High-voltage direct-current power supply, temperature control method, temperature control device, temperature control equipment, medium and product

Abstract

The invention relates to the technical field of power supplies, and discloses a high-voltage direct-current power supply, a temperature control method, device and equipment, a medium and a product. Wherein the output of the power electronic converter forms high-voltage output through the high-voltage transformer and the voltage doubling rectifier; the high-voltage direct-current power supply further comprises a digital controller; the digital controller is used for acquiring a sampling signal obtained by sampling the high-voltage output and generating a first control signal according to the sampling signal so as to control the power electronic converter; and the digital controller is also used for controlling a radiator and a heater in the high-voltage direct-current power supply so as to adjust the case temperature of the high-voltage direct-current power supply to a target value. According to the high-voltage direct-current power supply, when the temperature of the high-voltage power supply case changes, the temperature of the case body can be rapidly and accurately kept stable by adjusting the rotating speed of the cooling fan or adjusting the power of the heating wire, and therefore the stability of output voltage is effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply, and in particular to a high-voltage direct current power supply, a temperature control method, a device, equipment, a medium and a product. Background Art

[0002] High-voltage DC power supplies are widely used in ion implantation, ion beam and other application scenarios. With the rapid development of the integrated circuit industry, ion implantation has advantages over thermal diffusion implantation in terms of implantation depth, accurate and controllable concentration, and has become the mainstream process for integrated circuit manufacturing.

[0003] The most critical indicator of ion implantation high voltage power supply is high stability. The output stability of the suppressor power supply needs to reach 500PPM / 8hours, and the output voltage stability of the accelerating electrode power supply needs to reach more than 100PPM / 8hours to ensure the consistency of chip production. The stability of the high voltage power supply is mainly affected by temperature. When the temperature inside the high voltage power supply changes, the output voltage characteristics of devices such as sampling resistors and operational amplifiers will change with temperature, causing output voltage fluctuations. Therefore, there is an urgent need for a high voltage DC power supply that can provide stable temperature. Summary of the invention

[0004] In view of this, the present invention provides a high-voltage direct current power supply, a temperature control method, a device, an equipment, a medium and a product to achieve the stability of the output voltage of the high-voltage direct current power supply.

[0005] In a first aspect, the present invention provides a high-voltage direct current power supply, the high-voltage direct current power supply comprising a power electronic converter, a high-voltage converter and a voltage doubler rectifier unit; the power electronic converter output is converted into a high-voltage output through a high-voltage transformer and a voltage doubler rectifier;

[0006] The high-voltage DC power supply further includes a digital controller; the digital controller is used to obtain a sampling signal obtained by sampling the high-voltage output, and generate a first control signal according to the sampling signal to control the power electronic converter;

[0007] The digital controller is also used to control the heat sink and the heater in the high-voltage DC power supply to adjust the chassis temperature of the high-voltage DC power supply to a target value.

[0008] In a possible implementation, the sampling signal is obtained by processing the high voltage output in sequence through a voltage divider, an operational amplifier conditioning circuit, and an analog-to-digital conversion unit.

[0009] In a second aspect, a temperature control method in a high-voltage direct current power supply is provided, the method being executed by a digital controller in the above-mentioned high-voltage direct current power supply, the method comprising:

[0010] The internal temperature of the chassis is determined based on the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater, and the heat dissipation of the radiator;

[0011] A second control signal and a third control signal are generated according to the internal temperature of the chassis; the second control signal is used to control the radiator; and the third control signal is used to control the heater.

[0012] In a possible implementation, when the internal temperature of the chassis is higher than a given temperature, the third control signal is used to control the heater to stop heating.

[0013] In a possible implementation, generating a second control signal and a third control signal according to the internal temperature of the chassis; wherein the second control signal is used to control a radiator, includes:

[0014] Determine a fuzzy output value according to the interval to which the temperature inside the chassis belongs and the interval to which the rate of change of the temperature inside the chassis belongs;

[0015] The corresponding control signal table is queried according to the fuzzy output value to obtain the second control signal and the third control signal.

[0016] In a possible implementation, querying a corresponding control signal table according to the fuzzy output value to obtain the second control signal and the third control signal includes:

[0017] According to the fuzzy output value, a corresponding control signal table is searched to obtain the heating fuzzy interval and the heat dissipation fuzzy interval;

[0018] According to the heating fuzzy interval and the parameters of the heater, acquiring the second control signal to control the working state of the heater;

[0019] According to the heat dissipation fuzzy interval and the parameters of the heat sink, the third control signal is obtained to control the working state of the heat sink.

[0020] In a third aspect, a temperature control device in a high-voltage direct current power supply is provided, the device being applied to a digital controller in the above-mentioned high-voltage direct current power supply, the device comprising:

[0021] The temperature determination module is used to determine the internal temperature of the chassis according to the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater and the heat dissipation of the radiator;

[0022] The signal generating module is used to generate a second control signal and a third control signal according to the internal temperature of the chassis; the second control signal is used to control the radiator; and the third control signal is used to control the heater.

[0023] In a possible implementation, when the internal temperature of the chassis is higher than a given temperature, the third control signal is used to control the heater to stop heating.

[0024] In a possible implementation, the signal generating module is further used to:

[0025] Determine a fuzzy output value according to the interval to which the temperature inside the chassis belongs and the interval to which the rate of change of the temperature inside the chassis belongs;

[0026] The corresponding control signal table is queried according to the fuzzy output value to obtain the second control signal and the third control signal.

[0027] In a possible implementation, the signal generating module is further used to: query a corresponding control signal table according to the fuzzy output value to obtain the heating fuzzy interval and the heat dissipation fuzzy interval;

[0028] According to the heating fuzzy interval and the parameters of the heater, acquiring the second control signal to control the working state of the heater;

[0029] According to the heat dissipation fuzzy interval and the parameters of the heat sink, the third control signal is obtained to control the working state of the heat sink.

[0030] In a third aspect, a computer device is provided, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the above-mentioned temperature control method by executing the computer instructions.

[0031] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the above-mentioned temperature control method.

[0032] In a fifth aspect, a computer program product is provided, comprising computer instructions for causing a computer to execute the above-mentioned temperature control method.

[0033] The technical solution provided by this application may have the following beneficial effects:

[0034] The high-voltage DC power supply provided in the embodiment of the present application can process the sampling signal through the digital controller to achieve the normal working state of the high-voltage DC power supply, and then control the heat sink and the heater in the high-voltage DC power supply through the digital controller, so as to adjust the chassis temperature of the high-voltage DC power supply to a constant target value. That is, when the temperature of the high-voltage DC power supply chassis changes, the high-voltage DC power supply can quickly and accurately keep the box temperature stable by adjusting the speed of the cooling fan or the power of the heating wire, thereby effectively ensuring the stability of the output voltage. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 The diagram is a schematic diagram showing the structure of a high-voltage direct current power supply and its control logic according to an exemplary embodiment.

[0037] Figure 2 A temperature control logic diagram of a high-voltage DC power supply according to an embodiment of the present application is shown.

[0038] Figure 3 A logic diagram of the high voltage power supply output involved in an embodiment of the present application is shown.

[0039] Figure 4 The present invention is a method flow chart of a temperature control method in a high-voltage direct current power supply according to an exemplary embodiment.

[0040] Figure 5 A control logic diagram of a dual-path fuzzy PID controller involved in an embodiment of the present application is shown.

[0041] Figure 6 This is a graph showing the relationship between the ambient temperature and output voltage of a high voltage power supply without using fuzzy temperature closed-loop control.

[0042] Figure 7 This is a graph showing the relationship between the ambient temperature and output voltage of a high voltage power supply using fuzzy temperature closed-loop control.

[0043] Figure 8 It is a structural schematic diagram of a temperature control device in a high-voltage direct current power supply provided in an embodiment of the present application.

[0044] Fig. 9 It is a structural schematic diagram of a computer device provided by an optional embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0046] In the description of the embodiments of the present application, the term "corresponding" may indicate a direct or indirect correspondence between two items, or an association relationship between the two items, or a relationship between indication and being indicated, configuration and being configured, and the like.

[0047] High-voltage DC power supplies are widely used in ion implantation, ion beam and other application scenarios. With the rapid development of the integrated circuit industry, the manufacturing process level has evolved from micrometers to nanometers. As the line width becomes thinner and thinner, the polysilicon becomes thinner and thinner, and the implantation depth becomes shallower, ion implantation has advantages over thermal diffusion implantation, such as accurate and controllable implantation depth and concentration, and has become the mainstream process for integrated circuit manufacturing. Among them, the most critical indicator of ion implantation high-voltage power supply is high stability. The output stability of the suppressor power supply needs to reach 500PPM / 8hour, and the output voltage stability of the accelerating electrode power supply needs to reach more than 100PPM / 8hour to ensure the consistency of the produced chips.

[0048] The stability of high-voltage power supplies is mainly affected by temperature. When the temperature inside the high-voltage power supply changes, the output voltage characteristics of devices such as sampling resistors and operational amplifiers will change with the temperature, causing output voltage fluctuations. The traditional high-stability high-voltage power supply solution does not use temperature feedback. Therefore, when the ambient temperature or internal power supply losses increase, the stability of the power supply output will change. The classic solution uses temperature feedback to sample the internal ambient temperature and perform temperature compensation on the output voltage according to the ambient temperature. However, due to the differences in the devices used in each power supply, the temperature compensation coefficient of each power supply is different, and each power supply needs to be tested one by one, which increases production time and cost. The traditional constant temperature control method is the PID control method, which relies on the experience required to adjust the parameters of Kp, KI, and KD. The adjustment process is complicated and the accuracy is not high.

[0049] Therefore, the present application proposes a high-stability high-voltage DC power supply with fuzzy temperature closed-loop control, which uses a digital controller to achieve precise voltage internal temperature control and maintain it at a constant value to ensure the stability of the output voltage; the temperature control is controlled by a fuzzy algorithm, and when the temperature of the high-voltage power supply chassis changes, the cooling fan speed or the power of the heating wire can be adjusted to quickly and accurately maintain the box temperature stable. This solution can effectively ensure the stability of the output voltage by controlling the internal constant temperature of the power supply, and also avoids the need to test different power supplies one by one during the production process, thereby improving production efficiency and reducing costs. Figure 1 FIG. 1 is a schematic diagram showing the structure of a high voltage DC power supply and its control logic according to an exemplary embodiment. Figure 1 As shown, the high-voltage DC power supply includes a power electronic converter, a high-voltage converter and a voltage-doubling rectifier unit; the output of the power electronic converter forms a high-voltage output through a high-voltage transformer and a voltage-doubling rectifier; the high-voltage DC power supply also includes a digital controller; the digital controller is used to obtain a sampling signal obtained by sampling the high-voltage output, and generate a first control signal according to the sampling signal to control the power electronic converter; the digital controller is also used to control the heat sink and the heater in the high-voltage DC power supply to adjust the chassis temperature of the high-voltage DC power supply to a target value.

[0050] Optionally, the heat sink in the embodiment of the present application may be a fan and its related structures, and the heater in the embodiment itself may be a resistance wire arranged inside the chassis.

[0051] That is, the closed-loop control scheme of the digitally controlled high-voltage DC power supply includes the following links: high-voltage sampling link, op amp conditioning link, PWM controller, and kV signal setting. The PWM control signal output by the digital controller controls the power electronic converter, and the output of the power electronic converter forms a high-voltage output through a high-voltage transformer and a voltage doubler. The high-voltage output is processed in turn through a voltage divider, an op amp conditioning circuit, and an analog-to-digital conversion unit to obtain a sampling signal, thereby controlling the power electronic converter.

[0052] Please refer to Figure 2 , which shows a temperature control logic diagram of a high voltage DC power supply involved in an embodiment of the present application. Figure 2 As shown, the chassis temperature is closed-loop controlled by a digital controller, and the digital controller uses PID algorithm and fuzzy algorithm to control the fan and the heating wire to ensure a constant chassis temperature.

[0053] Please refer to Figure 3 , which shows a logic diagram of the high voltage power supply output involved in the embodiment of the present application. Figure 3 The high voltage output voltage U0 is shown in the following formula.

[0054]

[0055] In digital control, the reference voltage U2 and the gain K1 of the numerical controller are given by the digital quantity of the controller and will not be disturbed; the inverter conversion coefficient F, the transformer ratio N, and the voltage multiplication coefficient K2 of the voltage multiplier circuit will be affected by the input voltage, load and other influencing factors, but under closed-loop control, these changes will eventually be eliminated; for the voltage divider ratio β, the operational amplifier gain α, and the analog-to-digital converter gain γ, the input voltage and load will not affect them, but the ambient temperature change will affect them, and this influence is in the feedback link and cannot be eliminated by the closed-loop system, which will eventually cause the output voltage to change.

[0056] K1 is the gain of the digital controller, F is the conversion factor of the inverter, N is the transformation ratio of the transformer, and K2 is the voltage multiplication factor of the voltage multiplication circuit. The changes in the parameters of this part caused by the external environment can be offset by closed-loop control, so that the output high voltage can remain stable.

[0057] The output voltage U o Sampling is performed through a voltage divider, an op amp conditioning circuit, and an ADC module, and the error U between the sampling result and the given value U2 is calculated. oe The closed-loop controller calculates the switching frequency fsw of the inverter and controls the output voltage U o , to achieve closed-loop control.

[0058] The closed-loop controller calculation formula is as follows:

[0059] f sw (n) = f sw (n-1)+Δf sw (n);

[0060] f sw (n)=(k p +k i ) oe (n)-k p U oe (n-1);

[0061] Among them, β is the voltage divider ratio, which is composed of a resistor-capacitor voltage divider. The corresponding schematic diagram is shown in the figure. β is the voltage divider ratio R1 / R2 between the high-voltage resistor and the low-voltage resistor. It is easily affected by the external environment, especially the temperature, so it is necessary to select a high-stability resistor. α is the gain of the conditioning circuit composed of the operational amplifier, and γ is the gain of the analog-to-digital converter. Similarly, α and γ are also easily affected by temperature, so it is necessary to select a high-stability operational amplifier and analog-to-digital converter.

[0062] Figure 4The present invention is a method flow chart of a temperature control method in a high voltage DC power supply according to an exemplary embodiment. The method is executed by a digital controller, which can be implemented as a computer device.

[0063] like Figure 1 As shown, the temperature control method may include the following steps:

[0064] Step 401, determining the internal temperature of the chassis according to the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater and the heat dissipation of the radiator.

[0065] Specifically, in the embodiment of the present application, it is assumed that the lowest ambient temperature of the power supply is T air,min , the highest is T air,max In order to control the internal temperature of the high-voltage power supply to be constant, it is necessary to first discuss the value of the constant temperature inside the chassis. Since the high-voltage power supply itself generates heat, and under the heat dissipation conditions of forced air cooling, the internal ambient temperature of the power supply will inevitably be higher than the ambient temperature. Therefore, when designing the temperature value T that needs to be maintained inside the chassis give When the power supply is set to 0, it should be the internal temperature of the chassis when the ambient temperature is the highest, the heat dissipation conditions are the best, and the internal loss is the largest.

[0066] At this time, the given value of the internal temperature of the chassis can be calculated by the following formula:

[0067] T give =T air,max +P loss,max *R air,min ;

[0068] Among them, P loss,max is the maximum power loss.

[0069] R air,min The minimum thermal resistance between the inside of the chassis and the external environment.

[0070] P loss It consists of the following two parts: fixed loss P loss1 , loss P changes with output power loss2 .

[0071] Fixed loss P loss1 This includes auxiliary power loss, control IC heat loss, etc. Such losses will not change with output power.

[0072] P loss2 Including inverter MOSFET loss PMOS, transformer loss P Trans 、Inductance loss P ind , High voltage diode P diode Losses, etc. The losses of such devices are related to the output power.

[0073] Secondly, calculate the maximum power P of the required heating wire heat,max The power of the heating wire needs to be able to meet the system's ability to reach a given temperature under the lowest room temperature and the best heat dissipation conditions.

[0074] P heat,max =(T give -T air,min ) / R air,min ;

[0075] Among them, P heat is the power of the heating wire.

[0076] 3. The expression of the internal temperature of the chassis is:

[0077] T in =T air +(P loss +P heat )R air ;

[0078] T air is the current external ambient temperature.

[0079] At a certain moment, the steady-state temperature that can be reached inside the chassis is T in , which is determined by the current ambient temperature T air , the current output power loss P loss , the heat generated by the current heating wire P heat , current fan speed and cooling condition R air Decide.

[0080] Step 402, generating a second control signal and a third control signal according to the internal temperature of the chassis; the second control signal is used to control the radiator; the third control signal is used to control the heater.

[0081] Heating wire heat P heat and heat dissipation condition R air It can be controlled by adjusting the heating power of the heating wire and the fan speed. air And the power loss P loss It depends on the change of external environment temperature and the power output of the power supply at this moment. In order to keep the internal temperature of the power supply chassis constant, a temperature closed-loop control method needs to be adopted. At the same time, since the temperature control system is a large hysteresis system (large time constant), it is necessary to adopt a fuzzy plus control method to make it have a fast response and ensure that there is no overshoot after the temperature reaches a steady state.

[0082] The mathematical model of the power supply chassis has the characteristics of a second-order system. At the same time, because the temperature system has a large hysteresis, a second-order system with a large hysteresis term is used to represent the mathematical model of the temperature system:

[0083] G(s)=K / T1s 2 +T2s+1

[0084] Among them, K is the gain, T1 and T2 are time constants, which are determined by the power system parameters. The above values ​​can be tested based on the system temperature step response method.

[0085] The temperature system control includes the power of the heating wire and the speed of the fan, which are controlled by a dual-channel fuzzy PID controller. Figure 5 , which shows a control logic diagram of a dual-path fuzzy PID controller involved in an embodiment of the present application. Figure 5 As shown, when the internal temperature of the chassis is T in When the temperature is greater than a given value, the output of the speed PID is used to control the fan speed to quickly reduce the temperature. At this time, the output of the heating PID is 0 and the heating is stopped. in When the temperature inside the chassis is lower than the given temperature, the speed PID controls the fan speed to reduce the heat dissipation, and the heating PID controls the heating wire to heat. That is, when the temperature inside the chassis is higher than the given temperature, the third control signal is used to control the heater to stop heating; and the second control signal will adaptively adjust the fan speed according to the temperature inside the chassis, thereby adjusting the heat dissipation capacity.

[0086] In order to further improve the system control performance, when the internal temperature of the chassis approaches the given temperature, the fuzzy controller is used to continuously optimize the PID parameters so that when the temperature error is large, the temperature can approach the given temperature at a greater rate of change. When the system reaches the given temperature, the temperature can remain stable and not fluctuate. The output results of the fuzzy control include the parameters K of the speed PID controller. p1 ,K i1 ,K d1 And the parameter K of the power PID controller p2 ,K i2 ,K d2 At this time, the parameter of the speed controller is the second control parameter, the parameter of the power PID controller is the third control parameter, and the enabling control variable of the two controllers is ε.

[0087] Optionally, in an embodiment of the present application, the digital controller can determine the fuzzy output value based on the interval to which the internal temperature of the chassis belongs and the interval to which the rate of change of the internal temperature of the chassis belongs; query the corresponding control signal table based on the fuzzy output value to obtain the second control signal and the third control signal.

[0088] In the embodiment of the present application, the temperature error e and its change rate e' are used as the input of the fuzzy controller in the digital controller, and the output of the fuzzy controller is defined as Δε, the temperature error e is divided into five thresholds {T1, T2, T3, T4, T5}, the change rate e' is divided into five thresholds {dT1℃ / min, dT2℃ / min, 0, dT3℃ / min, dT4℃ / min}, and the output ε of the fuzzy controller is divided into 5 domains {1, 0.75, 0.5, 0.25, 0}. Then there is a fuzzy language:

[0089] e={NB, NS, ZO, PS, PB};

[0090] e'={NB, NS, ZO, PS, PB};

[0091] ε={NB, NS, ZO, PS, PB};

[0092] If |e| and |e'| are large, the approach rate ε should be increased, otherwise it should be reduced. The rules designed based on this experience are shown in Table 1:

[0093]

[0094]

[0095] Table 1. Input and output correspondence table of fuzzy controller

[0096] When ε=NB, NS, the speed PID control is stopped, so that the system can increase the temperature at the maximum rate. When ε=ZO, the speed PID and heating PID work at the same time to ensure the temperature stability of the system. When ε=PB, PS, only the PID works, so that the system can reduce the temperature at the maximum rate.

[0097] Furthermore, in an embodiment of the present application, the corresponding control signal table (ie, Table 1) can be queried according to the fuzzy output value to obtain the heating fuzzy interval and the heat dissipation fuzzy interval (at this time, the heating fuzzy interval and the heat dissipation fuzzy interval are both intervals corresponding to ε).

[0098] Then, according to the heating fuzzy interval and the parameters of the heater, a second control signal is obtained to control the working state of the heater; according to the heat dissipation fuzzy interval and the parameters of the radiator, a third control signal is obtained to control the working state of the radiator.

[0099] Specifically, the fuzzy controller needs to defuzzify the output variables and map the output variables from the fuzzy domain to the actual range of change, that is, the physical domain, that is, to obtain the second control signal and the third control signal to control the radiator and the heater. The fuzzy domain and physical domain of the input and output variables can be analyzed by the weighted average method, the median method and the maximum membership method, as shown in Table 2 below:

[0100]

[0101] Table 2. Correspondence between output variables and control signal values

[0102] Figure 6 and Figure 7 The relationship between the ambient temperature and the output voltage of the high-voltage power supply without fuzzy temperature closed-loop control and the relationship between the ambient temperature and the output voltage of the high-voltage power supply with fuzzy temperature closed-loop control are shown respectively. Figure 6 As shown in the figure, the high voltage power supply without fuzzy temperature closed-loop control has a stability of ±300PPM at an ambient temperature of 30-38°C; Figure 7 As shown, the stability of the high voltage power supply using analog fuzzy temperature closed-loop control is ±50PPM at an ambient temperature of 30-38°C.

[0103] In summary, the high-voltage DC power supply provided in the embodiment of the present application can process the sampling signal through the digital controller to achieve the normal working state of the high-voltage DC power supply, and control the heat sink and the heater in the high-voltage DC power supply through the digital controller, so as to adjust the chassis temperature of the high-voltage DC power supply to a constant target value. That is, when the temperature of the high-voltage power supply chassis changes, the high-voltage DC power supply can quickly and accurately keep the box temperature stable by adjusting the speed of the cooling fan or the power of the heating wire, thereby effectively ensuring the stability of the output voltage.

[0104] In the embodiments of the present application, a temperature control device in a high voltage DC power supply is also provided, which is used to implement the above embodiments and preferred embodiments, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware is also possible and conceived.

[0105] The present application provides a temperature control device in a high voltage DC power supply. Figure 8 : is a schematic diagram of the structure of a temperature control device in a high-voltage direct current power supply provided in an embodiment of the present application, the device comprising:

[0106] The temperature determination module 801 is used to determine the internal temperature of the chassis according to the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater and the heat dissipation of the radiator;

[0107] The signal generating module 802 is used to generate a second control signal and a third control signal according to the internal temperature of the chassis; the second control signal is used to control the radiator; and the third control signal is used to control the heater.

[0108] In a possible implementation, when the internal temperature of the chassis is higher than a given temperature, the third control signal is used to control the heater to stop heating.

[0109] In a possible implementation, the signal generating module 802 is further configured to:

[0110] Determine a fuzzy output value according to the interval to which the temperature inside the chassis belongs and the interval to which the rate of change of the temperature inside the chassis belongs;

[0111] The corresponding control signal table is queried according to the fuzzy output value to obtain the second control signal and the third control signal.

[0112] In a possible implementation, the signal generating module 802 is further used to: query a corresponding control signal table according to the fuzzy output value to obtain the heating fuzzy interval and the cooling fuzzy interval;

[0113] According to the heating fuzzy interval and the parameters of the heater, acquiring the second control signal to control the working state of the heater;

[0114] According to the heat dissipation fuzzy interval and the parameters of the heat sink, the third control signal is obtained to control the working state of the heat sink.

[0115] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0116] In summary, the high-voltage DC power supply provided in the embodiment of the present application can process the sampling signal through the digital controller to achieve the normal working state of the high-voltage DC power supply, and control the heat sink and the heater in the high-voltage DC power supply through the digital controller, so as to adjust the chassis temperature of the high-voltage DC power supply to a constant target value. That is, when the temperature of the high-voltage power supply chassis changes, the high-voltage DC power supply can quickly and accurately keep the box temperature stable by adjusting the speed of the cooling fan or the power of the heating wire, thereby effectively ensuring the stability of the output voltage.

[0117] The temperature control device in the high-voltage DC power supply in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0118] See also Fig. 9 , Fig. 9 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Fig. 9 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the computer device, including instructions stored in or on the memory to display graphic information in a graphical user interface on an external input / output device (such as a display device coupled to an interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Fig. 9 A processor 10 is taken as an example.

[0119] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0120] The memory 20 stores instructions executable by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0121] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0122] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0123] The computer device further comprises a communication interface 30 for the computer device to communicate with other devices or a communication network.

[0124] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0125] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0126] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A high voltage DC power supply, characterized in that: The high-voltage DC power supply includes a power electronic converter, a high-voltage converter and a voltage-doubling rectifier unit; the output of the power electronic converter is converted into a high-voltage output through a high-voltage transformer and a voltage-doubling rectifier; The high-voltage DC power supply further includes a digital controller; the digital controller is used to obtain a sampling signal obtained by sampling the high-voltage output, and generate a first control signal according to the sampling signal to control the power electronic converter; The digital controller is also used to control the heat sink and the heater in the high-voltage DC power supply to adjust the chassis temperature of the high-voltage DC power supply to a target value.

2. The high voltage DC power supply according to claim 1, characterized in that: The sampling signal is obtained by processing the high voltage output in sequence through a voltage divider, an operational amplifier conditioning circuit, and an analog-to-digital conversion unit.

3. A temperature control method in a high voltage DC power supply, characterized in that: The method is performed by a digital controller in the high-voltage direct current power supply according to claim 1 or 2, and the method comprises: The internal temperature of the chassis is determined based on the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater, and the heat dissipation of the radiator; A second control signal and a third control signal are generated according to the internal temperature of the chassis; the second control signal is used to control the radiator; and the third control signal is used to control the heater.

4. The temperature control method according to claim 3, characterized in that: When the internal temperature of the chassis is higher than a given temperature, the third control signal is used to control the heater to stop heating.

5. The temperature control method according to claim 4, characterized in that: The method of generating a second control signal and a third control signal according to the internal temperature of the chassis, wherein the second control signal is used to control the radiator, comprises: Determine a fuzzy output value according to the interval to which the temperature inside the chassis belongs and the interval to which the rate of change of the temperature inside the chassis belongs; The corresponding control signal table is queried according to the fuzzy output value to obtain the second control signal and the third control signal.

6. The temperature control method according to claim 5, characterized in that: The step of querying a corresponding control signal table according to the fuzzy output value to obtain the second control signal and the third control signal includes: According to the fuzzy output value, a corresponding control signal table is searched to obtain the heating fuzzy interval and the heat dissipation fuzzy interval; According to the heating fuzzy interval and the parameters of the heater, acquiring the second control signal to control the working state of the heater; According to the heat dissipation fuzzy interval and the parameters of the heat sink, the third control signal is obtained to control the working state of the heat sink.

7. A temperature control device in a high voltage DC power supply, characterized in that: The device is applied to a digital controller in a high voltage DC power supply as claimed in claim 1 or 2, and the device comprises: The temperature determination module is used to determine the internal temperature of the chassis according to the current ambient temperature of the chassis, the loss caused by the current output power, the heat generated by the heater and the heat dissipation of the radiator; The signal generating module is used to generate a second control signal and a third control signal according to the internal temperature of the chassis; the second control signal is used to control the radiator; and the third control signal is used to control the heater.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the temperature control method according to any one of claims 3 to 6 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the temperature control method according to any one of claims 3 to 6.

10. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the temperature control method according to any one of claims 3 to 6.

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