Radio frequency device and semiconductor device
By combining the antenna with the packaging structure and using a metal frame and plastic packaging material, the problems of UWB antenna design occupying a large PCB area and being difficult to miniaturize are solved, achieving the effects of cost reduction and structural simplification.
CN120834129APending Publication Date: 2025-10-24CALTERAH SEMICON TECH (SHANGHAI) CO LTD
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Patent Information
- Application Number
- CN202410452077.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-10-24
AI Technical Summary
Technical Problem
In existing UWB technology, the antenna design occupies a large PCB area, and the antenna device assembly method makes it difficult to achieve product miniaturization.
Method used
The antenna is combined with the packaging structure and encapsulated using a metal frame and plastic packaging materials. The part adjacent to the IC bare chip serves as the antenna radiation part, simplifying the packaging structure and realizing the radiation function.
Benefits of technology
The packaging cost is reduced, the structure is simplified, and the miniaturization of the antenna and efficient signal transmission are achieved.
✦ Generated by Eureka AI based on patent content.
Abstract
The radio frequency device comprises a packaging structure and an antenna unit, the packaging structure comprises a metal frame and an IC bare chip arranged on the metal frame, the part, corresponding to the installation position of the IC bare chip, of the metal frame serves as a radiation part of the antenna unit, and the antenna unit is arranged on the metal frame. And the radiation part is also electrically connected with the IC bare chip for signal transmission.
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