Integrated package chip pin detection device
By designing an integrated packaged chip pin detection device and using a swing track and clamping assembly to detect and screen out abnormal pin bending of chips with asymmetric pins on both sides, the problem of detection failure in the existing technology is solved and the degree of automation and efficiency of detection are improved.
Patent Information
- Application Number
- CN202510920698.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-04
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2045-07-04
AI Technical Summary
Existing technologies are unable to effectively detect and screen out pin bending anomalies in integrated packaged chips with asymmetric pins on both sides, especially SOP-type packaged chips, which may cause pin damage or detection failure.
An integrated packaged chip pin inspection device was designed. It uses an upper track and a lower track spaced along an inclined straight line, combined with a swing track and a clamping assembly. The pin bending state is detected by a pin detection frame, and defective chips are screened out by the rotation of the swing track. The screening is assisted by a proximity switch and an inclined air nozzle. The degree of automation is improved by combining a rotating plate and a detection assembly.
It realizes the detection and screening of abnormal pin bending of chips with asymmetric pins on both sides, improves the automation level of the device, ensures smooth detection and rapid discharge, avoids pin damage, and improves the reliability and efficiency of detection.