Positioning and cutting device for wafer processing

By designing a wafer processing positioning and cutting device, and using servo motors, cylinders, electromagnets and other components to achieve automatic wafer exchange and positioning, combined with a high-precision motion platform and laser, the problem of manual wafer picking and placing after cutting is solved, thereby improving processing efficiency and detection efficiency.

CN120619609AActive Publication Date: 2025-09-12YONGCHUN SEMICON (WUXI) CO LTD
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Patent Information

Application Number
CN202510709283.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-29
Publication Date
2025-09-12
Estimated Expiration
2045-05-29

AI Technical Summary

Technical Problem

In the prior art, wafer processing equipment cannot efficiently utilize laser cutting devices. After the wafer is laser cut, it is necessary to manually remove the wafer and then put in a new wafer, which is inconvenient to operate and results in low processing efficiency.

Method used

A wafer processing positioning and cutting device was designed, which included a cutting component, an alternating component, a detection component and a pushing component. The automatic exchange and positioning of wafers were realized through components such as servo motors, cylinders, and electromagnets. Combined with a high-precision motion platform and laser, the precise positioning and automatic cutting of wafers were achieved, and the convenience of operation was improved through visual inspection and pushing components.

Benefits of technology

It realizes the automatic cutting and inspection of wafers, simplifies manual operations, improves processing efficiency, reduces material retrieval time, and improves overall production efficiency.

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Abstract

The invention discloses a wafer processing, positioning and cutting device, and relates to the technical field of wafer processing, the wafer processing, positioning and cutting device comprises a cutting assembly and a material pushing assembly, and an alternating assembly and a detection assembly are arranged in the cutting assembly. When the device is used, the servo motor is started, the two placing tables are driven by the alternating plate to rotate along the arc-shaped guide rail, and when the servo motor is automatically closed, the two placing tables exchange positions. And the air cylinder is started again to fix the standby placing table, and then the two electromagnets are closed. And then the to-be-cut wafer is placed on the standby placement table, the cutting assembly is started, meanwhile, the pushing assembly is started, the cut wafer is pushed forwards, and a worker can take down the wafer conveniently. Under the cooperation of the alternating assembly and the cutting assembly, a new wafer can be placed without taking down the cut wafer, manual operation is simplified, convenience is achieved, more time is saved, and the wafer machining efficiency is greatly improved.
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