Display panel, method for manufacturing display panel, and display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation structure, a light-emitting layer, a first electrode layer and an encapsulation part. When the light-emitting layer is prepared, a large difference is generated at the edge of the isolation structure, and the light-emitting layer is difficult to connect, thereby being broken. The light-emitting layer is broken to form light-emitting units which are disconnected from each other and located in an isolation opening. The precise mask plate is not needed, the development and use of the precise mask plate are reduced, and the preparation cost is reduced. At least part of the encapsulation part comprises a first sublayer, a protective layer and a second sublayer. The three-layer structure of the first sublayer, the protective layer and the second sublayer makes the encapsulation part have a greater thickness, improves the encapsulation capacity and etching resistance of the encapsulation part, and improves the step-by-step preparation of the light-emitting units with different light-emitting colors. When the light-emitting units are prepared later, the encapsulation part corresponding to the light-emitting units prepared earlier is prone to over-etching damage, the light-emitting units prepared earlier are etched, and the problem of dark spots is generated.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide application range, becoming the mainstream display device.

[0003] Traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the process performance of current OLED display products needs to be improved. Summary of the Invention

[0005] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the process performance of OLED display products.

[0006] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation openings; a first electrode layer located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion located on a side of the first electrode layer away from the substrate, at least a portion of the encapsulation portion being located in the isolation openings, the encapsulation portion being used to encapsulate the light-emitting unit, wherein at least a portion of the encapsulation portion comprises a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate, a first concave space being formed on a side of the isolation structure, the protective layer at least comprising an extending portion, and the extending portion being located in the first concave space.

[0007] According to an embodiment of the first aspect of the present application, the first sub-layer encloses a second concave space at the first concave space, and the protruding portion is located in the second concave space.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the second sublayer contacts the first sublayer on the circumferential side and encloses a closed space, the protective layer is located in the closed space, and the orthographic projection of the light-emitting unit corresponding to the protective layer on the substrate is located within the orthographic projection of the protective layer on the substrate.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, at least part of the first electrodes are in contact with the isolation structure on one side in the first direction and are spaced apart from the isolation structure on the other side.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the protruding portion is located in the second concave space close to the isolation structure on the other side in the first direction; and / or the protruding portion fills the second concave space close to the isolation structure on one side in the first direction.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode includes a first section and a second section that are interconnected, the orthographic projection of the second section on the substrate is located within the orthographic projection of the isolation structure on the substrate, and the thickness of the first section is greater than or equal to the thickness of the second section.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of at least part of the second section on the substrate is located within the orthographic projection of the protective layer on the substrate; and / or, the orthographic projection of the part of the second section located on the other side of the first section in the first direction is located within the orthographic projection of the protective layer on the substrate; and / or, the first electrode is spaced from the isolation structure on the other side of the first direction to form a gap, and the orthographic projection of at least part of the gap on the substrate is located within the orthographic projection of the protective layer on the substrate; and / or, the minimum distance between the surface of the protective layer facing away from the substrate and the substrate is a first distance, the first sublayer includes a first subsection located on the side of the second section facing away from the substrate and in contact with the second section, the maximum distance between the surface of the first subsection facing away from the substrate and the substrate is a second distance, and the first distance is greater than the second distance.

[0013] According to any of the foregoing embodiments of the first aspect of the present application, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the isolation opening includes a first isolation opening and a second isolation opening, the first light-emitting unit is located in the first isolation opening, and the second light-emitting unit is located in the second isolation opening, and in at least one of the first isolation opening and the second isolation opening, the encapsulation portion includes a first sublayer, a protective layer and a second sublayer stacked in sequence in a direction away from the substrate, the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different, the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the packaging part corresponding to the first isolation opening is greater than or equal to the thickness of the packaging part corresponding to the second isolation opening; and / or the thickness of the protective layer in the first isolation opening is greater than the thickness of the protective layer in the second isolation opening.

[0015] According to any of the foregoing embodiments of the first aspect of the present application, the light-emitting unit also includes a third light-emitting unit, the isolation opening also includes a third isolation opening, the third light-emitting unit is located in the third isolation opening, and in the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sub-layer and a second sub-layer that are stacked and fully contacted, the first light-emitting unit, the second light-emitting unit and the third light-emitting unit have different luminous colors, and the thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging part corresponding to the first isolation opening and the second isolation opening.

[0016] According to any of the foregoing embodiments of the first aspect of the present application, in the same packaging part, the thickness of the first sub-layer is greater than or equal to the thickness of the second sub-layer; and / or the thickness of the protective layer is greater than or equal to the thickness of the first sub-layer, and / or the thickness of the protective layer is greater than or equal to the thickness of the second sub-layer.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, and the pixel opening and the isolation opening are connected; the display panel further includes a second electrode located between the substrate and the light-emitting unit, and at least a portion of the second electrode is exposed by the pixel opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; the first layer includes a conductive material; and / or, the second layer includes a conductive material or an insulating material; and / or, the first layer and the second layer both include metal materials, and the materials of the first layer and the second layer are different; and / or, the isolation structure also includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0019] The second aspect of the present application provides a display panel, which includes: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting layer located on one side of the substrate, the light-emitting layer including a light-emitting unit at least partially located in the isolation openings; a first electrode layer located on the side of the light-emitting layer away from the substrate, the first electrode layer including a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion located on the side of the light-emitting layer away from the substrate, at least a portion of the encapsulation portion located in the isolation openings, the encapsulation portion being used to encapsulate the light-emitting units, wherein at least a portion of the encapsulation portion includes a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate, a first concave space is formed on the side of the isolation structure, the protective layer includes at least an extending portion, the first sublayer encloses a second concave space at the first concave space, the extending portion is located in the second concave space, and in the same encapsulation portion, the thickness of the first sublayer is greater than or equal to the thickness of the second sublayer.

[0020] An embodiment of a third aspect of the present application provides a method for manufacturing a display panel, the method comprising:

[0021] An isolation structure is prepared on the substrate, wherein the isolation structure encloses a plurality of isolation openings, wherein the isolation openings include a first isolation opening;

[0022] A first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer are prepared in sequence on the substrate, and the first light-emitting material layer, the first electrode material layer, the first material layer, the second material layer and the third material layer are patterned to form a first light-emitting unit, a first sub-electrode and a first packaging portion that are at least partially located within the first isolation opening. The first packaging portion includes a first sub-layer, a protective layer and a second sub-layer stacked in sequence in a direction away from the substrate. A first concave space is formed on the side of the isolation structure, and the protective layer includes at least an extending portion, which is located within the first concave space.

[0023] According to an embodiment of the third aspect of the present application, the steps of sequentially preparing a first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer, and a third material layer on a substrate include:

[0024] A first light-emitting material layer, a first electrode material layer and a first material layer are sequentially prepared on the substrate, wherein the first material layer is recessed in the first isolation opening toward the substrate to form a first groove;

[0025] preparing a fluid material layer in the first groove and solidifying the fluid material layer to form a second material layer located in the first groove;

[0026] A third material layer is prepared on the side of the second material layer facing away from the substrate.

[0027] According to any of the aforementioned embodiments of the third aspect of the present application, the second sub-layer contacts the first sub-layer on the circumferential side and encloses a closed space, and the protective layer is located in the closed space; and / or, the material of the fluid material layer includes an organic material; and / or, the material of the fluid material layer includes at least one of PLN, MLA, OC, PR, and IJP; and / or, the material of the first material layer includes an inorganic material; and / or, the material of the second material layer includes an organic material; and / or, the material of the third material layer includes an inorganic material.

[0028] According to any of the aforementioned embodiments of the third aspect of the present application, the isolation structure further includes a second isolation opening. After forming the first light-emitting unit, the first sub-electrode, and the first encapsulation portion at least partially within the first isolation opening, the method includes:

[0029] A second light-emitting material layer, a second electrode material layer, and a second packaging material layer are prepared on the substrate, and the second light-emitting material layer, the second electrode material layer, and the second packaging material layer are patterned to form a second light-emitting unit, a second sub-electrode, and a second packaging portion that is at least partially located within the second isolation opening, and the second packaging portion includes a first sub-layer, a protective layer, and a second sub-layer stacked in sequence in a direction away from the substrate.

[0030] According to any of the aforementioned embodiments of the third aspect of the present application, the isolation structure further includes a third isolation opening. After forming a second light-emitting unit, a second sub-electrode, and a second encapsulation portion at least partially within the second isolation opening, the method includes:

[0031] A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer, the third electrode material layer and the third encapsulation material layer are patterned to form a third light-emitting unit, a third sub-electrode and a third encapsulation part that are at least partially located within the third isolation opening, and the material of the third encapsulation part includes an inorganic material.

[0032] An embodiment of the fourth aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments, or a display panel prepared by the preparation method according to any of the embodiments.

[0033] According to an embodiment of the present application, a display panel includes a substrate, an isolation structure, a light-emitting layer, a first electrode layer, and an encapsulation portion. During fabrication of the light-emitting layer, a significant drop occurs at the edge of the isolation structure, making it difficult to connect and resulting in fracture. The fractured light-emitting layer forms light-emitting units that are disconnected and located within the isolation opening. This eliminates the need for a precision mask, reducing the development and use of precision masks and lowering fabrication costs. The encapsulation portion is used to encapsulate the light-emitting units to increase their service life. At least a portion of the encapsulation portion includes a first sublayer, a protective layer, and a second sublayer. The three-layer structure of the first, protective, and second sublayers provides a greater thickness for the encapsulation portion, improving its encapsulation and etching resistance. The isolation structure is recessed away from the isolation opening to form a first recessed space. The protective layer includes at least an extension located within the first recessed space. This improves the stepwise fabrication of light-emitting units of different luminous colors. When fabricating a light-emitting unit later, over-etching damage to the encapsulation portion corresponding to the previously fabricated light-emitting unit is likely to occur, resulting in etching of the previously fabricated light-emitting unit and the generation of dark spots. This improves the process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0035] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0036] Figure 2 is a partial top view schematic diagram of a display panel provided in an embodiment of the present application;

[0037] Figure 3is a partial cross-sectional view of a display panel in another embodiment;

[0038] Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment;

[0039] Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0040] Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment;

[0041] Figure 7 This is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0042] Figures 8 to 14 This is a diagram of a manufacturing process of a display panel provided in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 10. Display panel;

[0045] 100. Substrate;

[0046] 200, isolation structure; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening; 241, first isolation opening; 242, second isolation opening; 243, third isolation opening;

[0047] 300, light-emitting layer; 310, light-emitting unit; 311, first light-emitting unit; 312, second light-emitting unit; 313, third light-emitting unit;

[0048] 400, first electrode layer; 410, first electrode; 411, first subsection; 412, second subsection; 420, gap;

[0049] 500, pixel definition layer; 510, pixel defining portion; 520, pixel opening; 530, second electrode;

[0050] 601, first material layer; 601a, first groove; 602, second material layer; 603, third material layer; 604, fourth material layer; 605, fifth material layer; 606, sixth material layer; 610, encapsulation portion; 611, first encapsulation portion; 612, second encapsulation portion; 613, third encapsulation portion; 620, first sublayer; 630, protective layer; 631, protruding portion; 640, second sublayer; 650, first recessed space; 660, second recessed space;

[0051] D1, first distance; D2, second distance;

[0052] X, first direction. DETAILED DESCRIPTION

[0053] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0054] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0055] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0056] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Hereinafter, embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described with reference to the accompanying drawings.

[0057] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0058] See also Figures 1 to 3 , Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 is a partial top view schematic diagram of a display panel provided in an embodiment of the present application; Figure 3 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0059] like Figures 1 to 3 As shown, the first embodiment of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 200, which is located on one side of the substrate 100 and encloses a plurality of isolation openings 240; a light-emitting layer 300, which is located on one side of the substrate 100 and includes a light-emitting unit 310 at least partially located in the isolation openings 240; a first electrode layer 400, which is located on a side of the light-emitting layer 300 facing away from the substrate 100 and includes a plurality of first electrodes 410 located in the plurality of isolation openings 240. The electrode 410 is electrically connected to the isolation structure 200; the encapsulation portion 610 is located on the side of the light-emitting layer 300 away from the substrate 100, and at least part of the encapsulation portion 610 is located in the isolation opening 240. The encapsulation portion 610 is used to encapsulate the light-emitting unit 310, wherein at least part of the encapsulation portion 610 includes a first sublayer 620, a protective layer 630 and a second sublayer 640 stacked in sequence in a direction away from the substrate 100, and a first concave space 650 is formed on the side of the isolation structure 200, and the protective layer 630 includes at least an extending portion 631, and the extending portion 631 is located in the first concave space 650.

[0060] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first electrode layer 400, and an encapsulation portion 610. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, making it difficult to connect, and thus breaking. The light-emitting layer 300 breaks to form light-emitting units 310 that are disconnected from each other and located within the isolation opening 240. This eliminates the need for a precision mask, reduces the development and use of precision masks, and reduces manufacturing costs. The encapsulation portion 610 is used to encapsulate the light-emitting unit 310 to increase the service life of the light-emitting unit 310. At least part of the encapsulation part 610 includes a first sublayer 620, a protective layer 630 and a second sublayer 640. The three-layer structure of the first sublayer 620, the protective layer 630 and the second sublayer 640 makes the encapsulation part 610 have a larger thickness, thereby improving the encapsulation ability and etching resistance of the encapsulation part 610, and the isolation structure 200 is recessed in the direction away from the isolation opening 240 to form a first concave space 650. The protective layer 630 includes at least an extension portion 631, and the extension portion 631 is located in the first concave space 650, thereby improving the step-by-step preparation of light-emitting units 310 with different luminous colors. When the light-emitting unit 310 is prepared later, it is easy to cause over-engraving damage to the encapsulation part 610 corresponding to the light-emitting unit 310 that has been prepared first, resulting in the etching of the light-emitting unit 310 prepared first, resulting in the problem of dark spots, thereby improving the process performance of the display panel 10.

[0061] The isolation structure 200 is recessed in a direction away from the isolation opening 240 to form a first recessed space 650. The protective layer 630 includes at least an extending portion 631, which is located within the first recessed space 650. The extending portion 631 fills the first recessed space 650 to prevent the weak portions of the encapsulation portion 610 and the first electrode 410 exposed by the first recessed space 650 from being easily etched, which could cause etching of the previously prepared light-emitting unit 310.

[0062] Optionally, the first sublayer 620 forms a second recessed space 660 at the first recessed space 650, and the extending portion 631 is located in the second recessed space 660. The extending portion 631 fills the second recessed space 660 to prevent the weak portions of the encapsulation portion 610 and the first electrode 410 exposed by the second recessed space 660 from being easily etched, thereby preventing the previously prepared light-emitting unit 310 from being etched.

[0063] Optionally, the second sub-layer 640 is in contact with the first sub-layer 620 at its periphery and encloses a closed space, the protective layer 630 is located within the closed space, and the orthographic projection of the light-emitting unit 310 corresponding to the protective layer 630 on the substrate 100 is located within the orthographic projection of the protective layer 630 on the substrate 100. The second sub-layer 640 is in contact with the first sub-layer 620 at its periphery and encloses a closed space, and the protective layer 630 is located within the closed space. The protective layer 630 is enclosed by the first sub-layer 620 and the second sub-layer 640, thereby preventing the protective layer 630 from being exposed. This would easily cause the protective layer 630 to be etched away in a subsequent etching process, resulting in etching of the previously prepared light-emitting unit 310 and the generation of dark spots.

[0064] The isolation structure 200 separates the first electrode layer 400 to form mutually spaced first electrodes 410 . The mutually spaced first electrodes 410 are electrically connected through the isolation structure 200 to ensure normal light emission of the light emitting unit 310 .

[0065] The light emitting unit 310 corresponding to the protection layer 630 refers to the light emitting unit 310 located in the same isolation opening 240 as the protection layer 630 .

[0066] See also Figure 4 , Figure 4 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0067] like Figure 4 As shown, in some optional embodiments, at least part of the first electrode 410 is in contact with the isolation structure 200 on one side in the first direction X, and is spaced apart from the isolation structure 200 on the other side (eg Figure 4 (large dashed box in the figure).

[0068] In the optional embodiments, by controlling the evaporation process, the first electrode 410 is offset during evaporation, one side of the first electrode 410 overlaps with the isolation structure 200, and the other side of the first electrode 410 is spaced apart from the isolation structure 200, so that the first electrode 410 has a larger overlap area with the isolation structure 200 on one side, thereby improving the overlap effect of the first electrode 410 and the isolation structure 200. In order to realize the one-side overlap of the first electrode 410, when evaporating the material of the first electrode 410, one evaporation can form the first electrode 410 which is one-side overlapped with the isolation structure 200, and improve the overlap area of the first electrode 410 on the overlap side and the isolation structure 200, thereby simplifying the preparation process. When the first electrode 410 overlaps with the isolation structure 200 on one side and is spaced apart from the isolation structure 200 on the other side, the light emitting unit 310 is easily exposed from the gap 420 between the first electrode 410 and the isolation structure 200 on the side where the first electrode 410 is spaced apart from the isolation structure 200. In the subsequent process, this part of the light emitting unit 310 is more easily damaged by etching and thus fails. Therefore, the encapsulation layer with the three-layer structure of the first sub-layer 620, the protection layer 630 and the second sub-layer 640 is used to encapsulate and protect the light emitting unit 310, which can improve the problem that the light emitting unit 310 is easily damaged by etching and thus appears dark spots.

[0069] Optionally, the protruding part 631 is located in the second recessed space 660 close to the other side isolation structure 200 in the first direction X. That is, the protruding part 631 is arranged in the second recessed space 660 on the non-overlapping side of the first electrode 410. Since the light emitting unit 310 is more easily damaged by etching after the encapsulation part 610 is etched on the non-overlapping side of the first electrode 410, the protruding part 631 is filled in the second recessed space 660 on the non-overlapping side to form etching protection on the non-overlapping side.

[0070] Optionally, the protruding part 631 fills the second recessed space 660 close to the other side isolation structure 200 in the first direction X, further improving the etching protection effect of the protruding part 631.

[0071] Optionally, the protruding part 631 fills the second recessed space 660 close to the other side isolation structure 200 in the first direction X, further improving the etching protection effect of the protruding part 631.

[0072] The substrate 100 can have various arrangement modes. For example, the substrate 100 can include a substrate and an array substrate arranged on the substrate. Alternatively, the substrate 100 is the substrate. Alternatively, the substrate 100 includes a buffer layer on the side away from the substrate and a support plate, etc.

[0073] As shown in FIG. 1, the substrate 100 includes a substrate 110 and an array substrate 120 arranged on the substrate 110. Figure 3As shown, in some optional embodiments, the light-emitting unit 310 includes a first light-emitting unit 311 and a second light-emitting unit 312, the isolation opening 240 includes a first isolation opening 241 and a second isolation opening 242, the first light-emitting unit 311 is located within the first isolation opening 241, and the second light-emitting unit 312 is located within the second isolation opening 242. In at least one of the first isolation opening 241 and the second isolation opening 242, the encapsulation portion 610 includes a first sub-layer 620, a protective layer 630, and a second sub-layer 640 stacked sequentially in a direction away from the substrate 100. This embodiment takes the first light-emitting unit 311 as an example, fabricated first, followed by the second light-emitting unit 312.

[0074] In these optional embodiments, when the packaging part 610 within the first isolation opening 241 includes a first sublayer 620, a protective layer 630 and a second sublayer 640, the three-layer packaging part 610 has better etching resistance, forming etching protection for the first light-emitting unit 311, so as to improve the preparation of the second light-emitting unit 312 and the corresponding packaging part 610 after the first light-emitting unit 311 and the corresponding packaging part 610 are completed. The preparation process of the second light-emitting unit 312 and the corresponding packaging part 610 involves an etching process, which easily causes over-etching of the packaging part 610 corresponding to the first light-emitting unit 311, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. When the encapsulation portion 610 within the second isolation opening 242 includes a first sublayer 620, a protective layer 630, and a second sublayer 640, the three-layer structure of the encapsulation portion 610 has better etching resistance, providing etching protection for the second light-emitting unit 312. This improves the problem of over-etching the encapsulation portion 610 corresponding to the second light-emitting unit 312 during subsequent preparation of the light-emitting unit 310, resulting in etching damage to the second light-emitting unit 312 and the generation of dark spots. Optionally, the encapsulation portion 610 within both the first isolation opening 241 and the second isolation opening 242 includes a first sublayer 620, a protective layer 630, and a second sublayer 640 to improve the etching protection capability for the first light-emitting unit 311 and the second light-emitting unit 312.

[0075] Optionally, the first light emitting unit 311 and the second light emitting unit 312 emit different colors. For example, the first light emitting unit 311 emits red light, and the second light emitting unit 312 emits green light.

[0076] In some optional embodiments, the material of the protective layer 630 includes an organic material. For example, the material of the protective layer 630 includes one or more of OC optical adhesive, microlens array (MLA), inkjet printing material (IJP), planarization material (PLN), and positive resist (PR).

[0077] In these optional embodiments, the protective layer 630 made of organic material has better leveling and filling capabilities. After the first sub-layer 620 is prepared, the protective layer 630 is formed on the first sub-layer 620. This allows the encapsulation portion 610 to have a greater thickness at all locations within the isolation opening 240, avoiding the problem of weak thickness areas that could easily cause over-etching in subsequent processes, resulting in damage to the light-emitting unit 310. The material of the protective layer 630 can also be other materials that can provide protection and transmit light.

[0078] Optionally, the material of the first sub-layer 620 and the second sub-layer 640 includes an inorganic material. The inorganic material has good density and good barrier capability against water and oxygen, thereby improving the packaging effect of the packaging part 610.

[0079] Optionally, the orthographic projection of the light emitting unit 310 on the substrate 100 is located within the orthographic projection of the protection layer 630 on the substrate 100 , thereby improving the etching protection effect of the protection layer 630 on the light emitting unit 310 .

[0080] In some optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 is greater than or equal to the thickness of the packaging portion 610 corresponding to the second isolation opening 242 .

[0081] The encapsulation portion 610 corresponding to the first isolation opening 241 refers to the encapsulation portion 610 partially located within the first isolation opening 241. The encapsulation portion 610 corresponding to the second isolation opening 242 refers to the encapsulation portion 610 partially located within the second isolation opening 242. The thickness of the encapsulation portion 610 refers to the dimension of the encapsulation portion 610 in the thickness direction of the display panel 10.

[0082] In these optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 is greater, so that the packaging portion 610 corresponding to the first isolation opening 241 has better etching resistance. For example, the light-emitting unit 310 is divided into three preparations: the first light-emitting unit 311, the second light-emitting unit 312 and the third light-emitting unit 313. In the preparation processes of the second light-emitting unit 312 and the third light-emitting unit 313, etching damage will be caused to the first light-emitting unit 311 and the corresponding packaging portion 610. Therefore, the packaging portion 610 corresponding to the first isolation opening 241 has a greater thickness, thereby having the ability to resist etching damage in the preparation processes of the second light-emitting unit 312 and the third light-emitting unit 313, so as to improve the problem that the first light-emitting unit 311 is etched and damaged, resulting in dark spots in the display panel 10.

[0083] In some optional embodiments, the thickness of the protective layer 630 in the first isolation opening 241 is greater than the thickness of the protective layer 630 in the second isolation opening 242. The thickness of the protective layer 630 refers to the dimension of the protective layer 630 in the thickness direction of the display panel 10.

[0084] In these optional embodiments, the thickness of the protective layer 630 within the first isolation opening 241 is set to be larger, so that the overall thickness of the packaging part 610 corresponding to the first isolation opening 241 is larger, thereby having the ability to resist etching damage in the preparation process of the second light-emitting unit 312 and the third light-emitting unit 313, so as to improve the problem of the first light-emitting unit 311 being damaged by etching, resulting in dark spots in the display panel 10.

[0085] Optionally, the thickness of the first sub-layer 620 of each packaging part 610 is equal, and the first sub-layer 620 of each packaging part 610 can be prepared simultaneously.

[0086] Optionally, the second sub-layers 640 of each packaging part 610 have the same thickness, and the second sub-layers 640 of each packaging part 610 can be prepared simultaneously.

[0087] In some optional embodiments, the light-emitting unit 310 further includes a third light-emitting unit 313, the isolation opening 240 further includes a third isolation opening 243, and the third light-emitting unit 313 is located in the third isolation opening 243. In the third isolation opening 243, the encapsulation portion 610 corresponding to the third light-emitting unit 313 includes a first sub-layer 620 and a second sub-layer 640 that are stacked and in full contact. Full contact between the first sub-layer 620 and the second sub-layer 640 means that the surface of the first sub-layer 620 facing the second sub-layer 640 is in contact with the second sub-layer 640, and no other film layer is disposed between the first sub-layer 620 and the second sub-layer 640.

[0088] In these optional embodiments, the encapsulation portion 610 corresponding to the third isolation opening 243 includes only the first sublayer 620 and the second sublayer 640, eliminating the need for a protective layer 630. This reduces the material usage of the protective layer 630 and lowers costs. Because the third light-emitting unit 313 and its corresponding encapsulation portion 610 are fabricated last and are not subject to etching damage, a protective layer 630 is not required to enhance the etching resistance of the encapsulation portion 610 corresponding to the third light-emitting unit 313.

[0089] Optionally, the first light emitting unit 311, the second light emitting unit 312 and the third light emitting unit 313 emit different colors. For example, the first light emitting unit 311 emits red, the second light emitting unit 312 emits green, and the third light emitting unit 313 emits blue.

[0090] In some optional embodiments, the thickness of the packaging portion 610 corresponding to the third isolation opening 243 is smaller than the thickness of the packaging portion 610 corresponding to the first isolation opening 241 and the second isolation opening 242 .

[0091] In these optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 and the second isolation opening 242 is set to be larger, so as to have the ability to resist etching damage in the subsequent preparation process of the light-emitting unit 310, so as to improve the problem that the first light-emitting unit 311 and the second light-emitting unit 312 are damaged by etching, resulting in dark spots in the display panel 10.

[0092] In some optional embodiments, in the same packaging portion 610 , the thickness of the first sub-layer 620 is greater than or equal to the thickness of the second sub-layer 640 .

[0093] In these optional embodiments, since the first sub-layer 620 is prepared first, after the preparation of the first sub-layer 620 is completed, it is easily affected by the etching in the subsequent process. The thickness of the first sub-layer 620 is set to be larger, so that the etching resistance of the first sub-layer 620 is improved, which can improve the problem that the thickness of the first sub-layer 620 is too thin, resulting in the first sub-layer 620 being over-etched in the subsequent process, the light-emitting unit 310 being exposed and damaged by etching, and dark spots appearing on the display panel 10.

[0094] In some optional embodiments, the thickness of the protective layer 630 is greater than or equal to the thickness of the first sub-layer 620 , and / or the thickness of the protective layer 630 is greater than or equal to the thickness of the second sub-layer 640 .

[0095] In these optional embodiments, the thickness of the protective layer 630 is greater than the thickness of the first sublayer 620 or the second sublayer 640, that is, the protective layer 630 has a greater thickness, and the encapsulation part 610 has better etching resistance, forming etching protection for the light-emitting unit 310, so as to improve the problem that when the subsequent light-emitting unit 310 is prepared, the encapsulation part 610 corresponding to the previously prepared light-emitting unit 310 is easily over-etched, resulting in etching damage to the light-emitting unit 310 and the generation of dark spots.

[0096] like Figure 4 As shown, in some optional embodiments, the first electrode 410 includes a first section 411 and a second section 412 that are interconnected, the orthographic projection of the second section 412 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100, and the thickness of the first section 411 is greater than or equal to the thickness of the second section 412.

[0097] In these optional embodiments, the first section 411 has a greater thickness, so that the first section 411 has better etching resistance, thereby preventing the first section 411 from being etched and failing in subsequent processes.

[0098] Optionally, at least part of the orthographic projection of the second section 412 on the substrate 100 is located within the orthographic projection of the protective layer 630 on the substrate 100, and the protective layer 630 covers at least part of the area where the second section 412 is located to form etching protection for the first electrode 410 in the weak thickness area.

[0099] Optionally, the part of the second division 412 located on the other side of the first division 411 in the first direction X is located within the orthographic projection of the protective layer 630 on the substrate 100, and the part of the second division 412 adjacent to the spaced isolation structure 200 is covered and protected by the protective layer 630 to form etching protection for this part of the second division 412.

[0100] Optionally, the first electrode 410 is separated from the isolation structure 200 on the other side of the first direction X to form a gap 420, and at least part of the gap 420 is located within the positive projection of the protective layer 630 on the substrate 100. Since the first electrode 410 does not form an etching barrier in the area where the gap 420 is located, when the packaging part 610 is etched through at this position, the underlying film layer is easily etched and damaged. Therefore, a protective layer 630 is set to cover the area where the gap 420 is located to form etching protection for the area where the gap 420 is located, thereby improving the problem that the underlying film layer is easily etched and damaged.

[0101] See also Figure 5 , Figure 5 FIG. 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0102] like Figure 5 As shown, optionally, the minimum distance between the surface of the protective layer 630 on the side facing away from the substrate 100 and the substrate 100 is a first distance D1, the first sub-layer 620 includes a first sub-portion located on the side of the second section 412 facing away from the substrate 100 and in contact with the second section 412, the maximum distance between the surface of the first sub-portion on the side facing away from the substrate 100 and the substrate 100 is a second distance D2, the first distance D1 is greater than the second distance D2, that is, the protective layer 630 is arranged higher than the first sub-portion, so that the protective layer 630 covers the weak thickness area of ​​the first sub-layer 620 on the peripheral side, thereby forming etching protection for the weak thickness area.

[0103] Optionally, the first sub-layer 620 further includes a second sub-portion located on the side of the first sub-portion 411 facing away from the substrate 100 , the second sub-portion is interconnected with the first sub-portion, and the thickness of the second sub-portion is greater than that of the first sub-portion.

[0104] Optionally, the orthographic projection of the first sub-section on the substrate 100 coincides with the orthographic projection of the second section 412 on the substrate 100, and the area where the second section 412 is located is the area where the first sub-section is located. This area and the area located on the side of this area facing the isolation structure 200 are both weak thickness areas. The first sub-layer 620 is more easily etched through in the weak thickness area. Therefore, after setting the protective layer 630, the protective layer 630 can fill and protect the weak thickness area to improve the etching resistance of the packaging part 610.

[0105] In some optional embodiments, the display panel 10 further includes: a pixel definition layer 500 located on one side of the substrate 100 , the pixel definition layer 500 including a pixel defining portion 510 and a pixel opening 520 enclosed by the pixel defining portion 510 , the pixel opening 520 being connected to the isolation opening 240 .

[0106] In these optional embodiments, the pixel defining portion 510 of the pixel definition layer 500 encloses a pixel opening 520 to accommodate the light-emitting unit 310 and ensure normal light emission of the light-emitting unit 310. Furthermore, the pixel defining portion 510 defines the placement area of ​​each light-emitting unit 310, thereby reducing color crosstalk between the light-emitting units 310.

[0107] Optionally, the material of the pixel defining portion 510 includes an inorganic material or an organic material.

[0108] Optionally, the display panel 10 further includes a second electrode 530 located between the substrate 100 and the light-emitting unit 310. At least a portion of the second electrode 530 is exposed by the pixel opening 520 to serve as an electrode of the light-emitting unit 310, driving the light-emitting unit 310 to emit light. One of the first electrode 410 and the second electrode 530 serves as an anode of the light-emitting unit 310, and the other serves as a cathode of the light-emitting unit 310. This embodiment of the present application uses the first electrode 410 as the cathode of the light-emitting unit 310 and the second electrode 530 as the anode of the light-emitting unit 310 as an example.

[0109] In some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on a side of the first layer 210 facing away from the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0110] In these optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100. The first layer 210 and the second layer 220 are stacked to form the isolation structure 200. The orthographic projection of the first layer 210 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100. The area of ​​the second layer 220 is larger than the area of ​​the first layer 210. The second layer 220 covers the surface of the first layer 210 close to the second layer 220. At this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large step at the edge of the isolation structure 200, and the first layer 210 is concave relative to the second layer 220. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, and thus breaks. The light-emitting layer 300 breaks to form light-emitting units 310 that are disconnected from each other, thereby reducing the crosstalk of carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting unit 310 can be prepared without the use of a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs.

[0111] Optionally, the first layer 210 includes a conductive material, for example, the first layer 210 includes a non-metallic conductive material or a metallic conductive material.

[0112] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material.

[0113] In these optional embodiments, the second layer 220 includes a conductive material, for example, a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to etch during wet etching of the first layer 210 using an etching solution, thereby making it easier for the first layer 210 to be concave relative to the second layer 220.

[0114] In some optional embodiments, both the first layer 210 and the second layer 220 include metal materials, and the materials of the first layer 210 and the second layer 220 are different.

[0115] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, an etchant can be used to wet-etch the first layer 210. By configuring the etchant, the etching rate of the second layer 220 can be lower than the etching rate of the first layer 210. Since the etching rate of the first layer 210 is higher, even though the second layer 220 will be etched to some extent during wet etching with the etchant, the first layer 210 will be etched faster, thereby causing the first layer 210 to be recessed relative to the second layer 220.

[0116] See also Figure 6 , Figure 6 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0117] like Figure 6 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0118] In these optional embodiments, to obtain the concave first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thereby forming the concave first layer 210. Due to the faster etching rate of the first layer 210, the etching waste generated is more likely to enter other locations of the display panel 10, thereby causing adverse effects. After the third layer 230 is provided, the first layer 210 can be well adhered to the third layer 230, and the generated etching waste falls on the third layer 230, making it easier to clean.

[0119] Optionally, the display panel 10 further includes a second encapsulation layer located on a side of the encapsulation portion 610 facing away from the substrate 100 .

[0120] Optionally, the material of the second encapsulation layer includes organic material.

[0121] Optionally, the display panel 10 further includes a third encapsulation layer located on a side of the second encapsulation layer facing away from the substrate 100 .

[0122] Optionally, the material of the third encapsulation layer includes an inorganic material.

[0123] Optionally, the light-emitting material layer includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL). The light-emitting unit 310 includes only at least one of the electron injection layer (EIL), the electron transport layer (ETL), the light-emitting material layer, the hole injection layer (HIL), and the hole transport layer (HTL), and does not include structures such as the first electrode 410 and the second electrode 530.

[0124] like Figures 1 to 6As shown, the second aspect of the present application provides a display panel 10, the display panel 10 comprises: a substrate 100; an isolation structure 200 located on one side of the substrate 100, the isolation structure 200 encloses to form a plurality of isolated openings 240; a light-emitting layer 300 located on one side of the substrate 100, the light-emitting layer 300 comprises a light-emitting unit 310 located at least partially in the isolated opening 240; a first electrode layer 400 located on the side of the light-emitting layer 300 away from the substrate 100, the first electrode layer 400 comprises a plurality of first electrodes 410 located in the plurality of isolated openings 240, the first electrode 410 is electrically connected with the isolation structure 200; an encapsulation part 610 located on the side of the light-emitting layer 300 away from the substrate 100, at least part of the encapsulation part 610 is located in the isolated opening 240, the encapsulation part 610 is used for encapsulating the light-emitting unit 310, wherein at least part of the encapsulation part 610 comprises a first sub-layer 620, a protective layer 630 and a second sub-layer 640 stacked in turn along the direction away from the substrate 100, the isolation structure 200 side forms a first recessed space 650, the first sub-layer 620 encloses a second recessed space 660 at the first recessed space 650, and the protruding part 631 is located in the second recessed space 660, in the same encapsulation part 610, the thickness of the first sub-layer 620 is greater than or equal to the thickness of the second sub-layer 640.

[0125] According to the display panel 10 of the present application, the display panel 10 comprises the substrate 100, the isolation structure 200, the light-emitting layer 300, the first electrode layer 400 and the encapsulation part 610. When the light-emitting layer 300 is prepared, the light-emitting layer 300 produces a large difference at the edge of the isolation structure 200, which is difficult to connect, thereby breaking, and the light-emitting layer 300 breaks to form the light-emitting unit 310 which is disconnected from each other and located in the isolated opening 240. Without using a precision mask plate, the development and use of the precision mask plate can be reduced, and the preparation cost is reduced. The encapsulation part 610 is used for encapsulating the light-emitting unit 310, so as to improve the service life of the light-emitting unit 310. The protruding part 631 fills the second recessed space 660, avoiding that the weak part of the encapsulation part 610 and the first electrode 410 exposed from the second recessed space 660 is easily affected by etching, thereby avoiding the problem that the light-emitting unit 310 prepared first is etched. Since the first sub-layer 620 is prepared first, the first sub-layer 620 is easily affected by etching in the subsequent process. By setting the thickness of the first sub-layer 620 to be larger, the etching resistance of the first sub-layer 620 is improved, thereby avoiding the problem that the thickness of the first sub-layer 620 is too thin, the first sub-layer 620 is over-etched in the subsequent process, the light-emitting unit 310 is exposed and damaged by etching, and the display panel 10 has a dark spot.

[0126] In the present embodiment, other structures can refer to the foregoing related descriptions, which will not be described here.

[0127] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0128] See also Figures 1 to 14 , Figure 7 This is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application; Figures 8 to 14 This is a diagram of a manufacturing process of a display panel provided in an embodiment of the present application.

[0129] like Figures 1 to 14 As shown, an embodiment of the third aspect of the present application provides a method for manufacturing a display panel 10, the method comprising:

[0130] Step S01: preparing an isolation structure 200 on a substrate 100 , wherein the isolation structure 200 encloses a plurality of isolation openings 240 , wherein the isolation openings 240 include a first isolation opening 241 ;

[0131] Step S02: Prepare a first light-emitting material layer, a first electrode material layer, a first material layer 601, a second material layer 602 and a third material layer 603 in sequence on the substrate 100, and pattern the first light-emitting material layer, the first electrode material layer, the first material layer 601, the second material layer 602 and the third material layer 603 to form a first light-emitting unit 311, a first sub-electrode and a first packaging part 611 that are at least partially located within the first isolation opening 241. The first packaging part 611 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640 stacked in sequence in a direction away from the substrate 100. A first recessed space 650 is formed on the side of the isolation structure 200. The protective layer 630 includes at least an extending portion 631, and the extending portion 631 is located within the first recessed space 650.

[0132] According to the preparation method of the embodiment of the present application, the isolation structure 200 is prepared by step S01. The first light-emitting unit 311, the first sub-electrode and the first packaging part 611 are prepared by step S02. When the first packaging part 611 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640, the first packaging part 611 with a three-layer structure has better etching resistance, forming etching protection for the first light-emitting unit 311, so as to improve the preparation of the second light-emitting unit 312 and the second packaging part 612 after the preparation of the first light-emitting unit 311 and the first packaging part 611 is completed. The preparation process of the second light-emitting unit 312 and the second packaging part 612 includes an etching process, which easily causes over-etching of the first packaging part 611, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. This can also improve the problem of preparing the third light-emitting unit 313 and the third encapsulation unit 613 after the second light-emitting unit 312 and the second encapsulation unit 612 are prepared. The preparation process of the third light-emitting unit 313 and the third encapsulation unit 613 involves an etching process, which can easily cause over-etching of the first encapsulation unit 611, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. The first material layer 601, the second material layer 602, and the third material layer 603 are sequentially patterned to form a first sub-layer 620, a protective layer 630, and a second sub-layer 640. The preparation process of the second material layer 602 can be inkjet printing or a glue coating process, etc.

[0133] Optionally, the steps of sequentially preparing a first light-emitting material layer, a first electrode material layer, a first material layer 601, a second material layer 602, and a third material layer 603 on the substrate 100 include:

[0134] A first light emitting material layer, a first electrode material layer and a first material layer 601 are sequentially formed on the substrate 100 . The first material layer 601 is recessed in the first isolation opening 241 toward the substrate 100 to form a first groove 601 a .

[0135] A fluid material layer is prepared in the first groove 601 a and the fluid material layer is solidified to form a second material layer 602 located in the first groove 601 a ;

[0136] A third material layer 603 is formed on the side of the second material layer 602 facing away from the substrate 100. In these optional embodiments, the second material layer 602 is formed by forming a fluid material layer (e.g., a wet film) on the first material layer 601 and curing the fluid material layer. Optionally, the fluid material layer includes an organic material. For example, the materials of the fluid material layer and the second material layer 602 include at least one of OCA (Optically Clear Adhesive), MLA, IJP (Inkjet Printing), PLN (Planarization Layer), and PR (Photoresist). Taking OCA as an example, the first step is to mix and form the adhesive: the resin, curing agent, and tackifier are mixed in proportion and deaerated. Next, coating is performed: a release film is applied to a thickness of 25μm-200μm. Pre-curing is then performed: UV irradiation or heat curing is used to establish initial adhesion. Lamination is then performed: pressurized lamination is performed in a cleanroom to the target layer, removing air bubbles. Finally, final curing is performed: further UV / heat curing is performed to achieve the final bond strength (>10 N / cm²). For example, IJP uses a piezoelectric printhead to precisely deposit ink on a designated area of ​​the substrate (inkjet printing), forming a wet film. UV light is then applied in an air environment to trigger a cross-linking reaction, forming a stable thin film. Taking PLN as an example, the process begins with material coating: spin coating or slot-die coating to form a film with a thickness of 1μm-5μm. Pre-curing follows: baking at 80°C-120°C to remove the solvent and form a semi-cured layer. Planarization follows: thermal reflow (150°C-200°C) or chemical mechanical polishing (CMP) to reduce the surface roughness to <1nm. Finally, final curing follows: UV light or high temperature (250°C) for complete crosslinking and a hardness of 3H or higher. For PR, the process begins with material coating and pre-baking: spin coating to form a film (1μm-2μm), followed by curing at 90°C-120°C. Exposure and development follow: exposure through a mask (100mJ / cm²-200mJ / cm²), followed by alkaline developer to remove unexposed areas. Finally, post-baking follows: high-temperature treatment at 210°C-240°C to enhance the film's heat resistance and insulation.

[0137] Optionally, the material of the first material layer 601 includes an inorganic material to form a first sub-layer 620 of an inorganic material.

[0138] Optionally, the second material layer 602 includes an organic material to form a protective layer 630 of an organic material.

[0139] Optionally, the third material layer 603 includes an inorganic material to form a second sub-layer 640 of an inorganic material.

[0140] In some optional embodiments, the isolation structure 200 further includes a second isolation opening 242 . After step S02 , the method includes:

[0141] A second light-emitting material layer, a second electrode material layer and a second packaging material layer are prepared on the substrate 100, and the second light-emitting material layer, the second electrode material layer and the second packaging material layer are patterned to form a second light-emitting unit 312, a second sub-electrode and a second packaging part 612 that are at least partially located within the second isolation opening 242. The second packaging part 612 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640 that are stacked in sequence in a direction away from the substrate 100.

[0142] In these optional embodiments, when the second packaging part 612 includes a first sublayer 620, a protective layer 630 and a second sublayer 640, the three-layer structure of the second packaging part 612 has better etching resistance, forming etching protection for the second light-emitting unit 312, so as to improve the preparation of the third light-emitting unit 313 and the third packaging part 613 after the second light-emitting unit 312 and the second packaging part 612 are prepared. The preparation process of the third light-emitting unit 313 and the third packaging part 613 involves an etching process, which easily causes over-etching of the second packaging part 612, resulting in etching damage to the second light-emitting unit 312 and the generation of dark spots.

[0143] In some optional embodiments, in the step of preparing a second light-emitting material layer, a second electrode material layer, and a second encapsulation material layer on the substrate 100, and patterning the second light-emitting material layer, the second electrode material layer, and the second encapsulation material layer to form a second light-emitting unit 312, a second sub-electrode, and a second encapsulation portion 612 at least partially located within the second isolation opening 242, the method includes:

[0144] Preparing a second light-emitting material layer and a second electrode material layer on the substrate 100;

[0145] On the side of the second electrode material layer facing away from the substrate 100 , a fourth material layer 604 , a fifth material layer 605 and a sixth material layer 606 are sequentially formed;

[0146] The second light-emitting material layer, the second electrode material layer, the fourth material layer 604 , the fifth material layer 605 and the sixth material layer 606 are patterned to form a second light-emitting unit 312 , a second sub-electrode, a first sub-layer 620 , a protective layer 630 and a second sub-layer 640 at least partially located within the second isolation opening 242 .

[0147] In these optional embodiments, the first sub-layer 620 , the protective layer 630 , and the second sub-layer 640 are prepared using three layers of materials to form the second encapsulation portion 612 having a three-layer structure.

[0148] Optionally, the fourth material layer 604 includes an inorganic material to form a first sub-layer 620 of an inorganic material.

[0149] Optionally, the fifth material layer 605 includes an organic material to form a protective layer 630 of an organic material.

[0150] Optionally, the sixth material layer 606 includes an inorganic material to form a second sub-layer 640 of inorganic material.

[0151] In some optional embodiments, the isolation structure 200 further includes a third isolation opening 243 . After forming the second light-emitting unit 312 , the second sub-electrode, and the second encapsulation portion 612 at least partially within the second isolation opening 242 , the method includes:

[0152] A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate 100 and patterned to form a third light-emitting unit 313, a third sub-electrode and a third encapsulation portion 613 that are at least partially located within the third isolation opening 243.

[0153] In these optional embodiments, the third light-emitting unit 313, the third sub-electrode and the third packaging part 613 are prepared last and will not be damaged by subsequent etching. Therefore, there is no need to set a protective layer 630 in the third packaging part 613 to reduce the material usage of the protective layer 630 and reduce material costs.

[0154] Optionally, the material of the third encapsulation part 613 includes an inorganic material.

[0155] The embodiments of the fourth aspect of the present application further provide a display device, comprising the display panel 10 of any of the above-mentioned embodiments, or the display panel 10 produced by the production method of any of the above-mentioned embodiments. Since the display device provided by the embodiments of the fourth aspect of the present application comprises the display panel 10 of any of the above-mentioned embodiments, or the display panel 10 produced by the production method of any of the above-mentioned embodiments, the display device provided by the embodiments of the fourth aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments, or the display panel 10 produced by the production method of any of the above-mentioned embodiments, which will not be further elaborated here.

[0156] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0157] In accordance with the embodiments of the application described above, these embodiments are not meant to be all-inclusive or limiting of the scope of the application. It will be apparent to those having skill in the art that many more modifications than those already described are possible. The present specification has been put forth with a full description for the purpose of enabling others skilled in the art to employ this application and modifications made by others skilled in the art based on the teachings herein. The application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a light-emitting layer, located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation opening; a first electrode layer, located on a side of the light-emitting layer facing away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion, located on a side of the first electrode layer facing away from the substrate, at least a portion of the encapsulation portion being located in the isolation opening, and the encapsulation portion being used to encapsulate the light-emitting unit; Wherein, at least part of the encapsulation portion includes a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate; a first concave space is formed on a side surface of the isolation structure; the protective layer includes at least an extending portion, and the extending portion is located in the first concave space; The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit; the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening; the first light-emitting unit is located in the first isolation opening; the second light-emitting unit is located in the second isolation opening; in at least one of the first isolation opening and the second isolation opening, the encapsulation portion includes the first sublayer, the protective layer, and the second sublayer sequentially stacked in a direction away from the substrate; the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material; The third light-emitting unit is located in the third isolation opening. In the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sublayer and a second sublayer that are stacked and fully contacted. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit have different luminous colors. The thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging parts corresponding to the first isolation opening and the second isolation opening.

2. The display panel according to claim 1, wherein: The first sub-layer forms a second concave space at the first concave space, and the protruding portion is located in the second concave space.

3. The display panel according to claim 1, wherein: The second sublayer contacts the first sublayer on the circumferential side and encloses a closed space, the protective layer is located in the closed space, and the orthographic projection of the light-emitting unit corresponding to the protective layer on the substrate is located within the orthographic projection of the protective layer on the substrate.

4. The display panel according to claim 2, wherein: At least part of the first electrodes contacts the isolation structure on one side in the first direction and is spaced apart from the isolation structure on the other side.

5. The display panel according to claim 4, wherein: The protruding portion is located in the second concave space close to the isolation structure on the other side in the first direction; And / or, the protruding portion fills the second concave space close to the isolation structure on one side in the first direction.

6. The display panel according to claim 4, wherein: The first electrode includes a first subsection and a second subsection connected to each other. The orthographic projection of the second subsection on the substrate is located within the orthographic projection of the isolation structure on the substrate. The thickness of the first subsection is greater than or equal to the thickness of the second subsection.

7. The display panel according to claim 6, wherein: At least a portion of the second sub-portion is located within the orthographic projection of the protective layer on the substrate; And / or, the orthographic projection of a portion of the second subsection located on the other side of the first subsection in the first direction on the substrate is located within the orthographic projection of the protective layer on the substrate; And / or, the first electrode is spaced apart from the isolation structure on the other side of the first direction to form a gap, and at least a portion of the gap is located within the orthographic projection of the protective layer on the substrate; And / or, the minimum distance between the surface of the protective layer facing away from the substrate and the substrate is a first distance, the first sub-layer includes a first sub-portion located on the side of the second portion facing away from the substrate and in contact with the second portion, the maximum distance between the surface of the first sub-portion facing away from the substrate and the substrate is a second distance, and the first distance is greater than the second distance.

8. The display panel according to claim 1, wherein: The thickness of the packaging portion corresponding to the first isolation opening is greater than or equal to the thickness of the packaging portion corresponding to the second isolation opening; And / or, the thickness of the protection layer in the first isolation opening is greater than the thickness of the protection layer in the second isolation opening.

9. The display panel according to claim 1, wherein: In the same encapsulation portion, the thickness of the first sub-layer is greater than or equal to the thickness of the second sub-layer; And / or, the thickness of the protective layer is greater than or equal to the thickness of the first sub-layer, and / or, the thickness of the protective layer is greater than or equal to the thickness of the second sub-layer.

10. The display panel according to claim 1, wherein The display panel further includes: a pixel definition layer located on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening being in communication with the isolation opening; The display panel further includes a second electrode located between the substrate and the light emitting unit, and at least a portion of the second electrode is exposed by the pixel opening.

11. The display panel according to claim 1, wherein The isolation structure includes a first layer and a second layer located on a side of the first layer facing away from the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; The first layer comprises a conductive material, and / or, the second layer comprises a conductive material or an insulating material, and / or, both the first layer and the second layer comprise metal materials and the materials of the first layer and the second layer are different, And / or, the isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

12. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a light-emitting layer, located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation opening; a first electrode layer, located on a side of the light-emitting layer facing away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion, located on a side of the first electrode layer facing away from the substrate, at least a portion of the encapsulation portion being located in the isolation opening, and the encapsulation portion being used to encapsulate the light-emitting unit; At least part of the encapsulation portion includes a first sublayer, a protective layer, and a second sublayer stacked sequentially in a direction away from the substrate; a first concave space is formed on a side of the isolation structure; the protective layer includes at least an extending portion; the first sublayer forms a second concave space at the first concave space; the extending portion is located within the second concave space; and in the same encapsulation portion, the thickness of the first sublayer is greater than or equal to the thickness of the second sublayer; The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit; the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening; the first light-emitting unit is located in the first isolation opening; the second light-emitting unit is located in the second isolation opening; in at least one of the first isolation opening and the second isolation opening, the encapsulation portion includes the first sublayer, the protective layer, and the second sublayer sequentially stacked in a direction away from the substrate; the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material; The third light-emitting unit is located in the third isolation opening. In the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sublayer and a second sublayer that are stacked and fully contacted. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit have different luminous colors. The thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging parts corresponding to the first isolation opening and the second isolation opening.

13. A method for preparing a display panel, characterized in that: The method comprises: preparing an isolation structure on a substrate, wherein the isolation structure encloses a plurality of isolation openings, wherein the isolation openings include a first isolation opening; A first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer, and a third material layer are sequentially prepared on the substrate, and the first light-emitting material layer, the first electrode material layer, the first material layer, the second material layer, and the third material layer are patterned to form a first light-emitting unit, a first sub-electrode, and a first encapsulation portion that are at least partially located within the first isolation opening, wherein the first encapsulation portion includes a first sublayer, a protective layer, and a second sublayer sequentially stacked in a direction away from the substrate, a first concave space is formed on a side of the isolation structure, and the protective layer at least includes an extending portion, which is located within the first concave space; the light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, the first light-emitting unit is located within the first isolation opening, and the second light-emitting unit is located within the second isolation opening, and in at least one of the first isolation opening and the second isolation opening, the encapsulation portion includes the first sublayer, the protective layer, and the second sublayer sequentially stacked in a direction away from the substrate, the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material; The third light-emitting unit is located in the third isolation opening. In the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sublayer and a second sublayer that are stacked and fully contacted. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit have different luminous colors. The thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging parts corresponding to the first isolation opening and the second isolation opening.

14. The preparation method according to claim 13, characterized in that The steps of sequentially preparing a first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer on the substrate include: Sequentially preparing a first light-emitting material layer, a first electrode material layer, and a first material layer on the substrate, wherein the first material layer is recessed in the first isolation opening toward the substrate to form a first groove; preparing a fluid material layer in the first groove and curing the fluid material layer to form a second material layer located in the first groove; A third material layer is prepared on a side of the second material layer facing away from the substrate.

15. The preparation method according to claim 14, characterized in that The second sub-layer is in contact with the first sub-layer on the circumferential side and encloses a closed space, and the protective layer is located in the closed space; And / or, the material of the fluid material layer includes organic material; And / or, the material of the first material layer includes an inorganic material; And / or, the material of the second material layer includes an organic material; and / or, the material of the third material layer includes an inorganic material.

16. The preparation method according to claim 14, characterized in that The isolation structure further includes a second isolation opening. After the step of forming the first light-emitting unit, the first sub-electrode, and the first encapsulation portion at least partially located within the first isolation opening, the method includes: A second light-emitting material layer, a second electrode material layer and a second packaging material layer are prepared on the substrate, and the second light-emitting material layer, the second electrode material layer and the second packaging material layer are patterned to form a second light-emitting unit, a second sub-electrode and a second packaging part that are at least partially located within the second isolation opening, and the second packaging part includes a first sub-layer, a protective layer and a second sub-layer stacked in sequence in a direction away from the substrate.

17. The preparation method according to claim 16, characterized in that The isolation structure further includes a third isolation opening. After the step of forming a second light-emitting unit, a second sub-electrode, and a second encapsulation portion that are at least partially located within the second isolation opening, the method includes: A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer, the third electrode material layer and the third encapsulation material layer are patterned to form a third light-emitting unit, a third sub-electrode and a third encapsulation part that are at least partially located within the third isolation opening, and the material of the third encapsulation part includes an inorganic material.

18. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 12, or a display panel prepared by the preparation method according to any one of claims 13 to 17.

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