Head-mounted device
By designing a slidable mounting bracket and exposed heat dissipation part in the head-mounted device, the problem of poor heat dissipation effect of existing equipment is solved, and more efficient heat removal and user experience improvement is achieved.
Patent Information
- Application Number
- CN202311713816.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-13
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2043-12-13
AI Technical Summary
The existing head-mounted devices have poor heat dissipation effect, which makes it difficult to effectively take away the heat, affecting the equipment performance and user experience.
A head-mounted device is designed, which includes a housing and a mounting bracket. A heat dissipation port is provided on the front side of the housing, and the mounting bracket can be slidably connected to the housing, driving the heat dissipation part to be exposed, and the heat dissipation part can be removed by convection heat transfer, and the exposed volume and heat exchange area of the heat dissipation part can be adjusted by driving the mounting bracket.
By revealing the heat dissipation part and adjusting its exposed volume, the heat dissipation efficiency of the head-mounted device is improved, especially when running programs with large memory, it can effectively take away heat and improve the user experience.