Display module and electronic equipment

Abstract

The embodiment of the invention provides a display module and electronic equipment, relates to the technical field of display, and is used for preventing a bending part of a display panel from generating defects such as cracks in a preparation process and improving the preparation yield of the display module. The display module comprises a display panel, a circuit board, an antenna assembly and a switching structure. The display panel comprises a display part and a binding part, and the binding part is connected to one side of the display part. One end of the circuit board is connected with the binding part, and the binding part and the circuit board are bent to the non-display side of the display panel. The antenna assembly and the binding part are located between the display part and the circuit board in the thickness direction of the display module. The circuit board comprises a first binding electrode, the antenna assembly comprises a second binding electrode, the first binding electrode is provided with a switching hole, a part of the switching structure is located in the switching hole, and the switching structure is connected with the first binding electrode and the second binding electrode. The material of the switching structure comprises conductive slurry. The display module is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0002] NFC (Near-Field Communication) is a short-range, high-frequency wireless communication technology. Electronic devices using NFC technology can perform contactless data transmission and exchange when they are close to each other, thereby utilizing electronic devices for mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting functions. Summary of the invention

[0003] The purpose of the embodiments of the present disclosure is to provide a display module and a method for manufacturing the same, and an electronic device, which are used to prevent defects such as cracks from occurring in the bent portion of the display panel during the manufacturing process, thereby improving the manufacturing yield of the display module.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] In one aspect, a display module is provided. The display module includes: a display panel, a circuit board, an antenna assembly, and a switching structure. The display panel includes a display portion and a binding portion, and the binding portion is connected to one side of the display portion. One end of the circuit board is connected to the binding portion, and the binding portion and the circuit board are bent to the non-display side of the display panel.

[0006] Along the thickness direction of the display module, the antenna assembly and the binding part are located between the display part and the circuit board. The circuit board includes a first binding electrode, and the antenna assembly includes a second binding electrode, which is connected to the first binding electrode.

[0007] The first binding electrode is provided with a transfer hole, a portion of the transfer structure is located in the transfer hole, and the transfer structure is connected to the first binding electrode and the second binding electrode. The material of the transfer structure includes conductive paste.

[0008] In the above-mentioned display module, the step of connecting the circuit board and the antenna assembly to the display panel can be after the step of bending the display panel. Compared with the situation where the circuit board and the antenna assembly are first connected to the display panel and then the display panel is bent, it can effectively avoid defects such as cracks during the bending process of the display panel.

[0009] In some embodiments, the display module further includes a connection layer. In the thickness direction of the display module, the connection layer is located between the circuit board and the antenna assembly, and is connected to the circuit board and the antenna assembly.

[0010] In some embodiments, in the thickness direction of the display module, the connection layer does not overlap with the first binding electrode, and does not overlap with the second binding electrode.

[0011] In some embodiments, the connection layer includes an extension portion, and the extension portion is located on one side of the second binding electrode in a first direction; the first direction is perpendicular to a length extension direction of the second binding electrode.

[0012] In some embodiments, the second binding electrode is provided with extension portions on both sides in the first direction.

[0013] In some embodiments, the connecting layer includes a first boundary opposite to the second binding electrode; along the length extension direction of the second binding electrode, the distance between one end of the extension portion away from the first boundary and the first boundary is greater than the distance between one end of the transfer hole away from the first boundary and the first boundary.

[0014] In some embodiments, the transfer hole is located within the range of the first binding electrode and has a distance from a boundary of the first binding electrode.

[0015] In some embodiments, the transfer hole includes: at least two through holes, and an exhaust groove; at least two through holes are arranged in a first direction at intervals, and the first direction is perpendicular to the length extension direction of the first binding electrode; the exhaust groove is located between two adjacent through holes and is connected to the two adjacent through holes. The minimum size of the through hole in the first direction is greater than the size of the exhaust groove in the first direction.

[0016] In some embodiments, the transfer hole includes at least two through holes; the at least two through holes are arranged at intervals along a first direction, the first direction is perpendicular to the length extension direction of the first binding electrode, and the through hole has at least one protrusion.

[0017] In some embodiments, a dimension of the transfer hole in the length extension direction of the first binding electrode is larger than a dimension of the transfer hole in the first direction, and the first direction is perpendicular to the length extension direction of the first binding electrode.

[0018] In some embodiments, along the thickness direction of the display module, the antenna assembly and the binding portion at least partially overlap.

[0019] In some embodiments, the display module further comprises: a heat dissipation structure disposed on the non-display side of the display panel. Along the thickness direction of the display panel, the antenna assembly is located between the heat dissipation structure and the circuit board, or between the heat dissipation structure and the display portion.

[0020] In another aspect, an electronic device is provided, comprising: a display module as described in any one of the above embodiments, and a frame; the display module is arranged in the frame.

[0021] The above electronic device has the same structure and beneficial technical effects as the display modules provided in some of the above embodiments, which will not be described in detail here.

[0022] In another aspect, a method for manufacturing a display module is provided. The method for manufacturing the display module includes: connecting one end of a circuit board to a bonding portion of a display panel; bending the bonding portion and the circuit board to the non-display side of the display portion of the display panel; placing an antenna assembly between the display portion and the circuit board, and overlapping a second bonding electrode of the antenna assembly with a first bonding electrode of the circuit board; injecting a conductive paste into a via hole of the first bonding electrode from a side of the circuit board away from the antenna assembly, so that the conductive paste is connected to the first bonding electrode and the second bonding electrode.

[0023] The method for manufacturing the display module has the same beneficial technical effects as the display modules provided in some of the above embodiments, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual dimensions of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0025] Figure 1 A plan view of the non-display side of an electronic device according to some embodiments;

[0026] Figure 2 A plan view of the non-display side of a display module according to some embodiments;

[0027] Figure 3 According to Figure 2 The cross-sectional structure diagram obtained by the section line A-A in;

[0028] Figure 4 A plan view of a display panel according to some embodiments;

[0029] Figure 5 A plan view of a circuit board according to some embodiments;

[0030] Figure 6 According to Figure 5 The cross-sectional structure diagram obtained by the section line B-B in;

[0031] Figure 7 A plan view of an antenna assembly according to some embodiments;

[0032] Figure 8 According to Figure 7 The cross-sectional structure diagram obtained by the section line C-C in;

[0033] Figure 9 is another planar structural diagram of an antenna assembly according to some embodiments;

[0034] Figure 10 Based on Figure 2 A magnified structural diagram of the middle region G1;

[0035] Figure 11 Based on Figure 10 The cross-sectional structure diagram obtained by the cross-sectional line DD in;

[0036] Figure 12 is a cross-sectional structural diagram of a first binding electrode, a second binding electrode, and a transfer structure of a display module during a connection process according to some embodiments;

[0037] Figure 13 is a planar structural diagram of a non-display side of a display module according to some other embodiments;

[0038] Figure 14 Based on Figure 13 The cross-sectional structure diagram obtained by the cross-sectional line EE in;

[0039] Figure 15 A planar structural diagram of a display module during preparation according to some embodiments;

[0040] Figure 16 is another planar structural diagram during the preparation process of a display module according to some embodiments;

[0041] Figure 17 Based on Figure 13 A magnified structural diagram of the middle region G2;

[0042] Figure 18 Based on Figure 17 The cross-sectional structure diagram obtained by the cross-sectional line FF in;

[0043] Figure 19 is a planar structural diagram of a first binding electrode according to some embodiments;

[0044] Figure 20 is a planar structural diagram of a first binding electrode according to some other embodiments;

[0045] Figure 21 is a planar structural diagram of a first binding electrode according to some other embodiments;

[0046] Figure 22 is a planar structural diagram of a first binding electrode according to some other embodiments;

[0047] Figure 23 is a planar structural diagram of a first binding electrode according to some other embodiments;

[0048] Figure 24 A plan view of a connection layer according to some embodiments;

[0049] Figure 25 A plan view of the non-display side of a display module according to some other embodiments;

[0050] Figure 26 A partial interface structure diagram of a display module according to some other embodiments. Detailed implementation manners

[0051] Next, in conjunction with the accompanying drawings, the technical solutions in some embodiments of the present disclosure will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0052] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, i.e., "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples", etc., are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0053] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality" is two or more.

[0054] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components have direct physical contact or electrical contact. The term "coupled" or "communicatively coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0055] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0056] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0057] As used herein, depending on the context, the term "if" is optionally interpreted to mean "when", "at the time of", "in response to determining", or "in response to detecting". Similarly, depending on the context, the phrase "if it is determined that..." or "if [the stated condition or event] is detected" is optionally interpreted to mean "when it is determined that...", "in response to determining...", "at the time of detecting [the stated condition or event]", or "in response to detecting [the stated condition or event]".

[0058] As used herein, "about", "substantially", or "approximately" includes the stated value and the average value within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system).

[0059] As used herein, "parallel", "perpendicular", "equal" include the stated situations and situations similar to the stated situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range of approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range of approximate perpendicularity can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, the difference between the two equal values is less than or equal to 5% of either one of them.

[0060] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there can also be an intermediate layer between the layer or element and the other layer or substrate.

[0061] The exemplary embodiments are described with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of regions are enlarged for clarity. Accordingly, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Thus, the exemplary embodiments should not be construed as being limited to the shape of the regions shown herein, but include shape deviations caused by, for example, manufacturing. For example, an etched region shown as rectangular will generally have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0062] Embodiments of the present disclosure provide an electronic device 100. Figure 1 FIG. is a plan view of the non-display side of the electronic device 100 according to some embodiments. In addition to Figure 1 structures such as the display module 10, the frame 20, the driving circuit 30, and the sensor 40 shown in, the electronic device 100 further includes other structures, such as a main board, a battery, and a rear cover, etc.

[0063] In some embodiments, as Figure 1 shown, the electronic device 100 includes a display module 10 and a frame 20, and the display module 10 is disposed within the frame 20.

[0064] The electronic device 100 includes, but is not limited to, any product or component having a display function, such as a laptop computer, a tablet computer, a mobile phone, a PDA (Personal Digital Assistant), a navigator, and a wearable device (such as a portable computer watch), etc.

[0065] Taking the electronic device 100 as a portable computer watch as an example, the frame 20 of the electronic device 100 may be the middle frame of the portable computer watch. Based on this, the electronic device 100 further includes a front cover plate and a rear back plate structure. The front cover plate and the rear back plate are respectively disposed on opposite sides of the middle frame. The front cover plate, the middle frame, and the rear back plate form an accommodation cavity, and the display module 10 is disposed within the accommodation cavity. Alternatively, the frame 20 of the electronic device 100 may also refer to the overall structure formed by the front cover plate, the middle frame, and the rear back plate.

[0066] In some embodiments, as Figure 2 , Figure 3 and Figure 4 shown, the display module 10 includes a display panel 1. The display panel 1 includes a display portion 11 and a bonding portion 12, and the bonding portion 12 is connected to one side of the display portion 11.

[0067] The display panel 1 is bendable, as Figure 2 and Figure 3As shown, in the display module 10, the display panel 1 is in a bent state; as Figure 4 shown, during the manufacturing process of the display panel 1, the display panel 1 can be in the Figure 4 unfolded state shown in

[0068] In some embodiments, as Figure 4 shown, a third bonding electrode group 13 is provided on the bonding portion 12 of the display panel 1. The third bonding electrode group 13 includes a plurality of third bonding electrodes. As Figure 1 and Figure 2 shown, the electronic device 100 further includes a driving circuit 30, and the driving circuit 30 is connected to the third bonding electrode 13.

[0069] Exemplarily, the driving circuit 30 can be configured to send a driving signal to the pixel P in the display panel 1 to control the pixel P to emit light or change color.

[0070] The display panel 1 can be any device that displays moving (e.g., video), stationary (e.g., still image), text, or images. A plurality of pixels P are provided on the display portion 11, and the display panel 1 is controlled to display an image by controlling the pixels P to emit light or change color.

[0071] Specifically, the display panel 1 can be an active light-emitting display panel, or the display panel 1 can also be a non-active light-emitting display panel.

[0072] When the display panel 1 is an active light-emitting display panel, a plurality of light-emitting devices are provided on the display portion 11 of the display panel 1, and each pixel P can include one or more (two or more) light-emitting devices.

[0073] The light-emitting devices include but are not limited to MLED (Mini Lighting Emitting Diode, mini light-emitting diode; or Micro Lighting Emitting Diode, micro light-emitting diode), OLED (Organic Light-Emitting Diode, organic light-emitting diode), or QLED (Quantum Dot Light Emitting Diode, quantum dot light-emitting diode), etc.

[0074] When the display panel 1 is a non-active light-emitting display panel, the display panel 1 can be an LCD display panel (Liquid Crystal Display, liquid crystal display panel), and each pixel P includes a pixel electrode, a common electrode, and liquid crystal molecules within the region defined by the pixel P.

[0075] The above is only an example for some possible implementation manners of the present disclosure, and is not a limitation to the present disclosure.

[0076] In some embodiments, as Figure 2 and Figure 3 shown, the display module 10 further includes a circuit board 2 and an antenna assembly 3. One end of the circuit board 2 is connected to the bonding portion 12 of the display panel 1, and the circuit board 2 is further connected to the antenna assembly 3. The bonding portion 12 and the circuit board 2 are bent to the non-display side of the display panel 1; along the thickness direction of the display module 10, the antenna assembly 3 and the bonding portion 12 are located between the display portion 11 and the circuit board 2.

[0077] Exemplarily, the circuit board 2 may be a flexible printed circuit board (FPC).

[0078] The circuit board 2 may be used to supply power to the display panel 1 and the antenna assembly 3, and / or implement data exchange between the display panel 1 and the antenna assembly 3, etc.

[0079] Exemplarily, the antenna assembly 3 may be a near-field communication assembly.

[0080] By providing the antenna assembly 3, the electronic device 100 can perform non-contact data transmission and data exchange when being close to another antenna assembly 3, so as to utilize functions such as mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting of the electronic device 100.

[0081] In some embodiments, as Figure 1 and Figure 2 shown, the circuit board 2 includes a first portion 2a and a second portion 2b, and the second portion 2 can be bent to one side of the first portion 2a. When the circuit board 2 is in a bent state, along the thickness direction of the display module 10, the second portion 2b is located on the side of the first portion 1a away from the display portion 11.

[0082] Based on this, the electronic device 100 further includes a main board (Mainboard or Motherboard), and the main board is disposed in the frame 20. The second portion 2b of the circuit board 2 is connected to the main board. In the electronic device 100, the second portion 2b of the circuit board 2 and the main board are bent to the non-display side of the display panel 1. Along the thickness direction of the electronic device 100, the main board and the second portion 2b are located on the side of the first portion 2a away from the display portion 11.

[0083] During the manufacturing process of the electronic device 100, the circuit board 2 can be first connected to the main board, and then, the second part 2b of the circuit board 2 can be bent together with the main board. In this way, during the connection process between the circuit board and the main board, structures such as the display panel 1 and the antenna assembly 3 can be avoided, and the connection process between the circuit board 2 and the main board can be prevented from being affected by the remaining structures in the electronic device 100.

[0084] Based on the above, the specific structures of the circuit board 2 and the antenna assembly 3 are introduced below.

[0085] In some embodiments, as Figure 5 and Figure 6 shown, the circuit board 2 includes a first bonding electrode 21, and the first bonding electrode 21 is used to connect to the antenna assembly 3.

[0086] Exemplarily, as Figure 6 shown, the circuit board 2 includes a first substrate 22, the first bonding electrode 21 includes a first conductive pattern 21a and a second conductive pattern 21b, the first conductive pattern and the second conductive pattern are disposed on opposite sides of the first substrate 22, and the first conductive pattern 21a and the second conductive pattern 21b can be connected through a via hole penetrating the first substrate 22.

[0087] For the circuit board 2 with a double-sided metal structure, wiring design can be carried out on both sides of the first substrate 22, and the parts where the conductive patterns on both sides need to be connected are connected through via holes penetrating the first substrate 22. In this way, compared with the circuit board 2 designed with a single-sided metal structure (only wiring design is carried out on one side of the first substrate 22), the wiring area on the circuit board 2 is larger, and the circuit density and function integration degree of the circuit board 2 can be improved.

[0088] In some embodiments, as Figure 3 and Figure 4 shown, a fourth bonding electrode group 14 is provided on the bonding part 12, and the fourth bonding electrode group 14 is located at the end of the bonding part 12 away from the display part 11; as Figure 5 and Figure 6 shown, a fifth bonding electrode group 23 is provided at one end of the circuit board 2, and the fifth bonding electrode group 23 is connected to the fourth bonding electrode group 14.

[0089] As Figure 6 shown, the fifth bonding electrode group 23 can be provided on one side of the first substrate 22. Alternatively, the fifth bonding electrode group 23 can also include two parts disposed on both sides of the first substrate 22.

[0090] Exemplarily, as Figure 5 and Figure 6As shown, the circuit board 2 further includes a sixth bonding electrode group 24, which is disposed on the second part 2b of the circuit board 2 and is used to connect to the main board.

[0091] As Figure 6 shown, the sixth bonding electrode group 24 can be disposed on one side of the first substrate 22. Alternatively, the sixth bonding electrode group 24 can also include two parts separately disposed on both sides of the first substrate 22.

[0092] Exemplarily, as Figure 5 and Figure 6 shown, the circuit board 2 further includes a seventh bonding electrode group 25. As Figure 1 and Figure 3 shown, the seventh bonding electrode group 25 is used to connect to the sensor 40. The sensor 40 includes but is not limited to a heart rate sensor or a blood oxygen sensor, etc.

[0093] As Figure 6 shown, the seventh bonding electrode group 25 can be disposed on one side of the first substrate 22. Alternatively, the seventh bonding electrode group 25 can also include two parts separately disposed on both sides of the first substrate 22.

[0094] Based on the above, as Figure 6 shown, when the fifth bonding electrode group 23, the sixth bonding electrode group 24, and the seventh bonding electrode group 25 on the circuit board 2 are all disposed only on one side of the first substrate 22, the fifth bonding electrode group 23 can be disposed on one side surface of the first substrate 22, and the fifth bonding electrode group 23 can be arranged on the same layer as the second conductive pattern 21b of the first bonding electrode 21; the sixth bonding electrode group 24 and the seventh bonding electrode group 25 are disposed on the other side surface of the first substrate 22, and the sixth bonding electrode group 24 and the seventh bonding electrode group 25 can be arranged on the same layer as the first conductive pattern 21a of the first bonding electrode 21.

[0095] Exemplarily, as Figure 3 、 Figure 5 and Figure 6 shown, in the display module 10, the fifth bonding electrode group 23 is at least disposed between the first substrate 22 and the display unit 11, and the sixth bonding electrode group 24 and the seventh bonding electrode group 25 are at least disposed on the side of the first substrate 22 away from the display unit 11.

[0096] In some embodiments, as Figure 6 shown, the circuit board 2 further includes a first insulating layer 26 and a second insulating layer 27. As Figure 6 shown, the first insulating layer 26 and the second insulating layer 27 are separately disposed on both sides of the first substrate 22 and respectively cover the conductive patterns provided on the surface of the first substrate 22. The conductive patterns provided on the surface of the first substrate 22 include structures such as bonding electrodes and signal lines on the first substrate.

[0097] Exemplarily, as Figure 6 shown, the first insulating layer 26 and the first conductive pattern 21a of the first bonding electrode 21 are provided on the same side of the first substrate 22, and the first insulating layer 26 is located on the side of the first conductive pattern 21a, the sixth bonding electrode group 24, and the seventh bonding electrode group 25 away from the first substrate 22.

[0098] Meanwhile, the first insulating layer 26 exposes at least a part of the first conductive pattern 21a, the first insulating layer 26 exposes at least a part of the sixth bonding electrode group 24, and the first insulating layer 26 exposes at least a part of the seventh bonding electrode group 25.

[0099] Exemplarily, as Figure 6 shown, the second insulating layer 27 and the second conductive pattern 21b of the first bonding electrode 21 are provided on the same side of the first substrate 22, and the second insulating layer 27 is located on the side of the second conductive pattern 21b and the fifth bonding electrode group 23 away from the first substrate 22.

[0100] Meanwhile, the second insulating layer 27 exposes at least a part of the second conductive pattern 21b, and the second insulating layer 27 exposes at least a part of the fifth bonding electrode group 23.

[0101] In some embodiments, as Figure 7 and Figure 8 shown, the antenna assembly 3 includes a second substrate 32 and a second bonding electrode 31, and the second bonding electrode 31 is provided on the second substrate 32. The second bonding electrode 31 is used to connect with the circuit board 2.

[0102] As Figure 9 shown, the antenna assembly 3 further includes an antenna coil 33 disposed around the edge of the second substrate 32. The antenna assembly 3 includes two second bonding electrodes 31. One end of the antenna coil 33 is connected to one second bonding electrode 31, and the other end of the antenna coil 33 is connected to the other second bonding electrode 31.

[0103] In some embodiments, as Figure 7 , Figure 8 and Figure 9 shown, the antenna assembly 3 further includes a third insulating layer 34 disposed on the side of the antenna coil 33 away from the second substrate 32. The third insulating layer 34 at least covers the antenna coil 33.

[0104] Exemplarily, as Figure 7 shown, in a direction perpendicular to the second substrate 32, the third insulating layer 34 may overlap with the boundary of the second substrate 32.

[0105] Exemplarily, the material of the third insulating layer 34 may be ferrite (Ferrite Sheet). By providing the ferrite covering the antenna coil 33, when the antenna assembly 3 is applied to the electronic device 100 or in other application scenarios, the ferrite layer can reduce the absorption of the signal magnetic field generated by the antenna coil 33 by metal materials other than the antenna assembly 3. At the same time, the ferrite can increase the intensity of the magnetic field generated by the antenna coil 33, effectively increasing the induction distance of the antenna assembly 3.

[0106] The other metal structures mentioned herein refer to parts other than the antenna assembly 3, including the metal structures inside the electronic device 100 when the antenna assembly 3 is applied to the electronic device 100, and the metal structures in the spatial environment where the electronic device 100 is located, etc.

[0107] For example, when the electronic device 100 with the antenna assembly 3 is applied to a wireless payment scenario, an electronic tag needs to be integrated or attached to the electronic device 100 to function as a participating part in the wireless payment scenario. At this time, the ferrite in the antenna assembly 3 can isolate the absorption and attenuation of the magnetic field of the antenna coil 33 by the metal conductor, effectively improving the performance of the antenna coil 33, increasing the magnetic field intensity of the antenna coil 33, and improving the induction distance and sensitivity of the antenna assembly 3.

[0108] Exemplarily, as Figure 7 and Figure 8 shown, the third insulating layer 34 exposes the second bonding electrode 31. As Figure 10 and Figure 11 shown, the second bonding electrode 31 of the antenna assembly 3 is connected to the first bonding electrode 21 of the circuit board 2.

[0109] The third insulating layer 34 exposes the bonding electrodes in the antenna assembly 3 that need to be connected to external structures, such as the second bonding electrode 31, etc., to ensure that the antenna assembly 3 can be effectively connected to structures such as the circuit board 2.

[0110] Based on the above embodiments, in order to clearly show the positional relationship and connection method between the second substrate 32, the antenna coil 33, and the second bonding electrode 31, Figure 9 the third insulating layer 34 of the antenna assembly 3 is not shown in

[0111] However, in any embodiment of the present disclosure, the antenna assembly 3 may be provided with the third insulating layer 34.

[0112] In some embodiments, the circuit board 2 has a connection hole K3, and the display module 10 further includes an adapter structure 4. A part of the adapter structure 4 is located in the connection hole K3, and the adapter structure 4 is connected to the first bonding electrode 21 and the second bonding electrode 31. Figure 10 and Figure 11As shown, the first binding electrode 21 is provided with a transfer hole 211 , which is a part of the connection hole K3 . The transfer hole 211 is located within the range of the first binding electrode 21 .

[0113] For example, Figure 10 As shown, the first binding electrode 21 has a plurality of (two or more) transfer holes 211 .

[0114] Taking the first binding electrode 21 as a rectangle, when forming the transfer hole 211, Figure 10 As shown, a portion of the transfer holes 211 and the border of the first binding electrode 21 have a gap, and another portion of the transfer holes 211 and the border of the first binding electrode 21 partially overlap.

[0115] In this way, the adapter structure 4 can pass through the middle part of the first binding electrode 21 and be connected to the first binding electrode 21 and the second binding electrode 31.

[0116] For example, Figure 11 As shown, the first conductive pattern 21a of the first binding electrode 21 is provided with a first via hole 211a, the second conductive pattern 21b of the second binding electrode 21 is provided with a second via hole 211b, and the first substrate 22 is provided with a third via hole 221; along the thickness direction of the circuit board 2, the first via hole 211a, the second via hole 211b and the third via hole 221 are connected to form a connecting hole K3.

[0117] For example, Figure 10 and Figure 11 As shown, the connection hole K3 is located within the range of the first binding electrode 21. The connection hole K3 can be formed by punching on the circuit board 2, and the side walls of the first via hole 211a, the second via hole 211b and the third via hole 221 are coplanar.

[0118] Furthermore, if Figure 5 As shown, the circuit board 2 is provided with a first positioning hole K1; Figure 7 As shown, the antenna assembly 3 is provided with a second positioning hole K2 ; the first positioning hole K1 and the second positioning hole K2 are provided correspondingly, and the first positioning hole K1 and the second positioning hole K2 are used to fix the relative positions of the circuit board 2 and the antenna assembly 3 .

[0119] In some embodiments, the first binding electrode 21 of the circuit board 2 and the second binding electrode 31 of the antenna assembly 3 may be connected by welding. The connection process of the circuit board 2 and the antenna assembly 3 includes the following steps.

[0120] A1. Pass the second positioning hole K2 on the antenna assembly 3 through the positioning post.

[0121] A2. Figure 12As shown, a layer of uniform welding material is formed on the second bonding electrode 31 of the antenna assembly 3.

[0122] A3. Pass the first positioning hole K1 on the circuit board 2 through the positioning posts, as Figure 12 shown, so that the first bonding electrode 21 of the circuit board 2 and the second bonding electrode 31 of the antenna assembly 3 are overlapped.

[0123] A4. Heat the welding material to connect the first bonding electrode 21 and the second bonding electrode 31 through the welding material.

[0124] Exemplarily, as Figure 11 and Figure 12 shown, the welding material will melt when heated, so that the welding material can better fill in the connection hole K3, and the circuit board 2 and the antenna assembly 3 can fit better; then, wait for the welding material to cool and solidify to realize the connection between the first bonding electrode 21 and the second bonding electrode 31.

[0125] Exemplarily, the welding material includes but is not limited to solder paste.

[0126] Since a large amount of heat will be generated during the welding process, in order to avoid the adverse effects of the heat generated by welding on the display panel 1, during the preparation process of the display module 10, the bonding step of the circuit board 2 and the antenna assembly 3 needs to be before the bending step of the display panel 1.

[0127] In this way, during the preparation process of the display module 10, the circuit board 2 and the antenna assembly 3 need to be connected first to form an integrated circuit board assembly, and then the circuit board assembly is connected to the display panel 1. During the bending process of the display panel 1, the overall weight of the circuit board 2 and the antenna assembly 3 connected to the bonding part 12 of the display panel 1 is relatively large, making it easy for the connection part between the display part 11 and the bonding part 12 of the display panel 1 to generate defects such as cracks, affecting the preparation yield of the display module 10.

[0128] Meanwhile, as Figure 2 and Figure 3 shown, in this case, the antenna assembly 3 needs to avoid the connection position between the circuit board 2 and the display panel 1. As shown in FIGS. 2 and Figure 3 shown, in the display module 10, the antenna assembly 3 cannot extend below the bonding part 12, that is, along the thickness direction of the display module 10, the antenna assembly 3 and the bonding part 12 of the display panel 1 do not overlap.

[0129] The antenna assembly 3 can enhance the magnetic field induction intensity of the antenna coil 33 by increasing the number of turns of the antenna coil 33 and / or increasing the coil area. The limited area of the antenna assembly 3 in the display module 10 limits the improvement of the signal volume of the antenna assembly 3.

[0130] Based on this, an embodiment of the present disclosure provides a display module 10 and a method for manufacturing the same.

[0131] In some embodiments, Figure 13 , Figure 14 and Figure 25 As shown, the material of the transfer structure 4 of the display module 10 includes conductive paste.

[0132] For example, Figure 13 and Figure 25 As shown, along the thickness direction of the display module 10 , the antenna assembly 3 and the binding portion 12 at least partially overlap.

[0133] Compared to Figure 2 The display module 10 shown in FIG. Figure 13 In the display module 10 shown, the antenna assembly 3 can extend into the binding portion 12 of the display panel 1 , thereby increasing the area of ​​the antenna assembly 3 .

[0134] Compared to Figure 2 The display module 10 shown in FIG. Figure 25 In the display module 10 shown, the antenna component 3 can be overlapped or roughly overlapped with the display portion 11, so that the area of ​​the antenna component 3 is further increased, and the number of turns and area of ​​the antenna coil 33 on the antenna component 3 can also be larger, thereby better improving the signal strength of the antenna component 3.

[0135] Exemplarily, the transfer structure 4 may be made of conductive glue, such as silver paste or other conductive materials. The first binding motor 21 of the circuit board 2 in the display module 10 and the second binding electrode 31 of the antenna assembly 3 are connected by glue injection (glue dispensing) process.

[0136] In this way, a large amount of heat will not be generated during the connection process of the first binding electrode 21 and the second binding electrode 31. Therefore, the connection step of the circuit board 2 and the antenna assembly 3 can be performed after the bending step of the display panel 1. Compared with the situation where the circuit board 2 and the antenna assembly 3 are first connected to the display panel 1 and then the display panel 1 is bent, it can prevent the bent part of the display panel 1 from having defects such as cracks during the preparation process, thereby improving the preparation yield of the display module 10.

[0137] Specifically, in some embodiments, the method for preparing the display module 10 includes the following steps.

[0138] S1 . Connect one end of the circuit board 2 to the binding portion 12 of the display panel 1 .

[0139] S2, such as Figure 15 As shown, the binding portion 12 and the circuit board 2 are bent to the non-display side of the display portion 11 of the display panel 1 .

[0140] S3. As shown in Figure 15 , place the antenna assembly 3 between the display unit 11 and the circuit board 2, and overlap the second bonding electrode 31 of the antenna assembly 3 with the first bonding electrode 21 of the circuit board 2.

[0141] S4. As shown in Figure 16 and Figure 18 , inject conductive paste into the via hole 211 of the first bonding electrode 21 from the side of the circuit board 2 away from the antenna assembly 3, so that the conductive paste is connected to the first bonding electrode 21 and the second bonding electrode 31.

[0142] In this way, as shown in Figure 13 and Figure 16 , the antenna assembly 3 in the display module 10 can extend into the range of the bonding part 12 of the display panel 1. Compared with the display module 10 shown in Figure 2 , the outer dimension of the antenna assembly 3 is larger. Correspondingly, the area of the antenna coil 33 is also larger, thereby improving the magnetic field induction intensity of the antenna assembly 3.

[0143] In some embodiments, as shown in Figure 17 and Figure 18 , the via hole 211 is located within the range of the first bonding electrode 21 and has a spacing from the boundary of the first bonding electrode 21.

[0144] In this way, it can be avoided that the conductive paste overflows from the via hole 211 during the process of dotting silver paste into the via hole 211, and it can be avoided that the conductive paste overflows and causes problems such as short - circuit due to the connection between the first bonding electrode 21 and other conductive structures except the second bonding electrode 31.

[0145] In some embodiments, as shown in Figure 19 , Figure 20 and Figure 21 , the via hole 211 includes: at least two through - holes K and an exhaust groove P; at least two through - holes K are arranged at intervals along the first direction X, and the first direction X is perpendicular to the length extension direction of the first bonding electrode 21; the exhaust groove P is located between two adjacent through - holes K and is communicated with the two adjacent through - holes K. The minimum dimension of the through - hole K in the first direction X is greater than the dimension of the exhaust groove P in the first direction X.

[0146] Exemplarily, the through - hole K can be in a rectangular, circular, regular polygon or similar shape.

[0147] In this way, during the dispensing process, the conductive paste is injected into the through-hole K, and the conductive paste will flow along the through-hole K towards the second bonding electrode 31. During this process, the exhaust groove P communicating with the through-hole K can prevent the conductive paste from being blocked in the transfer hole 211, ensuring that the conductive paste injected into the transfer hole 211 can flow down to the second bonding electrode 31, ensuring the effective connection between the first bonding electrode 21 and the second bonding electrode 31, and improving the production yield of the display module 10.

[0148] As Figure 19 and Figure 20 shown, at least one through-hole K communicates with two exhaust grooves P. In this way, after the conductive paste is injected into this through-hole K, both of the two exhaust grooves P communicating with this through-hole K can achieve the exhaust function, thus being able to better avoid the blockage of the conductive paste.

[0149] As Figure 21 shown, two adjacent through-holes K share one exhaust groove P, which can reduce the punching area of the first bonding electrode 21. Correspondingly, the area of the first bonding electrode 21 is larger, which can reduce the resistance of the first bonding electrode 21.

[0150] In some embodiments, as Figure 22 shown, the transfer hole 211 includes at least two through-holes K; the at least two through-holes K are arranged at intervals along the first direction X, and the first direction X is perpendicular to the length extension direction of the first bonding electrode 21. The through-hole K has at least one protrusion T.

[0151] Exemplarily, the through-hole K can be pentagonal, star-shaped or trapezoidal, etc.

[0152] In this way, during the dispensing process, the conductive paste is injected into the through-hole K, and the conductive paste will flow along the through-hole K towards the second bonding electrode 31. During this process, the protrusion T of the through-hole K can achieve the exhaust function during the dispensing process, which can prevent the conductive paste from being blocked in the transfer hole 211, ensuring that the conductive paste injected into the transfer hole 211 can flow down to the second bonding electrode 31, ensuring the effective connection between the first bonding electrode 21 and the second bonding electrode 31, and improving the production yield of the display module 10.

[0153] In some embodiments, as Figure 23 shown, the size of the transfer hole 211 in the length extension direction of the first bonding electrode 21 is larger than the size of the transfer hole 211 in the first direction X, and the first direction X is perpendicular to the length extension direction of the first bonding electrode 21.

[0154] Exemplarily, the transfer hole 211 can be rectangular or oval, etc.

[0155] Since the through-hole 211 is integrally elongated, after injecting the conductive paste into the through-hole 211, while the conductive paste flows towards the second bonding electrode 31, it will also diffuse along the length direction of the through-hole 211. Due to the relatively long length of the through-hole 211, a part of the conductive paste will not be filled by the through-hole 211, and this part can be used for exhaust during the glue injection process to prevent the conductive paste from being blocked in the through-hole 211, ensuring that the conductive paste injected into the through-hole 211 can flow down to the second bonding electrode 31, ensuring the effective connection between the first bonding electrode 21 and the second bonding electrode 31, and improving the manufacturing yield of the display module 10.

[0156] In some embodiments, as Figure 18 and Figure 24 shown, the display module 10 further includes a connection layer 5. In the thickness direction of the display module 10, the connection layer 5 is located between the circuit board 2 and the antenna assembly 3 and is connected to the circuit board 2 and the antenna assembly 3.

[0157] During the manufacturing process of the display module 10, after the aforementioned step S3 and before step S4, the circuit board 2 and the antenna assembly 3 are connected through the connection layer 5, thereby fixing the relative positions of the circuit board 2 and the antenna assembly 3, ensuring that the first bonding electrode 21 and the second bonding electrode 31 can remain overlapped, and the through-hole 211 on the first bonding electrode 21 can remain within the range of the second bonding electrode 31, so as to ensure that during the dispensing process into the through-hole 211, the conductive paste can flow along the through-hole 211 towards the second bonding electrode 31, ensuring the effective connection between the first bonding electrode 21 and the second bonding electrode 31.

[0158] In some embodiments, as Figure 18 and Figure 24 shown, in the thickness direction of the display module 10, the connection layer 5 does not overlap with the first bonding electrode 21 and does not overlap with the second bonding electrode 31.

[0159] Exemplarily, the connection layer 5 can be provided around the first bonding electrode 21 and the second bonding electrode 31, or the area of the connection layer 5 can be larger, as long as the connection layer 5 avoids the connection positions of the first bonding electrode 21 and the second bonding electrode 31. For example, the connection layer 5 is provided at the overlapping part of the circuit board 2 and the antenna assembly 3.

[0160] In this way, while the connection layer 5 realizes the connection and fixation of the circuit board 2 and the antenna assembly 3, it can also avoid the connection layer 5 from blocking the first bonding electrode 21 and the second bonding electrode 31, ensuring the effective contact area between the first bonding electrode 21 and the second bonding electrode 31, and ensuring the connection reliability between the first bonding electrode 21 and the second bonding electrode 31.

[0161] In some embodiments, as Figure 24As shown, the connection layer 5 includes an extension portion 51 , and the extension portion 51 is located at one side of the second binding electrode 31 in the first direction X; the first direction X is perpendicular to the length extension direction of the second binding electrode 31 .

[0162] For example, Figure 24 As shown, both sides of the second binding electrode 31 in the first direction X are provided with extension portions 51 .

[0163] In this way, the extension portion 51 can achieve the fixation and adhesion of the circuit board 2 and the antenna assembly 3. At the same time, when the conductive paste is injected into the transfer hole 211, it can prevent the conductive paste from overflowing to outside the range of the second binding electrode 31 during the dispensing process.

[0164] The extension portion 51 located between two adjacent second binding electrodes 31 can prevent the formed transfer structure 4 from being connected to another second binding electrode 31 adjacent to the corresponding second binding electrode 31 , thereby causing a lateral short circuit.

[0165] At the same time, the extension portion 51 can also prevent the formed transfer structure 4 from being connected to other conductive structures except the first binding electrode 21 and the second binding electrode 31 , or to another adjacent second binding electrode 31 , resulting in a short circuit or other defects.

[0166] Exemplarily, the connection layer 5 may be a double-sided adhesive tape. Based on this, the width of the extension portion 51 is greater than or equal to 0.8 mm.

[0167] Here is an example of a possible implementation of the present disclosure given in consideration of the cutting and adhesion limits of the double-sided tape. The material of the connecting layer 5 may also be other sticky materials, and the width of the extension portion 51 may also be less than 0.8 mm, as long as the bonding and anti-overflow effects can be achieved.

[0168] In some embodiments, Figure 24 As shown, the connection layer 5 includes a first boundary J1 opposite to the second binding electrode 31; along the length extension direction of the second binding electrode 31, the distance d2 between the end of the extension portion 51 away from the first boundary J1 and the first boundary J1 is greater than the distance d1 between the end of the transfer hole 211 away from the first boundary J1 and the first boundary J1.

[0169] In this way, the end of the extension portion 51 extends beyond the boundary of the transfer hole 211, which can better prevent the conductive paste from overflowing during the dispensing process.

[0170] In some embodiments, Figure 25 As shown, the display module 10 further includes: a heat dissipation structure 6 disposed on the non-display side of the display panel 1 .

[0171] By providing a heat dissipation structure 6, on the one hand, it can dissipate the heat generated when the display panel 1 is working, and on the other hand, it can also buffer the stress acting on the display panel 1, providing a certain protective effect on the display panel 1.

[0172] Exemplarily, the heat dissipation structure 6 can be made of a material with high heat conduction and has good heat conduction performance. In this way, the heat dissipation structure 6 can absorb the heat generated by the display panel 1 and dissipate the heat into the air, thereby achieving the heat dissipation effect and preventing the display panel 1 from overheating.

[0173] For example, the heat dissipation structure 6 can be a heat dissipation film SCF (Screen Cooling Film).

[0174] The heat dissipation film SCF can be one or multiple (two or more) thin films for heat conduction and dissipation. The materials of the heat dissipation film SCF include but are not limited to natural graphite heat dissipation film, artificial graphite heat dissipation film, graphene heat dissipation film, and carbon nanotube heat dissipation film, etc. Alternatively, the heat dissipation film SCF can also be composed of a grid adhesive, a foam, and a copper foil arranged in a stacked manner. The heat dissipation film SCF can be adhered to the display part 11 through the grid adhesive.

[0175] Again, the material of the heat dissipation structure 6 can also be materials with good heat conduction performance such as copper, aluminum, and stainless steel.

[0176] Of course, the heat dissipation structure 6 can also include other materials. This is only an exemplary description of some possible implementation manners disclosed and does not limit the present disclosure.

[0177] The heat dissipation structure 6 can also provide a certain structural support for the display part 11, improve the overall strength of the display panel 1, and reduce the risk of damage to the display panel 1 under external forces (such as accidental collisions, etc.).

[0178] In some embodiments, as Figure 13 、 Figure 14 and Figure 25 shown, along the thickness direction of the display panel 1, the antenna assembly 3 is located between the heat dissipation structure 6 and the circuit board 2, or, as Figure 26 shown, the antenna assembly 3 is located between the heat dissipation structure 6 and the display part 11.

[0179] When the connection structure 4 uses conductive paste, the circuit board 2 and the antenna assembly 3 can be connected to the display panel 1 after the display panel 1 is bent. Therefore, the installation positions of the heat dissipation structure 6 and the antenna assembly 3 are more flexible. The antenna assembly 3 can be placed on one side of the heat dissipation structure 6 close to the display part 11 of the display panel 1, or on the side of the heat dissipation structure 6 far from the display part 11 of the display panel 1.

[0180] As Figure 26As shown, when the antenna assembly 3 is located between the heat dissipation structure 6 and the display unit 11, during the preparation process of the display module 10, the circuit board 2, the antenna assembly 3, and the heat dissipation structure 6 can all be connected to each other after the display panel 1 is bent.

[0181] Based on this, the display module 10 can include two connection layers 5, one connection layer 5 is located between the antenna assembly 3 and the heat dissipation structure 6, and the other connection layer 5 is located between the heat dissipation structure 6 and the circuit board 2.

[0182] Furthermore, the heat dissipation structure 6 has a via 61. Along the thickness direction of the display panel 10, the via 61 on the heat dissipation structure 6 communicates with the transfer hole 211 on the first bonding electrode 21 of the antenna assembly 3. In this way, during the connection process between the circuit board 2 and the antenna assembly 3, the conductive paste is injected into the transfer hole 211 of the first bonding electrode 21 from the side of the circuit board 2 away from the antenna assembly 3. The conductive paste flows along the transfer hole 211 on the first bonding electrode 21, passes through the via 61 on the heat dissipation structure 6, and then flows to the second bonding electrode 31, so that the transfer structure 4 formed after the conductive paste is cured is connected to the first bonding electrode 21 and the second bonding electrode 31.

[0183] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure, thinking of changes or substitutions, should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel comprises a display portion and a binding portion, wherein the binding portion is connected to one side of the display portion; A circuit board, one end of which is connected to the binding portion, and the binding portion and the circuit board are bent to the non-display side of the display panel; the circuit board comprises a first binding electrode, and the first binding electrode is provided with a transfer hole; The antenna assembly includes a second binding electrode, wherein the second binding electrode is connected to the first binding electrode; Along the thickness direction of the display module, the antenna assembly and the binding portion are located between the display portion and the circuit board; A transfer structure, part of which is located in the transfer hole, and the transfer structure is connected to the first binding electrode and the second binding electrode; the material of the transfer structure includes conductive paste.

2. The display module according to claim 1, characterized in that: The display module further includes: a connection layer; In the thickness direction of the display module, the connection layer is located between the circuit board and the antenna assembly and is connected to the circuit board and the antenna assembly. The connection layer does not overlap with the first binding electrode and does not overlap with the second binding electrode.

3. The display module according to claim 2, characterized in that: The connection layer comprises: The extension portion is located at one side of the second binding electrode in a first direction; the first direction is perpendicular to a length extension direction of the second binding electrode.

4. The display module according to claim 3, characterized in that: The second binding electrode is provided with the extending parts on both sides in the first direction.

5. The display module according to claim 3, characterized in that: The connection layer includes a first boundary opposite to the second binding electrode; along the length extension direction of the second binding electrode, the distance between the first boundary and one end of the extension portion away from the first boundary is greater than the distance between the first boundary and one end of the transfer hole away from the first boundary.

6. The display module according to any one of claims 1 to 5, characterized in that: The transfer hole is located within the range of the first binding electrode and has a distance from a boundary of the first binding electrode.

7. The display module according to any one of claims 1 to 5, characterized in that: The transfer hole includes at least two through holes and an exhaust groove; the at least two through holes are arranged at intervals along a first direction, and the first direction is perpendicular to the length extension direction of the first binding electrode; the exhaust groove is located between two adjacent through holes and is connected to the two adjacent through holes; the minimum size of the through hole in the first direction is larger than the size of the exhaust groove in the first direction; or, The transfer hole comprises at least two through holes, the at least two through holes are arranged at intervals along a first direction, the first direction is perpendicular to the length extension direction of the first binding electrode, and the through hole has at least one protrusion; or, A dimension of the transfer hole in a length extension direction of the first binding electrode is greater than a dimension of the transfer hole in the first direction.

8. The display module according to any one of claims 1 to 5, characterized in that: Along the thickness direction of the display module, the antenna assembly and the binding portion at least partially overlap.

9. The display module according to any one of claims 1 to 5, characterized in that: The display module also includes: The heat dissipation structure is arranged on the non-display side of the display panel; along the thickness direction of the display panel, the antenna assembly is located between the heat dissipation structure and the circuit board, or the antenna assembly is located between the heat dissipation structure and the display part.

10. An electronic device, characterized in that: include: The display module according to any one of claims 1 to 9; and, A frame, wherein the display module is arranged in the frame.

Images