Photosensitive material film, patterned film, patterned substrate, semiconductor device and preparation method thereof

By using amorphous organic metal compounds to form a photosensitive material film with an irregular metal-based network structure, the problems of strong rigidity and poor solubility of the photosensitive material film in the existing technology are solved, a patterning effect with high resolution, low roughness and uniformity is achieved, and the exposure dose is reduced.

CN120699269APending Publication Date: 2025-09-26ZHUHAI CORNERSTONE TECH CO LTD
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Patent Information

Application Number
CN202510828005.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-19
Publication Date
2025-09-26

AI Technical Summary

Technical Problem

The photosensitive material film made from the existing metal cluster patterned composition has strong rigidity, large pores, poor solubility, poor film-forming properties, poor patterned film edge roughness, poor film layer uniformity, poor exposure effect, and requires a large exposure dose.

Method used

Amorphous organic metal compounds, including metal cluster skeletons and multidentate ligands, are used to form a photosensitive material film with a random metal-based network structure. The coordination bond energy is weak, the solubility is good, the stability is high, and the exposure performance is excellent.

Benefits of technology

The pattern resolution is improved, the pattern edge roughness and film layer unevenness are reduced, the exposure dose is reduced, and the film-forming performance of the photosensitive material film and the uniformity of the patterned film are improved.

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Abstract

The invention provides a photosensitive material film, a patterned film, a patterned substrate, a semiconductor device and a preparation method thereof, the photosensitive material film comprises an amorphous organic metal compound, and the amorphous organic metal compound comprises a metal cluster skeleton and a polydentate ligand in coordination connection with the metal cluster skeleton; the metal cluster skeleton comprises metal atoms or comprises metal atoms and oxygen atoms; the polydentate ligand comprises at least two coordination atoms, and the polydentate ligand is in coordination connection with metal atoms in the metal cluster framework through the coordination atoms. The photosensitive material film provided by the invention can form an irregular reticular framework molecular structure, the coordination bond in the structure is weak in bond energy, good in solubility and small in rigidity, the prepared pattern is high in resolution, low in edge roughness and low in required exposure energy, and the photosensitive material film is applied to preparation of semiconductor devices, so that the comprehensive performance of the semiconductor devices can be improved.
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