Liquid ejecting head, head module, and liquid ejecting apparatus

Abstract

The invention relates to a liquid ejecting head, a head module, and a liquid ejecting apparatus, and aims to ensure maintainability of the liquid ejecting head and inhibit deviation of a landing position of liquid. The liquid ejecting head (1) is provided with a nozzle plate (2) having a plurality of nozzles (3) that eject liquid, and is characterized in that ejection holes (4) that eject gas are provided on the end side of one end in the longitudinal direction of the nozzle plate (2), said end side being closer to the one end in the longitudinal direction than the nozzles (3) disposed on the outermost end side of the one end in the longitudinal direction (X).

Description

Technical Field

[0001] The present invention relates to a liquid ejection head, a printhead module, and a liquid ejection apparatus. Background Art

[0002] By causing a liquid ejection head to accurately land a liquid from each nozzle on a prescribed position on a recording medium, a desired image can be formed on the recording medium.

[0003] However, due to the influence of an air current generated by ejecting the liquid or the like, there is a problem that the landing position of the liquid shifts.

[0004] In contrast, for example, the liquid ejection head described in Patent Document 1 (Japanese Patent No. 6018356) has an air current ejection unit that ejects an air current toward the recording medium. The air current ejection unit has a main air current ejection port and a sub-air current ejection port, and these ejection ports are arranged so as to surround a nozzle row that is a row of nozzles for ejecting ink. The air current ejection unit is provided as a component different from a nozzle plate having nozzles, and is provided so as to protrude more toward the recording medium side than the nozzle plate.

[0005] As described in Patent Document 1, by forming the part that ejects the air current and the nozzle component from different components, there is a problem that the nozzle surface and the part that ejects the air current cannot be wiped simultaneously, and liquid remains, and maintenance such as wiping operations becomes troublesome and complicated.

[0006] An object of the present invention is to ensure the maintainability of a liquid ejection head and, at the same time, suppress the shift of the landing position of the liquid.

[0007] [Patent Document 1] Japanese Patent No. 6018356 Summary of the Invention

[0008] In order to solve the above problems, the present invention relates to a liquid ejection head including a nozzle component having a plurality of nozzles for ejecting a liquid, characterized in that: ejection holes for ejecting a gas are provided on the end side in the long side direction of the nozzle component, on the side closer to the end in the long side direction of the nozzle component than the nozzle at the most end side at one end in the long side direction of the nozzle component.

[0009] According to the present invention, while ensuring the maintainability of the liquid ejection head, it is possible to suppress the shift of the landing position of the liquid. Brief Description of the Drawings

[0010] Figure 1 The figure shows a plan view of a nozzle surface of a liquid ejection head according to an embodiment of the present invention.

[0011] Figure 2 The figure shows Figure 1 a cross-sectional view taken along line A1-A1 of

[0012] Figure 3 As shown Figure 2 is a sectional view taken along line A2 - A2.

[0013] Figure 4 As shown Figure 3 is a sectional view taken along line A3 - A3.

[0014] Figure 5 is a perspective view of the opposite side of the nozzle surface of the liquid ejection head.

[0015] Figure 6 is a liquid ejection head different from the embodiment of the present invention. (a) shows a top view of the nozzle surface, and (b) shows a sectional view taken along line A4 - A4 of (a).

[0016] Figure 7 is a liquid ejection head related to an embodiment of the present invention. (a) shows a top view of the nozzle surface, and (b) shows a sectional view taken along line A5 - A5 of (a).

[0017] Figure 8 is a liquid ejection head different from the above - mentioned embodiment. (a) shows a top view of the nozzle surface, and (b) shows a sectional view taken along line A6 - A6 of (a).

[0018] Figure 9 As shown is a top view of the nozzle surface of a liquid ejection head different from the above - mentioned embodiment.

[0019] Figure 10 As shown is a top view of the nozzle surface of a liquid ejection head different from the above - mentioned embodiment.

[0020] Figure 11 As shown is an exploded perspective view of the printhead module.

[0021] Figure 12 As shown is a schematic configuration diagram of a liquid ejection device.

[0022] Figure 13 As shown is provided on Figure 12 a sectional view of the printhead unit on the liquid ejection device.

[0023] Figure 14 As shown is a schematic configuration diagram of different embodiments of the liquid ejection device. Detailed Embodiments

[0024] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Also, in each figure, the same or corresponding parts are given the same reference numerals, and their detailed descriptions are appropriately omitted. In the following description, as an example of the liquid, a liquid ejection head that ejects ink will be described.

[0025] Using Figures 1 to 5Describes a liquid ejection head according to an embodiment of the present invention. Figure 1 Shown is the nozzle surface 2a side of the nozzle plate 2 provided on the liquid ejection head 1. Figure 2 It is Figure 1 a cross-sectional view taken along line A1-A1 of Figure 3 It is Figure 1 a cross-sectional view taken along line A2-A2 of Figure 4 It is Figure 1 a cross-sectional view taken along line A3-A3 of Figure 5 Shown is a perspective view of the opposite side of the nozzle surface side of the liquid ejection head 1. Figure 1 The direction of arrow X of Figure 1 is the long side direction of the nozzle plate. This long side direction is also the nozzle arrangement direction. In addition, the up-down direction of

[0026] As Figure 1 shown, the nozzle plate 2 as a nozzle member has a plurality of nozzles 3 and ejection holes 4. Figure 1 The nozzle surface 2a of the nozzle plate 2 shown is the surface at the end on the ink ejection side where the nozzles 3 are provided. In addition, at the end on the ejection gas side of the ejection holes 4 is provided on the nozzle surface 2a.

[0027] As Figure 2 and Figure 3 shown, the liquid ejection head 1 includes a nozzle plate 2, a separate liquid chamber substrate 5, a common liquid chamber substrate 6, a housing 7, a liquid port 8, a gas port 9, etc. The separate liquid chamber substrate 5 forms separate liquid chambers 10 leading to each nozzle 3 and separate supply flow paths leading to the separate liquid chambers 10. Oppositely facing each separate liquid chamber 10 is provided a piezoelectric element 11 as a pressure generating component. The common liquid chamber substrate 6 forms a common liquid chamber 12 communicating with each separate liquid chamber 10 via each separate supply flow path. The housing 7 forms a common supply flow path 13 communicating with the common liquid chamber 12. The common supply flow path 13 communicates with the liquid port 8 on the side opposite to the common liquid chamber 12 side. As Figure 3 and Figure 5 shown, a liquid port 8, a gas port 9, and an electrical I / F 15 are provided on the upper part of the housing 7. The electrical I / F 15 of the present embodiment is an electrical I / F in which a connector is assembled on a printed circuit board (PCB). As Figure 3 shown, the piezoelectric assembly 11 is electrically connected to the electrical I / F 15 via a wiring substrate 16. In addition, as Figure 2 and Figure 4As shown, a gas path 14 for supplying gas from a gas port 9 to ejection holes 4 is formed by a housing 7, a common liquid chamber substrate 6, and a separate liquid chamber substrate 5. The gas path 14 is formed by a gas common path 14a communicating with the gas port 9, a gas branch path 14b, and a gas separate path 14c. The ejection holes 4 eject the gas supplied from the gas port 9 and do not eject ink. As a method of ejecting gas from the ejection holes 4, for example, an appropriate air flow generating mechanism such as an air pump or an air compressor can be provided on the side of the gas port 9, and through this air flow generating mechanism, gas such as compressed air can be ejected from the ejection holes 4 via the gas port 9 and the gas path 14.

[0028] In a liquid ejection head that forms an image by ejecting a liquid from a nozzle onto a recording medium, there is a problem that the liquid ejected from the nozzle flows along with an air flow generated when ejecting the liquid, etc., and thus the landing position of the liquid on the recording medium will shift. This problem will be described using Figure 6 (a) and Figure 6 (b). Figure 6 is a nozzle plate 200 of a liquid ejection head having a configuration different from that of the present embodiment. Figure 6 (a) shows a top view of a nozzle surface 200a on the ink ejection side of the nozzle plate. Figure 6 (b) shows Figure 6 a cross-sectional view taken along line A1 - A1 of (a).

[0029] Figure 6 (a) shows the nozzle plate 200. As nozzle rows each having a plurality of nozzles 201 arranged in the longitudinal direction thereof, there are two nozzle rows 201A and 201B in the short side direction. In the upper and lower nozzle rows 201A and 201B, the nozzles 201 are arranged differently from each other in the longitudinal direction.

[0030] As Figure 6 (b) shows, in the region of nozzle arrangement in the longitudinal direction, an air flow is generated downward in the direction of Figure 6 (b) due to the ejection of ink. On the other hand, no such air flow is generated outside the region where the nozzles are arranged. Therefore, near the boundary between the region where the nozzles are arranged and its outside, as indicated by the arrow in Figure 6 (b), a vortex of an air flow circulating in the clockwise direction in the direction of Figure 6 (b) is generated. In addition, a recording medium M such as paper is conveyed facing the nozzle plate 200. An air flow is also generated by the conveyance of this recording medium M. Particularly when the recording medium M is conveyed in a direction parallel to the longitudinal direction, it has an influence of promoting the above-mentioned clockwise circulating air flow, etc.

[0031] Due to the influence of the above-mentioned airflow, especially the landing position of the ink 150 ejected from the nozzle 201 disposed at the outermost end in the long side direction in the nozzle array shifts outward in the long side direction. As a result, it becomes the cause of the formation of abnormal images such as uneven density and streaks in the image formed on the recording medium M. In particular, in a liquid ejection head with a large printing gap, i.e., the distance between the nozzle surface and the recording medium, the ink ejected from the nozzle is easily affected by the airflow, and the shift of the landing position of the ink due to the influence of the airflow becomes significant. As an example of the above-mentioned large printing gap, for example, a case where the printing gap is larger than 5 mm can be cited.

[0032] The following Figure 7 of (a) and Figure 7 of (b) are used to describe the configuration of the present embodiment that suppresses the shift of the landing position of the ink caused by the influence of the above-mentioned airflow.

[0033] As Figure 7 shown in (a), similar to the aforementioned nozzle plate 200, a plurality of nozzle arrays 30A and 30B are disposed on the nozzle plate 2, and in the nozzle arrays 30A and 30B, the nozzles 3 are arranged differently from each other in the long side direction. However, the arrangement of the nozzles in the nozzle component of the present invention is not limited to this. The nozzle array can be one or three or more, and in addition to the configuration in which the nozzles are arranged in a row in the long side direction, they can also be arranged irregularly.

[0034] The difference between the nozzle plate 2 of the present embodiment and the nozzle plate 200 is that, on the more end side than the nozzle 3 at the outermost end side in its long side direction, there are ejection holes 4 for ejecting gas. In addition, in Figure 7 of (a), Figure 7 of (b), for the sake of convenience, the ejection holes 4 are indicated by double-dot dash lines. The ejection holes 4 are particularly provided on the nozzle surface 2a on the more end side of the nozzle surface 2a than the nozzle 3. In the present embodiment, the nozzles 3 and the ejection holes 4 extend in a direction substantially perpendicular to the nozzle surface 2a. In Figure 7 the embodiment of (a), a total of four ejection holes 4 are respectively provided on the more outer sides of the nozzles 3 at both ends of each nozzle array 30A and 30B in the long side direction.

[0035] As Figure 7 shown in (b), gas is ejected from the ejection holes 4 toward the recording medium M side in the direction of arrow B. That is, an airflow in the direction of arrow B is formed at a position corresponding to the position where the clockwise airflow shown in (b) is formed or in its vicinity. Thus, as Figure 6 shown in Figure 7As shown in Fig. (b), it is possible to suppress the deviation of the ejection direction of the ink ejected from the outermost nozzle 3, that is, it is possible to suppress the deviation of the landing position. Therefore, it is possible to suppress the density unevenness or abnormal images caused by the deviation of the landing position of the ink. In addition, in the present embodiment, by providing the ejection holes 4 on the nozzle plate 2, there is no need to separately provide a component for forming the ejection holes 4, and the cost of the liquid ejection head 1 can be reduced and the size can be miniaturized. In addition, by providing the ejection holes 4, it does not have an adverse effect on the maintainability of the liquid ejection head 1. That is, compared with the case where the ejection holes 4 are provided on a component different from the nozzle plate 2, there is no adverse effect such as the wiping operation or suction operation of the nozzle 3 becoming complicated. In addition, in the present embodiment, the ejection holes 4 can also be wiped simultaneously by the wiping operation of the nozzle 3.

[0036] In the present embodiment, the diameter of the ejection holes 4 is set to be substantially the same as the diameter of the nozzles 3. Thereby, the processing of the nozzle plate 2 becomes easy, and the ejection holes 4 can be formed with high-precision dimensions.

[0037] In addition, in the present embodiment, the ejection holes 4 are provided on the two outer sides in the long side direction. Thereby, it is possible to suppress the influence of the air flow on the nozzles 3 at the outermost ends on both sides in the long side direction. However, the ejection holes of the present invention do not necessarily need to be provided on both sides in the long side direction. For example, when the influence of the air flow on one side in the long side direction is small and the deviation of the landing position of the liquid is small, the ejection holes may be provided only on the other side.

[0038] In addition, as Figure 2 shown, the gas path 14 for supplying gas from the gas port 9 to the ejection holes 4 is formed by the housing 7, the common liquid chamber substrate 6, and the independent liquid chamber substrate 5. The housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5 are flow path components, and form a liquid flow path composed of a common supply flow path, an individual supply flow path, etc. for supplying ink from the liquid port 8 to the nozzles 3. By forming the path for supplying ink and the path for supplying gas with common components, the liquid ejection head can be miniaturized and the cost can be reduced. In addition, it is not necessary to form the gas path by all of the housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5, that is, all of the flow path components. For example, the gas path may be formed only on the individual liquid chamber substrate 5.

[0039] Next, deformation examples of different liquid ejection heads such as the arrangement of the ejection holes 4 will be described in sequence.

[0040] In Figure 8 Figs. (a) and Figure 8 (b) of the liquid ejection head shown, two ejection holes 4 are arranged in parallel in the long side direction on the more outer side of the nozzles 3 at the outermost ends in the long side direction of each nozzle row. Thereby, compared with Figure 7Compared with the embodiment, it is possible to expand the range in the long side direction formed by the air flow from the ejection holes 4 and further suppress the deviation of the landing position of the ink ejected from the nozzle 3. Therefore, for example, even when the printing distance between the nozzle surface 2a and the recording medium M is large, it is possible to suppress the deviation of the landing position of the ink. In addition, it may be configured such that three or more ejection holes 4 are arranged side by side in the long side direction on the outside.

[0041] In Figure 9 In the liquid ejection head shown, the diameter of the ejection hole 4 is set smaller than the diameter of the nozzle 3. By reducing the diameter of the ejection hole 4, the flow rate of the gas ejected from the ejection hole 4 decreases, but on the other hand, the flow velocity of the ejected gas can be increased. Thereby, in the case where the influence of the air flow is large, etc., it is possible to effectively suppress the deviation of the ejection and landing position and suppress the deterioration of the quality of the image formed on the recording medium M.

[0042] In addition, it is not necessary to provide ejection holes corresponding to all nozzle rows. For example, in Figure 10 In the liquid ejection head shown, one ejection hole 4 is provided between the upper and lower nozzle rows. Thereby, it is possible to reduce the ejection hole 4 and the path of the gas flow, and it is possible to miniaturize the liquid ejection head and reduce the cost. In addition, in the present embodiment, the diameter of the ejection hole 4 is set larger than the diameter of the nozzle 3. Thereby, although the flow velocity of the gas ejected from the ejection hole 4 decreases, the range of the ejected gas can be increased. Thereby, even if the number of ejection holes 4 is small, it is possible to make the air flow flow in a large range. However, in the present embodiment, the diameter of the ejection hole 4 may be the same as or smaller than that of the nozzle 3, or a plurality of ejection holes 4 may be provided in the long side direction as shown in Figure 8 shown.

[0043] Next, an example of a method for manufacturing a liquid ejection head having ejection holes will be described.

[0044] The nozzle plate 2 of the present embodiment is formed of silicon. Thereby, it is possible to perform hole processing on the nozzle plate 2 with high precision and to form the nozzle 3 and the ejection holes 4 with high precision. The nozzle plate 2 may also be formed of a metal such as stainless steel or nickel, or a resin such as polyimide.

[0045] First, on a silicon wafer having a thickness of 600 μm, the nozzle 3 and the ejection holes 4 are formed by a photolithography process and a dry etching process. By forming the ejection holes 4 by the same processing method as the nozzle 3, it is possible to reduce or substantially eliminate the cost for providing the ejection holes 4. The diameter of the nozzle 3 is 0.02 mm. Then, the wafer is polished to a thickness of 100 μm and cut from the wafer. Here, after processing, a waterproof film is formed only at the end of the nozzle 3 on the nozzle surface 2a.

[0046] A 3-layer vibrating plate is formed by laminating 0.6 μm of SiO on a silicon wafer with a thickness of 600 μm. 2 , 1.5 μm of Si, and 0.4 μm of SiO 2 . After forming the vibrating plate composed of three layers, as the lower electrode, a film of 20 nm of Ti and 200 nm of Pt is formed by sputtering.

[0047] After forming a 2-μm-thick film on the lower electrode by using the sol-gel method of an organometallic solution with lead zirconate titanate (PZT), it is fired at 700 °C to form a PZT piezoelectric film. Then, a 200-nm-thick Pt film is formed on the piezoelectric film by sputtering as the upper electrode. After the upper electrode is formed, the upper electrode, the piezoelectric film, and the lower electrode are patterned by a dry etching method, thereby forming the piezoelectric element 11 on the nozzle plate 2.

[0048] Next, an interlayer insulating film is formed by plasma CVD method, and contact holes are formed in the interlayer insulating film on the upper electrode and the lower electrode. Then, by sequentially laminating 50 nm of Ti and 2 μm of Al and performing dry etching, a wiring layer is formed. Then, the vibrating plate of the ink supply port part is dry-etched to complete the wafer that is the basis of the single liquid chamber substrate 5.

[0049] Next, a holding substrate having a holding substrate recess and a holding substrate opening serving as a supply port is formed using a silicon wafer. On the bonding surface of the fabricated holding substrate wafer, an epoxy-based adhesive with a film thickness of 2 μm is coated by a flexographic printer for bonding, and the holding substrate is bonded by curing the adhesive. Then, the 600-μm single liquid chamber substrate 5 is ground to 80 μm, and the single liquid chamber 10 and the fluid resistance part are formed by ICP dry etching, and the wafer is diced to chip it, thereby completing the single liquid chamber substrate 5. The single liquid chamber substrate 5 has a connection part for inputting an electrical signal from the outside. The wiring layer is led out to the end of the single liquid chamber substrate 5 and connected to the wiring substrate 16 described later at that position.

[0050] A common liquid chamber substrate 6 having a single liquid chamber 12 for supplying ink to each single liquid chamber 10 is provided upstream of the single liquid chamber substrate 5. The common liquid chamber substrate 6 is formed by dry etching a silicon wafer.

[0051] The housing 7 can be made of resins such as epoxy resin or PPS, metals such as stainless steel, etc., but here, inexpensive and lightweight epoxy resin is adopted. A liquid port 8 and a gas port 9 are provided on the upper part of the housing 7.

[0052] The wiring substrate is a flexible wiring substrate and is electrically connected to the wiring of the separate liquid chamber substrate 5. As methods, there are soldering, ACF, NCP, etc., but NCP is used here. In addition, a drive circuit is provided on the wiring substrate 16. When the drive circuit is located on the separate liquid chamber substrate 5, although the drive circuit will be cooled, the heat generation will affect the temperature distribution of the nozzle plate 2, and as a result, the ejection characteristics will deteriorate. Therefore, in the present embodiment, the drive circuit is provided on the wiring substrate.

[0053] Then, the nozzle plate 2, the separate liquid chamber substrate 5, and the common liquid chamber substrate 6 are joined with an epoxy-based adhesive. The nozzle plate 2 and the separate liquid chamber substrate 5 may also be directly bonded with silicon. Further, the common liquid chamber substrate 6 and the housing 7 are joined with an epoxy-based bonding material. The wiring substrate 16 is a flexible wiring substrate. The wiring substrate 16 is connected to the electrical I / F 15 by soldering or the like and is led out from the electrical I / F 15.

[0054] Next, Figure 11 An example of a printhead module including the above-described plurality of liquid ejection heads will be described.

[0055] As Figure 11 shown, the printhead module 100 includes a plurality of liquid ejection heads 1, a base member 102, a cover member 103, a heat dissipation member 104, a manifold 105, a printed circuit board 106, and a module casing 107.

[0056] The plurality of liquid ejection heads 1 are inserted into the openings of the base member 102, and the cover member 103 joined and fixed to the base member 102 is joined and fixed to the separate liquid chamber substrate of the liquid ejection head 1 by an adhesive.

[0057] The cover member 103 has openings in the regions corresponding to the nozzles and ejection holes in the nozzle surface of the nozzle plate and covers the peripheral portion of the nozzle surface.

[0058] The flow paths provided in the manifold 105 communicate with the liquid ports of the liquid ejection heads 1.

[0059] The printed circuit board 106 is electrically connected to the piezoelectric elements of the liquid ejection heads 1 via the flexible wiring member 90. The driver IC (drive circuit) 91 is mounted on the flexible wiring member 90.

[0060] Next, Figure 12 and Figure 13 An example of a liquid ejection device including the above-described liquid ejection head or printhead module will be described.

[0061] As Figure 12As shown, a printing apparatus 500 as a liquid ejection apparatus includes an input unit 501, a guiding and conveying unit 503, a printing unit 505, a drying unit 507, an output unit 509, etc. The input unit 501 inputs a continuous medium 510. The guiding and conveying unit 503 guides and conveys the continuous medium 510 input from the input unit 501 to the printing unit 505. The printing unit 505 ejects a liquid onto the continuous medium 510 to form an image. The drying unit 507 heats the continuous medium 510 after image formation to dry it. The output unit 509 outputs the dried continuous medium 510.

[0062] After the continuous medium 510 is sent out from a roll paper roller 511 provided on the input unit 501, it is guided and conveyed by the input unit 501, the guiding and conveying unit 503, the drying unit 507, and the output unit 509, and wound around a winding roller 591 of the output unit 509.

[0063] The continuous medium 510 faces the nozzle unit 550 in the printing unit 505, and ink is ejected from the liquid ejection head to print an image.

[0064] As Figure 13 shown, in the nozzle unit 550, two nozzle modules 100A and 100B are provided on a common base member 552.

[0065] Next, as a liquid ejection apparatus including the above-described liquid ejection head or nozzle module, a Figure 14 manufacturing apparatus for an electrode and an electrochemical element will be described. Figure 14 Shown is a schematic diagram of an example of a manufacturing apparatus for an electrode according to an embodiment of the present invention. The manufacturing apparatus for an electrode is an apparatus that manufactures an electrode including a layer having an electrode material by ejecting a liquid composition using a nozzle module including a liquid ejection head.

[0066] Figure 14 The ejection means included in the shown manufacturing apparatus for an electrode is the nozzle module according to the above-described embodiment of the present invention. By ejecting a liquid composition from the liquid ejection head included in the nozzle module, the liquid composition is imparted to an object, and a liquid composition layer is formed. As the object (hereinafter, sometimes referred to as "ejection object"), any object that forms a layer containing an electrode material may be used, and there is no particular limitation, and it can be appropriately selected according to the purpose. For example, as the object, an electrode substrate (current collector), an active material layer, a layer containing a solid electrode material, etc. can be cited. In addition, the object may also be an electrode composite material layer containing an active material on an electrode substrate (current collector). In addition, as long as a layer having an electrode material can be formed on the ejection object, the ejection means and the ejection process may also be means and processes for directly ejecting a liquid composition to form a layer having an electrode material. In addition, the ejection means and the ejection process may also be means and processes for indirectly ejecting a liquid composition to form a layer having an electrode material.

[0067] As other components included in the manufacturing apparatus for the electrode composite material layer, as long as the effects of the present invention are not impaired, there are no particular limitations, and they can be appropriately selected according to the purpose. In addition, as other steps included in the manufacturing method of the electrode composite material layer, as long as the effects of the present invention are not impaired, there are no particular limitations, and they can be appropriately selected according to the purpose. For example, as the components and steps included in the manufacturing apparatus and manufacturing method of the electrode composite material layer, a heating mechanism and a heating step, etc., can be cited.

[0068] The heating mechanism included in the manufacturing apparatus for the electrode composite material layer is a mechanism for heating the liquid composition ejected by the ejection means. In addition, the heating step included in the manufacturing method of the electrode composite material layer is a step for heating the liquid composition ejected in the ejection step. By heating the liquid composition, the liquid composition layer can be dried.

[0069] Here, as an example of the manufacturing apparatus for the electrode, a manufacturing apparatus for an electrode in which an electrode composite material layer containing an active material is formed on an electrode substrate (current collector) will be described. As Figure 14 shown, the manufacturing apparatus for the electrode includes an ejection step portion 710, which includes a step of applying a liquid composition onto a printing substrate material 704 having an ejection object to form a liquid composition layer, and a heating step portion 720, which includes a heating step of heating the liquid composition layer to obtain an electrode composite material layer.

[0070] The manufacturing apparatus for the electrode includes a conveyance portion 705 for conveying the printing substrate material 704. The conveyance portion 705 conveys the printing substrate material 704 in the order of the ejection step portion 710 and the heating step portion 720 at a preset speed. As a manufacturing method of the printing substrate material 704 having an ejection object such as an active material layer, there are no particular limitations, and a known method can be appropriately selected. The ejection step portion 710 has a liquid ejection head 1 for implementing the application step of applying the liquid composition onto the printing substrate material 704, a storage container 701 for storing the liquid composition 707, and a supply pipe 702 for supplying the liquid composition 707 stored in the storage container 701 to the liquid ejection head 1.

[0071] In the ejection step portion 710, the liquid composition 707 is ejected from the liquid ejection head 1, and the liquid composition 707 is applied onto the printing substrate material 704 to form a thin-film-like liquid composition layer. In addition, the storage container 701 can be a configuration integrated with the manufacturing apparatus for the electrode composite material layer, or can be a configuration that can be removed from the manufacturing apparatus for the electrode composite material layer. In addition, the storage container 701 can be a storage container integrated with the manufacturing apparatus for the electrode composite material layer, or can also be a container for adding to a storage container that can be removed from the manufacturing apparatus for the electrode composite material layer.

[0072] The storage container 701 and the supply pipe 702 can be arbitrarily selected as long as they can stably store and supply the liquid composition 707.

[0073] In the heating process section 720, a solvent removal process is performed to heat and remove the solvent remaining in the liquid composition layer. Specifically, the solvent remaining in the liquid composition layer is dried by heating with the heating device 703 of the heating process section 720, thereby removing the solvent from the liquid composition layer. Thereby, an electrode composite material layer is formed. In addition, the solvent removal process in the heating process section 720 can also be performed under reduced pressure.

[0074] There is no particular limitation on the heating device 703, and it can be appropriately selected according to the purpose. For example, as the heating device 703, substrate heating, an IR heater, a hot air heater, etc. can be cited. In addition, the heating device 703 can also be a device formed by combining at least two of substrate heating, an IR heater, and a hot air heater. In addition, the heating temperature and heating time can be appropriately selected according to the boiling point of the solvent contained in the liquid composition 707 or the film thickness to be formed.

[0075] By using the manufacturing apparatus for an electrode according to the embodiment of the present invention, it is possible to eject a liquid composition onto a target site of an ejection object. The electrode composite material layer can be preferably used, for example, as a part of the configuration of an electrochemical element. There is no particular limitation on the configuration other than the electrode composite material layer in the electrochemical element, and a known configuration can be appropriately selected. For example, as the configuration other than the electrode composite material layer, a positive electrode, a negative electrode, a separator, etc. can be cited.

[0076] By applying the aforementioned liquid ejection head to the above nozzle module and liquid ejection device, while ensuring the maintainability of the liquid ejection head, it is possible to suppress the deviation of the landing position of the liquid.

[0077] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made as long as they do not depart from the gist of the present invention.

[0078] In the present application, the liquid to be ejected only needs to have a viscosity and surface tension that enable ejection from the nozzle, and there is no particular limitation. Preferably, it is a liquid having a viscosity of 30 MPa·s or less at normal temperature and pressure or when heated or cooled. More specifically, it includes solvents such as water or organic solvents, colorants such as dyes and pigments, functional imparting materials such as polymerizable compounds, resins, and surfactants, bio-compatible materials such as DNA, amino acids, proteins, and calcium, and edible materials such as natural pigments, etc., in the form of solutions, suspensions, latexes, etc. These can be used for applications such as inkjet inks, surface treatment liquids, components for electronic components and light-emitting elements, liquids for forming patterns of electronic circuit resist layers, and materials for three-dimensional modeling.

[0079] The "liquid" includes not only inks but also coatings, pretreatment liquids, adhesives, and overcoat liquids.

[0080] In the present application, the "liquid ejection device" is a device that includes a carriage having a liquid ejection head and drives the liquid ejection head to eject a liquid. In the liquid ejection device, it is not only a device that can eject a liquid with respect to a recording medium to which the liquid can adhere, but also includes a device that ejects a liquid into the air or into a liquid.

[0081] The "liquid ejection device" may further include mechanisms for feeding, transporting, and discharging paper for substances to which the liquid can adhere, as well as other pre-treatment devices, post-treatment devices, etc.

[0082] For example, as the "liquid ejection device", there are an image forming device that is a device for ejecting ink to form an image on paper, and a three-dimensional modeling device (3D modeling device) that ejects a modeling liquid into a powder layer in which powder is formed layer by layer in order to model a three-dimensional object (3D object).

[0083] In addition, the "liquid ejection device" is not limited to visualizing meaningful images such as characters and graphics by the ejected liquid. For example, it also includes those that form graphics that are not meaningful in themselves, and those that model three-dimensional images.

[0084] The above-mentioned "substance to which a liquid can adhere" refers to a substance to which a liquid can adhere at least temporarily, and refers to substances that adhere and penetrate after adhesion, etc., and is the recording medium in the above-mentioned embodiments. As specific examples, they can be recording media such as paper, recording paper, recording sheets, films, and cloth, electronic parts such as electronic substrates and piezoelectric elements, and media such as powder layers (powder layers), organ models, and inspection parts. As long as there is no particular limitation, it includes all substances to which a liquid can adhere.

[0085] Regarding the material of the above-mentioned "substance capable of adhering liquid", as long as it can temporarily adhere to liquids such as paper, silk, fiber, cloth, leather, metal, plastic, glass, wood, and ceramics, it is acceptable.

[0086] In addition, as the "liquid ejection device", there are also a treatment liquid coating device that ejects a treatment liquid onto the surface of paper for purposes such as surface modification of paper, and an ejection granulation device that granulates fine particles of raw materials by ejecting a composition liquid in which raw materials are dispersed into a solution through a nozzle, etc.

[0087] In addition, in the terminology of this application, image formation, recording, printing, writing, printing, shaping, etc. are all synonyms.

[0088] The embodiments of the present invention are described as follows, for example.

[0089] <1>

[0090] A liquid ejection head including a nozzle member having a plurality of nozzles for ejecting liquid, characterized in that: an ejection hole for ejecting gas is provided on the end side of the nozzle member closer to one end in the long side direction than the nozzle at the outermost end side of one end in the long side direction of the nozzle member.

[0091] <2>

[0092] According to the liquid ejection head described in <1>, the diameter of the ejection hole is the same as the diameter of the nozzle.

[0093] <3>

[0094] According to the liquid ejection head described in <1>, the diameter of the ejection hole is smaller than the diameter of the nozzle.

[0095] <4>

[0096] According to the liquid ejection head described in any one of <1> to <3>, an ejection hole for ejecting gas is provided on the end side of the nozzle member closer to the other end in the long side direction than the nozzle at the outermost end side of the other end in the long side direction of the nozzle member.

[0097] <5>

[0098] According to the liquid ejection head described in any one of <1> to <4>, it further includes a flow path member forming a liquid flow path communicating with the nozzle, and the flow path member has a gas path communicating with the ejection hole.

[0099] <6>

[0100] The liquid ejection head according to any one of <1> to <5>, wherein a plurality of ejection holes are arranged in a row in the longitudinal direction on a more end side than the nozzle at the most end side of either one of the sides in the longitudinal direction.

[0101] <7>

[0102] A head module having a plurality of the liquid ejection heads according to any one of <1> to <6>.

[0103] <8>

[0104] A liquid ejection device including the liquid ejection head according to any one of <1> to <6>.

Claims

1. A liquid ejecting head having a nozzle member having a plurality of nozzles for ejecting liquid, characterized in that: A jet hole for jetting gas is provided on the end side of one end in the longitudinal direction of the nozzle member relative to the nozzle disposed on the endmost side in one end in the longitudinal direction of the nozzle member.

2. The liquid ejecting head according to claim 1, wherein: The diameter of the ejection hole is the same as the diameter of the nozzle.

3. The liquid ejecting head according to claim 1, wherein: The diameter of the ejection hole is smaller than the diameter of the nozzle.

4. The liquid ejecting head according to claim 1, wherein: A jet hole for jetting gas is provided on the end side closer to the other end in the longitudinal direction than the nozzle disposed on the endmost side in the other end in the longitudinal direction of the nozzle member.

5. The liquid ejecting head according to claim 1, wherein: Also included is a flow path component forming a liquid flow path communicating with the nozzle, The flow path member has a gas path communicating with the ejection hole.

6. The liquid ejecting head according to claim 1, wherein: A plurality of the ejection holes are arranged side by side in the longitudinal direction on the end side relative to the nozzle arranged at the most end side on one or the other side in the longitudinal direction.

7. A nozzle module, characterized in that: A liquid ejecting head according to any one of claims 1 to 6 is provided in plurality.

8. A liquid spraying device, characterized in that: A liquid ejecting head according to any one of claims 1 to 6.

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