UV (ultraviolet) curing thermal debonding pressure-sensitive adhesive and preparation process thereof

Abstract

The invention relates to a UV (ultraviolet) curing thermal debonding pressure-sensitive adhesive and a preparation process thereof. The UV curing thermal debonding pressure-sensitive adhesive comprises the following components in parts by mass: 100 parts of acrylate prepolymer; 75 to 130 parts of an NCO closed monomer; 0.5-2 parts of a catalyst; a second photoinitiator; wherein the addition amount of the second photoinitiator is 0.5%-5% of the mass of the acrylate prepolymer. The problems that in an existing scheme, an existing thermal debonding system uses a thermal shrinkage film, adhesive layer melting or microsphere expansion and other debonding modes have limitation, high temperature and long time are needed in the coating and curing process, and the production efficiency is low; and a large amount of organic solvent can be generated in the solvent removal process before curing, so that additional treatment and recovery are needed.

Description

Technical Field

[0001] The invention relates to the field of UV-curable heat-debonding pressure-sensitive adhesives, and in particular to a UV-curable heat-debonding pressure-sensitive adhesive and a preparation process thereof. Background Art

[0002] Traditional pressure-sensitive adhesives use solvent-based or water-based acrylic pressure-sensitive adhesive resins. During the curing process, the monomers in the resin are polymerized by heating, thereby curing. However, this traditional curing method has the problems of high curing temperature and long curing time, usually requiring several hours or even days for the glue to mature.

[0003] Chinese utility model patent: CN206538372U discloses the use of thermally conductive fillers and heat shrinkable films to separate the adhesive layer from the bonded material. Chinese invention patent: CN116254078B discloses the use of epichlorohydrin to reduce the high temperature viscosity of polycaprolactone, which melts and destroys the bonding structure when heated, thereby achieving the effect of thermal debonding and easy peeling. The existing thermal debonding tape is to evenly add heat-expandable microsphere powder, such as calcium carbonate type foaming agent, to the glue. After heating, the microsphere powder expands 7-10 times, and the ball diameter is greater than the thickness of the glue, achieving the debonding effect of separating the adhesive layer.

[0004] The existing thermal debonding pressure-sensitive adhesives require high temperatures and long times during coating and curing / ripening, resulting in low production efficiency. Since a large amount of organic solvents are generated during the solvent removal process before curing, additional treatment and recycling are required.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] In view of the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a UV-curable thermal debonding pressure-sensitive adhesive and a preparation process thereof, so as to solve the limitations of the existing thermal debonding systems in the prior art, such as using heat shrinkable films, melting of adhesive layers or expansion of microspheres, and requiring higher temperatures and longer times during coating and curing, resulting in lower production efficiency; and since a large amount of organic solvents will be generated during the desolventizing process before curing, additional treatment and recycling are required.

[0007] To achieve the above object, the technical solution of the present invention is as follows:

[0008] A UV curing heat-debonding pressure-sensitive adhesive;

[0009] The invention comprises the following components by weight: 100 parts of acrylate prepolymer; 75-130 parts of NCO blocking monomer; 0.5-2 parts of catalyst; and a second photoinitiator;

[0010] Wherein, the added amount of the second photoinitiator is 0.5% to 5% of the mass of the acrylate prepolymer.

[0011] A further technical solution is that the acrylate prepolymer is formed by polymerizing the prepolymer monomer under the action of a first photoinitiator through ultraviolet light irradiation; wherein the prepolymer monomer is composed of pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate; and the addition amount of the first photoinitiator is 0.01%-0.5% of the mass of the prepolymer monomer.

[0012] A further technical solution is that in the NCO closed monomer, the hydroxyl double bond equivalent is 75%-100% of the sum of the hydroxyl equivalents of other monomers, and a certain proportion of a second initiator and a catalyst are added to prepare it; pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate in the acrylate prepolymer are copolymerized to obtain an acrylate copolymer containing polar hydroxyl groups.

[0013] A further technical solution is that the first photoinitiator and the second photoinitiator are one or more of TPO, 184, 1173, DETX, BP+P115, BP+EDB, BP+EDBA.

[0014] A further technical solution is that the first photoinitiator and the second photoinitiator are: TPO.

[0015] A further technical solution is that the NCO blocking monomer is: Lisenok NCO blocking monomer AOI-BP; and the catalyst is dibutyltin dilaurate.

[0016] A further technical solution is that the viscosity of the acrylate prepolymer is 1500mPa.s-10000mPa.s.

[0017] A preparation process of a UV-curable heat-debonding pressure-sensitive adhesive comprises the following steps:

[0018] Step 1, mixing the prepolymer monomer and the first photoinitiator in a certain proportion; introducing nitrogen to protect and irradiate the reaction with ultraviolet light, introducing air to stop the reaction to obtain an acrylate prepolymer, wherein the viscosity of the acrylate prepolymer is controlled to be 1500mPa.s-10000mPa.s;

[0019] Step 2: Add NCO blocking monomer to acrylate prepolymer in a certain proportion, and stir until both are fully dissolved; add catalyst and second photoinitiator in a certain proportion, and stir until the catalyst and second photoinitiator are dissolved to obtain pressure-sensitive adhesive;

[0020] Step 3: Apply the pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate it from the air, and then cure it with a UV lamp to obtain a UV-curable pressure-sensitive adhesive.

[0021] A further technical solution is that in step one, the ultraviolet light irradiation energy is 42mJ / cm2-57mJ / cm2; and the ultraviolet light irradiation time is 36s to 50s.

[0022] A further technical solution is that in step three, the UV lamp irradiation curing energy is 120mJ / cm2~225mJ / cm2; the UV lamp irradiation curing time is 30s~180s.

[0023] Compared with the prior art, the beneficial technical effects of the present invention are as follows: (1) When the UV-curing thermal debonding pressure-sensitive adhesive is thermally debonded, it only needs to be heated to 80-90° C. The UV-curing thermal debonding pressure-sensitive adhesive completes the changes of foaming expansion, polarity reduction, and cross-linking shrinkage, effectively reducing the adhesive force of the pressure-sensitive adhesive, reducing the adhesion area, and increasing the cross-linking shrinkage, thereby synergistically achieving thermal debonding;

[0024] After the UV-curing thermal debonding pressure-sensitive adhesive is heated, the adhesive layer of the UV-curing thermal debonding pressure-sensitive adhesive is heated, and the NCO closed monomer of the adhesive layer is decomposed; first, the released small molecules sublimate, the adhesive layer foams, and the adhesion area is reduced, thereby improving the demolding property of the UV-curing thermal debonding pressure-sensitive adhesive;

[0025] Secondly, the number and density of polar functional groups are reduced, and the released NCO groups react and cross-link with the -NH2 and -OH polar groups in the UV-curing thermal debonding pressure-sensitive adhesive, which reduces the polarity and further reduces the bonding force, increases the curing shrinkage rate, and reduces the adhesion rate;

[0026] Finally, during the curing process, the cross-linking density increases, and the cross-linking reaction reduces the number and density of polar functional groups, further increasing the shrinkage, reducing the bonding area, and achieving debonding and separation.

[0027] Through the synergistic effect of the above three processes, the UV-curable thermal debonding pressure-sensitive adhesive of the present invention has more excellent debonding properties, thereby achieving thermal debonding of the UV-curable thermal debonding pressure-sensitive adhesive.

[0028] (2) UV lamp irradiation curing is used to initiate a chemical reaction using ultraviolet radiation, so that the liquid resin is quickly cured into a solid state; the pressure-sensitive adhesive and the monomer can be cured in a short time, greatly improving production efficiency; compared with the traditional thermal curing method, UV lamp irradiation curing has a fast curing speed and good curing effect;

[0029] During the curing process, thermal debonding of the UV-curable thermal debonding pressure-sensitive adhesive is achieved through the decomposition of NCO blocked monomers and the sublimation of small molecules.

[0030] (3) UV curing heat-degradable pressure-sensitive adhesive preparation process uses UV lamp irradiation curing without the use of organic solvents or water, so no organic solvents or water vapor will be generated, and no environmental pollution will be caused. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of a preparation process of a UV-curable thermally debondable pressure-sensitive adhesive according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present invention clearer, the device proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0033] First embodiment:

[0034] The UV curing heat-debonding pressure-sensitive adhesive comprises the following components by weight: 100 parts of acrylate prepolymer, 75-130 parts of NCO blocking monomer, 0.5-2 parts of catalyst and second photoinitiator, wherein the addition amount of the second photoinitiator is 0.5% to 5% of the weight of the acrylate prepolymer.

[0035] The acrylate prepolymer is formed by polymerizing the prepolymer monomer under the action of the first photoinitiator through ultraviolet light irradiation. The prepolymer monomer is composed of pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate. The addition amount of the first photoinitiator is 0.01%-0.5% of the mass of the prepolymer monomer.

[0036] In the NCO blocking monomer, the hydroxyl double bond equivalent is 75%-100% of the sum of the hydroxyl equivalents of other monomers, and a certain proportion of the second initiator and catalyst are added. After the pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate in the acrylate prepolymer are copolymerized, an acrylate copolymer containing polar hydroxyl groups is obtained. The cohesive strength and bonding properties of the UV-curable thermal debonding pressure-sensitive adhesive are improved by the above-mentioned polar groups, and the end-blocking monomer is finally reacted to the end of the linking segment to improve the NCO reaction activity during subsequent debonding.

[0037] Acrylate prepolymer is a hydroxyl-containing acrylate prepolymer, which contains acrylate groups and hydroxyl functional groups in its molecular structure, making it weather-resistant and chemically resistant. At the same time, it also has the reactivity and compatibility brought by the hydroxyl group.

[0038] Pentaerythritol triacrylate acrylic acid is a multifunctional acrylic acid compound. Pentaerythritol triacrylate acrylic acid has good crosslinking properties during the reaction process with β-hydroxypropyl acrylate or β-hydroxyethyl acrylate. Pentaerythritol triacrylate acrylic acid is an unsaturated ester with a branched structure, and its molecule has multiple unsaturated double bonds. Pentaerythritol triacrylate acrylic acid has low viscosity and good solubility.

[0039] The molecular structure of β-hydroxypropyl acrylate contains an acrylic acid group and a hydroxypropyl group, which has bifunctionality and can participate in free radical polymerization as well as undergo ester exchange and cross-linking reactions of alcohols.

[0040] The copolymerization of pentaerythritol triacrylate, acrylic acid and β-hydroxypropyl acrylate can obtain an acrylic acid ester copolymer containing polar hydroxyl groups.

[0041] Acrylic acid-β-hydroxyethyl ester has active chemical properties and is easy to copolymerize with pentaerythritol triacrylate acrylic acid. Acrylic acid-β-hydroxyethyl ester can enhance the adhesion of pressure-sensitive adhesives and improve their peeling ability.

[0042] UV curing thermal debonding pressure sensitive adhesive contains NCO blocking monomers, so that a monomer with an acrylic double bond at one end and an NCO blocking monomer at the other end is introduced into the molecular structure or formula component of the acrylic pressure sensitive adhesive resin. The debonding monomer reacts with the resin monomer to form a single phase.

[0043] When the UV-curing thermal debonding pressure-sensitive adhesive is thermally debonded, it is only necessary to heat the UV-curing thermal debonding pressure-sensitive adhesive to 80-90°C. The UV-curing thermal debonding pressure-sensitive adhesive completes the changes of foaming expansion, polarity reduction, and cross-linking shrinkage, effectively reducing the adhesion of the pressure-sensitive adhesive, reducing the adhesion area, and increasing the cross-linking shrinkage, thereby synergistically achieving thermal debonding.

[0044] After the UV-curing thermal debonding pressure-sensitive adhesive is heated, the adhesive layer of the UV-curing thermal debonding pressure-sensitive adhesive is heated, and the NCO closed monomer of the adhesive layer is decomposed. First, the released small molecules sublimate, the adhesive layer foams, and the adhesion area is reduced, thereby improving the demolding property of the UV-curing thermal debonding pressure-sensitive adhesive.

[0045] Secondly, the number and density of polar functional groups are reduced, and the released NCO groups react and cross-link with the -NH2 and -OH polar groups in the UV-curing thermal adhesive, which reduces the polarity and further reduces the bonding force, increases the curing shrinkage rate, and reduces the adhesion rate.

[0046] Finally, during the curing process, the cross-linking density increases, and at the same time, the cross-linking reaction reduces the number and density of polar functional groups, further increasing the shrinkage, reducing the bonding area, and achieving debonding and separation.

[0047] Through the synergistic effect of the above three processes, the UV-curable thermal debonding pressure-sensitive adhesive of the present invention has a more excellent debonding effect, and the thermal debonding of the UV-curable thermal debonding pressure-sensitive adhesive is achieved.

[0048] The first photoinitiator and the second photoinitiator are one or more of TPO, 184, 1173, DETX, BP+P115, BP+EDB, and BP+EDBA.

[0049] When the first photoinitiator and the second photoinitiator are 184 photoinitiators, since 184 photoinitiators are not easily soluble in prepolymers and require slight heat to dissolve in prepolymers, the 184 photoinitiators need to be heated to a certain temperature.

[0050] Among the photoinitiators of TPO, 1173, DETX, BP+P115, BP+EDB, and BP+EDBA, the initiation efficiency of 1173 photoinitiator is lower than that of TPO photoinitiator, and the initiation efficiency and rate of DETX, BP+P115, BP+EDB, and BP+EDBA photoinitiators are all lower than those of TPO photoinitiator.

[0051] Considering the functional effect and convenience of the photoinitiator, preferably, the first photoinitiator and the second photoinitiator are: TPO photoinitiator.

[0052] The NCO blocking monomer is: Lisenok NCO blocking monomer AOI-BP; the catalyst is dibutyltin dilaurate.

[0053] The viscosity of the acrylate prepolymer is 1500mPa.s-10000mPa.s. When preparing the acrylate prepolymer, the viscosity of the acrylate prepolymer is determined by controlling the illumination time and illumination energy according to its different constituent raw materials.

[0054] Second embodiment:

[0055] Figure 1 The schematic diagram of the preparation process of the UV-curable heat-debonding pressure-sensitive adhesive according to the embodiment of the present invention is shown. Figure 1 As shown, the preparation process of UV curing thermal debonding pressure sensitive adhesive includes the following steps:

[0056] Step 1: Mix the prepolymer monomer and the first photoinitiator in a certain proportion. Pass nitrogen to protect the reaction by ultraviolet light irradiation, pass air to stop the reaction to obtain an acrylate prepolymer, and the viscosity of the acrylate prepolymer is controlled at 1500mPa.s-10000mPa.s. The ultraviolet light irradiation energy is 42mJ / cm2-57mJ / cm2; the ultraviolet light irradiation time is 36s-50s.

[0057] Step 2: Add NCO blocking monomer to acrylate prepolymer in a certain proportion, and stir until both are fully dissolved; add catalyst and second photoinitiator in a certain proportion, and stir until the catalyst and second photoinitiator are dissolved to obtain pressure-sensitive adhesive;

[0058] Step 3: Apply the pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate the air, and then cure it with UV light to obtain a UV-curable pressure-sensitive adhesive. The UV light curing energy is 120mJ / cm2 to 225mJ / cm2; the UV light curing time is 30s to 180s.

[0059] In step three, UV lamp irradiation curing is used to initiate a chemical reaction using ultraviolet radiation, so that the liquid resin is quickly cured into a solid state. The pressure-sensitive adhesive and the monomer can be cured in a short time, greatly improving production efficiency. Compared with traditional thermal curing methods, UV lamp irradiation curing has a fast curing speed and good curing effect.

[0060] In step 3 of the preparation process of the UV-curable thermal debonding pressure-sensitive adhesive, UV lamp irradiation curing is used without using organic solvents or water, and thus no organic solvents or water vapor will be generated, thereby not polluting the environment.

[0061] During the curing process of step three, the thermal debonding of the UV-curable thermal debonding pressure-sensitive adhesive is achieved through the decomposition of the NCO blocking monomer and the sublimation of small molecules.

[0062] The following three groups of examples illustrate the steps of the preparation process of the UV-curable thermal debonding pressure-sensitive adhesive of the present application.

[0063] Third embodiment:

[0064] A preparation process of a UV curable heat-debonding pressure-sensitive adhesive comprises the following steps:

[0065] Step 1: 50 parts of pentaerythritol triacrylate acrylic acid and 50 parts of β-hydroxypropyl acrylate are mixed into a prepolymer monomer. The first photoinitiator is added and mixed, and the addition amount of the first photoinitiator is 0.05% of the mass of the prepolymer monomer. Nitrogen is passed through to protect the reaction by ultraviolet light irradiation, the ultraviolet light time is 45s, and the light energy is 50mJ / cm2. Air is passed through to stop the reaction to obtain an acrylate prepolymer, and the viscosity of the acrylate prepolymer is controlled at 5000mPa.s.

[0066] Step 2: Add 100 parts of NCO blocked monomer to 100 parts of acrylate prepolymer, stir until both are fully dissolved, and obtain a transparent mixed solution. Among them, the hydroxyl double bond equivalent in the NCO blocked monomer is 85% of the sum of the hydroxyl equivalents of other monomers. Add the second photoinitiator and catalyst to the mixed solution, the amount of the second photoinitiator added is 1% of the mass of the acrylate prepolymer, and the catalyst is 1 part. Stir thoroughly until the catalyst and the second photoinitiator are dissolved to obtain a viscous and transparent pressure-sensitive adhesive.

[0067] Step 3: Apply the viscous and transparent pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate it from the air, and then cure it with a UV lamp. The UV lamp curing energy is 175mJ / cm2, and the UV lamp curing time is 100s to obtain a UV-curable pressure-sensitive adhesive.

[0068] Fourth embodiment:

[0069] A preparation process of a UV curable heat-debonding pressure-sensitive adhesive comprises the following steps:

[0070] Step 1: 50 parts of pentaerythritol triacrylate acrylic acid and 50 parts of β-hydroxypropyl acrylate are mixed to form a prepolymer monomer. A first photoinitiator is added and mixed, and the addition amount of the first photoinitiator is 0.01% of the mass of the prepolymer monomer. Nitrogen is passed through to protect the reaction by ultraviolet light irradiation, the ultraviolet light time is 36s, and the light energy is 42mJ / cm2. Air is passed through to stop the reaction to obtain an acrylate prepolymer, and the viscosity of the acrylate prepolymer is controlled at 1500mPa.s.

[0071] Step 2: Add 75 parts of NCO blocked monomer to 100 parts of acrylate prepolymer, stir until both are fully dissolved, and obtain a transparent mixed melt. Among them, the hydroxyl double bond equivalent in the NCO blocked monomer is 75% of the sum of the hydroxyl equivalents of other monomers. Add the second photoinitiator and catalyst to the mixed solution, the amount of the second photoinitiator added is 0.5% of the mass of the acrylate prepolymer, and the catalyst is 0.5 parts. Stir thoroughly until the catalyst and the second photoinitiator are dissolved to obtain a viscous and transparent pressure-sensitive adhesive.

[0072] Step 3: Apply the viscous and transparent pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate the air, and then cure it with a UV lamp. The UV lamp curing energy is 120mJ / cm2, and the UV lamp curing time is 30s to obtain a UV-curable pressure-sensitive adhesive.

[0073] Fifth embodiment:

[0074] A preparation process of a UV curable heat-debonding pressure-sensitive adhesive comprises the following steps:

[0075] Step 1: 50 parts of pentaerythritol triacrylate acrylic acid and 50 parts of β-hydroxypropyl acrylate are mixed to form a prepolymer monomer. A first photoinitiator is added and mixed, and the amount of the first photoinitiator added is 0.5% of the mass of the prepolymer monomer. Nitrogen is passed through to protect the reaction by ultraviolet light irradiation, the ultraviolet light time is 50s, and the light energy is 57mJ / cm2. Air is passed through to stop the reaction to obtain an acrylate prepolymer, and the viscosity of the acrylate prepolymer is controlled at 10000mPa.s.

[0076] Step 2: Add 130 parts of NCO blocked monomer to 100 parts of acrylate prepolymer, stir until both are fully dissolved, and obtain a transparent mixed melt. Among them, the hydroxyl double bond equivalent in the NCO blocked monomer is 100% of the sum of the hydroxyl equivalents of other monomers. Add the second photoinitiator and catalyst to the mixed solution, the addition amount of the second photoinitiator is 5% of the mass of the acrylate prepolymer, and the catalyst is 2 parts. Stir thoroughly until the catalyst and the second photoinitiator are dissolved to obtain a viscous and transparent pressure-sensitive adhesive.

[0077] Step 3: Apply the viscous and transparent pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate the air, and then cure it with a UV lamp. The UV lamp curing energy is 225mJ / cm2, and the UV lamp curing time is 180s to obtain a UV-curable pressure-sensitive adhesive.

[0078] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A UV curing heat-debonding pressure-sensitive adhesive, characterized in that: Includes the following quality ingredients: Acrylate prepolymer 100 parts; 75-130 parts of NCO blocking monomer; Catalyst 0.5-2 parts; a second photoinitiator; Wherein, the added amount of the second photoinitiator is 0.5% to 5% of the mass of the acrylate prepolymer.

2. The UV curable heat-debonding pressure-sensitive adhesive according to claim 1, characterized in that: The acrylate prepolymer is formed by polymerizing the prepolymer monomer under the action of a first photoinitiator through ultraviolet light irradiation; wherein the prepolymer monomer is composed of pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate; and the addition amount of the first photoinitiator is 0.01%-0.5% of the mass of the prepolymer monomer.

3. The UV curable heat-debonding pressure-sensitive adhesive according to claim 2, characterized in that: In the NCO closed monomer, the hydroxyl double bond equivalent is 75%-100% of the sum of the hydroxyl equivalents of other monomers, and a certain proportion of a second initiator and a catalyst are added to prepare the monomer; after copolymerization of pentaerythritol triacrylate acrylic acid and β-hydroxypropyl acrylate or β-hydroxyethyl acrylate in the acrylate prepolymer, an acrylate copolymer containing polar hydroxyl groups is obtained.

4. The UV curable heat-debonding pressure-sensitive adhesive according to claim 3, characterized in that: The first photoinitiator and the second photoinitiator are one or more of TPO, 184, 1173, DETX, BP+P115, BP+EDB, and BP+EDBA.

5. The UV curable heat-debonding pressure-sensitive adhesive according to claim 4, characterized in that: The first photoinitiator and the second photoinitiator are: TPO.

6. The UV curable heat-debonding pressure-sensitive adhesive according to claim 3, characterized in that: The NCO blocking monomer is: Lisenok NCO blocking monomer AOI-BP; the catalyst is dibutyltin dilaurate.

7. The UV curable heat-debonding pressure-sensitive adhesive according to claim 3, characterized in that: The viscosity of the acrylate prepolymer is 1500mPa.s-10000mPa.s.

8. A process for preparing a UV-curable heat-debonding pressure-sensitive adhesive, characterized in that: The steps include: Step 1, mixing the prepolymer monomer and the first photoinitiator in a certain proportion; introducing nitrogen to protect and irradiate the reaction with ultraviolet light, introducing air to stop the reaction to obtain an acrylate prepolymer, wherein the viscosity of the acrylate prepolymer is controlled to be 1500mPa.s-10000mPa.s; Step 2: Add NCO blocking monomer to acrylate prepolymer in a certain proportion, and stir until both are fully dissolved; add catalyst and second photoinitiator in a certain proportion, and stir until the catalyst and second photoinitiator are dissolved to obtain pressure-sensitive adhesive; Step 3: Apply the pressure-sensitive adhesive on the PET release film, cover it with PO or PVC film to isolate it from the air, and then cure it with a UV lamp to obtain a UV-curable pressure-sensitive adhesive.

9. The process for preparing the UV curable heat-debonding pressure-sensitive adhesive according to claim 8, characterized in that: In step 1, the ultraviolet light irradiation energy is 42mJ / cm2-57mJ / cm2; the ultraviolet light irradiation time is 36s-50s.

10. The process for preparing the UV curable heat-debonding pressure-sensitive adhesive according to claim 8, characterized in that: In step three, the UV lamp irradiation curing energy is 120mJ / cm2~225mJ / cm2; the UV lamp irradiation curing time is 30s~180s.

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