Model-driven optoelectronic integrated link analysis system and method
The model-driven optoelectronic integrated link analysis system integrates electro-optical equivalent models and electrical interconnection models, solving the problems of cumbersome modeling and high professional knowledge requirements in traditional optoelectronic integrated link design. It realizes efficient optoelectronic integrated link modeling and signal integrity analysis, improving design efficiency and optimization capabilities.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG LAB
- Filing Date
- 2025-07-29
- Publication Date
- 2026-05-29
AI Technical Summary
In traditional optoelectronic integrated link design, the modeling tools for optoelectronic interconnect links are cumbersome to simulate independently, making it difficult to achieve efficient collaboration. They also require a high level of professional knowledge, making it difficult for non-experts to quickly locate problems and resulting in low design efficiency.
This paper provides a model-driven optoelectronic integrated link analysis system. By integrating the signal transmitter model, electrical interconnect model, electro-optic equivalent model and signal receiver model, it realizes end-to-end simulation of optoelectronic links. The system uses a parameterized model to simplify the modeling process, integrates the electro-optic equivalent model and electrical interconnect model into the same system, and supports signal simulation of SerDes communication technology and multiple modulation formats.
It enables efficient optoelectronic integrated link modeling and signal integrity analysis, simplifies data format conversion across multiple software platforms, reduces model migration and maintenance costs, allows non-professionals to quickly locate design defects, and improves design optimization efficiency.
Smart Images
Figure CN120546772B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical communications, and in particular to a model-driven optoelectronic integrated link analysis system and method. Background Technology
[0002] With the explosive growth in demand for high-speed interconnects from high-bandwidth applications such as artificial intelligence and data centers, optoelectronic integration technologies such as silicon photonics and co-packaged optics (CPO) have become key means to solve the bandwidth bottleneck of high-speed interconnects. In optoelectronic co-design, signal integrity analysis of end-to-end optoelectronic interconnect links is required, involving collaborative modeling of multiple stages such as electrical interconnection, electro-optical conversion, optical transmission, and optoelectronic conversion. However, optoelectronic interconnect link design faces multiple challenges, including high bandwidth, low power consumption, and thermal management. The traditional "trial and error" R&D model can no longer meet the requirements, necessitating an efficient, accurate, and low-cost optoelectronic link analysis system.
[0003] In traditional approaches, optoelectronic integrated link modeling tools mostly perform independent simulations of single physical fields. Optoelectronic devices require specialized optical tools for simulation, making coordination with electrical circuits difficult. Signal data necessitates frequent switching between multiple simulation software programs, resulting in a cumbersome model building process. Furthermore, when the number and variety of optoelectronic devices in the link are large, model modification or migration becomes extremely complex, severely limiting design efficiency. In addition, optimizing optoelectronic interconnect links typically requires specialized optical knowledge, making it difficult for non-experts to quickly pinpoint problems. Therefore, achieving efficient optoelectronic integrated link modeling is a critical issue that urgently needs to be addressed for signal integrity analysis of optoelectronic interconnect links. Summary of the Invention
[0004] Based on the above technical issues, this application provides a model-driven optoelectronic integrated link analysis system and method.
[0005] In a first aspect, this application provides a model-driven optoelectronic integrated link analysis system, comprising:
[0006] A signal transmitter model used to generate the original electrical signal;
[0007] An electrical interconnect model, including at least one electrical interconnect sub-model, is used to simulate the input-output characteristics of an electrical interconnect device and output a primary electrical signal based on the original electrical signal.
[0008] An electro-optical equivalent model includes at least one electro-optical equivalent sub-model for simulating the input-output characteristics of an electro-optical link, and outputting a secondary electrical signal based on the primary electrical signal;
[0009] A signal receiver model is used to analyze the secondary electrical signal and obtain the analysis results.
[0010] In one embodiment, the electrical interconnect model is constructed by modeling and simulating the electrical interconnect device to obtain a parameterized model of the electrical interconnect device, based on the input-output characteristics of the parameterized model.
[0011] In one embodiment, the electrical interconnect model is constructed by experimentally obtaining a parameterized model of the electrical interconnect device based on the input-output characteristics of the parameterized model.
[0012] In one embodiment, the electro-optical equivalent model is constructed by simulating the electro-optical link, and the characteristic parameters used to characterize the electro-optical link are obtained by evaluating the input and output characteristics of the electro-optical link model, and the model is constructed based on the characteristic parameters.
[0013] In one embodiment, the at least one electrical interconnect sub-model is sequentially connected to the output of the signal transmitting end model, and the at least one electro-optical equivalent sub-model is sequentially connected to the output of the end electrical interconnect model.
[0014] In one embodiment, the at least one electrical interconnect sub-model and the at least one electro-optical equivalent sub-model are connected in series at intervals between the signal transmitting end model and the signal receiving end model.
[0015] Secondly, this application also provides a model-driven method for analyzing optoelectronic integrated links, including:
[0016] Build a signal transmitter model and use the signal transmitter model to generate the original electrical signal;
[0017] An electrical interconnection model is constructed, and a primary electrical signal is output based on the original electrical signal by simulating the input and output characteristics of the electrical interconnection device; the construction of the electrical interconnection model includes at least one electrical interconnection sub-model;
[0018] An electro-optical equivalent model is constructed, and the input-output characteristics of the electro-optical link are simulated to output a secondary electrical signal based on the primary electrical signal; the electro-optical equivalent model includes at least one electro-optical equivalent sub-model.
[0019] A signal receiver model was built, and the secondary electrical signal was analyzed to obtain the analysis results.
[0020] In one embodiment, the construction of the electrical interconnect model includes:
[0021] The electrical interconnect device is modeled and simulated to obtain a parametric model of the electrical interconnect device;
[0022] The electrical interconnection model is constructed based on the input-output characteristics of the parameterized model.
[0023] In one embodiment, the construction of the electrical interconnect model includes:
[0024] The parameterized model of the electrical interconnect device was obtained through experiments;
[0025] The electrical interconnection model is constructed based on the input-output characteristics of the parameterized model.
[0026] In one embodiment, the construction of the electro-optical equivalent model includes:
[0027] The electro-optical link is simulated, and an electro-optical link model is built;
[0028] Obtain the input and output characteristics of the electro-optical link model;
[0029] The input-output characteristics are evaluated, and characteristic parameters for characterizing the electro-optical link are extracted to obtain an electro-optical equivalent model.
[0030] The aforementioned model-driven optoelectronic integrated link analysis system and method simplifies the modeling process of optoelectronic interconnect links by transforming optoelectronic link device models into parametric forms through an electro-optical equivalent model. Integrating the electro-optical equivalent model and the electrical interconnect model into the same system solves the problem of cumbersome data format conversion caused by frequent switching between multiple software programs during the co-simulation of optoelectronic devices and electrical circuits in traditional optoelectronic integrated link analysis. Optimizing optoelectronic interconnect links through equivalent parametric models enables designers to quickly locate link problems based on electrical signal analysis, achieving efficient optoelectronic integrated link modeling and signal integrity analysis. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a block diagram of an optoelectronic integrated link analysis system in one embodiment;
[0033] Figure 2 This is a flowchart illustrating the method for constructing an electro-optical equivalent model in one embodiment;
[0034] Figure 3 This is a schematic diagram of the optoelectronic interconnect signal integrity analysis of an electro-optical link model in one embodiment;
[0035] Figure 4This is a schematic diagram of the optoelectronic interconnect signal integrity analysis of an electro-optical equivalent model in one embodiment;
[0036] Figure 5 This is a flowchart of an ordered cascaded optoelectronic integration link in one embodiment;
[0037] Figure 6 This is a flowchart of a disordered cascaded optoelectronic integration link in one embodiment;
[0038] Figure 7 This is a flowchart illustrating the optoelectronic integration link analysis method in one embodiment;
[0039] Figure 8 This is a flowchart illustrating a method for constructing an electro-optical equivalent model in one embodiment. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0041] In the field of optical communication, signal integrity analysis refers to the evaluation and optimization process of maintaining the waveform and logical integrity of electrical signals in the transmission link. In the field of optoelectronic integration, its core is to ensure that high-speed electrical signals, after being transmitted through electrical interconnects and optical links, still maintain the original signal's amplitude, phase, and timing characteristics, avoiding signal distortion caused by factors such as attenuation, noise, and inter-symbol interference. Signal integrity analysis is mainly achieved through simulation modeling tools. In existing technologies, electrical domain simulation and optical domain simulation are usually performed on different modeling platforms.
[0042] Figure 1 This is a block diagram of a model-driven optoelectronic integrated link analysis system according to some embodiments of this application. As shown in the figure, the system includes a signal transmitter model 100, an electrical interconnect model 200, an electro-optical equivalent model 300, and a signal receiver model 400 connected in sequence. These models are integrated into a single simulation environment, eliminating the need for designers to manually transfer data between optical and electrical tools. This system can directly adapt to the high-speed data serial transmission requirements of SerDes (Serializer / Deserializer) communication technology, supports signal simulation for common modulation formats such as NRZ and PAM4, and performs signal integrity analysis on processes such as electrical interconnect loss and optical transmission characteristics in SerDes links.
[0043] The signal transmitter model 100 is used to generate the original electrical signal. This model can provide an excitation signal source that conforms to the operating range of the optoelectronic device by setting the modulation format, rate, code pattern, impedance, swing, and equalization properties of the original signal.
[0044] The electrical interconnect model 200 includes at least one electrical interconnect sub-model for simulating the input-output characteristics of electrical interconnect devices and outputting a primary electrical signal based on the original electrical signal. The electrical interconnect model can, by setting equivalent parameters, make the electrical signal susceptible to the influence of the electrical link and thus attenuate it to a certain extent. Specifically, the electrical interconnect sub-model connected to the signal transmitting end is the transmitting end electrical interconnect sub-model, which receives the original electrical signal output from the signal transmitting end and introduces the influence of the transmitting end electrical link to obtain the primary electrical signal; the electrical interconnect sub-model connected to the signal receiving end is the receiving end electrical interconnect sub-model, which outputs a received electrical signal affected by the output end electrical link.
[0045] The electro-optic equivalent model 300 includes at least one electro-optic equivalent sub-model for simulating the input-output characteristics of the electro-optic link, and outputting a secondary electrical signal based on the primary electrical signal. The electro-optic equivalent model can output a secondary electrical signal characterizing the complete photoelectric conversion effect by setting equivalent parameters extracted through linear or nonlinear evaluation. It is understood that in the electro-optic equivalent model, the primary electrical signal is mainly affected by the electro-optic modulator, optical link, and photodetector; the signal may introduce noise and produce certain linear and nonlinear effects such as attenuation, inter-symbol interference, and crosstalk.
[0046] The signal receiver model 400 is used to analyze the secondary electrical signal. Specifically, the received electrical signal output from the receiver electrical interconnect sub-model is finally equalized and analyzed by the signal receiver model to output the target electrical signal. This model can set the signal modulation format, timing, and equalization parameters, and can provide multi-dimensional analysis functions as needed, including generating eye diagrams based on time-domain analysis results, and bit error rate analysis. Based on the above analysis results, the parameters of the preceding model are optimized in reverse.
[0047] The system provided in the above embodiments replaces the traditional multi-physics independent simulation mode by constructing electrical interconnection models and electro-optic equivalent models on the same platform. This solves the problems of cross-platform data switching, difficult data format conversion, and high computing power consumption caused by the need for multiple modeling tools. Designers can rely on the end-to-end link framework to quickly analyze circuit indicators, locate attenuation nodes or noise sources in the link, and achieve efficient optimization of optoelectronic integrated links.
[0048] In some embodiments, the electrical interconnect model is constructed by modeling and simulating the electrical interconnect device to obtain a parameterized model of the device, and then constructing the model based on the input-output characteristics of the parameterized model. It can be understood that the core of parameterized modeling is to obtain the input-output characteristics of the device through either simulation extraction or experimental measurement. Specifically, simulation software is used to model the electrical interconnect device, its electromagnetic characteristics are analyzed through frequency domain scanning, characteristic parameters are extracted, and then a parameterized model characterizing the device's input-output characteristics is generated through rational function fitting and other methods. This model can describe the amplitude attenuation, phase shift, and other characteristics of electrical signals during transmission.
[0049] In other embodiments, the electrical interconnect model can also be obtained experimentally. Specifically, a network analyzer can be used to perform frequency sweep measurements on the actual device to obtain the transmission characteristic curve, or a time domain reflectometer (TDR) and a time domain transmission meter (TDT) can be used to measure the reflection and transmission characteristics, and the measured data can be mapped to model parameters to form a parameterized model based on the experimental data.
[0050] The parameterized models obtained through the above simulation extraction or experimental measurement methods can all characterize the input and output characteristics of electrical interconnect devices, and thus construct electrical interconnect models to simulate the primary electrical signal output after the electrical signal is transmitted through the device.
[0051] In one exemplary embodiment, such as Figure 3 As shown, the electro-optical equivalent model is constructed by simulating the electro-optical link, and the characteristic parameters used to characterize the electro-optical link are obtained by evaluating the input and output characteristics of the electro-optical link model. The model is constructed based on the characteristic parameters.
[0052] Specifically, an electro-optic link including an electro-optic modulator, optical fiber, and photodetector is constructed using simulation software, including but not limited to VPIphotonics, ADS, and OptiSystem.
[0053] An electrical signal within a preset range is input to the link, and the output electrical signal is obtained through simulation. Subsequently, linear or nonlinear evaluations are performed on the input and output signals to extract characteristic parameters. Linear evaluation parameters can be obtained by calculating the amplitude-frequency response and phase-frequency response of the transfer function, or nonlinear evaluations can be performed by analyzing inter-symbol interference and noise power spectral density to extract characteristic parameters.
[0054] Through the extraction of the above feature parameters, such as Figure 2 As shown, the electro-optical link can be represented end-to-end using a mathematical model, which is the electro-optical equivalent model. The electro-optical equivalent model can simulate components such as the optical link and photodetector by setting equivalent parameters, introducing noise and generating certain signal attenuation and inter-symbol interference.
[0055] The method in this embodiment can replace the traditional complete electro-optical link multi-physics collaborative simulation with a parameterized model, avoiding the problems of signal format conversion and computing power scheduling of multiple simulation platforms. It only needs to consume computing power to calibrate the model when constructing the equivalent model, and the migration, maintenance and computing costs of the model are greatly reduced thereafter.
[0056] In contrast. Figure 3 This is an example of an optoelectronic interconnect signal integrity analysis using SerDes. The electro-optic link model in this example consists of a driver module, an electro-optic modulator, an optical fiber, a photodetector, and a transimpedance amplifier connected sequentially. The optical signal, after passing through the electro-optic modulator, undergoes wavelength division multiplexing (WDM) to combine different wavelengths of optical signals into a single optical fiber for transmission. Then, WDM is demultiplexed to separate the different wavelengths of optical signals before they are transmitted to the photodetector. The signal transmitter and receiver are each described by an IBIS-AMI model; the output signal modulation format of the transmitter is PAM4 or NRZ. By setting reasonable baud rate, matching impedance, swing, and feedforward equalization parameters, the waveform and eye diagram of the original electrical signal at the output node of the signal transmitter model can be obtained. After the original electrical signal passes through the passive electrical interconnection model of the transmitter, the primary electrical signal is output, with the signal swing attenuated and the eye height and eye width of the eye diagram reduced. After the primary electrical signal passes through the electro-optical link model, the secondary electrical signal is output, with the signal swing further altered. After the secondary electrical signal passes through the electrical interconnection model of the receiver, the received electrical signal is output, with the signal swing further altered. Finally, the received electrical signal passes through the signal receiver model to output the target electrical signal. Relying on the signal processing mechanisms built into the IBIS-AMI model, such as continuous-time linear equalization, feedforward equalization, and decision feedback equalization, signal reconstruction is achieved, and the signal-to-noise ratio and bit error rate are analyzed.
[0057] In contrast, Figure 4 This invention provides a link model using the electrical interconnection model and electro-optical equivalent model. The complete electro-optical link model is parameterized and converted into a single electro-optical equivalent model. The above-described opto-optical interconnection signal integrity analysis is then repeated to obtain eye diagrams at different nodes. Comparison is then performed. Figure 3 and Figure 4 The eye diagrams at corresponding nodes show that the results of the two link analyses are basically consistent. However, the equivalent model method enables efficient link simulation, avoiding signal format conversion across multiple simulation platforms. If the model needs modification, it can be done directly by modifying the equivalent parameters. Furthermore, if model migration is required, only the model parameters need to be saved and migrated, rather than saving and migrating each device in the link, thus improving migration efficiency. Simultaneously, this system helps non-optics professionals quickly locate design flaws based on signal eye diagrams and bit error rates, and track and optimize model parameters using the electro-optical equivalent model method, improving optimization efficiency and effectively optimizing link equalization parameters.
[0058] In one exemplary embodiment, such as Figure 5 As shown, the signal transmitting end model generates the original electrical signal and passes through a series of M cascaded electrical interconnect sub-models, namely electrical interconnect sub-models 201 to 20M, to output the primary electrical signal. The primary electrical signal then passes through a series of N cascaded electro-optical equivalent sub-models, namely electro-optical equivalent sub-models 301 to 30N, to output the received electrical signal. The received electrical signal finally passes through the signal receiving end model to output the target electrical signal, and the signal-to-noise ratio and bit error rate are analyzed. This embodiment is an ordered signal link model. The multi-cascaded electrical interconnect model can be implemented by multi-layer signal processing circuits. This application scenario can be for short-distance electrical signal routing, where the transmitting end signal needs to pass through multiple signal relay stations to reach the target receiving end. Similarly, the multi-cascaded electro-optical equivalent sub-model can be implemented by multi-layer optical links. This application scenario can be for long-distance optical signal routing, where the transmitting end signal needs to pass through multiple optical fibers to reach the target receiving end.
[0059] It should be noted that the electro-optical equivalent sub-model and the electrical interconnect sub-model can be constructed not only in an ordered cascade but also in a disordered hybrid cascade. In another exemplary embodiment, such as... Figure 6 As shown, the signal transmitting end model needs to pass through M electrical interconnect sub-models in any order (i.e., electrical interconnect sub-models 201 to 20M) and N electro-optical equivalent sub-models (i.e., electro-optical equivalent sub-models 301 to 30N) to reach the signal receiving end model before generating the original electrical signal. The M electrical interconnect sub-models and N electro-optical equivalent sub-models can be ordered arbitrarily. This embodiment is an unordered signal link model, applicable to long-distance signal routing, where the transmitting end signal needs to pass through multiple electrical signal relay stations and a hybrid link of multiple optical fibers to reach the target receiving end.
[0060] Based on the same inventive concept, this application also provides an analysis method for implementing the model-driven optoelectronic integrated link analysis system described above. The solution provided by this method is similar to the implementation scheme described in the above system; therefore, the specific limitations in one or more method embodiments provided below can be found in the limitations of the model-driven optoelectronic integrated link analysis system described above, and will not be repeated here.
[0061] In one exemplary embodiment, such as Figure 7 As shown, a model-driven method for analyzing optoelectronic integrated links is provided, which includes steps S701 to S704:
[0062] S701, build a signal transmitter model, and use the signal transmitter model to generate the original electrical signal;
[0063] S702, Build an electrical interconnection model, and output a primary electrical signal based on the original electrical signal by simulating the input and output characteristics of the electrical interconnection device; the building of the electrical interconnection model includes at least one electrical interconnection sub-model;
[0064] S703, Construct an electro-optical equivalent model, simulate the input and output characteristics of the electro-optical link, and output a secondary electrical signal based on the primary electrical signal; the electro-optical equivalent model includes at least one electro-optical equivalent sub-model;
[0065] S704, Build a signal receiver model, analyze the secondary electrical signal, and obtain the analysis results.
[0066] Furthermore, in some embodiments, step S702 can be implemented by: modeling and simulating the electrical interconnect device to obtain a parameterized model of the electrical interconnect device; and constructing the electrical interconnect model based on the input-output characteristics of the parameterized model.
[0067] In other embodiments, step S702 can also be implemented by: experimentally obtaining the electrical interconnect device, modeling it, simulating it to obtain a parameterized model of the electrical interconnect device, and constructing it based on the input-output characteristics of the parameterized model.
[0068] In some embodiments, such as Figure 8 As shown, the method for building the electro-optical equivalent model in step S703 specifically includes steps S801 to S803:
[0069] S801, simulates the electro-optical link and builds the electro-optical link model;
[0070] S802, Obtain the input and output characteristics of the electro-optical link model;
[0071] S803, evaluate the input-output characteristics, extract characteristic parameters to characterize the electro-optical link, and obtain an electro-optical equivalent model.
[0072] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.
[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.
[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. A model-driven optoelectronic integrated link analysis system, characterized in that, The system includes: A signal transmitter model used to generate the original electrical signal; An electrical interconnect model, including at least one electrical interconnect sub-model, is used to simulate the input-output characteristics of an electrical interconnect device and output a primary electrical signal based on the original electrical signal. An electro-optical equivalent model includes at least one electro-optical equivalent sub-model for simulating the input-output characteristics of an electro-optical link, outputting a secondary electrical signal based on the primary electrical signal. The electro-optical equivalent model is constructed by simulating the electro-optical link, building an electro-optical link model, and evaluating the input-output characteristics of the electro-optical link model to extract characteristic parameters that characterize the physical properties of the optoelectronic components in the electro-optical link. These characteristic parameters are extracted using linear or nonlinear evaluation methods. Linear evaluation is achieved by calculating the amplitude-frequency response and phase-frequency response of the transfer function, while nonlinear evaluation is achieved by analyzing inter-symbol interference and noise power spectral density. The electro-optical equivalent model can simulate the optoelectronic components by setting equivalent parameters corresponding to the characteristic parameters. These characteristic parameters can be adjusted to optimize and locate problems in the optoelectronic integrated link. A signal receiver model is used to analyze the secondary electrical signal and obtain the analysis results.
2. The system according to claim 1, characterized in that, The electrical interconnection model is constructed by modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device, based on the input-output characteristics of the parameterized model.
3. The system according to claim 1, characterized in that, The electrical interconnection model is constructed based on the input-output characteristics of the parameterized model of the electrical interconnection device obtained through experiments.
4. The system according to claim 1, characterized in that, The at least one electrical interconnect sub-model is sequentially connected to the output end of the signal transmitting end model, and the at least one electro-optical equivalent sub-model is sequentially connected to the output end of the terminal electrical interconnect model.
5. The system according to claim 1, characterized in that, The at least one electrical interconnect sub-model and the at least one electro-optical equivalent sub-model are connected in series at intervals between the signal transmitting end model and the signal receiving end model.
6. A model-driven method for analyzing optoelectronic integrated links, characterized in that, include: Build a signal transmitter model and use the signal transmitter model to generate the original electrical signal; An electrical interconnection model is built, and the input and output characteristics of the electrical interconnection devices are simulated to output a primary electrical signal based on the original electrical signal. The electrical interconnection model includes at least one electrical interconnection sub-model; An electro-optical link is simulated to build an electro-optical link model; the input and output characteristics of the electro-optical link model are obtained; the input and output characteristics are evaluated, and characteristic parameters used to characterize the physical characteristics of the optoelectronic components in the electro-optical link are extracted to obtain an electro-optical equivalent model. The characteristic parameters are extracted through linear or nonlinear evaluation methods. The linear evaluation is achieved by calculating the amplitude-frequency response and phase-frequency response of the transfer function, and the nonlinear evaluation is achieved by analyzing inter-symbol interference and noise power spectral density. The electro-optical equivalent model can simulate the optoelectronic components by setting equivalent parameters corresponding to the characteristic parameters. The characteristic parameters can be adjusted to optimize and locate problems in the optoelectronic integrated link. By simulating the input and output characteristics of an electro-optical link, a secondary electrical signal is output based on the primary electrical signal; The electro-optical equivalent model includes at least one electro-optical equivalent sub-model; A signal receiver model was built, and the secondary electrical signal was analyzed to obtain the analysis results.
7. The method according to claim 6, characterized in that, The electrical interconnection model includes: The electrical interconnect device is modeled and simulated to obtain a parametric model of the electrical interconnect device; The electrical interconnection model is constructed based on the input-output characteristics of the parameterized model.
8. The method according to claim 6, characterized in that, The electrical interconnection model includes: The parameterized model of the electrical interconnect device was obtained through experiments; The electrical interconnection model is constructed based on the input-output characteristics of the parameterized model.