface of the metal pad (3), which are functional areas No. 1 to No. 5 in sequence. Among them, functional area No. 2 is connected to metallized vias No. 2 and No. 5 through electroplating process. S5. Fix the chip / IC on the encapsulated circuit layer (1) and make electrical connections through the metallized via (4). Finally, use epoxy resin for insulation protection. It also includes a cutting mechanism, which comprises: Processing table (5); A placement plate (6) is set on top of the processing table (5) for placing PCB boards; A drive assembly (7) is disposed inside the processing table (5) and is used to drive the placement plate (6) to rotate; A fixing component (8) is provided on the side of the processing table (5) for fixing the PCB board on the placement plate (6); A cutting assembly (9) is disposed on the top of the processing table (5) for cutting the side of the PCB board; The fixing component (8) includes a U-shaped bracket (800) connected to the driving component (7). The top of the U-shaped bracket (800) is provided with an electric push rod (801). The output end of the electric push rod (801) is equipped with a pressing plate (802). The pressing plate (802) is arranged in the central area of the placement plate (6). The drive assembly (7) includes a rotating tube (700) rotatably disposed inside the processing table (5), a placement plate (6) disposed at the top of the rotating tube (700), a U-shaped bracket (800) fixedly disposed at the bottom of the rotating tube (700), a driven gear (701) disposed at the bottom of the rotating tube (700), a drive gear (702) rotatably disposed inside the processing table (5), the drive gear (702) meshing with the driven gear (701), and the drive gear (702) equipped with a drive motor.
2. The integrated LED display screen with bidirectional transmission according to claim 1, characterized in that: The processing table (5) is fixedly equipped with an electric push rod two (703), and the placement plate (6) is inserted into the top of the rotating tube (700) through a plug sleeve. The telescopic end of the electric push rod two (703) is rotatably connected to the plug sleeve.
3. The integrated LED display screen with bidirectional transmission according to claim 1, characterized in that: The cutting assembly (9) includes a pair of laser cutters (900), which are symmetrically arranged on the top of the processing table (5).
4. The integrated LED display screen for bidirectional transmission according to claim 3, characterized in that: The processing table (5) has a pair of discharge ports at a position relative to the laser cutting machine (900), and a discharge plate (10) is hinged inside the processing table (5) at a position relative to the discharge ports.
5. The integrated LED display screen for bidirectional transmission according to claim 4, characterized in that: An incomplete gear (11) is fixedly installed in the middle of the rotating tube (700). A pair of push rods (12) are slidably installed inside the processing table (5) through the vertical plate. One end of each of the two push rods (12) is fixedly provided with a rack plate (13). The two rack plates (13) mesh with the incomplete gear (11). The other end of each of the two push rods (12) is provided with a push block (14). The two push blocks (14) are in contact with the corresponding discharge plate (10). A pad is fixedly installed in the middle of the push rod (12). A spring (15) passes through the middle of the push rod (12) between the vertical plate and the pad.
Citation Information
Patent Citations
LED lamp bead with four-wire internally-sealed IC with bidirectional data transmission function
CN111768721A
Circuit board circuit detection workbench
CN115502939A