Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a first panel and a plurality of second panels, and at least two of the second panels are located on the same side of the first panel and spliced with each other; the first panel comprises a first substrate and a first connecting line, and the first connecting line is located on one side of the first substrate; the second panel comprises a second substrate, a second connecting line, a display layer and a connecting structure, the second connecting line and the display layer are sequentially stacked on the first side of the second substrate, the connecting structure is located on the second side of the second substrate, and the first side is opposite to the second side; orthographic projections of the display layer, the second connecting line, the connecting structure and the first connecting line on the first substrate are overlapped; the display layer is electrically connected with the second connecting line; a via hole is formed in the second substrate, the connecting structure is exposed at the via hole, and the second connecting line is electrically connected with the connecting structure through the via hole; the first panel is located on the side, away from the second substrate, of the connecting structure, and the connecting structure is electrically connected with the first connecting line. The display panel realizes seamless splicing of a plurality of second panels.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of display technology, and particularly relate to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) displays have attracted widespread attention due to their advantages such as self-luminescence, low power consumption, lightness, flexibility, brilliant colors, high contrast, and fast response rate. Summary of the Invention

[0003] In a first aspect, an embodiment of the present disclosure provides a display panel, comprising a first panel and a plurality of second panels, wherein at least two of the plurality of second panels are located on the same side of the first panel and are spliced ​​together;

[0004] The first panel includes a first substrate and a first connecting line, wherein the first connecting line is located on one side of the first substrate;

[0005] The second panel includes a second substrate, a second connecting line, a display layer, and a connecting structure, wherein the second connecting line and the display layer are sequentially stacked on a first side of the second substrate, and the connecting structure is located on a second side of the second substrate, and the first side and the second side are opposite to each other;

[0006] The orthographic projections of the display layer, the second connecting line, the connecting structure, and the first connecting line on the first substrate overlap;

[0007] The display layer is electrically connected to the second connecting line;

[0008] A via hole is defined in the second substrate, the connection structure is exposed at the via hole, and the second connection line is electrically connected to the connection structure through the via hole;

[0009] The first panel is located on a side of the connection structure away from the second substrate, and the connection structure is electrically connected to the first connection line.

[0010] In some embodiments, in the second panel, the number of the second connection lines is multiple; the multiple second connection lines are arranged in the same layer;

[0011] There are multiple connection structures; the multiple connection structures are arranged on the same layer;

[0012] The display layer is located in the display area of ​​the second panel,

[0013] A plurality of the second connection lines and a plurality of the connection structures are located in the display area.

[0014] In some embodiments, in the second panel, a plurality of the connection structures are sequentially arranged along at least one side edge of the display area.

[0015] In some embodiments, the display layer includes a driving circuit layer and a light emitting device layer.

[0016] The driving circuit layer and the light emitting device layer are stacked in sequence away from the second substrate;

[0017] The driving circuit layer includes a pixel circuit, a first shift register circuit and a second shift register circuit.

[0018] The pixel circuit is electrically connected to the first shift register circuit and the second shift register circuit respectively;

[0019] The pixel circuit is used to drive the light-emitting device layer to emit light;

[0020] The first shift register circuit is used to provide a gate drive signal to the pixel circuit;

[0021] The second shift register circuit is used to provide a light emitting control signal to the pixel circuit.

[0022] In some embodiments, there are multiple first connection lines.

[0023] A plurality of the first connecting lines are arranged in the same layer.

[0024] In some embodiments, the first panel further includes a signal source circuit located on the same side of the first substrate as the first connecting line.

[0025] The signal source circuit is electrically connected to the first connecting line;

[0026] The signal source circuit includes a power supply circuit and a display signal circuit.

[0027] The power supply circuit is used to provide a power signal to the first connecting line;

[0028] The display signal circuit is used to provide a display signal to the first connecting line.

[0029] In some embodiments, a conductive adhesive is further included, located between the connecting structure and the first connecting line.

[0030] The orthographic projection of the conductive adhesive on the first substrate is located in an overlapping area of ​​the orthographic projections of the connecting structure and the first connecting line on the first substrate.

[0031] In some embodiments, a radial dimension of a first end opening of the via hole located on the first side of the second substrate is larger than a radial dimension of a second end opening of the via hole located on the second side of the second substrate.

[0032] In some embodiments, the ratio of the radial dimension of the second end opening to the radial dimension of the first end opening is in a range of 1:1 to 1:6.

[0033] In some embodiments, an angle between a hole wall of the via hole and the second side surface of the second substrate ranges from 20° to 80°.

[0034] In some embodiments, the second panel further includes a first inorganic insulating layer located between the second substrate and the second connecting line.

[0035] An opening is formed in the first inorganic insulating layer, and an orthographic projection of the opening on the second substrate is located within an orthographic projection area of ​​the via hole on the second substrate;

[0036] The first inorganic insulating layer covers the second substrate and the hole wall of the via hole.

[0037] In some embodiments, the second panel further includes a planar layer and a second inorganic insulating layer, which are located between the second connecting line and the display layer, and the planar layer and the second inorganic insulating layer are sequentially stacked away from the second substrate.

[0038] The orthographic projections of the planar layer and the second inorganic insulating layer on the second substrate cover the second substrate,

[0039] A surface of the flat layer facing away from the second substrate is flush.

[0040] In some embodiments, the invention further comprises a cover plate located on a side of the second panel facing away from the first panel.

[0041] The orthographic projection of the cover plate on the first panel covers the plurality of second panels;

[0042] The frame sealant is located between the cover plate and the first panel and is located at the peripheral edge areas of the cover plate and the first panel. The frame sealant is bonded to the peripheral edge areas of the cover plate and the first panel to form a sealed cavity between the cover plate and the first panel.

[0043] The plurality of second panels are located in the enclosed cavity.

[0044] In some embodiments, the connection structure includes a connection electrode connected to the data line, a connection electrode connected to the power line, a connection electrode connected to the clock signal line, a connection electrode connected to the trigger signal line, and a connection electrode connected to the reset signal line.

[0045] In a second aspect, an embodiment of the present disclosure further provides a display device comprising the above-mentioned display panel.

[0046] In a third aspect, an embodiment of the present disclosure further provides a method for manufacturing a display panel, comprising preparing a first panel;

[0047] preparing a plurality of second panels;

[0048] Aligning the plurality of second panels with the first panel and electrically connecting the two;

[0049] The plurality of second panels are located on the same side of the first panel and are spliced ​​with each other;

[0050] The preparing the first panel includes preparing a first connecting line on one side of the first substrate;

[0051] Preparing the second panel includes sequentially preparing a connection structure, a second base, a second connection line, and a display layer on one side of the substrate to be peeled off;

[0052] The orthographic projections of the display layer, the second connecting line, the connecting structure, and the first connecting line on the first substrate overlap;

[0053] The display layer is electrically connected to the second connecting line;

[0054] Preparing the second substrate includes forming a via hole in the second substrate; the connection structure is exposed at the via hole, and the second connection line is electrically connected to the connection structure through the via hole;

[0055] peeling off the substrate to be peeled off;

[0056] The connection structure is electrically connected to the first connection line.

[0057] The display panel provided by the embodiment of the present disclosure can achieve direct contact and electrical connection between the display layer, the second connecting line, the connecting structure and the first connecting line in a direction perpendicular to the surface of the first panel and the second panel by making the orthographic projections of the display layer, the second connecting line, the connecting structure and the first connecting line overlap on the first substrate, and the display layer, the second connecting line, the connecting structure and the first connecting line are electrically connected to each other, thereby avoiding the electrical connection between the display layer, the second connecting line, the connecting structure and the first connecting line occupying the frame area of ​​the second panel, thereby reducing or eliminating the width of the frame area of ​​the second panel, that is, reducing or eliminating the width of the splicing seam between multiple second panels, achieving seamless splicing between multiple second panels, and ultimately making the splicing of multiple second panels no longer restricted by the large splicing frame.

[0058] The display device provided by the embodiment of the present disclosure can achieve seamless large-size display of the display device by adopting the above-mentioned display panel, while reducing the display power consumption and manufacturing cost of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing the detailed exemplary embodiments with reference to the accompanying drawings, in which:

[0060] Figure 1a is a schematic top view of a display panel in an embodiment of the present disclosure;

[0061] Figure 1b is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;

[0062] Figure 1c is another cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure;

[0063] Figure 2a is a schematic top view of a via hole in a second substrate according to an embodiment of the present disclosure;

[0064] Figure 2b is a schematic cross-sectional view of a via hole in a second substrate according to an embodiment of the present disclosure;

[0065] Figure 3 is another cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure;

[0066] Figure 4 is another cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure;

[0067] Figure 5 is a schematic top view of a second panel in an embodiment of the present disclosure;

[0068] Figure 6a Schematic diagram of step S101 of preparing a display panel in an embodiment of the present disclosure;

[0069] Figure 6b Schematic diagram of step S102 of preparing a display panel in an embodiment of the present disclosure;

[0070] Figure 6c Schematic diagram of step S103 of preparing a display panel in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0071] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, a display panel, a manufacturing method thereof, and a display device provided by the embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0072] The embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully enable those skilled in the art to understand the scope of this disclosure.

[0073] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings are schematic in nature, and the shapes of the regions shown in the drawings illustrate specific shapes of the regions, but are not intended to be limiting.

[0074] In the related technologies, large-size OLED display panels are becoming more and more popular. The light-emitting layers of different color OLED light-emitting devices in OLED display panels are usually formed by evaporation of metal masks (FMM, Fine Metal Mask). The cost of preparing metal masks for large-size OLED display panels is high, and the preparation process is difficult. Therefore, the current large-size OLED display panels all use WOLED+CF (white light OLED+color film) technology. The WOLED+CF technology is to evaporate the red, green, and blue light-emitting layers or the blue and yellow light-emitting layers on the entire display area to achieve white light OLED, and then set the color film layer on the white light OLED to achieve color display of the OLED display panel. Because the preparation of WOLED devices does not require a metal mask, only an OPENmask (that is, a mask corresponding to the opening of the entire display area) needs to be made.

[0075] In addition, the cathode of the OLED light-emitting device in the large-size OLED display panel is set on the entire surface, that is, the cathode of the OLED device covers the entire display area, so the resistance of the cathode is relatively large, resulting in a large voltage drop at the cathode, and an auxiliary electrode is needed to reduce the resistance of the cathode.

[0076] At present, compared with the large-size OLED display panel solution of WOLED+CF, the large-size OLED display panel solution using different color OLED light-emitting devices formed by metal mask evaporation can reduce power consumption by about 440%.

[0077] Research has found that the efficiency of stacked OLED light-emitting devices with different colors (such as a red OLED light-emitting device with two stacked light-emitting layers, a green OLED light-emitting device with two stacked light-emitting layers, and a blue OLED light-emitting device with two stacked light-emitting layers) is significantly higher than that of white light OLED devices. Compared with white light OLED devices with two stacked light-emitting layers (such as white light OLED devices with a blue and yellow light-emitting layers), stacked OLED light-emitting devices with different colors have obvious efficiency advantages. For example, the efficiency of stacked OLED light-emitting devices with two stacked light-emitting layers can be 5 to 9 times higher than that of white light OLED devices with two stacked light-emitting layers, as shown in Tables 1 and 2 below.

[0078] Table 1 is a comparison table of the changes in color point, current efficiency and EQE (external quantum efficiency of OLED light-emitting devices, specifically the ratio between the number of emitted photons and the number of injected electrons) of the two-layer OLED light-emitting devices of red R, green G, and blue B before and after the color filter layer CF is attached.

[0079] Table 1

[0080]

[0081] Table 2 is a comparison table of the changes in color point, current efficiency and EQE (external quantum efficiency of OLED light-emitting devices, specifically the ratio between the number of emitted photons and the number of injected electrons) of the stacked white light OLED device (WOLED) before and after the color filter layer CF is attached.

[0082] Table 2

[0083]

[0084] Taking a 12.3-inch automotive OLED display panel as an example, an OLED display panel with two stacked layers of OLED light-emitting devices (i.e., Tandem RGB+CF) can reduce power consumption by approximately 440% compared to a WOLED+CF OLED display panel. Table 3 below provides a comparison of power consumption for a 12.3-inch WOLED+CF OLED display panel and a Tandem RGB+CF OLED display panel.

[0085] Table 3

[0086]

[0087] In summary, RGB OLED devices have a clear advantage in power consumption over WOLED devices. However, due to the high-precision fabrication process required for RGB OLED devices, they cannot be used in large-scale display panels. However, if small-scale display panels using RGB OLED devices are spliced ​​together to form a large display panel, the limitations of the metal mask fabrication process will not apply. However, the splicing of small-scale display panels is limited by the large splicing border.

[0088] In order to solve the problem in the related art that the splicing of small-sized display panels is limited by the large splicing frame, in the first aspect, the embodiment of the present disclosure provides a display panel, referring to Figure 1a 、 Figure 1b and Figure 1c , Figure 1a is a schematic top view of a display panel in an embodiment of the present disclosure; Figure 1b is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure; Figure 1c : This is another cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure; wherein the display panel includes a first panel 1 and a plurality of second panels 2, at least two of the plurality of second panels 2 are located on the same side of the first panel 1 and are spliced ​​together; the first panel 1 includes a first substrate 11 and a first connecting line 12, the first connecting line 12 is located on one side of the first substrate 11; the second panel 2 includes a second substrate 21, a second connecting line 22, a display layer 23 and a connecting structure 24, the second connecting line 22 and the display layer 23 are sequentially stacked on the first side 201 of the second substrate 21, and the connecting structure 24 is located on the first side 201 of the second substrate 21. The first side 201 and the second side 202 of the second substrate 21 are opposite to each other; the display layer 23, the second connecting line 22, the connecting structure 24 and the orthographic projection of the first connecting line 12 on the first substrate 11 overlap; the display layer 23 is electrically connected to the second connecting line 22; a via 210 is provided in the second substrate 21, the connecting structure 24 is exposed at the via 210, and the second connecting line 22 is electrically connected to the connecting structure 24 through the via 210; the first panel 1 is located on the side of the connecting structure 24 away from the second substrate 21, and the connecting structure 24 is electrically connected to the first connecting line 12.

[0089] The display layer 23 can display video images. The first connection line 12 is used to provide the display layer 23 with power signals and display signals.

[0090] In this embodiment, by making the orthographic projections of the display layer 23, the second connecting line 22, the connecting structure 24, and the first connecting line 12 on the first substrate 11 overlap, and the display layer 23, the second connecting line 22, the connecting structure 24, and the first connecting line 12 are electrically connected to each other, direct contact and electrical connection between the display layer 23, the second connecting line 22, the connecting structure 24, and the first connecting line 12 in a direction perpendicular to the surface of the first panel 1 and the second panel 2 can be achieved, thereby avoiding the electrical connection between the display layer 23, the second connecting line 22, the connecting structure 24, and the first connecting line 12 occupying the frame area of ​​the second panel 2, thereby reducing or eliminating the width of the frame area of ​​the second panel 2, that is, reducing or eliminating the width of the splicing seam between multiple second panels 2, achieving seamless splicing between multiple second panels 2, and ultimately making the splicing of multiple second panels 2 no longer restricted by the large splicing frame.

[0091] In some embodiments, in the second panel 2, the number of second connecting lines 22 is multiple; the multiple second connecting lines 22 are arranged in the same layer; the number of connecting structures 24 is multiple; the multiple connecting structures 24 are arranged in the same layer; the display layer 23 is located in the display area of ​​the second panel 2, and the multiple second connecting lines 22 and the multiple connecting structures 24 are located in the display area.

[0092] With such arrangement, various structures for realizing display in the second panel 2 can be arranged in its display area, so that the second panel 2 can be borderless, thereby realizing seamless splicing between multiple second panels 2.

[0093] In some embodiments, to prevent cross-circuiting between the second connection lines 22 transmitting different signals, multiple second connection lines 22 may be arranged in parallel. In some embodiments, the multiple second connection lines 22 may also be arranged in different layers, with an insulating layer provided between adjacent layers. The second connection lines 22 located in different layers are electrically connected to the corresponding connection structures 24 through first vias provided in the insulating layer and vias 210 provided in the second substrate 21.

[0094] In some embodiments, multiple connection structures 24 are arranged in sequence along at least one side edge of the display area of ​​the second panel 2. This arrangement, on the one hand, prevents the distribution of the multiple connection structures 24 from causing visual shadows on the display of the second panel 2, and on the other hand, facilitates the electrical connection between the second panel 2 and the first panel 1, thereby improving the efficiency of the electrical connection assembly between the second panel 2 and the first panel 1.

[0095] In some embodiments, the display layer 23 includes a driving circuit layer 231 and a light-emitting device layer 232, and the driving circuit layer 231 and the light-emitting device layer 232 are stacked in sequence away from the second substrate 21; the driving circuit layer 231 includes a pixel circuit, a first shift register circuit and a second shift register circuit, and the pixel circuit is electrically connected to the first shift register circuit and the second shift register circuit respectively; the pixel circuit is used to drive the light-emitting device layer 232 to emit light; the first shift register circuit is used to provide a gate drive signal to the pixel circuit; and the second shift register circuit is used to provide a light-emitting control signal to the pixel circuit.

[0096] Among them, by integrating the first shift register circuit and the second shift register circuit in the second panel 2, the gate drive signal and the light-emitting control signal required for the pixel circuit to drive the light-emitting device layer 232 to emit light can be provided by the first shift register circuit and the second shift register circuit respectively, and no longer need to be introduced from the first panel 1, so there is no need to open corresponding vias in the second substrate 21, and there is no need to set corresponding connection structures 24 in the second panel 2, thereby reducing the number of vias 210 opened in the second substrate 21, and at the same time reducing the number of connection structures 24 set in the second panel 2, ultimately solving the problem of difficulty in electrical connection between the second panel 2 and the first panel 1 caused by too many vias 210 and connection structures 24 in the second substrate 21.

[0097] In some embodiments, the light-emitting device layer 232 includes multiple organic electroluminescent devices (OLED devices) of different colors, each of which is electrically connected to a corresponding pixel circuit. For example, if the light-emitting device layer 232 includes red, green, and blue OLEDs, the power consumption of the display panel can be significantly reduced compared to a display panel using white OLED devices. Furthermore, the size of the second panel 2 can be smaller, and during the manufacturing process, the second panel 2 can be formed using a metal mask for evaporation to form the different color emitting layers of the different color OLED devices, without being limited by the high-precision metal mask (FMM) manufacturing process.

[0098] In some embodiments, the organic electroluminescent device can be of top emission type, so that the pixel circuit, the first shift register circuit and the second shift register circuit can be integrated in the display area of ​​the second panel 2, without causing any impact on the display of the display panel. At the same time, the border width of the second panel 2 will not be increased, which is conducive to enabling the second panel 2 to achieve borderless display.

[0099] In some embodiments, the display panel further includes a pixel defining layer 7 and an encapsulation layer 8. The pixel defining layer 7 is located between the drive circuit layer 231 and the light-emitting device layer 232. The pixel defining layer 7 has multiple first openings defined therein, and the multiple organic electroluminescent devices in the light-emitting device layer 232 are located in different first openings. The encapsulation layer 8 is located on the side of the display layer 23 facing away from the second substrate 21 and is used to encapsulate the light-emitting device layer 232.

[0100] In some embodiments, there are multiple first connection lines 12, and the multiple first connection lines 12 are arranged in the same layer. This arrangement facilitates the first connection lines 12 to be aligned with the connection structure 24 and achieve electrical connection.

[0101] In some embodiments, to prevent cross-circuiting between first connection lines 12 transmitting different signals, multiple first connection lines 12 may be arranged in parallel. In some embodiments, multiple first connection lines 12 may also be arranged in different layers, with an insulating layer provided between adjacent layers. Multiple connection electrodes are provided on the surface layer of the first panel 1 that is electrically bonded to the second panel 2. The first connection lines 12 located on different layers are electrically connected to the corresponding connection electrodes through second vias provided in the insulating layer, thereby achieving electrical connection between the connection electrodes and the first connection lines 12, as well as bonding between the connection electrodes and the connection structure 24.

[0102] In some embodiments, reference Figure 1a The first panel 1 also includes a signal source circuit 13, which is located on the same side of the first substrate 11 as the first connecting line 12, and the signal source circuit 13 is electrically connected to the first connecting line 12; the signal source circuit 13 includes a power supply circuit and a display signal circuit, the power supply circuit is used to provide a power supply signal to the first connecting line 12; the display signal circuit is used to provide a display signal to the first connecting line 12.

[0103] In some embodiments, reference Figure 1a , multiple first connecting lines 12 extend from the area of ​​the first panel 1 corresponding to the second panel 2 to the binding side frame area 101 of the first panel 1. In the binding side frame area 101 of the first panel 1, the multiple first connecting lines 12 are distributed in a fan shape and are electrically connected to the signal source circuit 13 located in the binding side frame area 101.

[0104] In some embodiments, reference Figure 1b and Figure 1c The display panel further includes a conductive adhesive 3 located between the connection structure 24 and the first connection line 12. The orthographic projection of the conductive adhesive 3 on the first substrate 11 is located in the overlapping region of the orthographic projections of the connection structure 24 and the first connection line 12 on the first substrate 11. In this embodiment, the connection structure 24 and the first connection line 12 are electrically bonded via the conductive adhesive 3.

[0105] In some embodiments, the conductive adhesive 3 includes UV-curable conductive adhesive or anisotropic conductive adhesive.

[0106] Among them, ultraviolet light curing conductive adhesive such as UV conductive adhesive and anisotropic conductive adhesive is ACF adhesive. UV conductive adhesive can be cured at room temperature; the operating temperature of ACF adhesive is low, below 100°C, and the bonding time is short, within 5 seconds. Since the bonding connection between the connecting structure 24 and the first connecting line 12 is performed after the preparation of the organic electroluminescent device is completed, the subsequent bonding process is likely to have a certain impact on the performance of the organic electroluminescent device. In this embodiment, the bonding between the connecting structure 24 and the first connecting line 12 is achieved by ultraviolet light curing conductive adhesive or anisotropic conductive adhesive, which can avoid thermal effects on the organic electroluminescent device, thereby ensuring the performance of the organic electroluminescent device.

[0107] In some embodiments, UV-curable conductive adhesive is printed on the first panel 1 or the second panel 2, and then the second panel 2 is aligned and bonded to the first panel 1. Anisotropic conductive adhesive (ACF adhesive) is applied to the first panel 1 or the second panel 2, the protective film removed, and the first and second panels 1, 2, aligned and pressed together using a bonding tool, thereby achieving alignment and bonding between the second panel 2 and the first panel 1. Bonding with ACF adhesive can effectively prevent lateral short circuits between adjacent connecting structures 24, improving bonding yield.

[0108] In some embodiments, reference Figure 2a and Figure 2b , Figure 2a Schematic top view of a via hole in the second substrate according to an embodiment of the present disclosure. Figure 2b This is a cross-sectional schematic diagram of the via hole in the second substrate of the embodiment of the present disclosure; the radial dimension s1 of the first end opening 210a of the via hole 210 located on the first side of the second substrate 21 is greater than the radial dimension s2 of the second end opening 210b of the via hole 210 located on the second side of the second substrate 21.

[0109] In some embodiments, the ratio of the radial dimension s2 of the second end opening 210 b to the radial dimension s1 of the first end opening 210 a ranges from 1:1 to 1:6.

[0110] In some embodiments, the radial dimension s1 of the first end opening 210a of the via hole 210 located on the first side of the second substrate 21 is 30-44 μm, and the radial dimension s2 of the second end opening 210b of the via hole 210 located on the second side of the second substrate 21 is 14-20 μm.

[0111] In some embodiments, reference Figure 2bThe angle θ between the wall of the via hole 210 and the surface of the second side 202 of the second substrate 21 is in the range of 20° to 80°. This configuration ensures that the second connecting wire 22 in the via hole 210 will not break, thereby ensuring a reliable electrical connection between the second connecting wire 22 and the connecting structure 24, and further ensuring a reliable electrical connection between the second panel 2 and the first panel 1.

[0112] In some embodiments, reference Figure 1c and Figure 3 , Figure 3 This is another cross-sectional schematic diagram of the display panel in the embodiment of the present disclosure; wherein, the second panel 2 also includes a first inorganic insulating layer 25, which is located between the second substrate 21 and the second connecting line 22, and an opening 250 is provided in the first inorganic insulating layer 25, and the orthographic projection of the opening 250 on the second substrate 21 is located within the orthographic projection area of ​​the via 210 on the second substrate 21; the first inorganic insulating layer 25 covers the second substrate 21 and the hole wall of the via 210.

[0113] In some embodiments, the second substrate 21 is made of an organic resin material, such as polyimide, etc. The first inorganic insulating layer 25 is made of silicon nitride or silicon oxide, etc. In some embodiments, the second substrate 21 is made of an inorganic material, such as glass, etc.

[0114] The opening 250 and the via 210 form a sleeve hole, through which the second connecting wire 22 and the connecting structure 24 can be electrically connected. The first inorganic insulating layer 25 covers the second substrate 21 and the hole wall of the via 210, which can protect the second connecting wire 22 and prevent the second connecting wire 22 from being broken due to burrs on the surface of the second substrate 21 during the preparation process.

[0115] In some embodiments, reference Figure 3 The second panel 2 also includes a flat layer 26 and a second inorganic insulating layer 27, which are located between the second connecting line 22 and the display layer 23, and the flat layer 26 and the second inorganic insulating layer 27 are stacked in sequence away from the second substrate 21, and the orthographic projections of the flat layer 26 and the second inorganic insulating layer 27 on the second substrate 21 cover the second substrate 21, and the surface of the flat layer 26 on the side away from the second substrate 21 is flush.

[0116] In some embodiments, the planar layer 26 is made of an organic resin material, such as polyester, and the second inorganic insulating layer 27 is made of silicon nitride or silicon oxide.

[0117] Among them, since the second substrate 21 is relatively thick, the via holes 210 opened therein are relatively deep. The display layer 23 needs to be formed on a relatively flat surface. Therefore, the flat layer 26 is provided to fill the via holes 210, making the surface of the film layer forming the display layer 23 flat. A second inorganic insulating layer 27 is provided on the side of the flat layer 26 facing away from the second substrate 21. On the one hand, the conductive film layer in the display layer 23 is formed on the second inorganic insulating layer 27, avoiding the problem of the conductive film layer being easily peeled off from the flat layer 26 when formed on the flat layer 26, and the film formation being unstable; on the other hand, burrs on the surface of the flat layer 26 during the preparation process are avoided, which may cause the conductive film layer to break; on the other hand, the overlapping of the flat layer 26 and the second inorganic insulating layer 27 can prevent the organic electroluminescent material in the display layer 23 from being corroded by external water and oxygen.

[0118] In some embodiments, reference Figure 4 , is another cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure; wherein, the display panel further includes a cover plate 4, which is located on a side of the second panel 2 facing away from the first panel 1, and the orthographic projection of the cover plate 4 on the first panel 1 covers the multiple second panels 2; and further includes a frame sealant 5, which is located between the cover plate 4 and the first panel 1, and is located in the peripheral edge areas of the cover plate 4 and the first panel 1, and the frame sealant 5 is bonded to the peripheral edge areas of the cover plate 4 and the first panel 1 to form a closed cavity between the cover plate 4 and the first panel 1; the multiple second panels 2 are located in the closed cavity.

[0119] Among them, by providing the cover plate 4, the second panel 2 can be packaged and protected in the event that the packaging of the second panel 2 fails, thereby preventing external water and oxygen from entering the second panel 2, thereby avoiding the external water and oxygen from corroding the organic electroluminescent material in the second panel 2, and ensuring that the second panel 2 has packaging reliability and display quality.

[0120] In some embodiments, the frame sealant 5 may be made of ultraviolet curing adhesive, which can be cured at room temperature to avoid adverse effects on the second panel 2 .

[0121] In some embodiments, reference Figure 5 , which is a top view schematic diagram of a second panel in an embodiment of the present disclosure; wherein, the connection structure includes a connecting electrode connected to the data line, a connecting electrode connected to the power line, a connecting electrode connected to the clock signal line, a connecting electrode connected to the trigger signal line, and a connecting electrode connected to the reset signal line.

[0122] Reference Figure 5, is a 5-inch second panel 2, the resolution of the second panel 2 is 80PPI, the pixel circuit, the first shift register circuit and the second shift register circuit are all integrated in the second panel 2. With this configuration, the number of connection structures 24 in the second panel 2 is 323, of which 318 connection structures 24 are respectively electrically connected to the second connection lines 22 connected to different data lines (Data lines); 2 connection structures 24 are respectively electrically connected to the second connection lines 22 connected to different power lines (such as the VSS power line and the VDD power line); 1 connection structure 24 is electrically connected to the second connection line 22 connected to the reset signal line (RST signal line); 1 connection structure 24 is electrically connected to the second connection line 22 connected to the clock signal line (CLK signal line); and 1 connection structure 24 is electrically connected to the second connection line 22 connected to the trigger signal line (STV signal line).

[0123] In some embodiments, the cathodes of multiple organic electroluminescent devices are arranged on the entire surface. The cathodes of the organic electroluminescent devices are usually electrically connected to the VSS power line. The first connecting line 12 arranged on the first substrate 11 and electrically connected to the VSS power line can increase the cross-sectional area of ​​the cathode, thereby reducing the resistance of the cathode, and further reducing the power consumption of the display panel.

[0124] In some embodiments, the size of the second panel 2 ranges from 3 to 10 inches. The 3 to 10 inches refers to the diagonal length of the second panel 2. Second panels 2 of this size are more suitable for splicing to form a spliced ​​panel, and second panels 2 of this size can improve the yield of the bonding electrical connection between the second panel 2 and the first panel 1, thereby improving the manufacturing yield of the entire display panel and reducing the manufacturing cost.

[0125] Based on the above structure of the display panel, the present disclosure also provides a method for preparing the display panel. Figure 6a-6c , Figure 6a Schematic diagram of step S101 of preparing a display panel in an embodiment of the present disclosure; Figure 6b Schematic diagram of step S102 of preparing a display panel in an embodiment of the present disclosure;

[0126] Figure 6c Schematic diagram of step S103 of preparing a display panel in an embodiment of the present disclosure; wherein, the preparation method includes step S101: preparing a first panel 1.

[0127] The preparation of the first panel 1 includes preparing the first connecting lines 12 on one side of the first substrate 11. Specifically, the first connecting lines 12 can be prepared on one side of the first substrate 11 by a patterning process. The patterning process is a relatively mature traditional process and will not be described in detail here.

[0128] Step S102: preparing a plurality of second panels 2.

[0129] The preparation of the second panel 2 includes: first, sequentially preparing a connection structure 24, a second base 21, a second connection line 22 and a display layer 23 on one side of the substrate 6 to be peeled off; then, peeling off the substrate 6 to be peeled off.

[0130] Among them, the display layer 23, the second connecting line 22, the connecting structure 24 and the orthographic projections of the first connecting line 12 on the first substrate 11 overlap; the display layer 23 is electrically connected to the second connecting line 22; preparing the second substrate 21 includes opening a via 210 in the second substrate 21; the connecting structure 24 is exposed at the via 210, and the second connecting line 22 is electrically connected to the connecting structure 24 through the via 210.

[0131] In some embodiments, the second substrate 21 can be made of an organic resin material or an inorganic material such as glass. A via 210 is formed in the second substrate 21 through a patterning process. A layer of adhesive film is disposed between the substrate 6 to be peeled and the second substrate 21. When peeling the substrate 6, a light source is used to illuminate one side of the substrate 6 to be peeled, melting the adhesive film and thereby peeling the substrate 6.

[0132] In this embodiment, fabricating the display side 23 includes sequentially fabricating a driver circuit layer 231 and a light-emitting device layer 232. Fabricating the second panel 2 also includes fabricating a pixel defining layer 7 between the driver circuit layer 231 and the light-emitting device layer 232; and fabricating an encapsulation layer 8 on the side of the light-emitting device layer 232 facing away from the second substrate 21. Both the pixel defining layer 7 and the encapsulation layer 8 are fabricated using conventional processes and will not be further described here.

[0133] Step S103 : Align the plurality of second panels 2 with the first panel 1 and electrically connect the two.

[0134] The plurality of second panels 2 are located on the same side of the first panel 1 and are spliced ​​together, so that the connection structure 24 is electrically connected to the first connection line 12 .

[0135] Specifically, the conductive adhesive 3 can be printed or pasted on the connection structure 24 of the second panel 2 or on the position corresponding to the connection structure 24 of the first panel 1, and then the second panel 2 and the first panel 1 are aligned and bonded to achieve a bonded connection between the connection structure 24 and the first connection line 12. Multiple second panels 2 are sequentially attached to one side of the first panel 1, and the multiple second panels 2 are spliced ​​together.

[0136] The display panel provided by the embodiment of the present disclosure enables the display layer 23, the second connection line 22, the connection structure 24, and the first connection line 12 to overlap in their orthographic projections on the first substrate 11, and electrically connect the display layer 23, the second connection line 22, the connection structure 24, and the first connection line 12 to each other. This enables direct contact and electrical connection between the display layer 23, the second connection line 22, the connection structure 24, and the first connection line 12 in a direction perpendicular to the surface of the first panel 1 and the second panel 2, thereby preventing the electrical connection between the display layer 23, the second connection line 22, the connection structure 24, and the first connection line 12 from occupying the frame area of ​​the second panel 2. This can reduce or eliminate the width of the frame area of ​​the second panel 2, that is, can reduce or eliminate the width of the seam between multiple second panels 2, thereby achieving seamless splicing between the multiple second panels 2, and ultimately making the splicing of multiple second panels 2 no longer restricted by the large splicing frame.

[0137] In a second aspect, an embodiment of the present disclosure further provides a display device, comprising the display panel in the above embodiment.

[0138] By adopting the display panel in the above embodiment, seamless large-size display of the display device can be achieved, while reducing the display power consumption and manufacturing cost of the display device.

[0139] The display device provided in the embodiments of the present disclosure may be any product or component with a display function, such as an OLED panel, an OLED TV, an OLED billboard, a display, a mobile phone, or a navigation system.

[0140] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel, characterized in that: It comprises a first panel and a plurality of second panels, wherein at least two of the plurality of second panels are located on the same side of the first panel and are spliced ​​with each other; The first panel includes a first substrate and a first connecting line, wherein the first connecting line is located on one side of the first substrate; The second panel includes a second substrate, a second connecting line, a display layer, and a connecting structure, wherein the second connecting line and the display layer are sequentially stacked on a first side of the second substrate, and the connecting structure is located on a second side of the second substrate, and the first side and the second side are opposite to each other; The orthographic projections of the display layer, the second connecting line, the connecting structure, and the first connecting line on the first substrate overlap; The display layer is electrically connected to the second connecting line; A via hole is defined in the second substrate, the connection structure is exposed at the via hole, and the second connection line is electrically connected to the connection structure through the via hole; The first panel is located on a side of the connection structure away from the second substrate, and the connection structure is electrically connected to the first connection line.

2. The display panel according to claim 1, wherein: In the second panel, there are a plurality of second connection lines; the plurality of second connection lines are arranged in the same layer; There are multiple connection structures; the multiple connection structures are arranged on the same layer; The display layer is located in the display area of ​​the second panel, A plurality of the second connection lines and a plurality of the connection structures are located in the display area.

3. The display panel according to claim 2, wherein: In the second panel, a plurality of the connection structures are sequentially arranged along at least one side edge of the display area.

4. The display panel according to any one of claims 1 to 3, wherein: The display layer includes a driving circuit layer and a light emitting device layer, The driving circuit layer and the light emitting device layer are stacked in sequence away from the second substrate; The driving circuit layer includes a pixel circuit, a first shift register circuit and a second shift register circuit. The pixel circuit is electrically connected to the first shift register circuit and the second shift register circuit respectively; The pixel circuit is used to drive the light-emitting device layer to emit light; The first shift register circuit is used to provide a gate drive signal to the pixel circuit; The second shift register circuit is used to provide a light emitting control signal to the pixel circuit.

5. The display panel according to claim 4, wherein: There are multiple first connecting lines. A plurality of the first connecting lines are arranged in the same layer.

6. The display panel according to claim 5, wherein: The first panel further includes a signal source circuit, which is located on the same side of the first substrate as the first connecting line. The signal source circuit is electrically connected to the first connecting line; The signal source circuit includes a power supply circuit and a display signal circuit. The power supply circuit is used to provide a power signal to the first connecting line; The display signal circuit is used to provide a display signal to the first connecting line.

7. The display panel according to any one of claims 1-3, 5-6, characterized in that: It also includes a conductive adhesive located between the connecting structure and the first connecting line. The orthographic projection of the conductive adhesive on the first substrate is located in an overlapping area of ​​the orthographic projections of the connecting structure and the first connecting line on the first substrate.

8. The display panel according to claim 1, wherein: A radial dimension of an opening of a first end of the via hole located on the first side of the second substrate is greater than a radial dimension of an opening of a second end of the via hole located on the second side of the second substrate.

9. The display panel according to claim 8, wherein: The ratio of the radial dimension of the second end opening to the radial dimension of the first end opening is in a range of 1:1 to 1:

6.

10. The display panel according to claim 8, wherein An included angle between a hole wall of the via hole and the second side surface of the second substrate ranges from 20° to 80°.

11. The display panel according to any one of claims 8 to 10, characterized in that: The second panel further includes a first inorganic insulating layer located between the second substrate and the second connecting line. An opening is formed in the first inorganic insulating layer, and an orthographic projection of the opening on the second substrate is located within an orthographic projection area of ​​the via hole on the second substrate; The first inorganic insulating layer covers the second substrate and the hole wall of the via hole.

12. The display panel according to claim 11, wherein: The second panel further includes a planar layer and a second inorganic insulating layer, which are located between the second connecting line and the display layer, and the planar layer and the second inorganic insulating layer are stacked away from the second substrate in sequence. The orthographic projections of the planar layer and the second inorganic insulating layer on the second substrate cover the second substrate, A surface of the flat layer facing away from the second substrate is flush.

13. The display panel according to claim 1, wherein Also included is a cover plate located on a side of the second panel facing away from the first panel, The orthographic projection of the cover plate on the first panel covers the plurality of second panels; The frame sealant is located between the cover plate and the first panel and is located at the peripheral edge areas of the cover plate and the first panel. The frame sealant is bonded to the peripheral edge areas of the cover plate and the first panel to form a sealed cavity between the cover plate and the first panel. The plurality of second panels are located in the enclosed cavity.

14. The display panel according to claim 2 or 3, characterized in that: The connection structure includes a connection electrode connected to a data line, a connection electrode connected to a power line, a connection electrode connected to a clock signal line, a connection electrode connected to a trigger signal line, and a connection electrode connected to a reset signal line.

15. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 14.

16. A method for preparing a display panel, characterized in that: The method comprises preparing a first panel; preparing a plurality of second panels; Aligning the plurality of second panels with the first panel and electrically connecting the two; The plurality of second panels are located on the same side of the first panel and are spliced ​​with each other; The preparing the first panel includes preparing a first connecting line on one side of the first substrate; Preparing the second panel includes sequentially preparing a connection structure, a second base, a second connection line, and a display layer on one side of the substrate to be peeled off; The orthographic projections of the display layer, the second connecting line, the connecting structure, and the first connecting line on the first substrate overlap; The display layer is electrically connected to the second connecting line; Preparing the second substrate includes forming a via hole in the second substrate; the connection structure is exposed at the via hole, and the second connection line is electrically connected to the connection structure through the via hole; peeling off the substrate to be peeled off; The connection structure is electrically connected to the first connection line.

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