Glass core plate, chip packaging structure and preparation method of glass core plate

Abstract

The invention provides a glass core plate, a chip packaging structure and a preparation method of the glass core plate. The glass core plate comprises a glass substrate, an adhesion layer and a conductive wire, and the glass substrate comprises a substrate through hole penetrating through the glass substrate. The adhesion layer is located on the surface of the glass substrate, or the adhesion layer is located on the inner wall of the substrate through hole, or the adhesion layer is located on the surface of the glass substrate and the inner wall of the substrate through hole. The substrate through holes are filled with the conductive wires, and the two opposite sides of the glass substrate are communicated through the conductive wires. Thus, in the structure, the adhesion layer located on the surface of the glass substrate and / or the inner wall of the substrate through hole can improve the binding force between the metal layer (such as a seed metal layer, a wiring layer or a buffer layer) and the glass substrate, and then the product quality of the glass core plate is guaranteed.