Method for avoiding surface pit defect in silicon carbide wafer production and detection process

By coating a polymer protective layer on the surface of the silicon carbide wafer and combining it with specific solvent cleaning, the problem of pit defects caused by vacuum adsorption is solved, ensuring the wafer surface quality and process stability, and reducing equipment maintenance costs.

CN120656945APending Publication Date: 2025-09-16SHANDONG UNIV
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Patent Information

Application Number
CN202510516499.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-23
Publication Date
2025-09-16

AI Technical Summary

Technical Problem

During the production and inspection process of silicon carbide wafers, surface pit defects caused by vacuum adsorption are difficult to remove effectively, affecting wafer quality and subsequent processes. Existing technologies such as alcohol wiping and ultrasonic cleaning are ineffective and costly.

Method used

A polymer solution is coated on the surface of the silicon carbide wafer to form a protective layer, which is then heated and dried before being tested by vacuum adsorption. After the test, it is cleaned and dried with a specific solvent to avoid physical damage.

Benefits of technology

It effectively avoids pit defects caused by vacuum adsorption, improves wafer surface quality and process consistency, and reduces equipment maintenance costs and operational complexity.

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Abstract

According to the method for avoiding the surface pit defect in the production and detection process of the silicon carbide wafer, the vacuum adsorption face of the silicon carbide wafer is coated with the high-molecular polymer protection layer, physical damage caused by hard particles on the objective table is thoroughly avoided, and therefore the high quality of the surface of the wafer is kept. Compared with frequent replacement or cleaning of the objective table, the scheme provided by the invention is more economical and practical, the time and cost of equipment maintenance are reduced, meanwhile, the existing equipment does not need to be greatly modified, additional professional knowledge or complex equipment is not needed, the operation is simple and easy to implement, and the integrated implementation on the existing production process line is easy.
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