Preparation method of low-thermal-conductivity foaming composition for low-density quick release system
By using modified composite fibers and emulsifiers, the formation of foam cells is promoted and the closed cell rate is increased, which solves the problems of high thermal conductivity and easy rupture of hollow microspheres in traditional foaming materials, and realizes a foaming composition with low thermal conductivity and high thermal insulation performance.
Patent Information
- Application Number
- CN202510776912.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-11
- Publication Date
- 2025-10-03
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional foaming materials have deficiencies in terms of pore density and closed-cell rate, resulting in a high thermal conductivity coefficient, which makes it difficult to meet the strict requirements of car refrigerators for thermal insulation performance. In addition, hollow microspheres are prone to breakage during the foaming process, resulting in uneven dispersion, affecting the thermal insulation effect.
Modified composite fibers and emulsifiers were used to prepare modified composite fibers by electrospinning. Raw materials such as cyclopentane, polymethylene polyphenyl isocyanate and polycarbonate diol were added during the foaming process. The modified composite fibers were used as heterogeneous nucleation sites to promote bubble formation and increase the closed cell rate. The emulsifier was combined with the emulsifier to improve bubble stability.
The low thermal conductivity and high closed cell ratio of the foaming composition are achieved, the thermal insulation performance is improved, the mechanical strength and dimensional stability of the foaming composition are enhanced, and the thermal conductivity coefficient is reduced.