A micro-channel based LVDT displacement sensor heat dissipation structure

Abstract

This invention relates to a heat dissipation structure for an LVDT displacement sensor based on a microchannel, belonging to the field of sensor technology. It includes: a housing, a frame, a coil, an iron core, a microchannel, a water tank, and a piezoelectric diaphragm. The frame is disposed within the housing, with the coil arranged around its outer periphery. The iron core is disposed inside the frame and is movable along its axial direction. The microchannel is disposed inside the frame and surrounds the iron core. The water tank is located near one end of the frame. A liquid channel is formed within the microchannel, communicating with the water tank. The piezoelectric diaphragm is located near the water tank and is used to drive the heat-conducting liquid within the water tank to flow along the liquid channel. This invention, by providing a micro-heat dissipation channel within the frame and combining it with the piezoelectric diaphragm to drive the circulating flow of the heat-conducting liquid, effectively conducts and releases heat to the external environment, improving the performance and operational stability of the LVDT displacement sensor in applications requiring high linearity.

Description

Technical Field

[0001] This invention belongs to the field of sensor technology, specifically relating to a heat dissipation structure for an LVDT displacement sensor based on a microchannel. Background Technology

[0002] In automated equipment and servo control systems, LVDT (Linear Variable Differential Transformer) displacement sensors are often used as the core sensors for displacement detection to ensure the closed-loop control accuracy of the system. In practical applications of LVDT displacement sensors, especially under high-precision measurement and complex operating conditions, maintaining excellent linearity is a core requirement for sensor performance. However, rising temperatures can significantly affect the linearity of LVDT displacement sensors, causing output characteristic shifts and consequently affecting measurement accuracy. In high-temperature, high-load, or long-term operation applications, such as servo systems, industrial automation equipment, and aerospace sensors, LVDT displacement sensors not only need to maintain accurate linear output but also need to effectively address significant heat dissipation issues to ensure stability and reliability. The main factors causing temperature rise in LVDT displacement sensors include two aspects: firstly, the Joule heat generated by the coil's energization; and secondly, the cumulative effect of the external ambient temperature. Temperature rise not only affects the magnetic flux distribution of the coil, thus reducing the sensor's linearity, but may also damage internal insulation materials, accelerate aging, and even cause malfunctions. Therefore, improving heat dissipation performance and alleviating the problem of heat accumulation caused by limited heat dissipation has become a key aspect of improving the accuracy and linearity of LVDT displacement sensors.

[0003] Due to the compact internal structure of LVDT displacement sensors, including key components such as coils, cores, and frames, internal space is typically very limited. Therefore, existing heat dissipation methods typically place the heat dissipation structure on the sensor housing or directly on the outside of the sensor. Placing the heat dissipation structure on the sensor housing mainly achieves this through high-pressure oil flow channels, guiding the fluid to flow inside the sensor via inlet and outlet pipes. After absorbing heat, the oil is carried away by an external circulation system, achieving heat dissipation. However, this design is complex, requiring additional inlet and outlet pipes, oil passages, and high-pressure pumps, resulting in high manufacturing and assembly costs. Furthermore, it relies excessively on the stability of the external oil circulation system; if the system malfunctions, the heat dissipation efficiency drops significantly. Simultaneously, long-term operation under high pressure can easily lead to oil leakage and seal aging, increasing maintenance difficulty and safety hazards. Most importantly, because this solution relies entirely on oil conduction of heat, the heat must pass through the coil assembly, housing, and other insulation layers before being carried away by the oil, resulting in low heat dissipation efficiency. Another approach, using an external, independent heat dissipation device, employs a support frame magnet fixed to the surface of the LVDT displacement sensor and a fan magnetically attached to the support frame magnet for heat dissipation. The heat dissipation device utilizes the fan's airflow to remove heat generated by the internal windings of the LVDT displacement sensor. However, firstly, the fan's heat dissipation efficiency is limited, and it is poor at handling heat accumulation during high-power or long-term operation, especially in high-temperature or enclosed environments. Secondly, the magnetic attachment method may cause the fan to shift or fall off under vibration or impact, resulting in insufficient reliability. Furthermore, as a mechanical component, the fan is susceptible to dust and moisture, leading to malfunctions and increasing maintenance frequency and costs. More importantly, the support frame magnet may generate a magnetic field around the sensor, interfering with the normal operation of the LVDT displacement sensor and affecting signal accuracy.

[0004] During operation, the Joule heat generated by the coil of an LVDT displacement sensor is the primary heat source causing temperature rise. As current continues to flow, the coil inevitably releases a large amount of heat due to the resistance effect. This heat not only directly affects the temperature distribution inside the sensor but may also adversely affect surrounding components through heat conduction. Since existing heat dissipation solutions generally have low efficiency, they cannot meet the temperature stability requirements of high-precision measurements. Therefore, a high-efficiency and reliable LVDT displacement sensor is needed. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, this invention provides a heat dissipation structure for an LVDT displacement sensor based on a microchannel. The technical problem to be solved by this invention is achieved through the following technical solution:

[0006] This invention provides a heat dissipation structure for an LVDT displacement sensor based on a microchannel, comprising: a housing, a frame, a coil, an iron core, a microchannel, a water tank, and a piezoelectric diaphragm; wherein, the frame is disposed within the housing, and the coil is arranged around the outer periphery of the frame; the iron core is disposed inside the frame and is movable along its axial direction; the microchannel is disposed inside the frame and surrounds the iron core; the water tank is disposed near one end of the frame; a liquid channel is formed within the microchannel and communicates with the water tank through the liquid channel; the piezoelectric diaphragm is disposed near the water tank and is used to drive the heat-conducting liquid in the water tank to flow along the liquid channel.

[0007] In one embodiment of the present invention, the inner surface of the microchannel is provided with a hydrophilic coating; the material of the hydrophilic coating includes: polyvinyl alcohol, polyethylene glycol, polyacrylamide, silica nanoparticles or titanium dioxide.

[0008] In one embodiment of the present invention, a one-way valve is provided between the water outlet of the water tank and the microchannel.

[0009] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the microchannel further includes: two insulating partitions and two flanges, the two insulating partitions being respectively disposed at both ends of the frame and respectively connected to the outer shell; the two flanges being respectively connected to the two insulating partitions; and the water tank being disposed on one of the flanges.

[0010] In one embodiment of the present invention, elastic damping material is provided between the piezoelectric diaphragm and the water tank, and between the water tank and the flange.

[0011] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the microchannel further includes: a plurality of connectors; the two ends of each connector are arranged perpendicularly to each other and are respectively connected to the frame and the insulating partition.

[0012] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the microchannel further includes: a guide rod; the guide rod is disposed at one end of the housing; the iron core is coaxially disposed with the guide rod, and the iron core is slidably connected to the guide rod.

[0013] In one embodiment of the present invention, a sandwich layer is provided inside the skeleton, and the sandwich layer is filled with a phase change heat-absorbing material.

[0014] In one embodiment of the present invention, the heat dissipation structure of the LVDT displacement sensor based on the microchannel further includes: an aerosol cooling component; the aerosol cooling component includes: an aerosol nozzle and a guide plate; wherein, the aerosol nozzle is disposed on one side of the housing and is used to spray cooling aerosol; the housing is provided with a plurality of exhaust holes, and a plurality of the guide plates are disposed close to the plurality of exhaust holes to guide the flow direction of the cooling aerosol.

[0015] In one embodiment of the present invention, the guide plate is made of shape memory alloy and unfolds when the temperature rises.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] The present invention discloses a heat dissipation structure for an LVDT displacement sensor based on microchannels. Microchannels are integrated within the frame and positioned close to the coil. Combined with a piezoelectric diaphragm driving the circulation of a heat-conducting liquid, this effectively conducts and releases heat to the external environment. By tightly integrating the heat dissipation structure with the main structure of the LVDT displacement sensor, the size and weight of the sensor are reduced, improving its applicability. Furthermore, this not only significantly lowers the operating temperature of the LVDT displacement sensor but also stabilizes the magnetic properties of the coil, enhancing the performance and operational stability of the LVDT displacement sensor in applications requiring high linearity.

[0018] This invention fills the skeleton with a phase change heat-absorbing material. After reaching the phase change temperature of the phase change heat-absorbing material, the material absorbs a large amount of heat during the phase change, thereby effectively reducing the temperature fluctuation inside the LVDT displacement sensor and ensuring that the LVDT displacement sensor always operates within a stable temperature range. This improves the long-term stability and measurement accuracy of the LVDT displacement sensor while reducing the impact of temperature changes on its performance.

[0019] This invention incorporates an aerosol cooling component. By designing the aerosol cooling component within the LVDT displacement sensor, a cooling aerosol and ventilation channel are formed. Combined with the circulating flow of heat-conducting liquid within the microchannel, temperature management within the LVDT displacement sensor is achieved. This ensures that the LVDT displacement sensor maintains operational stability even in high-temperature environments, avoiding the impact of overheating on measurement accuracy.

[0020] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a heat dissipation structure for an LVDT displacement sensor based on a microchannel, provided in an embodiment of the present invention.

[0022] Figure 2 This is a cross-sectional view of the heat dissipation structure of the LVDT displacement sensor based on a microchannel provided in an embodiment of the present invention;

[0023] Figure 3 This is a cross-sectional view of another heat dissipation structure for an LVDT displacement sensor based on a microchannel provided in an embodiment of the present invention;

[0024] Figure 4 This is a cross-sectional view of another heat dissipation structure for an LVDT displacement sensor based on a microchannel provided in an embodiment of the present invention;

[0025] Figure 5 This is provided by the embodiments of the present invention. Figure 4 A schematic diagram illustrating the working process of the LVDT displacement sensor in the diagram;

[0026] Figures 6a to 6c These are schematic diagrams of the micro heat dissipation channels provided in the embodiments of the present invention.

[0027] Icons: 1-Outer shell; 2-Skeleton; 3-Coil; 4-Iron core; 5-Miniature channel; 6-Water tank; 7-Piezoelectric diaphragm; 8-Insulating partition; 9-Flange; 10-Connector; 11-Guide rod; 12-Phase change heat absorption material; 13-Aerosol nozzle; 14-Guide plate. Detailed Implementation

[0028] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the following describes in detail a heat dissipation structure for an LVDT displacement sensor based on a microchannel, in conjunction with the accompanying drawings and specific embodiments.

[0029] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of specific embodiments in conjunction with the accompanying drawings. Through the description of the specific embodiments, a more in-depth and concrete understanding can be gained of the technical means and effects adopted by the present invention to achieve its intended purpose. However, the accompanying drawings are for reference and illustration only and are not intended to limit the technical solutions of the present invention.

[0030] Example 1

[0031] Since the internal space of LVDT is usually very limited, the cooling structure may occupy the space of critical components, making it difficult to balance performance and heat dissipation requirements in the design. In view of this, this embodiment provides a heat dissipation structure for LVDT displacement sensor based on microchannel.

[0032] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of a heat dissipation structure for an LVDT displacement sensor based on a microchannel, provided in an embodiment of the present invention. Figure 2 This is a cross-sectional view of the heat dissipation structure of the LVDT displacement sensor based on a microchannel provided in an embodiment of the present invention.

[0033] In this embodiment, the heat dissipation structure of the LVDT displacement sensor based on microchannels includes: a housing 1, a frame 2, a coil 3, an iron core 4, a microchannel 5, a water tank 6, and a piezoelectric diaphragm 7. The frame 2 is disposed within the housing 1, and the coil 3 is arranged around the outer periphery of the frame 2. The iron core 4 is disposed inside the frame 2 and is movable along its axial direction. The microchannel 5 is disposed inside the frame 2 and surrounds the iron core 4. The water tank 6 is disposed near one end of the frame 2. A liquid channel is formed within the microchannel 5 and communicates with the water tank 6 through the liquid channel. The piezoelectric diaphragm 7 is disposed near the water tank 6 and is used to drive the heat-conducting liquid in the water tank 6 to flow along the liquid channel.

[0034] The principle behind this LVDT displacement sensor is that it measures displacement based on the principle of magnetic induction. First, an excitation is applied to the coil 3. When external displacement occurs, the iron core 4 moves to achieve displacement measurement. During operation, the heat generated on the coil 3 needs to be conducted away to dissipate heat. The piezoelectric diaphragm 7 generates periodic vibrations, which change the pressure of the heat-conducting liquid in the water tank 6, thus pushing the liquid to flow into the microchannel 5. The microchannel 5 contains a liquid channel, and the heat-conducting liquid circulates within it, thereby carrying away the heat generated by the coil 3 and accumulated inside the frame 2, reducing the temperature rise of the LVDT displacement sensor.

[0035] For example, the inner diameter of the liquid channel of the microchannel 5 can be set to a range of 0.5 mm to 2 mm to ensure that the heat-conducting liquid has a sufficient flow rate, avoid excessive friction loss, and ensure continuous circulation.

[0036] For example, the heat-conducting fluid can be a water-based coolant or a non-water-based coolant, such as a fluorinated liquid or a nanofluid coolant.

[0037] It is worth noting that by placing the microchannels 5 inside the frame 2, no additional volume or weight is added, making it widely applicable. Furthermore, the circulating heat-conducting liquid along the liquid channels improves the cooling effect of the heat generated by the coil 3.

[0038] In an optional embodiment, a conduit is also connected between the water tank 6 and the microchannel 5. The conduit is located outside the frame 2, extending from the water tank 6 and connecting to the microchannel 5 at the other end. Adjustable retaining rings are provided at the pipe interfaces between the conduit and the water tank 6, between the water tank 6 and the microchannel 5, and between the microchannel 5 and the conduit. These retaining rings ensure a secure fixation and prevent the connection from loosening. The separate conduit also facilitates observation and adjustment of the connection status from outside the frame 2, especially when connecting microchannels 5 of different shapes.

[0039] like Figures 6a to 6c As shown, Figures 6a to 6c These are schematic diagrams of the micro heat dissipation channels provided in the embodiments of the present invention.

[0040] It should be noted that the shape of the microchannel 5 can be in various forms, and the present invention does not limit it.

[0041] For example, such as Figure 6a As shown, the microchannel 5 is a diamond-shaped mesh, consisting of several intersecting channel tubes forming a near-cylindrical structure. The intersecting channel tubes form a diamond-shaped mesh. Its interior can be divided into four parts, each forming a flow path. Each flow path is led out by a channel tube, and the four channel tubes eventually converge on a conduit, which connects to the water tank 6 and also connects the diamond-shaped mesh inside the microchannel 5.

[0042] It is worth noting that by configuring the microchannel 5 as a diamond-shaped mesh, the four sections can achieve dispersed heat dissipation through corresponding channel tubes. Furthermore, the diamond-shaped mesh inside the microchannel 5 can be interconnected for cooling, allowing multiple sections to exchange heat in parallel, reducing the heat load on a single channel and improving overall cooling efficiency. Simultaneously, the diamond-shaped mesh configuration of the microchannel 5 also ensures a uniform distribution of the heat dissipation area. The four channel tubes disperse the flow of the heat-conducting liquid, ensuring uniform flow throughout the system and preventing localized overheating or uneven cooling. This facilitates more efficient heat management in micro-cooling systems, especially in applications requiring frequent temperature adjustments.

[0043] For example, such as Figure 6b As shown, the microchannel 5 is honeycomb-shaped, with several long strip channels arranged at intervals inside. Hexagonal honeycomb structures are arranged between adjacent channels, and the honeycomb structures and the long strip channels are interconnected. Each long strip channel is divided into 5 parts, which are connected to five channel pipes for cooling. The five channel pipes eventually converge on a single conduit, and several conduits can be further combined into two main conduits and connected to the water tank 6.

[0044] It is worth noting that arranging the microchannels 5 in a honeycomb pattern effectively increases the fluid flow path, enhances the fluid's thermal conductivity, and makes the flow of the heat-conducting liquid within the channels more uniform, resulting in a more even distribution of heat. The uniform distribution of the heat-conducting liquid within each hexagonal honeycomb structure improves the uniformity of heat exchange. In a heat dissipation system, uniform flow effectively prevents heat concentration in a single location, thereby reducing thermal stress caused by temperature differences. It also enhances fluid mixing; the interaction between the elongated channels and hexagonal units in the honeycomb structure increases the fluid's turbulence effect, thus improving the heat transfer efficiency of the heat-conducting liquid, making it suitable for applications with complex thermal management requirements.

[0045] For example, such as Figure 6c As shown, the microchannel 5 is mesh-like, and both the microchannel 5 and the frame 2 can be designed in the shape of an hourglass. This structure helps to improve the linearity of the LVDT and also optimizes the heat dissipation of the coil 3.

[0046] In an optional embodiment, a one-way valve is provided between the outlet of the water tank 6 and the microchannel 5 to ensure that the heat-conducting liquid in the microchannel 5 flows in one direction and does not flow back.

[0047] In an alternative implementation, a one-way valve can also be installed between the return port of the water tank 6 and the microchannel 5, which also serves to prevent the backflow of the heat-conducting liquid.

[0048] It is worth noting that by setting a one-way valve, the heat transfer liquid flows unidirectionally into the microchannel 5 to exchange heat and cool the coil 3. Specifically, the one-way valve prevents the heat transfer liquid from flowing back due to the reverse vibration of the piezoelectric diaphragm 7. The other end of the microchannel 5 is then connected to the return port of the water tank 6, thus forming a cooling cycle.

[0049] For example, a piezoelectric diaphragm 7 is installed on a water tank 6. It is provided with a diaphragm that can deform under the stimulation of alternating voltage. The diaphragm is installed in a closed cavity or water chamber and can effectively compress and release the heat-conducting liquid so as to directly or indirectly affect the heat-conducting liquid in the water tank 6 through the deformation of the diaphragm.

[0050] Furthermore, the piezoelectric diaphragm 7 is installed on the top or bottom of the water tank 6 and fixed by bolts. The central part of the diaphragm is in direct contact with the water tank 6 to transmit pressure changes through the vibration of the diaphragm.

[0051] The working principle of the piezoelectric diaphragm 7 is that by applying an alternating voltage, the diaphragm 7 undergoes bending deformation. When the diaphragm bends inward, it compresses the heat-conducting liquid in the water tank 6, generating pressure; when the diaphragm bends outward, it releases the pressure, the pressure in the water tank 6 decreases, and the one-way valve closes to prevent backflow of the heat-conducting liquid. By continuously applying an alternating voltage and generating deformation, the diaphragm periodically drives the heat-conducting liquid in the water tank 6 to vibrate, forming pulsed pressure waves, thereby pushing the heat-conducting liquid into the microchannel 5 for circulation.

[0052] For example, after the liquid inside the water tank 6 enters the microchannel 5 through the one-way valve, a hydrophilic coating can be provided on the inner surface of the microchannel 5 to improve the fluidity of the heat-conducting liquid.

[0053] For example, hydrophilic materials, such as polymers like polyvinyl alcohol (PVA), polyethylene glycol (PEG), and polyacrylamide (PAM), or inorganic materials like silica (SiO2) nanoparticles and titanium dioxide (TiO2), are dissolved in a solvent. The microchannel 5 is then immersed in the solution, allowing the coating to deposit naturally on the surface of the liquid channel. Using a hydrophilic coating significantly reduces the surface tension of the liquid, making it easier for the heat-conducting liquid to spread and flow along the inner wall of the channel. Since liquid flow is greatly affected by surface tension, a hydrophilic coating increases the wettability of the liquid on the surface, promoting smooth flow of the heat-conducting liquid along the liquid channel and reducing stagnation or uneven flow.

[0054] In an optional implementation, the heat dissipation structure of the LVDT displacement sensor based on microchannels further includes: two insulating partitions 8 and two flanges 9. The two insulating partitions 8 are respectively disposed at both ends of the frame 2 and respectively connected to the outer shell 1; the two flanges 9 are respectively connected to the two insulating partitions 8; and a water tank 6 is disposed on one of the flanges 9.

[0055] It is worth noting that since the piezoelectric diaphragm 7 may cause a slight change in magnetic field when vibrating, especially when current passes through the driving electrode of the piezoelectric diaphragm 7, the insulating partition 8 is made of insulating material to reduce the interference of the magnetic field on the normal operation of the LVDT displacement sensor.

[0056] In one optional embodiment, there are a plurality of connectors 10; each connector 10 is L-shaped, with both ends of each connector 10 perpendicular to each other, and is respectively connected to the frame 2 and the insulating partition 8.

[0057] The principle is as follows: two insulating partitions 8 are spaced apart and arranged inside the outer casing 1. Each insulating partition 8 has a cavity in its middle to form a clamping structure. Two flanges 9 are respectively embedded into the cavities in the middle of the two insulating partitions 8. At the same time, the frame 2 and the insulating partitions 8 are fixed together by L-shaped connectors 10. The mechanical fixation ensures the stability of the frame 2 and avoids the positional displacement of the frame 2 due to vibration or external interference. This achieves stable installation and precise positioning of the frame 2, ensuring that the LVDT can maintain a precise measurement position during operation.

[0058] In an optional embodiment, a sealing gasket, such as a silicone gasket or a rubber gasket, can be used at the connection between the piezoelectric diaphragm 7 and the water tank 6 to achieve a seal. Placing the sealing gasket at the joint where the diaphragm and the water tank 6 contact also helps to mitigate the impact of vibrations from the piezoelectric diaphragm 7 on the water tank 6 and the external environment, thus improving measurement accuracy.

[0059] Furthermore, elastic damping materials are provided between the piezoelectric diaphragm 7 and the water tank 6, and between the water tank 6 and the flange 9.

[0060] For example, the elastic damping material can be silicone rubber or polyurethane.

[0061] For example, elastic vibration isolation supports, such as springs or rubber pads, can be used to suspend the water tank 6 on the flange 9 to achieve a vibration reduction effect.

[0062] Specifically, a damping layer formed by sealing gaskets or elastic damping materials can absorb excess energy generated by diaphragm vibration. The damping layer can be designed along the vibration transmission path, such as between the piezoelectric diaphragm 7 and the water tank 6, or between the water tank 6 and the flange 9, or elastic vibration isolation supports can be used to suspend the water tank 6, such as springs or rubber pads, to reduce the path of vibration transmission to the outside. Simultaneously, by adjusting the size, thickness, or driving voltage frequency of the piezoelectric diaphragm 7, preventing the diaphragm's operating frequency from coinciding with the resonant frequency of the water tank 6 or surrounding structures, vibration reduction can also be achieved.

[0063] Furthermore, multiple small-sized diaphragms can be used instead of a large-sized diaphragm to disperse the vibration source and achieve synchronous drive through phase control, so as to further reduce the overall amplitude of the system and thus keep the vibration direction of the piezoelectric diaphragm 7 and the water tank 6 stable.

[0064] In an optional embodiment, the heat dissipation structure of the LVDT displacement sensor based on the microchannel further includes: a guide rod 11; the guide rod 11 is disposed at one end of the housing 1; the iron core 4 is coaxially disposed with the guide rod 11, and the iron core 4 and the guide rod 11 are slidably connected, that is, the iron core 4 and the guide rod 11 can slide relative to each other.

[0065] The principle is that a sleeve-type connection structure is formed between the iron core 4 and the guide rod 11. One end of the guide rod 11 is fixed to the outer shell 1, and the other end is slidably connected to the iron core 4. Guided by the guide rod 11, the iron core 4 can move freely and smoothly along the guide rod 11 to achieve displacement measurement and ensure the measurement accuracy of the LVDT displacement sensor. Furthermore, the contact surface between the iron core 4 and the guide rod 11 is coated with a low-friction material to reduce friction and ensure the smooth movement of the iron core 4.

[0066] The present invention discloses a heat dissipation structure for an LVDT displacement sensor based on microchannels. Microchannels are integrated within the frame and positioned close to the coil. Combined with a piezoelectric diaphragm driving the circulation of a heat-conducting liquid, this effectively conducts and releases heat to the external environment. By tightly integrating the heat dissipation structure with the main structure of the LVDT displacement sensor, the size and weight of the sensor are reduced, improving its applicability. Furthermore, this not only significantly lowers the operating temperature of the LVDT displacement sensor but also stabilizes the magnetic properties of the coil, enhancing the performance and operational stability of the LVDT displacement sensor in applications requiring high linearity.

[0067] Example 2

[0068] like Figure 3 As shown, Figure 3 This is a cross-sectional view of another heat dissipation structure for an LVDT displacement sensor based on a microchannel, provided in an embodiment of the present invention.

[0069] The difference between this embodiment and Embodiment 1 is that a sandwich layer is provided inside the skeleton 2, and the sandwich layer is filled with a phase change heat-absorbing material 12.

[0070] For example, the phase change heat-absorbing material 12 can be paraffin, stearic acid or other organic phase change materials suitable for the medium and low temperature range.

[0071] For example, the phase change heat-absorbing material 12 can be paraffin wax, which has a low melting point, is suitable for working environments of around 40°C, and has good heat storage capacity.

[0072] For example, the phase change heat-absorbing material 12 can also be docosane (C22H46), which belongs to the alkane organic phase change material and also has a low melting point and good heat storage capacity.

[0073] The principle is that, under normal operating conditions, the internal temperature of an LVDT displacement sensor is typically maintained within the range of room temperature to 50 degrees Celsius. To effectively control the internal temperature of the LVDT displacement sensor and prevent overheating, the phase change heat-absorbing material 12 can be set to 40 degrees Celsius. When the temperature reaches its phase change temperature, the phase change heat-absorbing material 12 absorbs a large amount of heat, thereby effectively reducing temperature fluctuations inside the LVDT displacement sensor. After the temperature decreases, the phase change heat-absorbing material 12 can also return to its original state. By setting the phase change heat-absorbing material 12, the LVDT displacement sensor always operates within a stable temperature range, improving the long-term stability and measurement accuracy of the LVDT displacement sensor, while reducing the impact of temperature changes on performance.

[0074] This invention fills the skeleton with a phase change heat-absorbing material. After reaching the phase change temperature of the phase change heat-absorbing material, the material absorbs a large amount of heat during the phase change, thereby effectively reducing the temperature fluctuation inside the LVDT displacement sensor and ensuring that the LVDT displacement sensor always operates within a stable temperature range. This improves the long-term stability and measurement accuracy of the LVDT displacement sensor while reducing the impact of temperature changes on its performance.

[0075] Example 3

[0076] like Figure 4 As shown, Figure 4 This is a cross-sectional view of another heat dissipation structure for an LVDT displacement sensor based on a microchannel provided in an embodiment of the present invention.

[0077] The difference between this embodiment and embodiment one or embodiment two is that an aerosol cooling component is provided; the aerosol cooling component includes: an aerosol nozzle 13 and a guide plate 14;

[0078] The aerosol nozzle 13 is located on one side of the outer casing 1 and is used to spray cooling aerosol. The outer casing 1 is provided with several exhaust holes, and several guide plates 14 are respectively arranged close to several exhaust holes to guide the flow direction of the cooling aerosol.

[0079] In an alternative embodiment, the deflector 14 is made of shape memory alloy (SMA) and unfolds as the temperature rises.

[0080] For example, the guide plate 14 is made of nickel-titanium shape memory alloy. One end of the guide plate 14 is fixed to the inner wall of the outer shell 1 using a high-strength, high-temperature resistant adhesive, while the other end of the guide plate 14 is a free end. The adhesive used can maintain stability and strength during temperature changes. Alternatively, a mechanical connection hook, slot, or other mechanical structure can be used to connect one end of the guide plate 14 to the inner wall of the outer shell 1 and ensure that the guide plate 14 will not fall off during operation. By training the initial shape of the guide plate 14, a bidirectional memory effect is achieved, thereby ensuring that the guide plate 14 can change from a tightly closed state to an open state of 30 degrees.

[0081] Its working process is as follows Figure 5 As shown, Figure 5 This is provided by the embodiments of the present invention. Figure 4 A schematic diagram of the working process of the LVDT displacement sensor.

[0082] Two aerosol nozzles 13 are spaced apart on one side of the housing 1. Each aerosol nozzle 13 can spray cooling aerosol, such as cooling gas or micro water mist. Several guide plates 14 are installed on the inner side of the housing 1. The guide plates 14 are made of shape memory alloy (SMA) material. When the temperature rises, they are driven to unfold by the phase change of the shape memory alloy to guide the cooling aerosol to flow along the direction of the guide plate 14. This allows the hot air to be efficiently discharged through the exhaust port on the housing 1, forming a stable airflow circulation, which can directly reduce the temperature of the core components inside the LVDT displacement sensor.

[0083] Specifically, at low temperatures, such as 30°C, the guide plate 14 remains contracted and close to the inner wall of the outer casing 1; at high temperatures, the guide plate 14 expands and tilts upwards to form an angle, which can be flexibly adjusted according to the overall structure to optimize the airflow channel. The outer casing 1 is provided with several exhaust holes, forming an exhaust channel through which hot air is discharged, while also preventing external hot air from entering the equipment.

[0084] Furthermore, the exhaust port is located between the two guide plates 14. When the temperature of the LVDT displacement sensor is around 30°C, before the phase change of the guide plate 14 is triggered, the guide plate 14 retracts and adheres to the inner wall of the outer casing 1 to seal the exhaust port, preventing external air from entering the LVDT displacement sensor and preventing the cold air after the LVDT displacement sensor has been liquid-cooled from being discharged. When the temperature reaches 40°C, the guide plate 14 triggers a phase change, and the internal hot air is discharged through the exhaust port on the outer casing 1 and the exhaust ports located on both sides of the aerosol nozzle 13.

[0085] Furthermore, a small temperature sensor can be installed on the outer shell 1 of the LVDT displacement sensor. The temperature sensor can monitor the internal temperature in real time. When the internal temperature of the LVDT displacement sensor reaches 30°C, the piezoelectric diaphragm 7 is controlled to push the water in the water tank 6 into the microchannel 5 for cooling through the heat-conducting liquid. When the temperature sensor temperature reaches 40°C, the internal temperature also exceeds 40°C, triggering the action of the guide plate 14 to start the aerosol nozzle 13 for cooling. The hot air is forced out of the LVDT displacement sensor from the exhaust port on the outer shell 1, thus achieving sufficient cooling of the LVDT displacement sensor.

[0086] It is worth noting that by designing an aerosol cooling component within the LVDT displacement sensor, forming a cooling mist and ventilation channel, and combining this with the circulating flow of the heat-conducting liquid within the microchannel 5, a dual-mode temperature control heat dissipation mode is achieved. This consists of a heat-conducting liquid heat exchange system composed of the microchannel 5, water tank 6, and piezoelectric diaphragm 7, and an aerosol cooling system composed of the aerosol nozzle 13, guide plate 14, and exhaust port. Liquid-cooled phase change technology is used to effectively remove the heat generated by the coil 3 during operation, improving heat dissipation. Furthermore, it can be combined with Embodiment 2 to form an integrated system of heat-conducting liquid heat exchange, aerosol cooling, and phase change heat-absorbing material 12, achieving temperature management within the LVDT displacement sensor and rapidly removing the heat generated by the coil 3.

[0087] In addition, improving heat dissipation capacity and efficiency can stabilize the magnetic properties of coil 3, maintain the working stability of LVDT displacement sensor in high-temperature environment, avoid the impact of overheating on measurement accuracy, and make LVDT displacement sensor perform better in applications with high linearity requirements.

[0088] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not expressly listed. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device comprising said element. Terms such as "connected" or "linked" are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect. The orientations or positional relationships indicated by terms such as "upper," "lower," "left," and "right" are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0089] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A microchannel-based heat dissipation structure for LVDT displacement sensors, characterized by, include: The outer shell (1), frame (2), coil (3), iron core (4), microchannel (5), water tank (6), piezoelectric diaphragm (7); The skeleton (2) is disposed inside the outer shell (1), and a coil (3) is disposed around the outer periphery of the skeleton (2). The iron core (4) is disposed inside the skeleton (2) and can move along its axial direction. The microchannel (5) is located inside the frame (2) and surrounds the iron core (4); the water tank (6) is located near one end of the frame (2); A liquid channel is formed within the microchannel (5) and is connected to the water tank (6) through the liquid channel; the piezoelectric diaphragm (7) is disposed close to the water tank (6) and is used to drive the heat-conducting liquid in the water tank (6) to flow along the liquid channel; The inner surface of the microchannel (5) is provided with a hydrophilic coating; the materials of the hydrophilic coating include: polyvinyl alcohol, polyethylene glycol, polyacrylamide, silica nanoparticles or titanium dioxide; It also includes: two insulating partitions (8) and two flanges (9), the two insulating partitions (8) are respectively disposed at both ends of the frame (2) and respectively connected to the outer shell (1); the two flanges (9) are respectively connected to the two insulating partitions (8); the water tank (6) is disposed on one of the flanges (9); The frame (2) is provided with a sandwich layer, and the sandwich layer is filled with a phase change heat-absorbing material (12); Elastic damping material is provided between the piezoelectric diaphragm (7) and the water tank (6), and between the water tank (6) and the flange (9); It also includes: a guide rod (11); the guide rod (11) is disposed at one end of the outer shell (1); the iron core (4) is coaxially disposed with the guide rod (11), and the iron core (4) is slidably connected with the guide rod (11).

2. The microchannel-based LVDT displacement sensor heat sink structure of claim 1, wherein, A one-way valve is provided between the outlet of the water tank (6) and the microchannel (5).

3. The microchannel-based LVDT displacement sensor heat sink structure of claim 1, wherein, Also includes: Several connectors (10); each connector (10) has two ends that are perpendicular to each other and are respectively connected to the frame (2) and the insulating partition (8).

4. The microchannel-based LVDT displacement sensor heat sink structure of claim 1, wherein, Also includes: aerosol cooling components; The aerosol cooling assembly includes: an aerosol nozzle (13) and a deflector plate (14); The aerosol nozzle (13) is disposed on one side of the outer shell (1) and is used to spray cooling aerosol. The outer shell (1) is provided with a plurality of exhaust holes, and a plurality of guide plates (14) are disposed close to the plurality of exhaust holes to guide the flow direction of the cooling aerosol.

5. The heat dissipation structure for the LVDT displacement sensor based on a microchannel according to claim 4, characterized in that, The guide plate (14) is made of shape memory alloy and unfolds when the temperature rises.

Images