Injection molding machine
By using two independent temperature regulators to adjust the temperature of the runner part and product part of the mold separately in the injection molding machine, the problem of difficulty in cooling separately in the hot runner mold is solved, and more effective temperature control and higher finished product quality are achieved.
Patent Information
- Application Number
- CN202411082196.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-22
- Filing Date
- 2024-08-08
- Publication Date
- 2025-05-23
AI Technical Summary
In injection molding machines using hot runner molds, it is difficult to cool the flow path parts of the molded material and the parts of the molded product respectively, resulting in deterioration of components with low heat resistance or condensation and rust caused by forced cooling.
Two independent temperature regulators are adopted. The first temperature regulator is used to adjust the temperature of the runner part of the mold, and the second temperature regulator is used to adjust the temperature of the product part, and cools according to the temperature requirements of each part.
Independent temperature adjustment of the molded material flow path and molded product parts in the injection molding machine is achieved, deterioration of low heat resistance and rust of molds is avoided, and the service life of the molding machine and the quality of the finished product are improved.
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Figure CN120023994A_ABST
Abstract
Description
[0001] This application claims priority based on Japanese Patent Application No. 2023-198362 filed on November 22, 2023. The entire contents of the Japanese Patent Application are incorporated herein by reference. Technical Field
[0002] The invention relates to an injection molding machine. Background Art
[0003] In a hot runner type mold among molds used in an injection molding machine, a molding material in a flow path within the mold is heated and maintained in a molten state.
[0004] Patent document 1 discloses an injection molding machine, which includes a clamping device provided with a mold, an injection device for injecting resin, and a controller, wherein the mold is a hot runner mold having a plurality of heaters and a plurality of temperature sensors provided therein and controlling the resin temperature of a flow path in the mold, wherein the controller sets a temperature at which each of the plurality of temperature sensors completes heating, i.e., each sensor set temperature, and a time at which the plurality of heaters are turned on and the plurality of temperature sensors respectively reach the respective sensor set temperatures, i.e., each sensor temperature reaching time, in a state in which the resin in the flow path is solidified by cooling the mold, and the controller sets the state in which the plurality of heaters are heated by the plurality of heaters to melt the resin so as to start a molding cycle, and controls the plurality of heaters according to the respective sensor temperature reaching times for the temperatures detected by the plurality of temperature sensors so that the heating completion time at the respective sensor set temperatures is consistent.
[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-73473
[0006] During the manufacturing process of molded products, the mold reaches a high temperature. Especially in hot runner molds, the molding material is heated in the runner section, so the high temperature state can be maintained. However, if the high temperature state is continuously maintained in the mold, the gasket and other parts with low heat resistance will deteriorate. Therefore, after the manufacturing process is completed, the mold is cooled using a temperature regulator. On the other hand, the part of the mold that forms the molded product will not deteriorate due to high temperature like the vicinity of the flow path of the molding material, but if forced cooling is performed using a temperature regulator, condensation will occur and become a cause of rust on the mold. Therefore, it is preferable to be able to cool the flow path of the molding material and the part that forms the molded product in the mold separately. Summary of the invention
[0007] An object of the present invention is to enable, in an injection molding machine using a hot runner mold, to cool a portion of a flow path of a molding material in the mold and a portion forming a molded product separately.
[0008] One embodiment of the present invention is an injection molding machine, characterized in that it comprises: a hot runner type mold, which is a mold of a molded product and has a portion provided with a flow path for molding material, namely a runner portion, and a portion forming the molded product, namely a product portion; a first temperature regulator, which performs temperature regulation of the runner portion of the mold; and a second temperature regulator, which performs temperature regulation of the product portion of the mold.
[0009] Effects of the Invention
[0010] According to one aspect of the present invention, in an injection molding machine using a hot runner mold, a portion of the mold that is a flow path of a molding material and a portion that forms a molded product can be cooled separately. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a diagram showing the structure of an injection molding machine to which the present embodiment is applied.
[0012] Figure 2 It is a diagram showing the structure of a control device.
[0013] Figure 3 It is a diagram showing the structure of a data processing device.
[0014] Figure 4 It is a diagram showing a hardware configuration example of a control device and a data processing device.
[0015] Figure 5 This is a diagram showing an injection molding machine equipped with a mold.
[0016] Figure 6 It is a figure which shows the structure of a mold.
[0017] Figure 7 It is a diagram showing a structure for adjusting the temperature of a mold.
[0018] Figure 8 This is a flowchart showing an operation example of the hot runner controller, the first temperature regulator, and the second temperature regulator accompanying the operation of the injection molding machine.
[0019] In the figure: 10-injection molding machine, 20-injection device, 30-mold clamping device, 31-mold, 32-fastening mechanism, 100-control device, 110-control unit, 120-molding condition setting unit, 130-storage unit, 200-data processing device, 210-data acquisition unit, 220-processing unit, 230-storage unit, 311-fixed mold, 311a-runner unit, 311b-runner unit, 311c-gate unit, 311d-heater, 312-movable mold, 312a-product unit, 510-hot runner controller, 520-first temperature regulator, 530-second temperature regulator. DETAILED DESCRIPTION
[0020] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0021] <Device Structure>
[0022] Figure 1 1 is a diagram showing the structure of an injection molding machine to which this embodiment is applied. The injection molding machine 10 includes an injection device 20, a mold clamping device 30, a control device 100, and a data processing device 200. Figure 1 Although not shown in the figure, the injection molding machine 10 uses a hot runner mold and is equipped with a hot runner controller, a first temperature regulator, and a second temperature regulator (reference Figure 7 ).
[0023] The injection device 20 is configured to include a cylinder for heating the molding material, a screw that can rotate in the cylinder and can move forward and backward along the axial direction, a rotary motor that drives the screw in the rotational direction, and a motor that drives the screw in the axial direction. The molding material is, for example, a resin. The injection device 20 injects the molding material that is heated in the cylinder and becomes liquid by extending the screw in the direction (front) from the injection device 20 toward the clamping device 30 while rotating, and fills it into the mold of the clamping device 30 arranged in front of the injection device 20. The injection device 20 performs, for example, a metering process, a filling process, a pressure holding process, etc. in the manufacturing process of the molded product. The filling process and the pressure holding process are also collectively referred to as an injection process.
[0024] The mold clamping device 30 is configured to include a mold, a fastening mechanism for fastening the mold, a motor for driving the fastening mechanism, and the like. The mold clamping device 30 closes the mold and receives the molding material injected from the injection device 20 into the mold. At this time, the mold clamping device 30 uses the fastening mechanism to fasten the mold so that the mold will not open (mold clamping) due to the filling of the molding material. The molding material filled into the mold is solidified to generate a molded product. Then, the mold clamping device 30 can open the mold and take out the generated molded product. The details of the mold will be described later. The mold clamping device 30 performs, for example, a mold closing process, a pressure increasing process, a mold clamping process, a decompression process, a mold opening process, and the like in the manufacturing process of the molded product.
[0025] The control device 100 is a device that controls the operation of the injection device 20 and the mold clamping device 30. The data processing device 200 is a device that processes data obtained as the injection device 20 and the mold clamping device 30 operate. Although not particularly shown in the figure, the control device 100 and the data processing device 200 are provided with an input device operated by a user to input commands or data, a display device that displays various screens such as an operation screen and an information prompt screen, and the like.
[0026] <Configuration of Control Device 100 >
[0027] Figure 2 1 is a diagram showing the structure of the control device 100. The control device 100 controls the actions of the injection device 20 and the mold clamping device 30. The control device 100 is realized by a computer, for example. The control device 100 includes a control unit 110, a molding condition setting unit 120, and a storage unit 130. The control device 100 controls the injection device 20 and the mold clamping device 30 to repeat the processes related to the manufacture of the molded product, thereby repeatedly manufacturing the molded product. The processes related to the manufacture of the molded product include a metering process, a mold closing process, a pressure increasing process, a mold clamping process, a filling process, a pressure holding process, a cooling process, a decompression process, a mold opening process, and an ejection process. Hereinafter, these processes related to manufacture are sometimes collectively referred to as "manufacturing processes". In addition, a series of actions for obtaining a molded product, such as the actions from the start of the metering process to the start of the next metering process in the above-mentioned manufacturing process, are referred to as "injection", "molding cycle", etc. In addition, the above-mentioned processes for manufacturing a molded product are only examples. For example, as a process performed by one injection, other processes not included in the above may be included.
[0028] The control unit 110 controls the injection device 20 and the clamping device 30 according to the control information. The control information includes conditions set by the user and fixed conditions. The conditions set by the user are generated, for example, based on information input by the user using an input device not shown. The control information includes, for example, molding conditions such as cylinder temperature (resin temperature), mold temperature, injection holding time, metering value, VP switching position, holding pressure, injection speed (filling speed), screw speed, screw back pressure, and clamping force. Regarding these molding conditions, multiple combinations are determined according to the molded product or mold. Hereinafter, the combination data of the molding conditions will also be referred to as a molding condition data set. The molding condition data set is prepared according to the type of molded product or mold, and is stored in the storage unit 130.
[0029] The control unit 110 uses the above-mentioned molding condition data set to control the injection device 20 and the mold clamping device 30 to implement the processes related to the manufacture (injection) of the molded product, including the above-mentioned processes. When starting to manufacture the molded product, the control unit 110 reads the molding condition data set corresponding to the molded product to be manufactured from the storage unit 130. Then, the control unit 110 controls the operation of the injection device 20 and the mold clamping device 30 based on the control information including the read molding condition data set. Specifically, the control unit 110 controls the injection device 20 and the mold clamping device 30 so that the data obtained from the injection device 20 and the mold clamping device 30 in the manufacturing process are consistent with the set value of the molding condition data set.
[0030] The molding condition setting unit 120 sets the molding conditions used in the control of the injection device 20 and the mold clamping device 30 by the control unit 110. The molding conditions are set by the molding condition setting unit 120 writing the molding condition data set into the control information stored in the storage unit 130. In addition, the molding conditions are set based on the information input by the user using the input screen described later. If the manufacturing process of the molded product is repeated, the state of the injection device 20 and the mold clamping device 30 changes, and the state change of the device 20, 30 affects the quality of the molded product (hereinafter referred to as "molding quality"). Therefore, in order to maintain the molding quality during the operation when mass-producing molded products, the molding condition setting unit 120 can automatically adjust the molding conditions.
[0031] The storage unit 130 stores control information used by the control unit 110 to control the injection device 20 and the mold clamping device 30. The control information includes a molding condition data set set by the molding condition setting unit 120. The molding condition data set is prepared in association with the molded product or mold of the manufacturing object. The storage unit 130 stores a molding condition data set for each molded product or each mold of the manufacturing object. In addition, the storage unit 130 stores information on molding conditions input by the user. The molding condition setting unit 120 writes the molding condition data set into the control information based on the information stored in the storage unit 130.
[0032] Although not shown in the figure, the storage unit 130 stores a program for the control unit 110 to control the injection device 20 and the mold clamping device 30, and a program for the molding condition setting unit 120 to set the molding conditions. Although the details will be described later, the processor in the control device 100 reads and executes the program stored in the storage unit 130, thereby realizing the functions of the control unit 110 and the molding condition setting unit 120.
[0033] <Configuration of Data Processing Device 200 >
[0034] Figure 3 2 is a diagram showing the structure of the data processing device 200. The data processing device 200 acquires and processes data obtained as the injection device 20 and the mold clamping device 30 perform the operations in the above-mentioned process related to the manufacture of the molded product. In addition, the data processing device 200 receives input operations performed by the user, generates information for the molding condition setting unit 120 of the control device 100 to set the molding conditions, and sends it to the control device 100. The data processing device 200 is realized by a computer, for example. The data processing device 200 includes a data acquisition unit 210, a processing unit 220, and a storage unit 230.
[0035] The data acquisition unit 210 acquires data of the processing object from the injection device 20 and the mold clamping device 30. Various sensors, detectors, etc. are installed on the injection device 20 and the mold clamping device 30. In addition, various measuring devices are sometimes connected to the injection device 20 or the mold clamping device 30. The data acquired using these sensors, detectors, measuring devices, etc. (hereinafter referred to as "acquired data") is information representing the molding results based on the injection device 20 and the mold clamping device 30, and can be used for quality management of molded products. Specifically, for example, it includes the weight of the molded product, the size of the molded product, the internal pressure of the mold, the minimum buffer position, the characteristic quantity of the waveform of the filling pressure, etc. These acquired data are actual values obtained in the manufacturing process of the molded product. The data acquisition unit 210 receives the acquired data sent from the sensor, detector, or measuring device, and stores it in the storage unit 230.
[0036] The processing unit 220 processes the acquired data stored in the storage unit 230. Specifically, the processing unit 220 extracts representative values of the acquired data in each process, generates time series data by time-series the acquired data in each process, and the like. In extracting the representative value, the processing unit 220 performs statistical processing such as calculating the average value, determining the range of values, and determining the maximum or minimum value on the acquired data.
[0037] The storage unit 230 stores the acquired data acquired by the data acquisition unit 210. As the data format of the acquired data stored in the storage unit 230, for example, binary, text, CSV (Comma Separated Values), INI, YAML (YAML Ain't Markup Language), JSON (JavaScript Object Notation), etc. can be used. By setting it as a data file based on these general data formats, the data file stored in the storage unit 230 can be exchanged with other information processing devices, or the data file acquired from the external device can be edited.
[0038] Although not shown, the storage unit 230 stores a program for the processing unit 220 to execute data processing. Although the details will be described later, the functions of the processing unit 220 can be realized by the processor in the data processing device 200 reading and executing the program stored in the storage unit 230.
[0039] <Hardware Configuration of Control Device 100 and Data Processing Device 200>
[0040] Figure 4 1 is a diagram showing a hardware configuration example of a computer 400 that realizes the control device 100 and the data processing device 200 . Figure 4The computer 400 shown has a processor 401 as a computing mechanism, a main storage device (main memory) 402 as a storage mechanism, and an auxiliary storage device 403. As the processor 401, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), and other various computing circuits can be used. The processor 401 reads the program stored in the auxiliary storage device 403 into the main storage device 402 for execution. As the main storage device 402, for example, a RAM (Random Access Memory) is used. As the auxiliary storage device 403, for example, a magnetic disk device or an SSD (Solid State Drive) is used. In addition, a display device 404 for displaying images and an input device 405 as an input mechanism for the computer to be operated by the user are connected to the computer 400. As the input device 405, for example, a keyboard or a mouse is used. In addition, Figure 4 The structure of the computer 400 shown is only an example, and the computer 400 used in this embodiment is not limited to Figure 4 For example, a nonvolatile memory such as a flash memory or a ROM (Read Only Memory) may be provided as a storage device.
[0041] In the control device 100 Figure 4 In the case of computer implementation shown, the functions of the control unit 110 and the molding condition setting unit 120 are implemented, for example, by the processor 401 reading and executing a program. The storage unit 130 is implemented by the auxiliary storage device 403, for example.
[0042] In the data processing device 200, Figure 4 In the case of computer implementation shown, the functions of the data acquisition unit 210 and the processing unit 220 are implemented, for example, by the processor 401 reading and executing a program. The storage unit 230 is implemented by the auxiliary storage device 403, for example.
[0043] <Mold temperature control>
[0044] Next, the temperature adjustment of the mold is described. The mold used in this embodiment is a hot runner type mold (hereinafter referred to as a "hot runner mold") that keeps the molding material of the flow path in the mold in a molten state. Hereinafter, the mold and the structure for adjusting the temperature of the mold are first described, and then the specific temperature adjustment operation is described.
[0045] Figure 5 It is a diagram showing an injection molding machine 10 provided with a mold. Figure 6 It is a figure which shows the structure of a mold. Figure 7 is a diagram showing a structure for adjusting the temperature of a mold. Figure 5 As shown, the mold 31 is set in the mold clamping device 30, and in the injection process, the mold 31 is filled with the heated and molten molding material from the injection device 20. Then, the molding material filled in the mold 31 is cooled and solidified, thereby forming a molded product.
[0046] like Figure 5 As shown, the injection device 20 includes a cylinder 21, a screw 22 disposed in the cylinder 21, and a motor 23 for driving the screw 22. In addition, the injection device 20 includes: a hopper 24 for supplying molding material into the cylinder 21; a heater 25 for heating the molding material in the cylinder 21 to melt it; and a check valve 26 for preventing the molding material in a liquid state from flowing back in the cylinder 21. The mold clamping device 30 includes a fastening mechanism 32, and the mold 31 disposed in the mold clamping device 30 is opened, closed, and fastened by the operation of the fastening mechanism 32.
[0047] like Figure 6 As shown in FIG. 1 , the mold 31 is divided into a fixed mold 311 and a movable mold 312. The fixed mold 311 is fixed in position when it is set in the mold clamping device 30. The movable mold 312 is fixed in position when it is set in the mold clamping device 30 by a fastening mechanism 32 (refer to FIG. 1 ) of the mold clamping device 30. Figure 5 ) is arranged to be able to move forward and backward relative to the fixed mold 311. If the movable mold 312 is extended toward the fixed mold 311 by the fastening mechanism 32, the mold 31 is closed and the mold is clamped. If the movable mold 312 is moved backward and separated from the fixed mold 311 by the fastening mechanism 32, the molded product can be taken out. Figure 6 In FIG. 1 , the fixed mold 311 and the movable mold 312 are shown in a separated state.
[0048] The fixed mold 311 comprises: a runner portion 311a, which is a flow path for the molding material to pass through; a runner portion 311b, which is arranged at one end side of the runner portion 311a; a gate portion 311c, which is arranged at the other end side of the runner portion 311a; and a heater 311d, which covers the runner portion 311a and heats it.
[0049] The runner portion 311a is a passage for the molding material injected from the injection device 20. The mold 31 of this embodiment is a hot runner type mold, so during the manufacturing process, the molding material passing through the runner portion 311a will not solidify and will not form a solid runner. Figure 6 In the illustrated configuration example, the flow channel portion 311 a is shaped such that one flow channel continuing from the runner portion 311 b is divided into two flow channels in the middle.
[0050] The runner portion 311b is disposed opposite to the injection device 20 in a state where the fixed mold 311 is disposed on the mold clamping device 30. In the injection process, the nozzle at the front end of the cylinder 21 of the injection device 20 contacts the runner portion 311b, and the molding material is injected from the cylinder 21 to the runner portion 311b. The injected molding material is transported to the runner portion 311a via the runner portion 311b.
[0051] The gate portion 311c is an injection port for the molding material through the runner portion 311a. The gate portion 311c is provided on the side of the fixed mold 311 opposite to the runner portion 311b so as to face the movable mold 312. Figure 6 In the illustrated configuration example, the runner portion 311 a is divided in the middle, and two gate portions 311 c are described.
[0052] The heater 311d is provided at a portion of the fixed mold 311 where the flow channel 311a is formed, and heats the flow channel 311a. The molding material in the flow channel 311a is kept in a molten liquid state by being heated by the heater 311d. In addition, although not particularly shown, a temperature sensor for measuring the temperature of the flow channel 311a is provided around the flow channel 311a of the fixed mold 311.
[0053] The movable mold 312 is provided with a product portion 312a for forming a molded product at a position corresponding to the gate portion 311c on the side opposite to the fixed mold 311. Figure 6 In the example shown, two product portions 312a corresponding to two gate portions 311c are shown. More specifically, if the mold 31 is closed by the clamping mechanism 32 of the mold clamping device 30, as shown in FIG. Figure 7 As shown in FIG. 1 , a space 313 is formed by cavities and cores formed in mutually opposing portions of the fixed mold 311 and the movable mold 312. Then, the molding material is filled into the space 313, and the filled molding material is solidified to form a molded product. Figure 6 In the example shown, for convenience, the Figure 7 The portion of the space 313 shown on the movable mold 312 side is set as a product portion 312a.
[0054] As described above, in the hot runner type mold 31, the runner portion 311a of the fixed mold 311 is heated by the heater 311d. Figure 7 As shown, the heater 311d is controlled by the hot runner controller 510. In the manufacturing process, the hot runner controller 510 obtains the information of the detected temperature from the temperature sensor set in the fixed mold 311, and controls the heater 311d so that the runner portion 311a reaches a preset temperature. In addition, in the hot runner controller 510, three action modes are prepared as actions after the manufacture of the target production quantity of the molded products is completed, and the heater 311d is controlled to be turned on / off according to the set action modes. The three action modes are a mode in which the heater 311d is stopped after the manufacture of the target production quantity of the molded products is completed (hereinafter referred to as the "off mode"), a mode in which the operation of the heater 311d is continued (hereinafter referred to as the "on mode"), and a mode in which the heater 311d is controlled in such a way that the runner portion 311a is kept at a predetermined temperature (hereinafter referred to as the "keep warm mode"). The off mode is an example of the first action mode, and the on mode and the keep warm mode are examples of the second action mode. The action content of each mode will be described later. The hot runner controller 510 is connected to the injection molding machine 10 (heater 311 d or temperature sensor) using a communication method such as OPC-UA, SPICCP, or MODBUS.
[0055] Furthermore, a temperature regulator for regulating the temperature of the mold 31 is connected to the mold 31. The temperature regulator regulates the temperature of the mold 31 heated by filling the molten molding material by flowing a refrigerant such as water or oil through a flow path provided in the mold 31. In the present embodiment, a first temperature regulator 520 for regulating the temperature of a portion including the runner portion 311a of the mold 31 and a second temperature regulator 530 for regulating the temperature of a portion including the product portion 312a of the mold 31 are prepared and connected.
[0056] The first temperature regulator 520 and the second temperature regulator 530 are connected to the injection molding machine 10 using a communication method such as OPC-UA, SPICCP, or MODBUS. Then, the first temperature regulator 520 and the second temperature regulator 530 obtain information on the operation mode of the hot runner controller 510 and operate in coordination with the operation of the hot runner controller 510. Figure 7 In the example shown, the portion of the mold 31 including the flow channel portion 311a corresponds to the fixed mold 311, and the temperature of the fixed mold 311 is adjusted by the first temperature adjustment device 520. In addition, the portion of the mold 31 including the product portion 312a corresponds to the movable mold 312, and the temperature of the movable mold 312 is adjusted by the second temperature adjustment device 530.
[0057] In the manufacturing process of the molded product, the mold 31 is heated by the filled molding material. And, in the hot runner type mold 31, the heater 311d is used to heat the molding material of the runner portion 311a to keep it in a molten state. And, even after the manufacture of the molded product of the target production quantity is completed, the mold 31 continues to be heated for a period of time using the molding material remaining inside the mold 31. Here, the gaskets and the like provided in the flow path through which the refrigerant of the temperature regulator passes have lower heat resistance than the main body of the mold 31, and deteriorate if maintained at a high temperature. Therefore, even after the manufacture of the molded product of the target production quantity is completed, it is expected that the temperature rise of the mold 31 can be suppressed by keeping the temperature regulator in operation.
[0058] On the other hand, in the product section 312a, there is no heat source for maintaining a high temperature state like in the runner section 311a. Therefore, even for components with low heat resistance such as the above-mentioned gasket, there is no concern about degradation due to high temperature after the molded product is manufactured. However, if forced cooling is performed in the product section 312a, condensation will occur, which will cause rust on the mold 31. In addition, using a temperature regulator to cool the product section 312a that does not need to be cooled will consume unnecessary electricity. Therefore, it is expected that after the manufacture of the target production quantity of molded products is completed, the temperature regulator will be stopped and cooling will be performed through natural heat dissipation. Therefore, if Figure 7 As shown, a structure is set as follows: a first temperature regulator 520 corresponding to the fixed mold 311 including the runner portion 311a and a second temperature regulator 530 corresponding to the movable mold 312 including the product portion 312a are separately provided and operate separately.
[0059] <Operation Example of Hot Runner Controller 510 and First and Second Temperature Regulators 520 and 530>
[0060] Figure 8 It is a flowchart showing an example of the operation of the hot runner controller 510, the first temperature regulator 520, and the second temperature regulator 530 accompanying the operation of the injection molding machine 10. As a pre-setting, the operation mode of the hot runner controller 510 after the manufacture of the target production quantity of molded products is completed is set to one of the closed mode, the open mode, and the warm-keeping mode. Here, the closed mode is, for example, an operation mode used in the case where the injection molding machine 10 is stopped, etc., after the manufacture of the target production quantity of molded products is completed, the manufacture of other molded products is not performed, etc. The open mode and the warm-keeping mode are, for example, operation modes used in the case where the temperature of the mold 31 or the molding material inside the mold 31 is kept in a molten state, etc., after the manufacture of the target production quantity of molded products is completed, the manufacture of another set target production quantity of molded products (hereinafter referred to as "next manufacture") is continued.
[0061] After the operation mode of the hot runner controller 510 is set, the molding cycle of the molded product is started under the control of the control device 100 (S101). Next, the control device 100 sets the number of shots implemented since the start of the molding cycle to the current number of shots as the number of shots C, and sets the number of shots of the production target to the number of shots T, and determines whether C=T. If C=T is not ("No" in S102), it is determined whether C=T for each shot. On the other hand, if C=T ("Yes" in S102), the control device 100 retreats the injection device 20 from the position during the injection process, removes the molding material remaining in the cylinder 21, and stops the second temperature regulator 530 corresponding to the product portion 312a of the mold 31 (S103). As a result, the forced cooling of the product portion 312a is stopped. And at this point in time, the first temperature regulator 520 corresponding to the runner portion 311a of the mold 31 remains in operation.
[0062] Next, when the operation mode of the hot runner controller 510 (recorded as "HR mode" in the figure) is the off mode ("Yes" in S104), the hot runner controller 510 sets the heater 311d (recorded as "HR heater" in the figure) to off (S105). Then, the first temperature regulator 520 obtains detection data based on the temperature sensor provided in the mold 31, and compares the current temperature T1 of the runner portion 311a with the set temperature T2. The set temperature T2 refers to a temperature set to a safe temperature that will not cause deterioration of the gasket provided in the mold 31. When T1≥T2 ("No" in S106), the first temperature regulator 520 continuously monitors the temperature T1 of the runner portion 311a, and if T1<T2 ("Yes" in S106), the first temperature regulator 520 is turned off (S107).
[0063] In contrast, when the operation mode of the hot runner controller 510 is the on mode ("No" in S104, "Yes" in S108), the hot runner controller 510 maintains the heater 311d in the on state (S109). Then, the injection molding machine 10 starts the next manufacturing. At this time, the first temperature regulator 520 is maintained in the on state, and the second temperature regulator 530 is turned on when the next manufacturing starts. In addition, the operation mode after the next manufacturing is completed is also set for the hot runner controller 510.
[0064] Furthermore, when the operation mode of the hot runner controller 510 is the insulation mode ("No" in S104, "No" in S108), the hot runner controller 510 controls the heater 311d in a manner to keep the runner portion 311a warm (described as "insulation control" in the figure) (S110). Then, the injection molding machine 10 starts the next manufacturing. At this time, the first temperature regulator 520 remains in the open state, and the second temperature regulator 530 is opened when the next manufacturing starts. Furthermore, the operation mode after the next manufacturing is completed is also set for the hot runner controller 510.
[0065] In addition, in the above-mentioned operation example, control is performed to stop the first temperature regulator 520 based on the temperature T1 of the runner portion 311a of the mold 31. In contrast, if it is possible to determine the moment when the temperature T1 of the runner portion 311a becomes lower than the safe temperature, information other than the temperature T1 of the runner portion 311a may be used as a stop condition for the first temperature regulator 520. For example, it may be configured as follows: based on actual data, the time t required for the temperature T1 of the runner portion 311a to become lower than the safe temperature when the first temperature regulator 520 is continuously operated is predicted, and after the heater 311d is stopped (see S105), the first temperature regulator 520 is stopped after the predicted time t has passed.
[0066] The embodiments of the present invention are described above, but the technical scope of the present invention is not limited to the above embodiments. For example, in the above embodiments, the first temperature regulator 520 for the flow channel portion 311a and the second temperature regulator 530 for the product portion 312a are respectively provided, but as long as the temperature regulation of the flow channel portion 311a and the temperature regulation of the product portion 312a can be performed independently, the first temperature regulator 520 and the second temperature regulator 530 can also be an integrated device.
[0067] Furthermore, in the above-mentioned embodiment, the object of temperature regulation by the first temperature regulator 520 is set to the fixed mold 311 including the flow channel portion 311a, and the object of temperature regulation by the second temperature regulator 530 is set to the movable mold 312 including the product portion 312a. However, the first temperature regulator 520 and the second temperature regulator 530 cool the flow channel portion 311a and the product portion 312a, respectively, and sometimes the corresponding relationship as described above is not achieved depending on the structure of the mold 31. In addition, various changes or structural substitutions that do not depart from the scope of the technical idea of the present invention are also included in the present invention.
Claims
1. An injection molding machine, characterized in that: have: A hot runner type mold is a mold for a molded product and has a runner portion where a flow path of the molding material is provided and a product portion where the molded product is formed; a first temperature regulating device for regulating the temperature of the runner portion of the mold; and The second temperature controller controls the temperature of the product portion of the mold.
2. The injection molding machine according to claim 1, characterized in that The first temperature control device operates according to a predetermined setting after the molded product is manufactured. The second temperature regulator is stopped after the production of the molded product is completed.
3. The injection molding machine according to claim 2, characterized in that further comprising a controller for a heater for heating the runner portion of the mold, The controller has a first operation mode for stopping the heater and a second operation mode for not stopping the heater as operation modes after the manufacture of the molded product is completed. The first temperature regulator operates based on the predetermined setting when the controller is in the first operation mode.
4. The injection molding machine according to claim 3, characterized in that As the operation based on the predetermined setting, the first temperature regulator stops on the condition that the temperature of the runner portion of the mold becomes lower than a set temperature after the heater stops.
5. The injection molding machine according to claim 3, characterized in that: As the operation based on the predetermined setting, the first temperature regulator stops on the condition that a predetermined time has passed after the heater stops.
Citation Information
Patent Citations
Hot runner mold temperature rise method, hot runner mold, and injection molding machine
JP2022073473A