Preparation method of high-frequency low-thermal-expansion BT resin-based packaging substrate material

By optimizing the preparation process and surface modification treatment of scandium tungstate filler, the problems of dielectric loss and thermal expansion coefficient of BT resin substrate material in the high-frequency band were solved, realizing a high-frequency, low-thermal-expansion packaging substrate material, which improves the reliability of devices and signal transmission performance.

CN120966244APending Publication Date: 2025-11-18ZHEJIANG UNIV
0 Cites 0 Cited by

Patent Information

Application Number
CN202511036085.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-26
Publication Date
2025-11-18

AI Technical Summary

Technical Problem

Existing BT resin-based packaging substrate materials suffer from high dielectric loss at high frequencies, and the difference in thermal expansion coefficients leads to device warping and reliability issues. Traditional methods cannot simultaneously achieve excellent high-frequency dielectric performance and low thermal expansion.

Method used

By optimizing the preparation process of scandium tungstate filler, using gradient low-temperature pre-sintering and surface modification treatment, and combining it with a bismaleimide-triazine resin system, a scandium tungstate filler with small particle size and excellent dielectric properties was prepared for use in the preparation of high-frequency, low-thermal-expansion packaging substrate materials.

Benefits of technology

It significantly reduces the thermal expansion coefficient and dielectric loss of composite materials, improves the dimensional stability and high-frequency performance of the substrate, and meets the requirements of high-density packaging and high reliability.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention relates to an electronic packaging material technology, and aims to provide a preparation method of a high-frequency low-thermal-expansion BT resin-based packaging substrate material. Comprising the following steps: modifying scandium tungstate powder serving as an inorganic filler by using a pre-hydrolyzed silane coupling agent: mixing BMI, CE and DBA resins with a curing catalyst, heating, melting, and stirring until the mixture is clear and transparent; adding the modified scandium tungstate filler, or simultaneously adding the modified scandium tungstate filler and the modified spherical silicon dioxide; ultrasonic treatment is performed while continuous stirring is performed, and a uniformly mixed glue solution is obtained. The powder with specific small particle size and excellent dielectric property is obtained by optimizing the process, and the packaging substrate material with remarkably reduced thermal expansion coefficient and excellent high-frequency dielectric property can be prepared by combining with a needle surface modification technology; and when being further combined with reinforcing materials such as glass fiber cloth and the like, the composite material shows an excellent synergistic effect, and is particularly suitable for high-density packaging and high-reliability application scenes with extremely strict requirements on dimensional stability.
Need to check novelty before this filing date? Find Prior Art