LED display screen and manufacturing method thereof

Abstract

The embodiment of the invention provides an LED display screen. The LED display screen comprises a substrate, a packaging layer and a non-light-transmitting layer. Wherein the packaging layer covers the plurality of light-emitting elements on the substrate, the top surface of the packaging layer is provided with a plurality of first grooves, the non-light-transmitting layer is formed in the plurality of first grooves, and second grooves are formed in the first grooves, so that the non-light-transmitting layer is blocked among the plurality of light-emitting elements, the contrast ratio of a packaged product is increased, and the light-emitting efficiency is improved. And meanwhile, color cast generated by side view is reduced, and light reflection is effectively reduced. In some embodiments of the invention, the granular sensation of the surface of the LED display screen can be increased.

Description

Technical Field

[0001] This application relates to the technical field of LED packaging, and particularly to an LED display screen and a manufacturing method thereof. Background Art

[0002] With the rapid development of LED display technology, LED packaging technology is also constantly progressing and evolving to meet different application and market requirements. In the existing packaging of LED display screens, after the PCB board is encapsulated with AB glue, a black film is directly attached to the AB glue to reduce light reflection. However, the display surface of the LED display screen is a smooth surface, and the light reflection situation is serious. It is still difficult to solve the light reflection problem only by attaching a black film. At the same time, there are problems such as low contrast and easy color deviation when viewing from a wide viewing angle. Summary of the Invention

[0003] Multiple aspects of this application provide an LED display screen and a manufacturing method thereof. By separating multiple light-emitting elements with a non-light-transmitting layer, and a second groove is provided on the non-light-transmitting layer, so as to form a double isolation effect between the multiple light-emitting elements to solve one or more of the above problems.

[0004] An embodiment of this application provides an LED display screen, including a substrate, a packaging layer, and a non-light-transmitting layer. A plurality of light-emitting elements are electrically arranged on the substrate. The packaging layer has opposite bottom and top surfaces. The bottom surface is formed on the substrate and covers the light-emitting elements. The top surface is provided with a plurality of first grooves to separate the plurality of light-emitting elements. The non-light-transmitting layer is formed in the first grooves, and the side and bottom of the non-light-transmitting layer are respectively in contact with the packaging layer, and a second groove extending towards the bottom is formed at its top.

[0005] In some embodiments, the non-light-transmitting layer is composed of epoxy black glue; and / or the packaging layer is composed of a packaging material mixed with melanin. The packaging material is a transparent or semi-transparent AB glue mixed with a diffusing agent and melanin.

[0006] In some embodiments, the top surface has a predetermined texture composed of a plurality of granular structures.

[0007] In some embodiments, the width of the first groove is 0.4 mm and the depth is 0.24 mm.

[0008] In some embodiments, the LED display screen further includes a light-shielding layer provided on the top surface to enhance the blackness of the top surface; and / or the LED display screen further includes a protective layer provided on the top surface to enhance the wear resistance of the top surface.

[0009] In some embodiments, the multiple first grooves include a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals, and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in a staggered manner.

[0010] In some embodiments, the LED display screen further includes a mask. The mask has a plurality of shielding portions corresponding to the first grooves, and the shielding portions are embedded in the corresponding first grooves.

[0011] An embodiment of the present application further provides a manufacturing method of an LED display screen, including providing a substrate, on which light-emitting elements are electrically disposed; forming a packaging layer on the substrate, and the bottom surface of the packaging layer covers the plurality of light-emitting elements; forming a plurality of first grooves on the top surface of the packaging layer; filling a non-light-transmitting material in the plurality of first grooves to form a non-light-transmitting layer; and forming second grooves on the non-light-transmitting layer, and the side surface and the bottom surface of the non-light-transmitting layer are located between the first grooves and the second grooves.

[0012] In some embodiments, the step of forming the non-light-transmitting layer further includes: filling the non-light-transmitting material in the first grooves and curing the non-light-transmitting material to form the non-light-transmitting layer; and removing the non-light-transmitting material overflowing on the top surface.

[0013] In some embodiments, the manufacturing method further includes: forming a light-shielding layer on the top surface to enhance the blackness of the top surface; or forming a protective layer on the top surface to enhance the wear resistance of the top surface.

[0014] In the embodiment of the present application, a plurality of first grooves are provided in the packaging layer, and correspondingly, a plurality of light-emitting elements on the substrate are separated, so that the problem of light mixing that is likely to occur when the plurality of light-emitting elements emit light can be transformed into point light source emission, achieving the point light source effect of SMD (Surface Mount Device). At the same time, a non-light-transmitting layer is filled in the first grooves, and second grooves are formed on the non-light-transmitting layer, so that the non-light-transmitting layer provides a double isolation effect between the respective light-emitting elements. In addition to improving the contrast and reducing or eliminating color deviation, in some embodiments in which the surface of the first encapsulation layer has a granular structure, the granularity effect can also be enhanced.

[0015] Among them, the first encapsulation layer and the light-blocking layer can be, but are not limited to, composed of an encapsulation material mixed with melanin, and the appearance color depth of the encapsulation material can be adjusted to reduce light reflection. At the same time, a plurality of grooves are provided on the top surface of the encapsulation layer, which can not only endow a plurality of light-emitting elements with the characteristic of non-light reflection, but also a plurality of shielding parts are respectively attached in the plurality of grooves, thereby increasing the contrast of the LED display screen, reducing the color deviation generated when viewed from the side, and effectively protecting the light-emitting elements. In addition, in some embodiments, the LED display screen further includes a release film disposed on the top surface of the encapsulation material, and the surface of the release film has a plurality of particles. Therefore, when the encapsulation material is cured to form the encapsulation layer, the plurality of particles can form a predetermined texture on the top surface of the encapsulation layer. At the same time, the setting of the light-shielding layer can increase the blackness of the appearance of the encapsulation layer and reduce light reflection. Description of the Drawings

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0017] Figure 1 is a top view of the LED display screen according to an embodiment of the present application.

[0018] Figure 2 is Figure 1 a cross-sectional view taken along the A-A section line in

[0019] Figure 3 is a cross-sectional view of the LED display screen according to another embodiment of the present application.

[0020] Figure 4 is a flowchart of a manufacturing method of the LED display screen according to an embodiment of the present application.

[0021] Figure 5 is a schematic diagram of Process 1 of the manufacturing method of the LED display screen according to an embodiment of the present application.

[0022] Figure 6 is a schematic diagram of Process 2 of the manufacturing method of the LED display screen according to an embodiment of the present application.

[0023] Figure 7 is a schematic diagram of Process 3 of the manufacturing method of the LED display screen according to an embodiment of the present application.

[0024] Figure 8 is a schematic diagram of Process 4 of the manufacturing method of the LED display screen according to an embodiment of the present application. Detailed Description of the Embodiments

[0025] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts fall within the scope of protection of the present application.

[0026] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, commodity or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, commodity or device comprising the element.

[0027] Please refer to Figures 1 to 2 , embodiments of the present application provide an LED display screen 1, including a substrate 10, a packaging layer 20 and a light-blocking layer 30.

[0028] The substrate 10 may be, but is not limited to, a PCB board (printed circuit board), and a plurality of light-emitting elements 11 are electrically disposed on the substrate 10. For example, light-emitting diodes (LEDs).

[0029] The packaging layer 20 is composed of a packaging material, and the light-blocking layer 30 is composed of a light-blocking material. The packaging layer 20 is used to protect and fix the electronic components and light-emitting elements 11 on the substrate 10. For example: the packaging layer 20 may be, but is not limited to, a thermosetting packaging adhesive, and is formed on the substrate 10 in a direct packaging (Chip on board, COB) manner, providing effects such as dust-proof, moisture-proof, insulation and shock resistance to the electronic components and light-emitting elements 11 on the substrate 10. The light-blocking layer 30 is used to prevent the light of adjacent two light-emitting elements from mixing. Therefore, in some embodiments of the present application, the packaging layer 20 is composed of a packaging material mixed with melanin, such as a transparent or semi-transparent black packaging adhesive, and the light-blocking layer 30 is composed of a completely black and opaque light-blocking material (such as epoxy black glue, but not limited thereto), which can reduce light reflection and light mixing phenomena and improve optical performance.

[0030] After encapsulation, the encapsulation layer 20 has an opposite bottom surface 21 and a top surface 22. The bottom surface 21 of the encapsulation layer 20 covers a plurality of light-emitting elements 11 on the substrate 10, while the top surface of the encapsulation layer 20 defines a plurality of first grooves 23, which are respectively recessed in the top surface 22 of the encapsulation layer 20 and separate the plurality of light-emitting elements 11 on the substrate 10 into a plurality of light-emitting regions.

[0031] The light-blocking layer 30 is formed by directly filling each of the first grooves 23 with a light-blocking material, and a second groove 31 is formed on the light-blocking layer 30. Wherein, the side surface and the bottom surface of the light-blocking layer 30 are respectively in contact with the encapsulation layer 20 within the first groove 23, and the second groove 31 is opened at the top of the light-blocking layer 30 and extends towards its bottom, so that the second groove 31 is recessed towards the bottom surface 21 of the encapsulation layer 20 within the first groove 23. Therefore, in the embodiment of the present application, the light-blocking layer 30 with the second groove 31 forms a double isolation structure among the plurality of light-emitting elements 11, that is, including a solid encapsulation material structure and an air medium air wall structure, so that the light emitted by adjacent light-emitting elements 11 can be isolated by the light-blocking layer 30 and the second groove 31, thereby improving the contrast and simultaneously reducing or eliminating the light mixing problem caused by the mutual interference of different color lights.

[0032] In some embodiments of the present application, the above-mentioned encapsulation material refers to a transparent or semi-transparent AB glue mixed with a diffusing agent and melanin. Among them, the diffusing agent can be, but is not limited to, spherical polymer resin powder, which is used to evenly disperse the light from the light source, provide soft illumination, and achieve the effect of light mixing. Melanin can be, but is not limited to, light-absorbing materials such as carbon powder or carbon paste, or a combination of carbon powder and carbon paste, which is used to adjust the depth of the appearance color of the encapsulation material (that is, to adjust the blackness of the encapsulation material). The AB glue includes component A and component B. Component A can be, but is not limited to, resin, usually in liquid or viscous form, and component B is a curing agent. When the diffusing agent, melanin, resin and curing agent are mixed, the curing agent will react chemically with the resin to cure the encapsulation material, thereby forming a transparent or semi-transparent black encapsulation layer 20. In some other embodiments of the present application, during the manufacturing process of the LED display screen 1, a release film 60 is also disposed on the top surface 22 of the encapsulation layer 20. The surface of this release film 60 has a plurality of particles 61, which are used to form a plurality of predetermined patterns 221 with a granular structure on the top surface 22 of the encapsulation layer 20. In this embodiment of Figure 2 In order to show the relationship between the top surface 22 of the encapsulation layer 20 and the release film 60, the release film 60 is in an unpeeled state.

[0033] In this way, by adding melanin and the predetermined pattern 221 on the top surface 22, the appearance blackness of the encapsulation layer 20 can be increased, making the product look darker and reducing light reflection.

[0034] In some embodiments of the present application, the multiple first trenches 23 further include a plurality of transverse trenches and a plurality of longitudinal trenches arranged at intervals, and the transverse trenches and the longitudinal trenches have the same width W and depth H. Wherein, the trench width W is 0.4 mm, the depth H is 0.24 mm, and the plurality of transverse trenches and the plurality of longitudinal trenches are arranged in a staggered manner. For example, the transverse trenches and the longitudinal trenches are perpendicular to each other to form a mesh structure. In this way, through the distribution and size design of the trenches, the light sources generated by the multiple light-emitting elements 11 can be changed from mixed light to point light sources, and the light sources have a granular feeling, achieving the point light source effect of SMD and generating the characteristic of non-reflection. In addition, by filling the transverse trenches and the longitudinal trenches with a non-light-transmitting material to form a non-light-transmitting layer 30, and the second trenches 31 provided on the non-light-transmitting layer 30, the effect of the point light source and the granular feeling effect on the surface of the encapsulation layer 20 can be made more obvious.

[0035] In addition, in some embodiments of the present application, a mask 40 is further provided on the encapsulation layer 20. This mask 40 is composed of a plurality of shielding portions 41 connected to each other, and is arranged corresponding to the direction of the second trenches 31, and is arranged in a staggered manner to form a mesh structure, so that the plurality of shielding portions 41 of the mask 40 can be embedded in the corresponding second trenches 31.

[0036] It is worth mentioning that the mask 40 can be made of, but not limited to, a metal material, and the appearance color is black, or other colors that can reduce reflection. Among them, the shielding portion 41 is attached to the trench through a bonding process, and the width and thickness of the plurality of shielding portions 41 respectively correspond to the width W and depth H of the trench, so that the plurality of shielding portions 41 can completely correspond to and fill the second trenches 31. In some embodiments of the present application, the thickness of the shielding portion 41 is greater than the depth H of the second trench 31, so that after the mask 40 is disposed in the second trench 31, it has a predetermined height on the encapsulation layer 20. This predetermined height is higher than the height of the light-emitting element 11, and the light-emitting element 11 is surrounded by the mesh structure of the mask 40, which can better increase the product contrast, reduce color deviation at a wide viewing angle, and at the same time can protect the light-emitting element 11.

[0037] Such as Figure 3As shown, the LED display screen 1 provided by another embodiment of the present application is substantially the same as the LED display screen 1 of the above embodiment. The difference between the two is that the LED display screen 1 of this embodiment further includes a light-shielding layer 51 to further improve the light-shielding effect on the surface of the encapsulation layer 20. Among them, the light-shielding layer 51 is disposed on the top surface 22 of the encapsulation layer 20 to enhance the blackness of the top surface 22. For example, the light-shielding layer 51 can be, but is not limited to, coating a paint with a color on the top surface 22 of the encapsulation layer 20 by spraying to increase the blackness of the top surface 22 and reduce or prevent light from passing through. In the figure of this embodiment, the release film 60 has been peeled off from the top surface 22 of the encapsulation layer 20. Therefore, after spraying, the light-shielding layer 51 can cover the top surface 22 of the encapsulation layer 20 and the predetermined texture 221.

[0038] Similarly, in order to improve the wear resistance of the encapsulation layer 20, the LED display screen 1 further includes a protective layer 52. Among them, the protective layer 52 is disposed on the top surface 22 of the encapsulation layer 20 to enhance the wear resistance of the top surface 22. For example: the protective layer 52 can be, but is not limited to, coating a protective paint on the top surface 22 of the encapsulation layer 20 by spraying to protect the top surface 22 and improve the wear resistance.

[0039] As Figure 3 shown, in this embodiment, it is taken as an example that the protective layer 52 is stacked on the light-shielding layer 51, and the light-shielding layer 51 and the protective layer 52 are formed on both the top surface 22 and the second groove 31, so that the light-shielding layer 51 and the protective layer 52 are located between the second groove 31 and the shielding portion 41 of the mask 40, but it is not limited thereto. For example, in some embodiments, the light-shielding layer 51 can also be stacked on the protective layer 52, or only the light-shielding layer 51 or the protective layer 52 is formed on the top surface 22 and the second groove 31, etc. The above is only for illustrative purposes and is not limited thereto.

[0040] As Figure 4 shown, the embodiment of the present application also provides a manufacturing method of an LED display screen, which includes the following steps.

[0041] Step S101, providing a substrate 10, on which a plurality of light-emitting elements 11 are electrically arranged (as Figure 5 shown).

[0042] Step S102, forming an encapsulation layer 20 on the substrate 10. In some embodiments, the encapsulation layer 20 is composed of an encapsulation material mixed with melanin, and the bottom surface of the encapsulation layer 20 covers a plurality of light-emitting elements 11.

[0043] Step S103: Form a plurality of first grooves 23 on the top surface 22 of the encapsulation layer 20. Among them, the formation method of the plurality of first grooves 23 can be, but is not limited to, mechanical cutting, laser cutting, thermal cutting, or chemical cutting (etching), etc. In this embodiment, the first grooves 23 are formed by a dicing machine for groove cutting.

[0044] Step S104: Fill non-translucent materials into the plurality of first grooves 23 to form a non-translucent layer. This non-translucent layer 30 is composed of a fully black and opaque non-translucent material, such as epoxy black glue.

[0045] Step S105: Open grooves on the non-translucent layer 30 to form second grooves 31, and the side and bottom of the non-translucent layer 30 are located between the first grooves 23 and the second grooves 31. Among them, the non-translucent layer 30 is composed of a fully black and opaque non-translucent material, such as epoxy black glue, and the second grooves 31 can be formed on the non-translucent layer 30 by the above-mentioned method for forming the first grooves. The non-translucent layer 30 and the second grooves 31 provided thereon divide the plurality of light-emitting elements 11 into a plurality of light-emitting regions, which can avoid interference between light-emitting elements 11 of different color systems when emitting light, and have beneficial effects such as eliminating light mixing, enhancing contrast, and reducing color deviation generated when viewed from the side.

[0046] In some embodiments of the present application, the formation steps of the encapsulation layer 20 further include:

[0047] Prepare the encapsulation material. The encapsulation material is a transparent or semi-transparent AB glue mixed with a diffusing agent and melanin, and the A and B components of the AB glue and the diffusing agent and melanin are mixed in appropriate proportions. In this step, first, according to the required thickness of the encapsulation layer 20, adjust the molding thickness and molding parameters such as heating temperature and time, and prepare the dosages of the A and B components of the AB glue. Then, according to the dosage of the AB glue and the above ratio, prepare the dosages of the diffusing agent and melanin. Finally, after mixing the four materials of AB glue, diffusing agent, and melanin into the encapsulation material, select a default specification encapsulation mold, and inject the encapsulation material into the molding rubber tube of the encapsulation mold.

[0048] Next, coat the encapsulation material on the substrate 10. In this step, the encapsulation material is guided into the encapsulation mold through the molding rubber tube, and the encapsulation material can be coated on the substrate 10. And, a release film 60 is provided on the encapsulation material. The surface of the release film 60 has a plurality of particles 61, and the plurality of particles 61 are used to form a predetermined pattern on the top surface 22 of the encapsulation layer 20.

[0049] After that, the encapsulation material is cured to form the encapsulation layer 20. The encapsulation material is molded by an encapsulation mold and baked in a high-temperature oven. After the encapsulation layer 20 is cured, a predetermined texture with a plurality of granular structures is formed on the top surface 22 of the encapsulation layer 20. For example, the release film 60 has a plurality of raised particles arranged regularly or irregularly on the surface facing the encapsulation layer 20. When the encapsulation material is coated on the substrate 10, the release film 60 is attached to the top surface of the encapsulation material, so that a plurality of particles 61 generate a plurality of recesses on the top surface of the encapsulation material. When the encapsulation material is cured to form the encapsulation layer 20, the plurality of recesses form corresponding predetermined textures 221 on the top surface 22 of the encapsulation layer 20. In addition, the release film 60 can be selected with different thicknesses and particle sizes according to actual needs, so as to control the predetermined texture 221 of the top surface 22 of the encapsulation layer 20 (as Figure 6 shown).

[0050] Next, the release film 60 is peeled off. After the encapsulation material is cured to form the encapsulation layer 20, the encapsulation mold can be demolded and the release film 60 can be peeled off.

[0051] In some embodiments of the present application, the step of forming a plurality of first grooves 23 on the top surface 22 of the encapsulation layer 20 further includes:

[0052] Forming a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals on the top surface 22 of the encapsulation layer 20 (as Figure 1 and Figure 7 shown), and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in an interleaved manner. For example, they are perpendicular to each other to form a network structure. It can be understood that in the embodiments provided with the mask 40, the plurality of shielding portions 41 on the structure of the mask 40 also correspond to the arrangement of the first grooves 23, and are arranged in an interleaved manner to form a network structure. The widths and thicknesses of the plurality of shielding portions 41 respectively correspond to the width W and the depth H of the second grooves 31, so that the plurality of shielding portions 41 can be completely embedded in the second grooves 31.

[0053] In addition, after the first grooves 23 are formed, the edge of the substrate 10 needs to be cut to remove the unnecessary edge of the substrate 10, so that the LED display screen can meet the default size requirements. It should be noted that after the encapsulation layer 20 is completely cured, a vacuum chuck fixture can be used to completely fix the substrate 10 and the encapsulation layer 20, and the parameters of the dicing machine are adjusted. Then, the encapsulation layer 20 is cut with a predetermined groove width and groove depth to form the above-mentioned first grooves 23.

[0054] In some embodiments of the present application, after multiple first trenches 23 are formed, the step of filling the first trenches 23 with a non-transparent material may be to fill the non-transparent material into the first trenches 23, and then through the same or similar curing process as described above, the non-transparent material is cured in the first trenches 23 to form a non-transparent layer 30. In some embodiments, the non-transparent material is filled in the first trenches 23. After the first trenches 23 are filled, the non-transparent material will overflow onto the top surface 22 around the first trenches 23. Through the same or similar curing process as described above, the non-transparent material is cured on the top surface 22 of the encapsulation layer 20 and in the first trenches 23 to form a non-transparent layer 30. Then, through grinding or other appropriate means, the non-transparent layer 30 located on the top surface 22 of the encapsulation layer 20 is removed or thinned.

[0055] Next, by the above operation method of forming the first trenches 23, trenches are formed on the non-transparent layer 30 to form second trenches 31 that penetrate into the non-transparent layer 30, such that the side and bottom of the non-transparent layer are located between the first trenches and the second trenches. That is, when forming the second trenches 31, the non-transparent layer 30 is retained on the bottom and side surfaces of the second trenches 31. Compared with spraying the non-transparent layer 30 in the first trenches 23, in the embodiments of the present application, the method of filling the first trenches 23 with a non-transparent material and then forming the second trenches 31 on the non-transparent layer 30 is adopted. The thickness of the non-transparent layer 30 is controllable and uniform, and the side surfaces of the light-emitting elements 11 will not leak light due to the thinness or absence of the non-transparent layer 30, thus effectively avoiding the phenomenon of light mixing between the light-emitting elements 11.

[0056] In some other embodiments of the present application, after the non-transparent layer 30 and the second trenches 31 are formed, a light-shielding layer 51 is further formed on the top surface 22 of the encapsulation layer 20 to enhance the blackness of the top surface 22, and / or a protective layer 52 is formed on the top surface 22 of the encapsulation layer 20 to enhance the wear resistance of the top surface 22. Among them, after cutting the edge of the substrate 10, the surfaces of the substrate 10 and the encapsulation layer 20 need to be cleaned. Then, a colored coating is applied to the top surface 22 of the encapsulation layer 20 by spraying to reduce or prevent light from passing through. The protective layer 52 is formed by spraying a protective coating on the top surface 22 of the encapsulation layer 20 to enhance the wear resistance effect. It is worth mentioning that after spraying, the substrate 10 and the encapsulation layer 20 are baked at a high temperature to cause the sprayed material to react with the encapsulation layer 20 to achieve a more stable adhesion.

[0057] In addition, the spraying of the light-shielding layer 51 and the protective layer 52 can also be adjusted according to actual requirements. For example, the light-shielding layer 51 can be sprayed on the top surface 22 first, and then the protective layer 52 is sprayed so that the protective layer 52 is stacked on the light-shielding layer 51. Or the protective layer 52 is sprayed on the top surface 22 first, and then the light-shielding layer 51 is sprayed so that the light-shielding layer 51 is stacked on the protective layer 52. Or only the light-shielding layer 51 or the protective layer 52 is sprayed on the top surface 22. As Figure 2 shown, in this embodiment, the light-shielding layer 51 is formed on the top surface 22 first, and then the protective layer 52 is formed so that the light-shielding layer 51 and the protective layer 52 cover the top surface 22 of the encapsulation layer 20 and the inside of the first trench 23 (as Figure 8 shown).

[0058] Of course, in some embodiments, the spraying process of the light-shielding layer 51 and the protective layer 52 can also be carried out after the non-light-transmitting layer 30 and the second trench 31 are formed, so that the light-shielding layer 51 and the protective layer 52 cover the top surface 22 of the encapsulation layer 20, the top of the non-light-transmitting layer 30, and the inside of the second trench 31.

[0059] It can be understood that in other embodiments of the present application, for the setting of the mask, multiple shielding portions 41 of the mask 40 can also be directly embedded in the corresponding second trenches 31 respectively, while omitting the setting of the light-shielding layer 51 and the protective layer 52.

[0060] The above are only the embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. An LED display screen, characterized in that, comprising: a substrate, electrically provided with a plurality of light-emitting elements; a packaging layer having an opposite bottom surface and a top surface, the bottom surface being formed on the substrate and covering the light-emitting elements, and the top surface being provided with a plurality of first grooves to separate the plurality of light-emitting elements; and a light-blocking layer formed in the first grooves, and the side and bottom of the light-blocking layer are respectively in contact with the packaging layer, and a second groove extending toward the bottom is formed at the top thereof.

2. The LED display screen according to claim 1, characterized in that, the light-blocking layer is composed of epoxy black glue; and / or the packaging layer is composed of a packaging material mixed with melanin, and the packaging material is a transparent or semi-transparent AB glue mixed with a diffusing agent and melanin.

3. The LED display screen according to claim 1, characterized in that, the top surface has a predetermined texture composed of a plurality of granular structures.

4. The LED display screen according to claim 1, characterized in that, the width of the first groove is 0.4 mm and the depth is 0.24 mm.

5. The LED display screen according to claim 1, characterized in that, further comprising a light-shielding layer provided on the top surface of the packaging layer to enhance the blackness of the top surface; and / or the LED display screen further comprises a protective layer provided on the top surface of the packaging layer to enhance the abrasion resistance of the top surface.

6. The LED display screen according to claim 1, characterized in that, the plurality of first grooves include a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals, and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in a staggered manner.

7. The LED display screen according to claim 6, characterized in that, further comprising a mask having a plurality of shielding portions, the shielding portions corresponding to the first grooves, and the shielding portions being embedded in the corresponding first grooves.

8. A manufacturing method of an LED display screen, characterized in that, comprising: providing a substrate, on which a plurality of light-emitting elements are electrically provided; forming a packaging layer on the substrate, and the bottom surface of the packaging layer covering the plurality of light-emitting elements; forming a plurality of first grooves on the top surface of the packaging layer; filling a light-blocking material into the plurality of first grooves to form a light-blocking layer; and grooving on the light-blocking layer to form a second groove, and the side and bottom of the light-blocking layer are located between the first groove and the second groove.

9. The manufacturing method according to claim 8, characterized in that, the step of forming the light-blocking layer further includes: filling the light-blocking material into the first grooves, and curing the light-blocking material to form the light-blocking layer; and removing the light-blocking material overflowing on the top surface.

10. The manufacturing method according to claim 9, characterized in that, the step of forming a plurality of the first grooves on the top surface includes: forming a plurality of transverse grooves and a plurality of longitudinal grooves arranged at intervals on the top surface, and the plurality of transverse grooves and the plurality of longitudinal grooves are arranged in a staggered manner.

11. The manufacturing method according to claim 9, characterized in that, further comprising: A light-shielding layer is formed on the top surface to enhance the blackness of the top surface; or a protective layer is formed on the top surface to enhance the wear resistance of the top surface.

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