Resin composition, method for manufacturing electronic device, and electronic device

By using a resin composition with a specific composition to form an adhesive component, the problem of insufficient coating properties of the adhesive layer in foldable display devices is solved, achieving excellent performance in adhesion and transparency, suitable for folding and unfolding of flexible display devices.

CN120818098APending Publication Date: 2025-10-21SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202510455435.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-04-12
Filing Date
2025-04-11
Publication Date
2025-10-21

AI Technical Summary

Technical Problem

Existing adhesive resins are difficult to meet the requirements for superior coating properties for different shapes and components when forming adhesive layers for foldable, flexible and/or rollable display devices.

Method used

A resin composition comprising urethane (meth)acrylate, a monofunctional (meth)acrylate monomer, a free radical polymerization initiator, and a polyether-modified dimethylsiloxane, with a viscosity in the range of about 5 mPa·s to about 20 mPa·s, is used to form adhesive components, ensuring adhesion to different shapes and components.

Benefits of technology

It achieves excellent applicability and display quality of adhesive components in foldable display devices, ensuring adhesion and transparency, and is suitable for folding and unfolding flexible display devices.

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Abstract

The invention provides a resin composition, a method for manufacturing an electronic device, and an electronic device. The resin composition includes at least one urethane (meth) acrylate having a weight average molecular weight of about 5,000 to about 50,000, at least one monofunctional (meth) acrylate monomer, at least one photoinitiator including a free-radical polymerization initiator, and a polyether-modified dimethyl siloxane having a number average molecular weight of about 1,000 to about 30,000, and excluding any polyfunctional (meth) acrylate monomer. The resin composition has a viscosity of from about 5 mPa.s to about 20 mPa.s, as measured by the JIS K7117-2 method at about 25 DEG C. The molecular weight of the dimethyl siloxane group may be from about 15% to about 90% based on 100% of the total molecular weight of the polyether-modified dimethyl siloxane. When the sum of the weight of the urethane (meth) acrylate and the weight of the monofunctional (meth) acrylate monomer is 100 parts by weight, the weight of the polyether-modified dimethyl siloxane may be about 0.001 parts by weight to about 0.1 parts by weight.
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