Integrated module of transmitting end of photon terahertz wireless communication system

Abstract

The invention discloses an integrated module of a transmitting end of a photon terahertz wireless communication system, and the integrated module is characterized in that an optical signal transmitted by a tunable laser chip is focused by a focusing module and then enters a modulation coupler chip through a signal input end of the modulation coupler chip; the modulation driver chip is used for sending a modulation driving signal to the modulation coupler chip so as to control the working state of the modulation coupler chip; the signal output end of the modulation coupler chip is correspondingly coupled and connected with the signal receiving end of the antenna photodiode chip, and the modulation coupler chip is used for modulating the received optical signal according to the modulation driving signal to generate a modulated optical signal; the modulated optical signal is transmitted to the antenna photodiode chip through the signal output end; and the antenna photodiode chip is used for converting the received modulated optical signal into an electromagnetic wave signal and radiating the electromagnetic wave signal to a free space. The system is high in integration level, low in energy consumption and more flexible in application scene.

Description

Technical Field

[0001] The invention relates to the technical field of optoelectronics and photon wireless communication, and in particular to an integrated module of a transmitting end of a photon terahertz wireless communication system. Background Art

[0002] As wireless communication bandwidth continues to increase, traditional electronic technology can no longer meet the demand for increased transmission rates. The generation of terahertz wave signals using photonics technology is not affected by the processing speed bottleneck of electronic technology. At the same time, combined with the low loss and high transmission bandwidth characteristics of optoelectronic communication itself, the transmission distance of the signal can be increased, thus overcoming the shortcoming of the short transmission distance of wireless signals themselves.

[0003] In the prior art, due to the large number of discrete devices in the photonic terahertz wireless communication system, the entire terahertz wireless communication system has a complex structure, a large volume, and high energy consumption, which in turn leads to many restrictions on the application scenarios of the terahertz wireless communication system. Summary of the invention

[0004] The present invention provides an integrated module for a transmitting end of a photonic terahertz wireless communication system, so as to improve integration, reduce energy consumption, and adapt to various application scenarios.

[0005] According to one aspect of the present invention, an integrated module of a transmitting end of a photonic terahertz wireless communication system is provided, the integrated module comprising:

[0006] Base, circuit board, tunable laser chipset, focusing module, modulation coupler chip, modulation driver chip and antenna photodiode module;

[0007] The circuit board is arranged on one surface of the base; the adjustable laser chipset, the modulation coupler chip, the modulation driver chip and the antenna photodiode module are arranged on the circuit board; and the focusing module is arranged on the base;

[0008] The tunable laser chip group includes a first tunable laser chip and a second tunable laser chip, and the focusing module includes a first focusing unit and a second focusing unit; the modulation coupler chip includes a first signal input end, a second signal input end and a signal output end; the laser emission port of the first tunable laser chip is coupled and connected with the first signal input end of the modulation coupler chip through the first focusing unit, and the laser emission port of the second tunable laser chip is coupled and connected with the second signal input end of the modulation coupler chip through the second focusing unit, so that the optical signal emitted by the tunable laser chip is focused by the focusing module and then enters the modulation coupler chip through the signal input end of the modulation coupler chip;

[0009] The modulation driver chip is electrically connected to the modulation coupler chip, and the modulation driver chip is used to send a modulation drive signal to the modulation coupler chip to control the working state of the modulation coupler chip;

[0010] The signal output end of the modulation coupler chip is coupled and connected correspondingly to the signal receiving end of the antenna photodiode module. The modulation coupler chip is used to modulate the received optical signal according to the modulation drive signal to generate a modulated optical signal, and transmit the modulated optical signal to the antenna photodiode module through the signal output end; the antenna photodiode module is used to convert the received modulated optical signal into an electromagnetic wave signal, and radiate the electromagnetic wave signal into free space.

[0011] Furthermore, the modulation coupler chip includes:

[0012] A first mode spot converter, a second mode spot converter, a third mode spot converter, a modulator chip and an optical coupler;

[0013] The first pattern spot converter is arranged at the first signal input end of the modulation coupler chip, the second pattern spot converter is arranged at the second signal input end of the modulation coupler chip, the third pattern spot converter is arranged at the signal output end of the modulation coupler chip, and the first pattern spot converter is connected to the input end of the modulator chip; the output end of the modulator chip is connected to the first end of the optical coupler, the second pattern spot converter is connected to the second end of the optical coupler, and the third end of the optical coupler is connected to the third pattern spot converter.

[0014] Further, the antenna photodiode module includes:

[0015] A third focusing unit and a waveguide antenna photodiode output chip;

[0016] The signal output end of the modulation coupler chip is arranged to be focused and coupled with the signal receiving end of the waveguide antenna photodiode output chip through the third focusing unit, so that the modulated light signal emitted by the modulation coupler chip is focused by the third focusing unit and enters the waveguide antenna photodiode output chip;

[0017] The waveguide antenna photodiode output chip is used to convert the received modulated optical signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

[0018] Further, the waveguide antenna photodiode output chip includes:

[0019] a first substrate;

[0020] A first insulating film layer, the first insulating film layer is arranged on one side of the first substrate;

[0021] A fourth mode spot converter, which is arranged at a signal receiving end of the waveguide antenna photodiode output chip and at a side of the first substrate close to the first insulating film layer;

[0022] A fifth optical waveguide structure, wherein the fifth optical waveguide structure is arranged on a side of the first substrate close to the first insulating film layer, and one end of the fifth optical waveguide structure is connected to the fourth mode spot converter, and the first insulating film layer covers a portion of the fifth optical waveguide structure away from the fourth mode spot converter;

[0023] A first photodiode, the first photodiode is arranged on a side of the fifth optical waveguide structure away from the first substrate, and the first photodiode is arranged away from the fourth spot converter, and the sum of the thickness of the first photodiode and the thickness of the fifth optical waveguide structure is greater than or equal to the thickness of the first insulating film layer;

[0024] The first terahertz antenna is arranged on a side of the first insulating film layer away from the first substrate, and the electrode end of the first photodiode passes through the first insulating film layer and is connected to the first terahertz antenna.

[0025] Further, the antenna photodiode module includes:

[0026] Optical fiber transmission unit and surface-incident antenna photodiode output chip;

[0027] The signal receiving end of the optical fiber transmission unit is connected to the signal output end of the modulation coupler chip, and the signal output end of the optical fiber transmission unit is correspondingly coupled and connected to the signal receiving end of the surface-incident antenna photodiode output chip; the optical fiber transmission unit is used to receive the modulated optical signal, and transmit the modulated optical signal to the surface-incident antenna photodiode output chip through the signal output end of the optical fiber transmission unit;

[0028] The surface-incident antenna photodiode output chip is used to convert the received modulated optical signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

[0029] Furthermore, the optical fiber transmission unit includes:

[0030] An optical fiber array output portion and an optical fiber array support portion;

[0031] The first signal receiving end of the optical fiber array output part is connected to the signal output end of the modulation coupler chip, and the signal output end of the optical fiber array output part is correspondingly coupled and connected to the signal receiving end of the surface-incident antenna photodiode output chip;

[0032] The optical fiber array output portion is fixed on the circuit board through the optical fiber array support portion.

[0033] Furthermore, the surface-incident antenna photodiode output chip includes:

[0034] a second substrate;

[0035] A second insulating film layer, the second insulating film layer is arranged on one side of the second substrate and covers the second substrate;

[0036] A second photodiode, wherein the second photodiode is embedded in the second insulating film, and a photosensitive layer of the second photodiode is exposed outside the second insulating film layer;

[0037] The second terahertz antenna is arranged on a side of the second insulating film layer away from the second substrate, and the electrode end of the second photodiode passes through the second insulating film layer and is connected to the second terahertz antenna.

[0038] Further, the first focusing unit includes a first focusing lens and a first lens base;

[0039] The first focusing lens is fixed on the base through a first lens base;

[0040] The second focusing unit includes a second focusing lens and a second lens base;

[0041] The second focusing lens is fixed on the base through a second lens base.

[0042] Furthermore, the modulator chip includes a Mach-Zehnder modulator chip.

[0043] Further, the third focusing unit includes a third focusing lens and a third lens base;

[0044] The third focusing lens is fixed on the base through a third lens base.

[0045] The integrated module of the transmitting end of the photon terahertz wireless communication system provided in the embodiment of the present invention includes: a base, a circuit board, an adjustable laser chipset, a focusing module, a modulation coupler chip, a modulation driver chip and an antenna photodiode module. The circuit board is arranged on one side of the base, the adjustable laser chipset, the modulation coupler chip, the modulation driver chip and the antenna photodiode module are arranged on the circuit board, and the focusing module is arranged on the base. The laser emission port of the first adjustable laser chip is coupled and connected with the first signal input end of the modulation coupler chip through the first focusing unit, and the laser emission port of the second adjustable laser chip is coupled and connected with the second signal input end of the modulation coupler chip through the second focusing unit, so that the optical signal emitted by the adjustable laser chip is focused by the focusing module and enters the modulation coupler chip through the signal input end of the modulation coupler chip. The modulation driver chip is electrically connected with the modulation coupler chip to control the working state of the modulation coupler chip through the modulation driver chip. The signal output end of the modulation coupler chip is set corresponding to the signal receiving end of the antenna photodiode module, so that the modulation coupler chip modulates the received optical signal according to the modulation drive signal, generates a modulated optical signal, and transmits the modulated optical signal to the antenna photodiode module through the signal output end. The antenna photodiode module converts the received modulated optical signal into an electromagnetic wave signal and radiates the electromagnetic wave signal into free space. Compared with the prior art in which the transmitting end of the photonic terahertz wireless communication system is composed of discrete devices, the system is large, the structure is complex and the energy consumption is high, the integrated module of the transmitting end of the photonic terahertz wireless communication system provided in the embodiment of the present invention integrates the adjustable laser chipset, the focusing module, the modulation coupler chip, the modulation driver chip and the antenna photodiode module on the base and the circuit board, which is smaller in size, higher in integration, more compact in structure, better in portability, lower in energy consumption and can adapt to various application scenarios.

[0046] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0048] Figure 1 It is a schematic structural diagram of an integrated module of a transmitting end of a photonic terahertz wireless communication system provided according to an embodiment of the present invention;

[0049] Figure 2 is a schematic structural diagram of a modulation coupler chip provided according to an embodiment of the present invention;

[0050] Figure 3 is a top view of a waveguide antenna photodiode output chip provided according to an embodiment of the present invention;

[0051] Figure 4 yes Figure 3 Schematic diagram of the cross section along the A-A' direction;

[0052] Figure 5 is a schematic structural diagram of an integrated module of another photonic terahertz wireless communication system transmitting end provided in an embodiment of the present invention;

[0053] Figure 6 1 is a schematic diagram of an optoelectronic packaging structure of a surface-incident antenna photodiode output chip provided in an embodiment of the present invention;

[0054] Figure 7 is a top view of a surface-incident antenna photodiode output chip provided according to an embodiment of the present invention;

[0055] Figure 8 yes Figure 7 Schematic diagram of the cross section along the B-B' direction. DETAILED DESCRIPTION

[0056] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0057] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0058] The embodiment of the present invention provides an integrated module of a transmitting end of a photonic terahertz wireless communication system. Figure 1 is a schematic diagram of the structure of an integrated module of a transmitting end of a photonic terahertz wireless communication system provided according to an embodiment of the present invention, with reference to Figure 1 , integrated modules include:

[0059] Base 1, circuit board 2, adjustable laser chipset 3, focusing module, modulation coupler chip 5, modulation driver chip 6 and antenna photodiode module 7;

[0060] The circuit board 2 is arranged on a surface of the base 1; the adjustable laser chipset 3, the modulation coupler chip 5, the modulation driver chip 6 and the antenna photodiode module 7 are arranged on the circuit board 2; and the focusing module is arranged on the base 1;

[0061] The tunable laser chip group 3 includes a first tunable laser chip 31 and a second tunable laser chip 32, and the focusing module includes a first focusing unit 41 and a second focusing unit 42; the modulation coupler chip 5 includes a first signal input end, a second signal input end and a signal output end; the laser emission port of the first tunable laser chip 31 is coupled and connected with the first signal input end of the modulation coupler chip 5 through the first focusing unit 41, and the laser emission port of the second tunable laser chip 32 is coupled and connected with the second signal input end of the modulation coupler chip 5 through the second focusing unit 42, so that the optical signal emitted by the tunable laser chip is focused by the focusing module and enters the modulation coupler chip 5 through the signal input end of the modulation coupler chip 5;

[0062] The modulation driver chip 6 is electrically connected to the modulation coupler chip 5, and the modulation driver chip 6 is used to send a modulation drive signal to the modulation coupler chip 5 to control the working state of the modulation coupler chip 5;

[0063] The signal output end of the modulation coupler chip 5 is coupled and connected correspondingly to the signal receiving end of the antenna photodiode module 7. The modulation coupler chip 5 is used to modulate the received optical signal according to the modulation drive signal, generate a modulated optical signal, and transmit the modulated optical signal to the antenna photodiode module 7 through the signal output end; the antenna photodiode module 7 is used to convert the received modulated optical signal into an electromagnetic wave signal, and radiate the electromagnetic wave signal into free space.

[0064] The modulation coupler chip 5 may be made of silicon on insulator, thin-film lithium niobate, III-V compound semiconductor materials, etc., which are not limited in the embodiment of the present invention. The base 1 may be made of copper, alloy, etc., which are not limited in the embodiment of the present invention. The first focusing unit 41 and the second focusing unit 42 may be focusing lenses.

[0065] Specifically, after completing the design and preparation of the modulation coupler chip 5 and the antenna photodiode module 7, first, fix the designed circuit board 2 on the base 1 by screws. Then, mount the modulation coupler chip 5 and the modulation driver chip 6 on the circuit board 2 and complete the corresponding binding wire connection. Secondly, mount the two adjustable laser chips in the adjustable laser group 3 on the pre-designed positions on the circuit board 2, and adjust the focusing module to focus the optical signal emitted by the adjustable laser group 3 on the center position of the signal input end of the modulation coupler chip 5, thereby achieving the maximum optical coupling efficiency between the laser in the adjustable laser chip and the modulation coupler chip 5, and fix the focusing module at this position. Finally, mount the antenna photodiode module 7 on the circuit board 2, and couple the signal output end of the modulation coupler chip 5 with the signal receiving end of the antenna photodiode module 7.

[0066] When the integrated module at the transmitting end of the photonic terahertz wireless communication system is in working state, the optical signals output by the two adjustable laser chips in the adjustable laser chipset 3 are focused by the focusing module and then transmitted to the modulation coupler chip 5. After receiving the modulation driving signal, the modulation coupler chip 5 modulates one of the optical signals according to the modulation driving signal, couples the processed optical signal with the other optical signal to generate a modulated optical signal, and transmits the modulated optical signal to the antenna photodiode module 7 through the signal output end, so as to convert the received modulated optical signal into an electromagnetic wave signal and radiate it into free space.

[0067] The integrated module of the transmitting end of the photon terahertz wireless communication system provided in the embodiment of the present invention comprises: a base 1, a circuit board 2, an adjustable laser chipset 3, a focusing module, a modulation coupler chip 5, a modulation driver chip 6 and an antenna photodiode module 7. By setting the circuit board 2 on one side of the base 1, the adjustable laser chipset 3, the modulation coupler chip 5, the modulation driver chip 6 and the antenna photodiode module 7 are set on the circuit board 2, and the focusing module is set on the base 1. The laser emission port of the first adjustable laser chip 31 is coupled and connected with the first signal input end of the modulation coupler chip 5 through the first focusing unit 41, and the laser emission port of the second adjustable laser chip 32 is coupled and connected with the second signal input end of the modulation coupler chip 5 through the second focusing unit 42, so that the optical signal emitted by the adjustable laser chip is focused by the focusing module and enters the modulation coupler chip 5 through the signal input end of the modulation coupler chip 5. The modulation driver chip 6 is electrically connected to the modulation coupler chip 5, so that the working state of the modulation coupler chip 5 is controlled by the modulation driver chip 6. The signal output end of the modulation coupler chip 5 is set corresponding to the signal receiving end of the antenna photodiode module 7, so that the modulation coupler chip 5 modulates the received optical signal according to the modulation drive signal to generate a modulated optical signal, and transmits the modulated optical signal to the antenna photodiode module 7 through the signal output end. The antenna photodiode module 7 converts the received modulated optical signal into an electromagnetic wave signal and radiates the electromagnetic wave signal into free space. Compared with the prior art in which the transmitting end of the photonic terahertz wireless communication system is composed of discrete devices, the system is large, the structure is complex and the energy consumption is high, the integrated module of the transmitting end of the photonic terahertz wireless communication system provided in the embodiment of the present invention integrates the adjustable laser chipset 3, the focusing module, the modulation coupler chip 5, the modulation driver chip 6 and the antenna photodiode module 7 on the base 1 and the circuit board 2, which has a smaller size, a higher integration, a more compact structure, better portability, lower energy consumption and can adapt to various application scenarios.

[0068] Furthermore, Figure 2 is a schematic diagram of the structure of a modulation coupler chip provided according to an embodiment of the present invention, with reference to Figure 1 and Figure 2 , the modulation coupler chip includes:

[0069] A first spot converter 51, a second spot converter 52, a third spot converter 53, a modulator chip 54 and an optical coupler 55;

[0070] The first pattern spot converter 51 is arranged at the first signal input end of the modulation coupler chip, the second pattern spot converter 52 is arranged at the second signal input end of the modulation coupler chip, and the third pattern spot converter 53 is arranged at the signal output end of the modulation coupler chip. The first pattern spot converter 51 is connected to the input end of the modulator chip 54; the output end of the modulator chip 54 is connected to the first end of the optical coupler 55, the second pattern spot converter 52 is connected to the second end of the optical coupler 55, and the third end of the optical coupler 55 is connected to the third pattern spot converter 53.

[0071] Specifically, after the first optical signal emitted by the first adjustable laser chip 31 is focused by the first focusing unit 41, it is received by the first spot converter 51 at the first signal input end, and the received first optical signal is transmitted to the input end of the modulator chip 54 through the first spot converter 51. Exemplarily, the first optical signal received by the first spot converter 51 can be coupled to the first optical waveguide structure 56, and transmitted to the input end of the modulator chip 54 through the first optical waveguide structure 56. The modulator chip 54 modulates the received first optical signal, loads the set data signal onto the first optical signal, and then generates a first modulated optical signal, and transmits the first modulated optical signal to the optical coupler 55. Exemplarily, the first modulated optical signal can be transmitted to the optical coupler 55 through the second optical waveguide structure 57.

[0072] The second optical signal emitted by the second tunable laser chip 32 is focused by the second focusing unit 42, and then received by the second spot converter 52 at the second signal input end, and the received second optical signal is transmitted to the second end of the optical coupler 55 through the second spot converter 52. For example, the second optical signal received by the second spot converter 52 can be coupled to the third optical waveguide structure 58, and transmitted to the second end of the optical coupler 55 through the third optical waveguide structure 58. The optical coupler 55 will combine the received first modulated optical signal and the second optical signal into a modulated optical signal, and transmit the modulated optical signal to the antenna photodiode module 7 after coupling through the third spot converter 53. For example, the modulated optical signal can be transmitted to the third spot converter 53 through the fourth optical waveguide structure 59, and then transmitted to the antenna photodiode module 7 after coupling through the third spot converter 53. Among them, the signal input end of the modulation coupler chip is provided with a pattern spot converter, which can increase the receiving surface of the optical signal, so that the optical signal emitted by the adjustable laser group 3 can enter the optical waveguide structure through the pattern spot converter to the maximum extent, thereby improving the optical coupling efficiency between the adjustable laser chip in the adjustable laser chip group 3 and the optical waveguide in the pattern spot converter. The pattern spot converter is provided at the signal output end of the modulation coupler chip so that the generated modulated optical signal can be effectively transmitted to the antenna photodiode module 7. Among them, the modulator chip 54 can be a Mach-Zehnder Modulator (MZM) or a micro-ring modulator chip, and the optical coupler 55 can be a Y-branch coupler or a multi-mode interference coupler, etc., which is not limited in the embodiment of the present invention.

[0073] For further information, please refer to Figure 1 , the antenna photodiode module includes:

[0074] A third focusing unit 71 and a waveguide antenna photodiode output chip 72;

[0075] The signal output end of the modulation coupler chip 5 is focused and coupled with the signal receiving end of the waveguide antenna photodiode output chip 72 through the third focusing unit 71, so that the modulated light signal emitted by the modulation coupler chip 5 is focused by the third focusing unit 71 and enters the waveguide antenna photodiode output chip 72;

[0076] The waveguide antenna photodiode output chip unit 72 is used to convert the received modulated optical signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

[0077] Specifically, after the modulation coupler chip 5 outputs the modulated optical signal through the signal output end, it enters the waveguide antenna photodiode output chip 72 through the third focusing unit 71, so as to convert the received modulated optical signal into an electromagnetic wave signal through the waveguide antenna photodiode output chip 72, and radiate the electromagnetic wave signal into free space. By adjusting the third focusing unit 71 to focus the modulated optical signal output by the modulation coupler chip 5 at the center position of the signal input end of the waveguide antenna photodiode output chip 72, the maximum optical coupling efficiency between the modulation coupler chip 5 and the waveguide antenna photodiode output chip 72 is achieved. Among them, the third focusing unit 71 can be a focusing lens.

[0078] Furthermore, Figure 3 is a top view of a waveguide antenna photodiode output chip provided according to an embodiment of the present invention, Figure 4 yes Figure 3 Schematic diagram of the cross section along the A-A' direction, refer to Figure 3-Figure 4 , waveguide antenna photodiode output chip includes:

[0079] A first substrate 721;

[0080] A first insulating film layer 722, wherein the first insulating film layer 722 is disposed on one side of the first substrate 721;

[0081] A fourth mode spot converter 723, which is arranged at the signal receiving end of the waveguide antenna photodiode output chip and at a side of the first substrate 721 close to the first insulating film layer 722;

[0082] A fifth optical waveguide structure 724, which is disposed on a side of the first substrate 721 close to the first insulating film layer 722, and one end of the fifth optical waveguide structure 724 is connected to the fourth mode spot converter 723, and the first insulating film layer 722 covers a portion of the fifth optical waveguide structure 724 away from the fourth mode spot converter 723;

[0083] A first photodiode 725, wherein the first photodiode 725 is disposed on a side of the fifth optical waveguide structure 724 away from the first substrate 721, and the first photodiode 725 is disposed away from the fourth spot converter 723, and the sum of the thickness of the first photodiode 725 and the thickness of the fifth optical waveguide structure 724 is greater than or equal to the thickness of the first insulating film layer 722;

[0084] The first terahertz antenna 726 is disposed on a side of the first insulating film layer 722 away from the first substrate 721 , and an electrode end of the first photodiode 725 passes through the first insulating film layer 722 and is connected to the first terahertz antenna 726 .

[0085] The first terahertz antenna 726 may be a series of planar thin film antennas such as an end-fire antenna, a helical antenna, a dipole antenna, and a butterfly antenna, and the output frequency of the first terahertz antenna 726 may be changed by adjusting the size of the antenna. The first insulating film layer 722 may be a polyimide film, and the first insulating film layer 722 is provided on one side of the first substrate 721, so that the first terahertz antenna 726 may be raised by a first preset distance, so that the transmission of signals between the photodiode and the terahertz antenna is more efficient, wherein the first preset distance may be set according to actual conditions. The first photodiode 725 may be a III-V photodiode.

[0086] Specifically, the modulated optical signal output by the modulation coupler chip enters the fifth optical waveguide structure 724 via the fourth spot converter 723, and transmits the modulated optical signal to the first photodiode 725 through the fifth optical waveguide structure 724. The first photodiode 725 converts the received modulated optical signal into an electrical signal, and transmits the electrical signal to the first terahertz antenna 726 through the N-electrode 01 and the P-electrode 02 of the first photodiode 725. The first terahertz antenna 726 converts the received electrical signal into an electromagnetic wave signal, and radiates it into free space.

[0087] Furthermore, Figure 5 is a schematic diagram of the structure of an integrated module of another photonic terahertz wireless communication system transmitter according to an embodiment of the present invention, with reference to Figure 5 , the antenna photodiode module includes:

[0088] Optical fiber transmission unit 73 and surface-incident antenna photodiode output chip 74;

[0089] The signal receiving end of the optical fiber transmission unit 73 is connected to the signal output end of the modulation coupler chip 5, and the signal output end of the optical fiber transmission unit 73 is coupled and connected with the signal receiving end of the surface-incident antenna photodiode output chip 74; the optical fiber transmission unit 73 is used to receive the modulated optical signal, and transmit the modulated optical signal to the surface-incident antenna photodiode output chip 74 through the signal output end of the optical fiber transmission chip 73;

[0090] The surface-incident antenna photodiode output chip 74 is used to convert the received modulated light signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

[0091] Specifically, the modulated optical signal output by the modulation coupler chip 5 enters the surface-incident antenna photodiode output chip 74 through the optical fiber transmission unit 73, so that the received modulated optical signal is converted into an electromagnetic wave signal through the surface-incident antenna photodiode output chip 74, and the electromagnetic wave signal is radiated into free space. The position between the signal output end of the optical fiber transmission unit 73 and the signal receiving end 743 of the surface-incident antenna photodiode output chip 74 is adjusted to achieve the maximum optical coupling efficiency.

[0092] Furthermore, Figure 6 is a schematic diagram of an optoelectronic packaging structure of a surface-incident antenna photodiode output chip according to an embodiment of the present invention, with reference to Figure 6 , the optical fiber transmission unit includes:

[0093] The optical fiber array output portion 731 and the optical fiber array support portion 732;

[0094] The signal receiving end of the optical fiber array output part 731 is connected to the signal output end of the modulation coupler chip 5, and the signal output end of the optical fiber array output part 731 is correspondingly coupled and connected to the signal receiving end of the surface-incident antenna photodiode output chip 74;

[0095] The optical fiber array FA output portion 731 is fixed on the circuit board 2 through the optical fiber array support portion 732 .

[0096] Specifically, after the surface-incident antenna photodiode output chip 74 is mounted on the circuit board 2, the optical fiber array output part 731 is adjusted to a suitable height according to the size of the optical coupling efficiency, exemplarily, adjusted to the height when the optical coupling efficiency is maximum, and the optical fiber array output part 731 and the circuit board 2 are fixed by the optical fiber support part 733 below the optical fiber array output part 731. When in working state, the modulated optical signal can be incident on the photosensitive surface of the surface-incident antenna photodiode output chip 74 through the optical fiber array output part 731 to realize light-to-electricity conversion.

[0097] Furthermore, Figure 7 is a top view of a surface-incident antenna photodiode output chip provided according to an embodiment of the present invention, Figure 8 yes Figure 7 Schematic diagram of the cross section along the B-B' direction, refer to Figure 7-Figure 8 , the surface-incident antenna photodiode output chip includes:

[0098] A second substrate 741;

[0099] A second insulating film layer 742, wherein the second insulating film layer 742 is disposed on one side of the second substrate 741 and covers the second substrate 741;

[0100] A second photodiode 743, wherein the second photodiode 743 is embedded in the second insulating film 742, and a photosensitive layer of the second photodiode 743 is exposed outside the second insulating film layer 742;

[0101] The second terahertz antenna 744 is disposed on a side of the second insulating film layer 742 away from the second substrate 741 , and an electrode end of the second photodiode 743 passes through the second insulating film layer 742 and is connected to the second terahertz antenna 744 .

[0102] Specifically, the modulated optical signal is incident on the second photodiode 743 through the optical fiber transmission unit 73, and the received modulated optical signal is converted into an electrical signal through the second photodiode 743, and the electrical signal is transmitted to the second terahertz antenna 744 through the N-electrode 03 and the P-electrode 04 of the second photodiode 743, and the second terahertz antenna 744 converts the received electrical signal into an electromagnetic wave signal and radiates it into free space. The surface-incident antenna photodiode output unit designed in the embodiment of the present invention has a low integration level, a simpler preparation process, and reduces production costs.

[0103] For further reference, Figure 1 , the first focusing unit 41 includes a first focusing lens 411 and a first lens base 412; the first focusing lens 411 is fixed on the base 1 through the first lens base 412;

[0104] The first focusing unit 42 includes a second focusing lens 421 and a second lens base 422 ; the second focusing lens 421 is fixed on the base 1 via the second lens base 422 .

[0105] Furthermore, the modulator chip includes a Mach-Zehnder modulator chip.

[0106] For further information, please refer to Figure 1 , the third focusing unit 71 includes a third focusing lens 711 and a third lens base 712;

[0107] The third focusing lens 711 is fixed on the base 1 through a third lens base 712 .

[0108] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0109] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated module for the transmitting end of a photonic terahertz wireless communication system, characterized in that: include: Base, circuit board, tunable laser chipset, focusing module, modulation coupler chip, modulation driver chip and antenna photodiode module; The circuit board is arranged on one surface of the base; the adjustable laser chipset, the modulation coupler chip, the modulation driver chip and the antenna photodiode module are arranged on the circuit board; the focusing module is arranged on the base; The tunable laser chip group includes a first tunable laser chip and a second tunable laser chip, the focusing module includes a first focusing unit and a second focusing unit; the modulation coupler chip includes a first signal input end, a second signal input end and a signal output end; the laser emission port of the first tunable laser chip is coupled and connected with the first signal input end of the modulation coupler chip through the first focusing unit, and the laser emission port of the second tunable laser chip is coupled and connected with the second signal input end of the modulation coupler chip through the second focusing unit, so that the optical signal emitted by the tunable laser chip is focused by the focusing module and then enters the modulation coupler chip through the signal input end of the modulation coupler chip; The modulation driver chip is electrically connected to the modulation coupler chip, and the modulation driver chip is used to send a modulation drive signal to the modulation coupler chip to control the working state of the modulation coupler chip; The signal output end of the modulation coupler chip is coupled and connected correspondingly to the signal receiving end of the antenna photodiode module. The modulation coupler chip is used to modulate the received optical signal according to the modulation drive signal to generate a modulated optical signal, and transmit the modulated optical signal to the antenna photodiode module through the signal output end; the antenna photodiode module is used to convert the received modulated optical signal into an electromagnetic wave signal, and radiate the electromagnetic wave signal into free space.

2. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 1, characterized in that: The modulation coupler chip comprises: A first mode spot converter, a second mode spot converter, a third mode spot converter, a modulator chip and an optical coupler; The first pattern spot converter is arranged at the first signal input end of the modulation coupler chip, the second pattern spot converter is arranged at the second signal input end of the modulation coupler chip, and the third pattern spot converter is arranged at the signal output end of the modulation coupler chip. The first pattern spot converter is connected to the input end of the modulator chip; the output end of the modulator chip is connected to the first end of the optical coupler, the second pattern spot converter is connected to the second end of the optical coupler, and the third end of the optical coupler is connected to the third pattern spot converter.

3. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 1, characterized in that: The antenna photodiode module comprises: A third focusing unit and a waveguide antenna photodiode output chip; The signal output end of the modulation coupler chip is arranged to be focused and coupled with the signal receiving end of the waveguide antenna photodiode output chip through the third focusing unit, so that the modulated light signal emitted by the modulation coupler chip is focused by the third focusing unit and enters the waveguide antenna photodiode output chip; The waveguide antenna photodiode output chip is used to convert the received modulated optical signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

4. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 3, characterized in that: The waveguide antenna photodiode output chip comprises: a first substrate; a first insulating film layer, wherein the first insulating film layer is disposed on one side of the first substrate; A fourth pattern spot converter, the fourth pattern spot converter is arranged at a signal receiving end of the waveguide antenna photodiode output chip and is arranged on a side of the first substrate close to the first insulating film layer; a fifth optical waveguide structure, wherein the fifth optical waveguide structure is arranged on a side of the first substrate close to the first insulating film layer, one end of the fifth optical waveguide structure is connected to the fourth mode spot converter, and the first insulating film layer covers a portion of the fifth optical waveguide structure away from the fourth mode spot converter; a first photodiode, wherein the first photodiode is arranged on a side of the fifth optical waveguide structure away from the first substrate, and the first photodiode is arranged away from the fourth spot converter, and the sum of the thickness of the first photodiode and the thickness of the fifth optical waveguide structure is greater than or equal to the thickness of the first insulating film layer; A first terahertz antenna is disposed on a side of the first insulating film layer away from the first substrate, and an electrode end of the first photodiode passes through the first insulating film layer and is connected to the first terahertz antenna.

5. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 1, characterized in that: The antenna photodiode module comprises: Optical fiber transmission unit and surface-incident antenna photodiode output chip; The signal receiving end of the optical fiber transmission unit is connected to the signal output end of the modulation coupler chip, and the signal output end of the optical fiber transmission unit is correspondingly coupled and connected to the signal receiving end of the surface-incident antenna photodiode output chip; the optical fiber transmission unit is used to receive the modulated optical signal, and transmit the modulated optical signal to the surface-incident antenna photodiode output chip through the signal output end of the optical fiber transmission unit; The surface-incident antenna photodiode output chip is used to convert the received modulated light signal into an electromagnetic wave signal and radiate the electromagnetic wave signal into free space.

6. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 5, characterized in that: The optical fiber transmission unit comprises: An optical fiber array output portion and an optical fiber array support portion; The first signal receiving end of the optical fiber array output part is connected to the signal output end of the modulation coupler chip, and the signal output end of the optical fiber array output part is correspondingly coupled and connected to the signal receiving end of the surface-incident antenna photodiode output chip; The optical fiber array output portion is fixed on the circuit board through the optical fiber array support portion.

7. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 5, characterized in that: The surface-incident antenna photodiode output chip comprises: a second substrate; a second insulating film layer, wherein the second insulating film layer is disposed on one side of the second substrate and covers the second substrate; a second photodiode, wherein the second photodiode is embedded in the second insulating film, and a photosensitive layer of the second photodiode is exposed outside the second insulating film layer; A second terahertz antenna is provided on a side of the second insulating film layer away from the second substrate, and an electrode end of the second photodiode passes through the second insulating film layer and is connected to the second terahertz antenna.

8. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 1, characterized in that: The first focusing unit includes a first focusing lens and a first lens base; The first focusing lens is fixed on the base through the first lens base; The second focusing unit includes a second focusing lens and a second lens base; The second focusing lens is fixed on the base through the second lens base.

9. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 2, characterized in that: The modulator chip includes a Mach-Zehnder modulator chip.

10. The integrated module of the transmitting end of the photonic terahertz wireless communication system according to claim 3, characterized in that: The third focusing unit includes a third focusing lens and a third lens base; The third focusing lens is fixed on the base through the third lens base.

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