Cooling cold fog instrument

Abstract

The invention relates to the technical field of beauty instruments, in particular to a cooling cold fog instrument. Comprising an air blower, an atomization box and a ventilation pipeline, an ultrasonic atomizer is arranged in the atomization box, a heat exchange grid is further included, the air blower, the atomization box and the heat exchange grid are sequentially communicated through the ventilation pipeline, and an air outlet pipe and a semiconductor refrigeration assembly are arranged on the heat exchange grid; according to the cooling cold fog instrument, the ultrasonic atomizer generates water mist in the atomization box, the semiconductor refrigeration assembly acts on the heat exchange grid, the air blower drives the water mist to enter the heat exchange grid from the ventilation pipeline, the water mist is rapidly cooled after passing through the heat exchange grid, the heat exchange efficiency is high, and the temperature of the water mist blown out of the air outlet is far lower than the normal temperature; and the cold fog action range can be effectively expanded, and the use experience is better.

Description

Technical Field

[0001] The invention relates to the technical field of beauty instruments, in particular to a cooling mist instrument. Background Art

[0002] Beauty equipment usually uses hot and cold air, massage, light irradiation and other methods to promote the activation of human skin cells, expand pores, achieve cleaning or promote the absorption of skin care products. For example, Chinese patent CN2174888Y discloses a hot and cold spray beauty device, which includes an atomizing nozzle and a mist generating box, wherein an ultrasonic atomizer is arranged in the mist generating box, an air blower is arranged on the upper side of the mist generating box, a mist pipe is arranged on the side of the mist generating box opposite to the air blower, a mist pipe is arranged on the side of the mist generating box opposite to the air blower, the mist generating box is connected to the atomizing nozzle through the mist pipe, and a hot and cold dual-control device is arranged in the atomizing nozzle.

[0003] The above-mentioned prior art uses cold and hot mist to clean and care for the skin, and is combined with beauty liquid and medicine to achieve the purpose of skin care. However, the cold and hot dual-control device is set in the nozzle, which makes the nozzle heavy and usually requires a bracket to support and fix it, which is inconvenient to operate. In addition, the cold and hot dual-control efficiency is not high, and it is difficult to achieve the care effect if it is far away from the skin.

[0004] Some beauty products on the market currently use compression cooling, which results in a large size and weight of the main unit, making it inconvenient to move. Or some products add ice water or ice crystals to the water. After atomization, the cold water mist will be quickly assimilated by the hot air in the environment, and the actual temperature of the mist outlet is difficult to reach the expected target. The body's sense of coolness is actually produced by the combined effect of water and airflow, resulting in a poor user experience.

[0005] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0006] The purpose of the present invention is to provide a cooling cold mist device with a compact and light structure and good cold mist effect in view of the defects and shortcomings of the prior art.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0008] The cooling mist device described in the present invention includes a blower, an atomization box and a ventilation pipeline. The atomization box is provided with an ultrasonic atomizer and also includes a heat exchange grid. The blower, the atomization box and the heat exchange grid are connected in sequence through the ventilation pipeline. The heat exchange grid is provided with an air outlet pipe and a semiconductor refrigeration component.

[0009] Water is injected into the atomizing box, and the ultrasonic atomizer can atomize the water in the atomizing box. The airflow generated by the blower drives the water mist from the ventilation pipe into the heat exchange grid. The semiconductor refrigeration component works to cool the heat exchange grid. It can be understood that the heat exchange grid has a cavity inside so that the water mist can pass through, and the heat exchange grid has a larger surface area. The water mist can be quickly cooled when passing through the heat exchange grid, so that the temperature of the water mist blown out of the air outlet pipe is much lower than the ambient temperature, thereby effectively reducing the skin surface temperature. In particular, the setting density of the heat exchange grid can increase the heat exchange surface area and heat exchange efficiency. Based on the power increase of the semiconductor refrigeration component, the cooling efficiency of the water mist can be further improved, thereby obtaining a better care experience. In addition, the semiconductor refrigeration component is small in size, which makes the present invention have a more compact structural layout, reduces the overall weight, and thus improves the user experience.

[0010] According to the above scheme, the heat exchange grid includes a shell, a plurality of fins are arranged inside the shell, and the fins are arranged at intervals to form a heat exchange channel; the inlet end of the shell is connected to the ventilation pipeline, and the outlet end of the shell is connected to the air outlet pipe; the fins are fixedly connected to the shell, and the semiconductor refrigeration component is fitted on the side wall of the shell. In simple terms, the shell is a hollow structure to provide space for heat exchange, and a plurality of fins are arranged in the same direction inside the shell. The gaps between the fins constitute the heat exchange channel. When the water mist enters the shell and passes through the heat exchange channel, it forms heat exchange with the fins to quickly cool down, so that the air outlet can output water mist far lower than the conventional one. It can be understood that the number of fins in the shell is related to the cooling efficiency. Of course, the flow rate of the heat exchange channel needs to meet the demand for air output.

[0011] According to the above scheme, the semiconductor refrigeration component includes a semiconductor refrigeration plate and a radiator, the cold end of the semiconductor refrigeration plate is attached to the side wall of the shell, the hot end of the semiconductor refrigeration plate is provided with a heat conduction block, and a number of heat conduction tubes are connected between the heat conduction block and the radiator. The semiconductor refrigeration plate has two end faces with opposite polarities, wherein the cold end of the semiconductor refrigeration plate is attached to the shell, and the temperature in the heat exchange channel is reduced through the shell and a number of fins, and the water mist is cooled when passing through the heat exchange channel. The hot end of the semiconductor refrigeration plate is provided with a heat conduction block, and the heat conduction block conducts heat to the radiator through the heat conduction tube for heat dissipation. Preferably, a group of semiconductor refrigeration components are respectively provided on both sides of the shell. Furthermore, the heat conduction tube itself can be a heat conducting material, and the heat conduction tube can be built-in with a heat conduction liquid to achieve heat conduction. On this basis, a circulation pipeline can be set between the heat conduction block and the radiator to accelerate heat conduction.

[0012] It is understandable that the polarity of the semiconductor refrigeration plate can be reversed, and the cold end and the hot end of the semiconductor refrigeration plate can be exchanged through circuit control, so as to heat the water mist passing through the heat exchange grid and realize hot air and hot mist care.

[0013] According to the above solution, the semiconductor refrigeration assembly further includes a heat dissipation fan, which is paired with the heat dissipation fins. The heat dissipation fan can generate airflow to blow through the radiator, and the radiator can be forced to be air-cooled to ensure the normal operation of the semiconductor refrigeration sheet.

[0014] According to the above scheme, the ventilation duct includes an airway and a transfer airway, the blower is arranged on the airway, the upper end of the transfer airway is connected to the blower, and the lower end of the transfer airway is matched to the upper port of the atomizer box; the atomizer box is provided with an atomizer tube, the lower port of the atomizer tube is matched with the ultrasonic atomizer, and the upper port of the atomizer tube passes through the transfer airway to connect the first end of the airway. The ultrasonic atomizer is arranged at the bottom of the atomizer box, and the water in the atomizer box is atomized and gathered in the atomizer tube. The blower generates an airflow through the transfer airway and the atomizer box, driving the water mist in the atomizer tube into the airway.

[0015] According to the above scheme, the heat exchange grid, the atomizer box and the heat dissipation fins are arranged in sequence in the transverse direction, and a transfer base is provided at the lower end of the heat exchange grid, and the second end of the air duct is bent and connected to the transfer base. The air duct is bent and connected to the above transfer duct to form a pipeline approximately in the shape of a "Z", making the overall structural layout more compact.

[0016] According to the above solution, a box cover is provided on the lower port of the atomization box, and the ultrasonic atomizer is arranged in the box cover. The box cover can be disassembled so as to maintain the ultrasonic atomizer.

[0017] According to the above scheme, the atomizer box is connected to a water supply pipeline, which is connected to a water tank. The water tank is filled with pure water to increase the service life of the ultrasonic atomizer. Of course, the water tank can control the water level in the atomizer box through the water level balance principle, or it can be set according to the program to replenish water into the atomizer box through the water supply pipeline based on a water pump.

[0018] According to the above scheme, the present invention also includes a controller, which is respectively connected to the semiconductor cooling plate, the ultrasonic atomizer, the blower and the heat dissipation fan through lines.

[0019] The present invention provides a cooling cold mist device, in which the ultrasonic atomizer generates water mist in the atomization box, the semiconductor refrigeration component acts on the heat exchange grid, and the blower drives the water mist to enter the heat exchange grid from the ventilation duct. The water mist is quickly cooled after passing through the heat exchange grid. The high heat exchange efficiency makes the temperature of the water mist blown out of the air outlet much lower than the normal temperature, which can effectively expand the scope of action of the cold mist and provide a better user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2It is a schematic diagram of the overall cross-sectional structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the overall explosion structure of the present invention.

[0023] In the figure:

[0024] 1. Blower; 2. Atomizer box; 3. Heat exchange grid; 4. Air duct; 5. Controller; 21. Ultrasonic atomizer; 22. Box cover; 23. Water supply pipeline; 31. Air outlet pipe; 32. Shell; 33. Fin; 34. Semiconductor cooling sheet; 35. Heat transfer block; 36. Radiator; 37. Heat transfer pipe; 38. Cooling fan; 41. Adapter air duct; 42. Atomizer pipe; 43. Adapter base. DETAILED DESCRIPTION

[0025] The technical solution of the present invention is described below in conjunction with the accompanying drawings and embodiments.

[0026] like Figure 1-3 As shown, a cooling mist device described in the present invention includes a blower 1, an atomizing box 2 and a ventilation pipeline, wherein the atomizing box 2 is provided with an ultrasonic atomizer 21, and also includes a heat exchange grid 3. The blower 1, the atomizing box 2 and the heat exchange grid 3 are sequentially connected through the ventilation pipeline, and an air outlet pipe 31 and a semiconductor refrigeration component are provided on the heat exchange grid 3. Water is injected into the atomizing box 2, and the ultrasonic atomizer 21 can atomize the water in the atomizing box 2. The blower 1 generates airflow to drive the water mist into the heat exchange grid 3 from the ventilation pipeline. The semiconductor refrigeration component works to cool the heat exchange grid 3. It can be understood that the heat exchange grid 3 has a cavity inside so that the water mist can pass through, and the heat exchange grid 3 has a larger surface area. The water mist can be quickly cooled when passing through the heat exchange grid 3, so that the temperature of the water mist blown out of the air outlet pipe 31 is much lower than the ambient temperature, thereby effectively reducing the skin surface temperature. In particular, the arrangement density of the heat exchange grid 3 can increase the heat exchange surface area and heat exchange efficiency. Based on the power increase of the semiconductor refrigeration component, the cooling efficiency of the water mist can be further improved, thereby obtaining a better care experience. In addition, the semiconductor refrigeration component is small in size, so that the present invention has a more compact structural layout, reduces the overall weight, and thus improves the user experience.

[0027] The heat exchange grid 3 includes a shell 32, and a plurality of fins 33 are arranged inside the shell 32. The fins 33 are arranged at intervals to form a heat exchange channel; the inlet end of the shell 32 is connected to the ventilation pipeline, and the outlet end of the shell 32 is connected to the air outlet 31; the fins 33 are fixedly connected to the shell 32, and the semiconductor refrigeration component is fitted on the side wall of the shell 32. In simple terms, the shell 32 is a hollow structure to provide a space for heat exchange. A plurality of fins 33 are arranged in the same direction inside the shell 32, and the gaps between the fins 33 constitute the heat exchange channel. When the water mist enters the shell 32 and passes through the heat exchange channel, it forms heat exchange with the fins 33 to cool quickly, so that the air outlet can output water mist far lower than the conventional one. It can be understood that the number of fins 33 in the shell 32 is related to the cooling efficiency. Of course, the flow rate of the heat exchange channel needs to meet the demand for the air volume.

[0028] The semiconductor refrigeration assembly includes a semiconductor refrigeration sheet 34 and a radiator 36. The cold end of the semiconductor refrigeration sheet 34 is attached to the side wall of the shell 32. The hot end of the semiconductor refrigeration sheet 34 is provided with a heat conduction block 35. A plurality of heat conduction pipes 37 are connected between the heat conduction block 35 and the radiator 36. The semiconductor refrigeration sheet 34 has two end faces with opposite polarities. The cold end of the semiconductor refrigeration sheet 34 is attached to the shell 32. The temperature in the heat exchange channel is reduced through the shell 32 and the plurality of fins 33. The water mist is cooled when passing through the heat exchange channel. The hot end of the semiconductor refrigeration sheet 34 is provided with a heat conduction block 35. The heat conduction block 35 conducts heat to the radiator 36 through the heat conduction pipe 37 for heat dissipation. Preferably, a group of semiconductor refrigeration assemblies are respectively provided on both sides of the shell 32. Further, the heat conduction pipe 37 itself can be a heat conducting material, and the heat conduction pipe 37 can be built with a heat conduction liquid to achieve heat conduction. On this basis, a circulation pipeline can be set between the heat conduction block 35 and the radiator 36 to accelerate heat conduction.

[0029] It is understandable that the polarity of the semiconductor refrigeration plate 34 can be reversed, and the cold end and the hot end of the semiconductor refrigeration plate 34 can be exchanged through circuit control, so as to heat the water mist passing through the heat exchange grid 3 and realize hot air and hot mist care.

[0030] The semiconductor refrigeration assembly further includes a heat dissipation fan 38, which is arranged in pair with the heat dissipation fins 33. The heat dissipation fan 38 can generate airflow to blow through the radiator 36, and the radiator 36 can be forcedly cooled to ensure that the semiconductor refrigeration sheet 34 works normally.

[0031] The ventilation pipeline includes an air duct 4 and a transfer air duct 41. The blower 1 is arranged on the air duct 4. The upper end of the transfer air duct 41 is connected to the blower 1, and the lower end of the transfer air duct 41 is matched with the upper end of the atomizer box 2. The atomizer box 2 is provided with an atomizer tube 42. The lower end of the atomizer tube 42 is matched with the ultrasonic atomizer 21. The upper end of the atomizer tube 42 passes through the transfer air duct 41 to connect the first end of the air duct 4. The ultrasonic atomizer 21 is arranged at the bottom of the atomizer box 2. The water in the atomizer box 2 is atomized and gathered in the atomizer tube 42. The blower 1 generates an airflow through the transfer air duct 41 and the atomizer box 2, driving the water mist in the atomizer tube 42 into the air duct 4.

[0032] The heat exchange grid 3, the atomization box 2 and the heat dissipation fins 33 are arranged in sequence in the transverse direction. The lower end of the heat exchange grid 3 is provided with an adapter base, and the second end of the air duct 4 is bent and connected to the adapter base. The air duct 4 is bent and connected to the above-mentioned adapter air duct 41 to form a pipeline approximately in the shape of a "Z", making the overall structural layout more compact.

[0033] A box cover 22 is provided on the lower port of the atomizing box 2, and the ultrasonic atomizer 21 is arranged in the box cover 22. The box cover 22 can be disassembled so as to maintain the ultrasonic atomizer 21.

[0034] The atomizing box 2 is connected to a water supply pipeline 23, which is connected to a water tank. The water tank is filled with pure water to increase the service life of the ultrasonic atomizer 21. Of course, the water tank can control the water level in the atomizing box 2 through the water level balance principle, or it can be set according to the program to replenish water into the atomizing box 2 through the water supply pipeline 23 based on the water pump.

[0035] The present invention further comprises a controller 5, which is respectively connected to the semiconductor cooling sheet 34, the ultrasonic atomizer 21, the blower 1 and the heat dissipation fan 38 through lines. Of course, the controller 5 is connected to a power source.

[0036] The above description is only a preferred embodiment of the present invention, so all equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A cooling mist device, comprising a blower (1), a mist box (2) and a ventilation pipeline, wherein an ultrasonic atomizer (21) is arranged in the mist box (2), characterized in that: It also comprises a heat exchange grid (3); the blower (1), the atomizing box (2) and the heat exchange grid (3) are connected in sequence through a ventilation pipeline; and an air outlet pipe (31) and a semiconductor refrigeration component are provided on the heat exchange grid (3).

2. The cooling mist device according to claim 1, characterized in that: The heat exchange grid (3) comprises a shell (32), a plurality of fins (33) are arranged in the shell (32), and the plurality of fins (33) are arranged at intervals to form a heat exchange channel; the inlet end of the shell (32) is connected to the ventilation pipeline, and the outlet end of the shell (32) is connected to the air outlet pipe (31); the fins (33) are fixedly connected to the shell (32), and the semiconductor refrigeration component is arranged on the side wall of the shell (32).

3. The cooling mist device according to claim 2, characterized in that: The semiconductor refrigeration component comprises a semiconductor refrigeration sheet (34) and a radiator (36), wherein the cold end of the semiconductor refrigeration sheet (34) is arranged on the side wall of the shell (32), and the hot end of the semiconductor refrigeration sheet (34) is provided with a heat conduction block (35), and a plurality of heat conduction pipes (37) are connected between the heat conduction block (35) and the radiator (36).

4. The cooling cold mist device according to claim 3, characterized in that: The semiconductor refrigeration component also includes a heat dissipation fan (38), and the heat dissipation fan (38) is arranged in pair with the heat dissipation fins (33).

5. The cooling mist device according to claim 1, characterized in that: The ventilation pipeline comprises an air duct (4) and a switching air duct (41); the blower (1) is arranged on the air duct (4); the upper end of the switching air duct (41) is connected to the blower (1); and the lower end of the switching air duct (41) is matched and connected to the upper port of the atomizer box (2); an atomizer tube (42) is arranged in the atomizer box (2); the lower port of the atomizer tube (42) is matched and arranged with the ultrasonic atomizer (21); and the upper port of the atomizer tube (42) passes through the switching air duct (41) to be connected to the first end of the air duct (4).

6. The cooling cold mist device according to claim 5, characterized in that: The heat exchange grid (3), the atomization box (2) and the heat dissipation fins (33) are arranged in sequence in the transverse direction; a transfer base (43) is provided at the lower end of the heat exchange grid (3); and the second end of the air duct (4) is bent and connected to the transfer base (43).

7. The cooling cold mist device according to claim 5, characterized in that: A box cover (22) is provided on the lower port of the atomization box (2), and the ultrasonic atomizer (21) is arranged inside the box cover (22).

8. The cooling mist device according to claim 1, characterized in that: The atomization box (2) is connected to a water supply pipeline (23).

9. The cooling cold mist device according to claim 1, characterized in that: It also includes a controller (5), wherein the controller (5) is respectively connected to the semiconductor cooling sheet (34), the ultrasonic atomizer (21), the blower (1) and the heat dissipation fan (38) through lines.

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