Bone conduction loudspeaker

Abstract

The invention relates to a magnetic circuit assembly of a bone conduction loudspeaker. The magnetic circuit assembly generates a first full magnetic field and comprises a first magnetic element, a first magnetic conductive element and a second magnetic conductive element. The first magnetic element generates a second magnetic field. The second magnetic conductive element surrounds the first magnetic element, and a magnetic gap is formed between the second magnetic conductive element and the first magnetic element. The magnetic circuit assembly further comprises at least one second magnetic element. The at least one second magnetic element is arranged below the magnetic gap, and the magnetic field intensity of the first full magnetic field in the magnetic gap is larger than that of the second magnetic field in the magnetic gap.

Description

[0001] This application is a divisional application of the Chinese invention patent application filed on January 8, 2018, with application number 201810015659.2 and invention name “A bone conduction speaker”. Technical Field

[0002] The present application relates to a bone conduction speaker, and in particular to a magnetic circuit component in the bone conduction speaker. Background Art

[0003] Bone conduction speakers can convert electrical signals into mechanical vibration signals, and transmit the vibration signals into the cochlea through human tissue and bones, so that the user can hear the sound. Compared with air conduction speakers that use the diaphragm to drive the air to vibrate to produce sound, bone conduction vibration speakers need to drive the user's soft tissue and bones to vibrate, so the mechanical power required is higher. Improving the sensitivity of bone conduction speakers can make the conversion of electrical energy into mechanical energy more efficient, thereby outputting greater mechanical power. Improving sensitivity is even more important for bone conduction speakers with higher power requirements. Summary of the invention

[0004] The present application relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly generates a first full magnetic field, and the magnetic circuit assembly may include a first magnetic element, the first magnetic element generates a second magnetic field; a first magnetic conductive element; a second magnetic conductive element, the second magnetic conductive element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element; and at least one second magnetic element, the at least one second magnetic element is placed below the magnetic gap, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap.

[0005] According to some embodiments of the present application, the magnetic circuit assembly may further include at least one third magnetic element, and the third magnetic element is connected to the second magnetic conductive element.

[0006] According to some embodiments of the present application, the magnetic circuit assembly may further include at least one fourth magnetic element, and the at least one fourth magnetic element is located between the second magnetic conductive element and the at least one third magnetic element.

[0007] According to some embodiments of the present application, the magnetic circuit assembly may further include a magnetically conductive cover, which surrounds the first magnetic element, the first magnetically conductive element, the second magnetically conductive element and the second magnetic element.

[0008] According to some embodiments of the present application, the magnetic circuit assembly may further include at least one fifth magnetic element, and the at least one fifth magnetic element is connected to the upper surface of the first magnetic conductive element.

[0009] According to some embodiments of the present application, the magnetic circuit assembly may further include at least one conductive element, which connects at least one of the first magnetic element, the first magnetic conductive element, or the second magnetic element.

[0010] Some additional features of the present application may be explained in the following description. Some additional features of the present application will be apparent to those skilled in the art by inspection of the following description and corresponding drawings or understanding of the production or operation of the embodiments. The features disclosed in the present application may be realized and achieved by practice or use of various methods, means and combinations of the specific embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The exemplary embodiments of the present application and their descriptions are used to explain the present application and do not constitute a limitation of the present application. In each figure, the same reference numeral represents the same component.

[0012] Figure 1 is a structural module diagram of a bone conduction speaker according to some embodiments of the present application;

[0013] Figure 2 is a schematic longitudinal section diagram of a bone conduction speaker according to some embodiments of the present application;

[0014] Figure 3 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0015] Figure 4 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0016] Figure 5 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0017] Figure 6 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0018] Figure 7 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0019] Figure 8 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0020] Fig. 9 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0021] Fig.10 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0022] Fig.11 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly according to some embodiments of the present application;

[0023] Fig.12 is a schematic cross-sectional view of a magnetic element according to some embodiments of the present application;

[0024] Fig.13 is a schematic diagram of a magnetic element according to some embodiments of the present application;

[0025] Fig.14 is a schematic diagram of the magnetization direction of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application;

[0026] Fig.15 is a magnetic induction line distribution diagram of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application;

[0027] Fig.16 It is a schematic diagram of the structure of a bone conduction speaker according to some embodiments of the present application. DETAILED DESCRIPTION

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without paying creative work. It should be understood that these exemplary embodiments are given only to enable technicians in related fields to better understand and implement the present invention, and do not limit the scope of the present invention in any way. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0029] As shown in the present application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not specifically refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate that the steps and elements that have been clearly identified are included, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment". The relevant definitions of other terms will be given in the following description. Below, without loss of generality, when describing the bone conduction related technology in the present invention, the description of "bone conduction speaker" or "bone conduction earphone" will be used. This description is only a form of bone conduction application. For ordinary technicians in this field, "speaker" or "earphone" can also be replaced by other similar words, such as "player", "hearing aid", etc. In fact, the various implementations of the present invention can be easily applied to other non-speaker hearing devices. For example, for professionals in this field, after understanding the basic principle of bone conduction speakers, it is possible to make various modifications and changes in form and details to the specific methods and steps of implementing bone conduction speakers without deviating from this principle. In particular, the functions of picking up and processing ambient sound are added to the bone conduction speakers to enable the speakers to realize the functions of hearing aids. For example, microphones and other sound sources can pick up the sounds of the user / wearer's surrounding environment, and under a certain algorithm, the processed sounds (or the generated electrical signals) are transmitted to the bone conduction speaker part. That is, the bone conduction speaker can be modified to add the function of picking up ambient sound, and after certain signal processing, the sound is transmitted to the user / wearer through the bone conduction speaker part, thereby realizing the functions of bone conduction hearing aids. As an example, the algorithms mentioned here can include one or more combinations of noise elimination, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environmental recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, etc.

[0030] The present invention provides a high-sensitivity bone conduction speaker. In some embodiments, the bone conduction speaker may include a magnetic circuit assembly. The magnetic circuit assembly may generate a first total magnetic field. The magnetic circuit assembly may include a first magnetic element, a first magnetic conductive element, a second magnetic conductive element, and one or more second magnetic elements. The first magnetic element may generate a second magnetic field, and the second magnetic conductive element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element. The one or more magnetic elements are placed below the magnetic gap. The one or more second magnetic elements in the magnetic circuit assembly can reduce the volume and weight of the magnetic circuit assembly, improve the efficiency of the bone conduction speaker, and increase the service life of the bone conduction speaker while increasing the magnetic field strength of the magnetic gap and the sensitivity of the bone conduction speaker.

[0031] The bone conduction speaker has the characteristics of small size, light weight, high efficiency, high sensitivity and long service life, which makes it easy to combine the bone conduction speaker with wearable smart devices, so as to realize the multifunctionality of a single device and improve and optimize the user experience. The wearable smart devices include but are not limited to smart headphones, smart glasses, smart headbands, smart helmets, smart watches, smart gloves, smart shoes, smart cameras, smart video cameras, etc. The bone conduction speaker can be further combined with smart materials to integrate the bone conduction speaker into the manufacturing materials of the user's clothes, gloves, hats, shoes, etc. The bone conduction speaker can also be further implanted in the human body to cooperate with the human body implanted chip or external processor to realize more personalized functions.

[0032] Figure 1 1 is a structural module diagram of a bone conduction speaker 100 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 100 may include a magnetic circuit component 102, a vibration component 104, a support component 106 and a storage component 108.

[0033] The magnetic circuit component 102 can provide a magnetic field. The magnetic field can be used to convert a signal containing sound information into a vibration signal. In some embodiments, the sound information may include a video or audio file in a specific data format or data or files that can be converted into sound through a specific path. The signal containing sound information may come from the storage component 108 of the bone conduction speaker 100 itself, or from an information generation, storage or transmission system outside the bone conduction speaker 100. The signal containing sound information may include a combination of one or more electrical signals, optical signals, magnetic signals, mechanical signals, etc. The signal containing sound information may come from one signal source or multiple signal sources. The multiple signal sources may be related or unrelated. In some embodiments, the bone conduction speaker 100 may obtain the signal containing sound information in a variety of different ways, and the acquisition of the signal may be wired or wireless, and may be real-time or delayed. For example, the bone conduction speaker 100 may receive an electrical signal containing sound information in a wired or wireless manner, or may directly obtain data from a storage medium (e.g., the storage component 108) to generate a sound signal. For another example, a bone conduction hearing aid may include a component with a sound collection function, which converts the mechanical vibration of the sound into an electrical signal by picking up the sound in the environment, and obtains the electrical signal that meets specific requirements after being processed by an amplifier. In some embodiments, the wired connection may include a metal cable, an optical cable, or a hybrid cable of metal and optical, such as a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheathed cable, a metal sheathed cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, a telecommunication cable, a two-strand cable, a parallel two-core conductor, a twisted pair, or a combination of one or more thereof. The examples described above are for convenience of explanation only, and the medium of the wired connection may also be other types, such as a transmission carrier of other electrical signals or optical signals.

[0034] Wireless connection may include radio communication, free space optical communication, acoustic communication, and electromagnetic induction, etc. Radio communication may include IEEE802.11 series standards, IEEE802.15 series standards (such as Bluetooth technology and ZigBee technology, etc.), first generation mobile communication technology, second generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet radio service technology, third generation mobile communication technology (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX, etc.), fourth generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), near field communication (NFC) and other technologies running in ISM frequency bands (such as 2.4GHz, etc.); free space optical communication may include visible light, infrared signals, etc.; acoustic communication may include sound waves, ultrasonic signals, etc.; electromagnetic induction may include near field communication technology, etc. The examples described above are only for the convenience of explanation, and the medium of wireless connection may also be other types, such as Z-wave technology, other paid civil radio frequency bands and military radio frequency bands, etc. For example, as some application scenarios of the present technology, the bone conduction speaker 100 can obtain signals containing sound information from other devices through Bluetooth technology.

[0035] The vibration component 104 can generate mechanical vibration. The generation of the vibration is accompanied by energy conversion. The bone conduction speaker 100 can use a specific magnetic circuit component 102 and a vibration component 104 to realize the conversion of a signal containing sound information into mechanical vibration. The conversion process may include the coexistence and conversion of multiple different types of energy. For example, an electrical signal can be directly converted into mechanical vibration through a transducer to generate sound. For another example, sound information can be contained in an optical signal, and a specific transducer can realize the process of converting an optical signal into a vibration signal. Other types of energy that can coexist and convert during the operation of the transducer include thermal energy, magnetic field energy, etc. The energy conversion method of the transducer may include moving coil, electrostatic, piezoelectric, moving iron, pneumatic, electromagnetic, etc. The frequency response range and sound quality of the bone conduction speaker 100 will be affected by the vibration component 104. For example, in a dynamic coil transducer device, the vibration component 104 includes a wound cylindrical coil and a vibrating body (for example, a vibrating plate). The cylindrical coil driven by the signal current drives the vibrating body to vibrate and produce sound in the magnetic field. The extension and contraction of the vibrating body material, the deformation, size, shape and fixing method of the folds, the magnetic density of the permanent magnet, etc., will have a great impact on the sound quality of the bone conduction speaker 100. The vibrating body in the vibration component 104 can be a mirror-symmetrical structure, a centrally symmetrical structure or an asymmetrical structure; the vibrating body can be provided with an intermittent hole-shaped structure to make the vibrating body produce a larger displacement, so that the bone conduction speaker can achieve higher sensitivity and improve the output power of vibration and sound; the vibrating body can be a torus structure, and a plurality of support rods radiating to the center are provided in the torus, and the number of the support rods can be two or more.

[0036] The support assembly 106 can support the magnetic circuit assembly 102, the vibration assembly 104 and / or the storage assembly 108. The support assembly 106 can include one or more shells and one or more connectors. The one or more shells can form a storage space for accommodating the magnetic circuit assembly 102, the vibration assembly 104 and / or the storage assembly 108. The one or more connectors can connect the shell with the magnetic circuit assembly 102, the vibration assembly 104 and / or the storage assembly 108.

[0037] The storage component 108 can store signals containing sound information. In some embodiments, the storage component 108 may include one or more storage devices. The storage device may include storage devices on storage systems such as direct attached storage, network attached storage, and storage area network. The storage device may include various types of storage devices such as solid-state storage devices (solid-state hard disks, solid-state hybrid hard disks, etc.), mechanical hard disks, USB flash drives, memory sticks, memory cards (such as CF, SD, etc.), other drives (such as CD, DVD, HDDVD, Blu-ray, etc.), random access memory (RAM) and read-only memory (ROM). RAM may include decimal counters, select tubes, delay line memory, Williams tubes, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T-RAM), and zero capacitance random access memory (Z-RAM), etc.; ROM may include bubble memory, magnetic button line memory, thin film memory, magnetic plated line memory, magnetic core memory, magnetic drum memory, optical drive, hard disk, magnetic tape, early NVRAM (non-volatile memory), phase change memory, magnetoresistive random access memory, ferroelectric random access memory, non-volatile SRAM, flash memory, electronically erasable rewritable read-only memory, erasable programmable read-only memory, programmable read-only memory, shielded stack read memory, floating connection gate random access memory, nano random access memory, racetrack memory, variable resistance memory, and programmable metallization unit, etc. The above-mentioned storage devices / storage units are some examples, and the storage devices that can be used by the storage devices / storage units are not limited to these.

[0038] The above description of the structure of the bone conduction speaker is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone conduction speaker, it is possible to make various modifications and changes in form and details to the specific methods and steps of implementing the bone conduction speaker without deviating from this principle, but these modifications and changes are still within the scope of the above description. For example, the bone conduction speaker 100 may include one or more processors, and the processor may execute one or more sound signal processing algorithms. The sound signal processing algorithm may modify or enhance the sound signal. For example, the sound signal is subjected to noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or other similar or any combination of the above processing, and these modifications and changes are still within the scope of protection of the claims of the present invention. For another example, the bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, etc. The sensor may collect user information or environmental information.

[0039] Figure 2 FIG. 2 is a schematic longitudinal section diagram of a bone conduction speaker 200 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 200 may include a first magnetic element 202, a first magnetic conductive element 204, a second magnetic conductive element 206, a first vibration plate 208, a voice coil 210, a second vibration plate 212 and a vibration panel 214.

[0040] The magnetic element described in the present application refers to an element that can generate a magnetic field, such as a magnet. The magnetic element may have a magnetization direction, and the magnetization direction refers to the direction of the magnetic field inside the magnetic element. The first magnetic element 202 may include one or more magnets. In some embodiments, the magnet may include a metal alloy magnet, a ferrite, and the like. Among them, the metal alloy magnet may include neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination of multiple thereof. The ferrite may include barium ferrite, steel ferrite, manganese ferrite, lithium manganese ferrite, or the like, or a combination of multiple thereof.

[0041] The lower surface of the first magnetic conductive element 204 can be connected to the upper surface of the first magnetic element 202. The second magnetic conductive element 206 can be connected to the first magnetic element 202. It should be noted that the magnetic conductive body mentioned here can also be called a magnetic field concentrator or an iron core. The magnetic conductive body can adjust the distribution of the magnetic field (for example, the magnetic field generated by the first magnetic element 202). The magnetic conductive body may include an element processed from a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, etc., such as iron, an iron-silicon alloy, an iron-aluminum alloy, a nickel-iron alloy, an iron-cobalt alloy, a low-carbon steel, a silicon steel sheet, a silicon steel sheet, a ferrite, etc. In some embodiments, the magnetic conductive body may be processed by one or more combinations of casting, plastic processing, cutting processing, powder metallurgy, etc. Casting may include sand casting, investment casting, pressure casting, centrifugal casting, etc.; plastic processing may include one or more combinations of rolling, casting, forging, stamping, extrusion, drawing, etc.; cutting processing may include turning, milling, planing, grinding, etc. In some embodiments, the processing method of the magnetic conductor may include 3D printing, CNC machine tools, etc. The connection method between the first magnetic conductive element 204, the second magnetic conductive element 206 and the first magnetic element 202 may include one or more combinations of bonding, clamping, welding, riveting, bolting, etc. In some embodiments, the first magnetic element 202, the first magnetic conductive element 204 and the second magnetic conductive element 206 may be set as an axisymmetric structure. The axisymmetric structure may be an annular structure, a columnar structure or other axisymmetric structures.

[0042] In some embodiments, a magnetic gap may be formed between the first magnetic element 202 and the second magnetic conductive element 206. A voice coil 210 may be disposed in the magnetic gap. The voice coil 210 may be connected to the first vibration plate 208. The first vibration plate 208 may be connected to the second vibration plate 212, and the second vibration plate 212 may be connected to the vibration panel 214. When current is passed through the voice coil 210, the voice coil 210 is located in the magnetic field formed by the first magnetic element 202, the first magnetic conductive element 214, and the second magnetic conductive element 206, and is subjected to the Ampere force, which drives the voice coil 210 to vibrate, and the vibration of the voice coil 210 drives the vibration of the first vibration plate 208, the second vibration plate 212, and the vibration panel 214. The vibration panel 214 transmits the vibration to the auditory nerve through tissues and bones, so that people can hear the sound. The vibration panel 214 may be in direct contact with human skin, or may be in contact with the skin through a vibration transmission layer composed of a specific material.

[0043] In some embodiments, for a bone conduction speaker with a single magnetic element, the magnetic flux lines passing through the voice coil are not uniform but divergent. At the same time, magnetic leakage may be formed in the magnetic circuit, that is, more magnetic flux lines leak out of the magnetic gap and fail to pass through the voice coil, thereby reducing the magnetic induction intensity (or magnetic field intensity) at the voice coil position, affecting the sensitivity of the bone conduction speaker. Therefore, the bone conduction speaker 200 may further include at least one second magnetic element and / or at least one third magnetic conductive element (not shown). The at least one second magnetic element and / or at least one third magnetic conductive element can suppress the leakage of magnetic flux lines, constrain the shape of magnetic flux lines passing through the voice coil, so that more magnetic flux lines pass through the voice coil as horizontally and densely as possible, and enhance the magnetic induction intensity (or magnetic field intensity) at the voice coil position, thereby improving the sensitivity of the bone conduction speaker 200, and further improving the mechanical conversion efficiency of the bone conduction speaker 200 (that is, the efficiency of converting the electrical energy input to the bone conduction speaker 200 into the mechanical energy of the voice coil vibration). For more description of the at least one second magnetic element, please refer to Figure 3-11 .

[0044] The above description of the structure of the bone conduction speaker 200 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone conduction speaker, it is possible to make various modifications and changes in form and details to the specific methods and steps of implementing the bone conduction speaker without deviating from this principle, but these modifications and changes are still within the scope of the above description. For example, the bone conduction speaker 200 may include a housing, a connector, etc. The connector may connect the vibration panel 214 to the housing. For another example, the bone conduction speaker 200 may include a second magnetic element, which may be connected to the first magnetic conductive element 204. For another example, the bone conduction speaker 200 may further include one or more annular magnetic elements, which may be connected to the second magnetic conductive element 206.

[0045] Figure 3 is a schematic longitudinal section diagram of a magnetic circuit assembly 3100 according to some embodiments of the present application. Figure 3As shown, the magnetic circuit assembly 3100 may include a first magnetic element 302, a first magnetic conductive element 304, a first total magnetic field changing element 306, and a second magnetic element 308. In some embodiments, the first magnetic element 302 and / or the second magnetic element 308 may include any one or more magnets described in the present application. The first magnetic element 302 may include a first magnet, and the second magnetic element 308 may include a second magnet, and the first magnet and the second magnet may be the same or different. The first magnetic conductive element 304 may include any one or more magnetic conductive materials described in the present application, such as low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc. In some embodiments, the first magnetic element 302 and / or the first magnetic conductive element 304 may be set as an axisymmetric structure.

[0046] The first magnetic element 302 and / or the first magnetic conductive element 304 can be a cylinder. In some embodiments, the first magnetic element 302 and the first magnetic conductive element 304 can be coaxial cylinders with the same or different diameters. In some embodiments, the first total magnetic field changing element 306 can be any one of a magnetic element or a magnetic conductive element. The first total magnetic field changing element 306 and / or the second magnetic element 308 can be set to be annular or sheet-shaped. In some embodiments, the second magnetic element 308 can be an annular cylinder coaxial with the first magnetic element 302, the first magnetic conductive element 304 and / or the first total magnetic field changing element 306, containing an inner ring and / or an outer ring with the same or different diameters. The processing method of the first magnetic conductive element 304 and / or the first total magnetic field changing element 306 can include any one or more of the processing methods described in this application.

[0047] The upper surface of the first magnetic element 302 can be connected to the lower surface of the first magnetic conductive element 304, and the second magnetic element 308 can be connected to the first magnetic element 302 and the first total magnetic field changing element 306. The connection method between the first magnetic element 302, the first magnetic conductive element 304, the first total magnetic field changing element 306 and / or the second magnetic element 308 can be based on any one or more connection methods described in the present application. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the first total magnetic field changing element 306 and / or the second magnetic element 308 can form a magnetic circuit and a magnetic gap.

[0048] In some embodiments, the magnetic circuit assembly 3100 can generate a first total magnetic field (also referred to as the "total magnetic field of the magnetic circuit assembly"), the first magnetic element 302 can generate a second magnetic field, and the magnetic field strength of the first total magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 308 can generate a third magnetic field, and the third magnetic field can increase the magnetic field strength of the second magnetic field at the magnetic gap. The first total magnetic field is formed by the magnetic fields generated by all components in the magnetic circuit assembly 3100 (for example, the first magnetic element 302, the first magnetic conductive element 304, the first total magnetic field changing element 306, and the second magnetic element 308). The magnetic field strength (also referred to as magnetic induction strength or magnetic flux density) of the first total magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 308 can generate a third magnetic field, and the third magnetic field can increase the magnetic field strength of the first total magnetic field at the magnetic gap. Here, the third magnetic field improving the magnetic field strength of the first total magnetic field means that when the third magnetic field exists (i.e., the second magnetic element 308 exists), the magnetic field strength of the first total magnetic field in the magnetic gap is greater than that of the first total magnetic field when the third magnetic field does not exist (i.e., the second magnetic element 308 does not exist). In other embodiments in this specification, unless otherwise specified, the magnetic circuit assembly represents a structure including all magnetic elements and magnetic conductive elements, the first total magnetic field represents the magnetic field generated by the magnetic circuit assembly as a whole, and the second magnetic field, the third magnetic field, ..., the Nth magnetic field respectively represent the magnetic fields generated by the corresponding magnetic elements. In different embodiments, the magnetic elements that generate the second magnetic field (or the third magnetic field, ..., the Nth magnetic field) may be the same or different.

[0049] In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be between 0 and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be between 45 and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be no greater than 90 degrees.

[0050] In some embodiments, at the position of the second magnetic element 308, the angle between the direction of the first total magnetic field and the magnetization direction of the second magnetic element 308 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 308, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the second magnetic element 308 can be 0 degrees, 10 degrees, 20 degrees, etc., which is less than or equal to 90 degrees. For another example, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and is vertically upward (as shown in the direction a in the figure), and the magnetization direction of the second magnetic element 308 is from the outer ring of the second magnetic element 308 to the inner ring (as shown in the direction c in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction).

[0051] Compared with a magnetic circuit assembly with a single magnetic element, the first full magnetic field changing element 306 in the magnetic circuit assembly 3100 can increase the total magnetic flux in the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the first full magnetic field changing element 306, the originally divergent magnetic flux lines will converge to the location of the magnetic gap, further increasing the magnetic induction intensity in the magnetic gap.

[0052] The above description of the structure of the magnetic circuit assembly 3100 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3100 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3100 may further include a magnetic conductive cover, and the magnetic conductive cover may include a first magnetic element 302, a first magnetic conductive element 304, a first full magnetic field changing element 306, and a second magnetic element 308.

[0053] Figure 4 FIG. 3 is a schematic longitudinal section diagram of a magnetic circuit assembly 3200 according to some embodiments of the present application. Figure 4 As shown, different from the magnetic circuit assembly 3100 , the magnetic circuit assembly 3200 may further include a third magnetic element 310 .

[0054] The lower surface of the third magnetic element 310 can be connected to the first total magnetic field changing element 306. The connection method between the third magnetic element 310 and the first total magnetic field changing element 306 can be based on any one or more connection methods described in this application. In some embodiments, a magnetic gap can be formed between the first magnetic element 302, the first magnetic conductive element 304, the first total magnetic field changing element 306, the second magnetic element 308 and / or the third magnetic element 310. In some embodiments, the magnetic circuit assembly 3200 can generate a first total magnetic field, the first magnetic element 302 can generate a second magnetic field, and the magnetic field strength of the first total magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the third magnetic element 310 can generate a third magnetic field, and the third magnetic field can increase the magnetic field strength of the second magnetic field at the magnetic gap.

[0055] In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be between 0 and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 45 and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and is vertically upward (as shown in the direction a in the figure), and the magnetization direction of the third magnetic element 310 is directed from the inner ring of the third magnetic element 310 to the outer ring (as shown in the direction b in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 90 degrees in the clockwise direction).

[0056] In some embodiments, at the location of the third magnetic element 310, the angle between the direction of the first total magnetic field and the magnetization direction of the second magnetic element 308 is no greater than 90 degrees. In some embodiments, at the location of the third magnetic element 310, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the third magnetic element 310 can be 0 degrees, 10 degrees, 20 degrees, or the like, which is less than or equal to 90 degrees.

[0057] Compared with the magnetic circuit assembly 3100, the magnetic circuit assembly 3200 further adds a third magnetic element 310. The third magnetic element 310 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3200, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the third magnetic element 310, the magnetic flux lines will further converge to the location of the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap.

[0058] The above description of the structure of the magnetic circuit assembly 3200 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3200 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3200 may further include a magnetic conductive cover, and the magnetic conductive cover may include a first magnetic element 302, a first magnetic conductive element 304, a first full magnetic field changing element 306, a second magnetic element 308 and a third magnetic element 310.

[0059] Figure 5 3 is a schematic diagram of a magnetic circuit assembly 3300 according to some embodiments of the present application. Figure 5 As shown, different from the magnetic circuit assembly 3200 , the magnetic circuit assembly 3300 may further include a fourth magnetic element 312 .

[0060] The lower surface of the fourth magnetic element 312 can be connected to the upper surface of the first total magnetic field changing element 306, and the upper surface of the fourth magnetic element 312 can be connected to the lower surface of the second magnetic element 308. The connection method between the fourth magnetic element 312 and the first total magnetic field changing element 306 and the second magnetic element 308 can be based on any one or more of the connection methods described in this application. In some embodiments, a magnetic gap can be formed between the first magnetic element 302, the first magnetic conductive element 304, the first total magnetic field changing element 306, the second magnetic element 308, the third magnetic element 310 and / or the fourth magnetic element 312. The magnetization directions of the second magnetic element 308 and the third magnetic element 310 can refer to the respective connection methods described in this application. Figure 3 and / or the detailed description in 4.

[0061] In some embodiments, the magnetic circuit assembly 3300 can generate a first full magnetic field, the first magnetic element 302 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the fourth magnetic element 312 can generate a third magnetic field, and the third magnetic field can increase the magnetic field strength of the second magnetic field at the magnetic gap.

[0062] In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be between 0 and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 45 and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and is vertically upward (as shown in the direction a in the figure), and the magnetization direction of the fourth magnetic element 312 is from the upper surface of the fourth magnetic element 312 to the lower surface (as shown in the direction d in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 180 degrees in the clockwise direction).

[0063] In some embodiments, at the location of the fourth magnetic element 312, the angle between the direction of the first total magnetic field and the magnetization direction of the fourth magnetic element 312 is no greater than 90 degrees. In some embodiments, at the location of the fourth magnetic element 312, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 can be 0 degrees, 10 degrees, 20 degrees, or the like, which is less than or equal to 90 degrees.

[0064] Compared with the magnetic circuit assembly 3200, the magnetic circuit assembly 3300 further adds a fourth magnetic element 312. The fourth magnetic element 312 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3300, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the fourth magnetic element 312, the magnetic flux lines will further converge to the location of the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap.

[0065] The above description of the structure of the magnetic circuit assembly 3300 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3300 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3200 may further include one or more conductive elements, and the one or more conductive elements may connect at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, the third magnetic element 310 and the fourth magnetic element 312.

[0066] Figure 6 FIG. 3 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly 3400 according to some embodiments of the present application. Figure 6As shown, unlike the magnetic circuit assembly 3300 , the magnetic circuit assembly 3400 may further include a magnetic conductive cover 314 .

[0067] The magnetic shield 314 may include any one or more magnetic conductive materials described in the present application, for example, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc. The magnetic shield 314 may be connected to the first total magnetic field changing element 306, the second magnetic element 308, the third magnetic element 310, and the fourth magnetic element 312 by any one or more connection methods described in the present application. The processing method of the magnetic shield 314 may include any one of the processing methods described in the present application, for example, one or more combinations of casting, plastic processing, cutting, powder metallurgy, etc. In some embodiments, the magnetic shield 314 may include a bottom plate and a side wall, and the side wall is an annular structure. In some embodiments, the bottom plate and the side wall may be integrally formed. In some embodiments, the bottom plate may be connected to the side wall by any one or more connection methods described in the present application.

[0068] Compared with magnetic circuit assembly 3300, magnetic circuit assembly 3400 further adds magnetic shield 314. Magnetic shield 314 can suppress magnetic leakage of magnetic circuit assembly 3300, effectively reduce magnetic circuit length and magnetic resistance, so that more magnetic flux lines can pass through the magnetic gap, and improve the magnetic induction intensity in the magnetic gap.

[0069] The above description of the structure of the magnetic circuit assembly 3400 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3400 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3400 may further include one or more conductive elements, and the one or more conductive elements may be connected to at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, the third magnetic element 310 and the fourth magnetic element 312. For another example, the magnetic circuit assembly 3200 may further include a fifth magnetic element, the lower surface of the fifth magnetic element is connected to the upper surface of the first magnetic conductive element 304, and the magnetization direction of the fifth magnetic element is opposite to the magnetization direction of the first magnetic element 302.

[0070] Figure 7 FIG. 3 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly 3500 according to some embodiments of the present application. Figure 7 As shown, unlike the magnetic circuit assembly 3200 , the connection surface between the first full magnetic field changing element 306 and the second magnetic element 308 of the magnetic circuit assembly 3500 can be a wedge-shaped cross-section.

[0071] Compared with the magnetic circuit assembly 3100, the connection surface between the first full magnetic field changing element 306 and the second magnetic element 308 of the magnetic circuit assembly 3500 is configured as a wedge-shaped cross section, which can make the magnetic flux lines turn smoothly. At the same time, the wedge-shaped cross section can facilitate the assembly of the first full magnetic field changing element 306 and the second magnetic element 308 and can reduce the number of assembly components and reduce the weight of the bone conduction speaker.

[0072] The above description of the structure of the magnetic circuit assembly 3500 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3500 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3500 may further include one or more conductive elements, and the conductive elements may be connected to at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, and the third magnetic element 310. For another example, the magnetic circuit assembly 3500 may further include a fifth magnetic element, the lower surface of the fifth magnetic element is connected to the upper surface of the first magnetic conductive element 304, and the magnetization direction of the fifth magnetic element is opposite to the magnetization direction of the first magnetic element 302. In some embodiments, the magnetic circuit assembly 3500 may further include a magnetically conductive cover, which may include a first magnetic element 302 , a first magnetically conductive element 304 , a first total magnetic field changing element 306 , a second magnetic element 308 , and a third magnetic element 310 .

[0073] Figure 8 FIG. 3 is a longitudinal cross-sectional schematic diagram of a magnetic circuit assembly 3600 according to some embodiments of the present application. Figure 8As shown, unlike the magnetic circuit assembly 3100, the magnetic circuit assembly 3600 may further include a fifth magnetic element 316. In some embodiments, the fifth magnetic element 316 may include one or more magnets. The magnet may include any one or more magnetic materials described in the present application. In some embodiments, the fifth magnetic element 316 may include a first magnet, and the first magnetic element 302 may include a second magnet, and the magnetic materials included in the first magnet and the second magnet may be the same or different. In some embodiments, the fifth magnetic element 316, the first magnetic element 302, and the first magnetic conductive element 304 may be arranged as an axially symmetrical structure, for example, the fifth magnetic element 316, the first magnetic element 302, and the first magnetic conductive element 304 may be cylinders. In some embodiments, in some embodiments, the fifth magnetic element 316, the first magnetic element 302, and the first magnetic conductive element 304 may be coaxial cylinders with the same or different diameters. For example, the diameter of the first magnetic element 304 can be larger than the first magnetic element 302 and / or the fifth magnetic element 316, and the sidewalls of the first magnetic element 302 and / or the fifth magnetic element 316 can form a first recess and / or a second recess. In some embodiments, the ratio of the thickness of the second magnetic element 316 to the sum of the thicknesses of the first magnetic element 302, the second magnetic element 316, and the first magnetic element 304 is in the range of 0.4-0.6. The ratio of the first magnetic element 304 to the sum of the thicknesses of the first magnetic element 302, the second magnetic element 316, and the first magnetic element 304 is in the range of 0.5-1.5. In some embodiments, the thickness of the fifth magnetic element 316 is equal to the thickness of the first magnetic element 302.

[0074] In some embodiments, the angle between the magnetization direction of the fifth magnetic element 316 and the magnetization direction of the first magnetic element 302 is between 150 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the fifth magnetic element 316 and the magnetization direction of the first magnetic element 302 is between 90 degrees and 180 degrees. For example, the magnetization direction of the fifth magnetic element 316 is opposite to the magnetization direction of the first magnetic element 302 (as shown in the figure, direction a and direction e).

[0075] Compared with the magnetic circuit assembly 3100, the magnetic circuit assembly 3600 further adds a fifth magnetic element 316. The fifth magnetic element 326 can suppress the leakage of the first magnetic element 302 in the magnetic circuit assembly 3600 in the magnetization direction, so that the magnetic field generated by the first magnetic element 302 can be more compressed into the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap.

[0076] The above description of the structure of the magnetic circuit assembly 3600 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3600 without deviating from this principle, but these corrections and changes are still within the scope of the above description. In some embodiments, the magnetic circuit assembly 3600 may further include one or more conductive elements, and the one or more conductive elements may be connected to at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, and the fifth magnetic element 316. For example, the one or more conductive elements may be arranged in the first recess and / or the second recess. In some embodiments, the magnetic circuit assembly 3600 may further add at least one magnetic element, and the further added magnetic element may be connected to the first full magnetic field changing element 306. In some embodiments, the magnetic circuit assembly 3600 may further include a magnetically conductive cover, which includes a first magnetic element 302 , a first magnetically conductive element 304 , a first total magnetic field changing element 306 , a second magnetic element 308 and a fifth magnetic element 316 .

[0077] Fig. 9 3700 is a schematic longitudinal section diagram of a magnetic circuit assembly 3700 according to some embodiments of the present application. The magnetic circuit assembly 3700 may include a first magnetic element 302, a first magnetic conductive element 304, a first full magnetic field changing element 306, a second magnetic element 308, a third magnetic element 310, a fourth magnetic element 312, a fifth magnetic element 316, a sixth magnetic element 318, a seventh magnetic element 320, and a second annular element 322. The first magnetic element 302, the first magnetic conductive element 304, the first full magnetic field changing element 306, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, and the fifth magnetic element 316 may be referred to in the present application. Figure 3 , 4 , 5, 6, 7 and / or 8. In some embodiments, the first full magnetic field changing element 306 and / or the second annular element 322 may include an annular magnetic element or an annular magnetic conductive element. The annular magnetic element may include any one or more magnetic materials described in the present application, and the annular magnetic conductive element may include any one or more magnetic conductive materials described in the present application.

[0078] In some embodiments, the sixth magnetic element 318 can be connected to the fifth magnetic element 316 and the second annular element 322, and the seventh magnetic element 320 can be connected to the third magnetic element 310 and the second annular element 322. In some embodiments, the first magnetic element 302, the fifth magnetic element 316, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the sixth magnetic element 318 and / or the seventh magnetic element 320, the first magnetic conductive element 304, the first total magnetic field changing element 306 and the second annular element 322 can form a magnetic loop.

[0079] The magnetization direction of the second magnetic element 308 can refer to the present application Figure 3 The magnetization directions of the third magnetic element 310, the fourth magnetic element 312 and the fifth magnetic element 316 can refer to the detailed description of the present application. Figure 4 , 5 and a detailed description of 8.

[0080] In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 can be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 is not higher than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and is vertically upward (as shown in the direction a in the figure), and the magnetization direction of the sixth magnetic element 318 is from the outer ring of the sixth magnetic element 318 to the inner ring (as shown in the direction f in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction). In some embodiments, in the same vertical direction, the magnetization direction of the sixth magnetic element 318 can be the same as the magnetization direction of the second magnetic element 308. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and is vertically upward (as shown in the direction a in the figure), and the magnetization direction of the seventh magnetic element 320 is from the lower surface of the seventh magnetic element 320 to the upper surface (as shown in the direction e in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 360 degrees in the clockwise direction). In some embodiments, the magnetization direction of the seventh magnetic element 320 can be the same as the magnetization direction of the third magnetic element 312.

[0081] In some embodiments, at the location of the sixth magnetic element 318, the angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the sixth magnetic element 318 is not greater than 90 degrees. In some embodiments, at the location of the sixth magnetic element 318, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 can be 0 degrees, 10 degrees, 20 degrees, or the like, which is less than or equal to 90 degrees.

[0082] In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 may be between 0 and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 is between 45 and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 is not higher than 90 degrees.

[0083] In some embodiments, at the position of the seventh magnetic element 320, the angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the seventh magnetic element 320 is not greater than 90 degrees. In some embodiments, at the position of the seventh magnetic element 320, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 can be 0 degrees, 10 degrees, 20 degrees, etc., which is less than or equal to 90 degrees.

[0084] In some embodiments, the first full magnetic field changing element 306 may be an annular magnetic element. In this case, the magnetization direction of the first full magnetic field changing element 306 may be the same as the magnetization direction of the second magnetic element 308 or the fourth magnetic element 312. For example, on the right side of the first magnetic element 302, the magnetization direction of the first full magnetic field changing element 306 may be directed from the outer ring of the first full magnetic field changing element 306 to the inner ring. In some embodiments, the second annular element 322 may be an annular magnetic element. In this case, the magnetization direction of the second annular element 322 may be the same as the magnetization direction of the sixth magnetic element 318 or the seventh magnetic element 320. For example, on the right side of the first magnetic element 302, the magnetization direction of the second annular element 322 may be directed from the outer ring of the second annular element 322 to the inner ring.

[0085] In the magnetic circuit assembly 3700, multiple magnetic elements can increase the total magnetic flux. The interaction between different magnetic elements can suppress the leakage of magnetic flux lines, increase the magnetic induction intensity at the magnetic gap, and improve the sensitivity of the bone conduction speaker.

[0086] The above description of the structure of the magnetic circuit assembly 3700 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3700 without deviating from this principle, but these corrections and changes are still within the scope of the above description. In some embodiments, the magnetic circuit assembly 3700 may further include one or more conductive elements, and the one or more conductive elements may connect at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 316, the sixth magnetic element 318 and the seventh magnetic element 320.

[0087] Fig.10 FIG. 3 is a schematic longitudinal section diagram of a magnetic circuit assembly 3800 according to some embodiments of the present application. Fig.10 As shown, unlike the magnetic circuit assembly 3700 , the magnetic circuit assembly 3800 may further include a magnetic conductive cover 314 .

[0088] The magnetic shield 314 may include any one or more magnetic conductive materials described in the present application, such as low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc. The magnetic shield 314 may be connected to the first magnetic element 302, the first full magnetic field changing element 306, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 316, the sixth magnetic element 318, the seventh magnetic element 320 and the second annular element 322 by any one or more connection methods described in the present application. The processing method of the magnetic shield 314 may include any one of the processing methods described in the present application, such as casting, plastic processing, cutting processing, powder metallurgy, etc. One or more combinations thereof. In some embodiments, the magnetic shield may include at least one bottom plate and a side wall, and the side wall is an annular structure. In some embodiments, the bottom plate and the side wall may be integrally formed. In some embodiments, the bottom plate may be connected to the side wall by any one or more connection methods described in the present application. For example, the magnetic cover 314 may include a first bottom plate, a second bottom plate and a side wall. The first bottom plate and the side wall may be integrally formed, and the second bottom plate may be connected to the side wall by any one or more connection methods described in this application.

[0089] In the magnetic circuit assembly 3800, the magnetic conductive cover 314 can close the magnetic circuit generated by the magnetic circuit assembly 3800, so that more magnetic flux lines are concentrated in the magnetic gap in the magnetic circuit assembly 3800, thereby achieving the effect of suppressing leakage flux, increasing the magnetic induction intensity at the magnetic gap, and improving the sensitivity of the bone conduction speaker.

[0090] The above description of the structure of the magnetic circuit assembly 3800 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3800 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3800 may further include one or more conductive elements, and the one or more conductive elements may connect at least one of the first magnetic element 302, the first magnetic conductive element 304, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 316, the sixth magnetic element 318 and the seventh magnetic element 320.

[0091] Fig.11 FIG. 3 is a schematic longitudinal section diagram of a magnetic circuit assembly 3900 according to some embodiments of the present application. Fig.11 As shown, different from the magnetic circuit assembly 3100, the magnetic circuit assembly 3900 may further include one or more conductive elements (eg, a first conductive element 324, a second conductive element 326, and a third conductive element 328).

[0092] The description of the conductive element is similar to that of conductive element 318 , conductive element 320 , and conductive element 322 , and the related descriptions thereof are not repeated here.

[0093] The above description of the structure of the magnetic circuit assembly 3900 is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make various corrections and changes in form and details to the specific methods and steps of implementing the magnetic circuit assembly 3900 without deviating from this principle, but these corrections and changes are still within the scope of the above description. For example, the magnetic circuit assembly 3900 may further include at least one magnetic element and / or a magnetic conductive element.

[0094] Fig.12 400 is a cross-sectional schematic diagram of a magnetic element structure according to some embodiments of the present application. The magnetic element 400 can be applied to any magnetic circuit component in the present application (for example, Figure 3-11 As shown in the figure, the magnetic element 400 can be annular. The magnetic element 400 can include an inner ring 402 and an outer ring 404. In some embodiments, the shape of the inner ring 402 and / or the outer ring 404 can be circular, elliptical, triangular, quadrilateral or other arbitrary polygons.

[0095] Fig.13is a schematic diagram of a magnetic element structure according to some embodiments of the present application. The magnetic element can be used in any magnetic circuit component in the present application (for example, Figure 3-11 Magnetic circuit assembly shown). As shown in the figure, the magnetic element can be composed of a plurality of magnets arranged. The two ends of any one of the magnets can be connected to the two ends of the adjacent magnet or there is a certain distance. The spacing between the multiple magnets can be the same or different. In some embodiments, the magnetic element can be composed of 2 or 3 sheet-like magnets (for example, magnets 408-2, 408-4, and 408-6) arranged equidistantly. The shape of the sheet-like magnet can be a fan-shaped, quadrilateral, etc.

[0096] Fig.14 Schematic diagram of the magnetization direction of magnetic elements in a magnetic circuit assembly according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly may include a first magnetic element 401, a second magnetic element 403 and a third magnetic element 405. The magnetization direction of the first magnetic element 401 may be from the lower surface of the first magnetic element 401 to the upper surface (i.e., perpendicular to the direction outward from the paper). The second magnetic element 403 may be arranged around the first magnetic element 401. A magnetic gap may be formed between the inner ring of the second magnetic element 403 and the inner ring of the first magnetic element 401. The magnetization direction of the second magnetic element 403 may be from the inner ring of the second magnetic element 403 to the outer ring. The inner ring of the third magnetic element 405 may be connected to the outer ring of the first magnetic element 401, and the outer ring of the third magnetic element 405 may be connected to the inner ring of the second magnetic element 403. The magnetization direction of the third magnetic element 405 may be from the outer ring of the third magnetic element 403 to the inner ring.

[0097] Fig.15 FIG. 4 is a schematic diagram of magnetic induction lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As shown in the figure, a magnetic circuit assembly 400 (for example, Figure 3-11The magnetic circuit assembly shown in FIG. 4 may include a first magnetic element 402 and a second magnetic element 404. The magnetization direction of the first magnetic element 402 may be from the lower surface of the first magnetic element 402 to the upper surface (as shown by arrow a). The first magnetic element 402 may generate a second magnetic field, which may be represented by magnetic induction lines (the solid line in the figure represents the distribution of the second magnetic field in the absence of the second magnetic element 404), and the magnetic field direction of the second magnetic field at a certain point is the tangent direction of the point on the magnetic induction line. The magnetization direction of the second magnetic element 404 may be from the inner ring of the second magnetic element 404 to the outer ring (as shown by arrow b). The second magnetic element 404 may generate a third magnetic field. The third magnetic field may also be represented by magnetic induction lines (the dotted line in the figure represents the distribution of the third magnetic field in the absence of the first magnetic element 402), and the magnetic field direction of the third magnetic field at a certain point is the tangent direction of the point on the third magnetic induction line. Under the interaction of the second magnetic field and the third magnetic field, the magnetic circuit assembly 400 may generate a first full magnetic field. The magnetic field strength of the first full magnetic field at the voice coil 406 is greater than the magnetic field strength of the second magnetic field or the third magnetic field at the voice coil 406. As shown in the figure, the angle between the magnetic field direction of the second magnetic field at the voice coil 406 and the magnetization direction of the second magnetic element 404 is less than or equal to 90 degrees.

[0098] Fig.16 1 is a schematic diagram of a bone conduction speaker 5000 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 5000 may include a first magnetic element 502, a first magnetic conductive element 510, a second magnetic element 504, a third magnetic element 506, a second magnetic conductive element 508, a washer 514, a voice coil 512, a first vibration plate 516, a bracket 518, a second vibration plate 520 and a vibration panel 522. The lower surface of the first magnetic element 502 is connected to the inner wall of the second magnetic conductive element 508.

[0099] The upper surface of the first magnetic element 502 is connected to the lower surface of the first magnetic conductive element 510. The outer wall of the second magnetic element 504 is connected to the inner wall of the second magnetic conductive element 508. The third magnetic element 506 is below the second magnetic element 504. At the same time, the outer wall of the third magnetic element 506 is connected to the inner wall of the second magnetic conductive element 508; the inner wall of the third magnetic element 506 is connected to the outer wall of the first magnetic element 502; the lower surface of the third magnetic element 506 is connected to the inner wall of the second magnetic conductive element 508; a magnetic gap can be formed between the first magnetic element 502, the first magnetic conductive element 510 and the second magnetic element 504, the third magnetic element 506. The voice coil 512 can be placed in the magnetic gap. In some embodiments, the voice coil 512 can be Figure 5The racetrack shape shown may also be other geometric shapes, such as a triangle, rectangle, square, ellipse, pentagon or other irregular shapes. The voice coil 512 is connected to the bracket 518, the bracket 518 is connected to the first vibration plate 516, and the first vibration plate 516 is connected to the second magnetic conductive element 508 through the washer 514. The lower surface of the second vibration plate 520 is connected to the bracket 518, and the upper surface of the second vibration plate 520 is connected to the vibration panel 522. In some embodiments, the second magnetic element 504 can be composed of multiple magnetic elements, such as Fig.16 As shown, it can be composed of four magnetic elements 541, 542, 543, 544. The shape surrounded by multiple magnetic elements can be Fig.16 The racetrack shape shown may also be other geometric shapes, such as triangle, rectangle, square, ellipse, pentagon or other irregular shapes. The third magnetic element 506 may be composed of multiple magnetic elements, such as Fig.16 As shown, it can be composed of four magnetic elements 561, 562, 563, 564. The shape surrounded by multiple magnetic elements can be Figure 5 The racetrack shape shown may also be other geometric shapes, such as triangle, rectangle, square, ellipse, pentagon or other irregular shapes. As described in other embodiments of the present application, the second magnetic element 504 or the third magnetic element 506 may be replaced by a plurality of interconnected magnetic elements with different magnetization directions, and the plurality of interconnected magnetic elements with different magnetization directions may increase the magnetic field strength at the magnetic gap in the bone conduction speaker 500, thereby increasing the sensitivity of the bone conduction speaker 500.

[0100] In some embodiments, each of the first magnetic element 502, the first magnetic conductive element 510, the second magnetic element 504, the third magnetic element 506, the second magnetic conductive element 508, the washer 514, the voice coil 512, the first vibration plate 516, the bracket 518, the second vibration plate 520 and / or the vibration panel 522 can be connected by any one or more of the connection methods described in the present application. For example, the first magnetic element 502, the second magnetic element 504, and the third magnetic element 506 can be connected to the first magnetic conductive element 510 and / or the second magnetic conductive element 508 by bonding. For another example, the washer 514 can be connected to the second magnetic conductive element 508 by an undercut structure, and further, the washer 514 can be connected to the second magnetic conductive element 508 and / or the second magnetic element 504 by an undercut structure plus bonding. In some embodiments, the first vibration plate 516 and / or the second vibration plate 520 can be configured as one or more coaxial ring bodies, wherein the plurality of ring bodies are provided with a plurality of support rods radiating to the center, and the center of convergence is consistent with the center of the first vibration plate 516 and / or the second vibration plate 520. The plurality of support rods are staggered. The plurality of support rods are straight rods or curved rods or partly straight rods and partly curved rods. Preferably, the plurality of support rods are curved rods. In some embodiments, the outer surface of the vibration panel 522 can be a plane or a curved surface. For example, the outer surface of the vibration panel 522 is Fig.16 The convex curved surface shown.

[0101] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only used as an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0102] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment" and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0103] In addition, it will be appreciated by those skilled in the art that various aspects of the present application may be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product or combination of substances or any new and useful improvements thereto. Accordingly, various aspects of the present application may be performed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software may all be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". In addition, various aspects of the present application may be represented as a computer product located in one or more computer-readable media, the product including computer-readable program code.

[0104] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters or other names, are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0105] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0106] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used to describe the embodiments are modified by modifiers such as "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and data used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0107] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. A bone conduction speaker, It is characterized in that The bone conduction speaker comprises a magnetic circuit assembly, and the magnetic circuit assembly comprises: a first magnetic element; A first magnetic conductive element, wherein a lower surface of the first magnetic conductive element is connected to an upper surface of the first magnetic element; and A second magnetic conductive element, surrounding the first magnetic element and forming a magnetic gap with the first magnetic element; Wherein, in the spacing direction between the upper surface and the lower surface of the first magnetic element, the first magnetic conductive element and the first magnetic element are both located as a whole inside the second magnetic conductive element.

2. The bone conduction speaker according to claim 1, It is characterized in that The bone conduction speaker further includes a voice coil disposed in the magnetic gap, and the magnetic circuit assembly further includes: At least one second magnetic element surrounds the first magnetic element and is used to increase the magnetic field strength in the magnetic gap, the magnetic circuit assembly generates a first full magnetic field, the first magnetic element generates a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap; wherein the outer side wall of the at least one second magnetic element is connected to the inner side wall of the second magnetic conductive element, so that the magnetic gap is located between the first magnetic element and the second magnetic element; and / or, The at least one second magnetic element is disposed within the magnetic gap and below the voice coil.

3. The bone conduction speaker according to claim 2, It is characterized in that The second magnetic element is located in the magnetic gap, the inner sidewall of the second magnetic element is connected to the outer sidewall of the first magnetic element, and the outer sidewall of the second magnetic element is connected to the inner sidewall of the second magnetic conductive element.

4. The bone conduction speaker according to claim 3, It is characterized in that The outer side wall of the second magnetic element is connected to the inner side wall of the second magnetic conductive element, and the formed connection surface is a wedge-shaped cross section.

5. The bone conduction speaker according to claim 3, It is characterized in that In the spacing direction between the upper surface and the lower surface of the first magnetic element, the upper surface of the second magnetic element and the lower surface of the voice coil are both entirely located between the upper surface and the lower surface of the first magnetic element and are spaced apart from each other.

6. The bone conduction speaker according to claim 2, It is characterized in that An angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.

7. The bone conduction speaker according to claim 6, It is characterized in that An angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is no greater than 90 degrees.

8. The bone conduction speaker according to claim 2, It is characterized in that In the spacing direction between the upper surface and the lower surface of the first magnetic element, the lower surface of the second magnetic element is located between the upper surface and the lower surface of the first magnetic element, and the upper surface of the second magnetic element is located above the upper surface of the first magnetic conductive element, and the outer side wall of the second magnetic element is connected to the inner side wall of the second magnetic conductive element, so that the magnetic gap is located between the first magnetic element and the second magnetic element.

9. The bone conduction speaker according to claim 8, It is characterized in that The magnetic circuit assembly also includes: At least one third magnetic element surrounds the first magnetic element and is located below the second magnetic element and the voice coil, and is used to increase the magnetic field strength of the second magnetic field at the magnetic gap.

10. The bone conduction speaker according to claim 9, It is characterized in that The inner sidewall of the third magnetic element is connected to the outer sidewall of the first magnetic element, and the upper surface of the third magnetic element is connected to the lower surface of the second magnetic element.

11. The bone conduction speaker according to claim 9, It is characterized in that The second magnetic conductive element includes a bottom plate and a side wall, the outer side wall of the second magnetic element and the outer side wall of the third magnetic element are connected to the inner side wall of the side wall, and the lower surface of the first magnetic element and the lower surface of the third magnetic element are connected to the inner wall of the bottom plate.

12. The bone conduction speaker according to claim 9, It is characterized in that The magnetization direction of the at least one third magnetic element is between 45 degrees and 135 degrees to the magnetization direction of the first magnetic element.

13. The bone conduction speaker according to claim 12, It is characterized in that An angle between a magnetization direction of the at least one third magnetic element and a magnetization direction of the first magnetic element is no greater than 90 degrees.

14. The bone conduction speaker according to any one of claims 9 to 13, It is characterized in that In the spacing direction between the upper surface and the lower surface of the first magnetic element, the upper surface of the third magnetic element and the lower surface of the voice coil are both entirely located between the upper surface and the lower surface of the first magnetic element and are spaced apart from each other.

15. The bone conduction speaker according to claim 1, It is characterized in that The bone conduction speaker also includes a voice coil, a bracket, a first vibration plate and a gasket, the voice coil is connected to the bracket, the bracket is connected to the first vibration plate, the gasket is located inside the second magnetic conductive element, and the first vibration plate is connected to the second magnetic conductive element through the gasket.

16. The bone conduction speaker according to claim 15, It is characterized in that The gasket is connected to the second magnetic conductive element through an undercut structure.

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