RGB backlight partition display LED packaging module and preparation method thereof

Abstract

The invention discloses an RGB backlight partition display LED packaging module and a preparation method thereof, and belongs to the technical field of backlight display. The RGB backlight partition display LED packaging module comprises a substrate, an LED assembly, a barrier wall assembly and an optical transparent adhesive diffusion particle layer. The LED assembly is arranged on the substrate; the barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls, and the barrier walls are used for isolating an optical path; the optical transparent adhesive tape is used for isolating pollutants and carrying out primary light mixing on colored light emitted by the LED assembly; and the diffusion particle layer is used for converting the directionally propagated light into spatial random distribution so as to eliminate glare spots caused by specular reflection, and carrying out secondary light mixing on the colored light emitted by the LED assembly. According to the RGB backlight partition display LED packaging module provided for a user, the color levels displayed by the packaging module are effectively enriched, the image quality is improved, and the power consumption of a machine is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of backlight display, in particular to an RGB backlight partition display LED packaging module and a preparation method thereof. BACKGROUND

[0002] In the field of display technology, with the continuous improvement of Mini LED chip manufacturing process and driving technology, its application in backlight display is increasing year by year.

[0003] As a display solution targeting the mid-to-high-end market, Mini LED backlight is naturally adapted to high-contrast picture presentation requirements due to its fine partition light control characteristics, and is usually combined with high color gamut technology to improve color performance. The current mainstream architecture is still based on the combination mode of white light source backlight and liquid crystal panel. For high color gamut implementation path, the industry mainly adopts three technical routes: one is the scheme of independent control of RGB three primary color electroluminescent chips; two is the mixed conversion scheme based on blue light chip exciting KSF fluorescent powder and beta-SiAlON fluorescent powder; three is the structure design of blue light chip combined with quantum film.

[0004] Specifically, although the combination of blue light chip, KSF powder and beta-SiAlON fluorescent powder has cost advantages, its NTSC color gamut coverage can only reach about 85%, which is difficult to meet the requirements of wide color gamut for high-end display; while the combination of blue light and quantum film can break through 100% NTSC color gamut, but the amount of quantum dot material is large, and the preparation cost of water and oxygen barrier layer is high, which has a significant price disadvantage in large-size, especially in the application of super-large screens above 85 inches. In addition, the photoelectric conversion efficiency of this scheme is low, which leads to a significant increase in the whole machine power consumption under the same brightness. As for the RGB three primary color electroluminescent chip scheme, although it can realize delicate color levels and dynamic energy saving effect by independently adjusting the brightness of each channel, the core bottleneck is the low yield of GaAs material red light chip due to its mechanical brittleness, and the economic burden of red light chip cost reaching twice that of blue light chip, which makes the overall backlight system cost high.

[0005] That is, the current high color gamut implementation path has defects, and an LED packaging module that can provide higher picture quality and energy efficiency is urgently needed.

[0006] Therefore, the prior art still needs to be improved and improved. SUMMARY

[0007] The main purpose of the present application is to provide an RGB backlight partition display LED packaging module and a preparation method thereof, which aims to solve the problem of low-cost compatibility with high energy efficiency, high picture quality and true television picture quality in the prior art.

[0008] In order to achieve the object, the first aspect of the present application provides an RGB backlight partition display LED packaging module, which comprises a substrate, an LED assembly, a barrier wall assembly, and an optical transparent adhesive diffusion particle layer. The LED assembly is arranged on the substrate and is configured to provide a light source to form a target color. The barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls configured to isolate light paths. The optical transparent adhesive is configured to isolate contaminants and perform first light mixing on color light emitted by the LED assembly. The diffusion particle layer is configured to convert directional light into spatially random distribution to eliminate glare spots caused by specular reflection and perform second light mixing on color light emitted by the LED assembly.

[0009] In an implementation manner, the LED assembly comprises three-color pads, a first number of green light chips, and a second number of blue light chips, wherein the second number is twice the first number.

[0010] In an implementation manner, the RGB backlight partition display LED packaging module further comprises an R medium configured to convert blue light emitted by the blue light chips into red light.

[0011] In an implementation manner, the barrier wall assembly comprises a peripheral barrier wall and a first barrier wall, the peripheral barrier wall comprises a second barrier wall, a third barrier wall, a fourth barrier wall, and a fifth barrier wall, wherein the second barrier wall and the third barrier wall are peripheral barrier walls parallel to the first barrier wall, the fourth barrier wall and the fifth barrier wall are peripheral barrier walls perpendicular to the first barrier wall, and the first barrier wall is arranged inside the packaging module and connected to the fourth barrier wall and the fifth barrier wall. The height of the first barrier wall is less than the height of the peripheral barrier wall. The width between the first barrier wall and the second barrier wall is less than the width between the first barrier wall and the third barrier wall.

[0012] In an implementation manner, the first number of blue light chips are arranged between the first barrier wall and the second barrier wall. The first number of blue light chips and the first number of green light chips are arranged between the first barrier wall and the third barrier wall.

[0013] In an implementation manner, the R medium is arranged between the first barrier wall and the second barrier wall, wraps the blue light chips between the first barrier wall and the second barrier wall, and has a height not higher than the first barrier wall. When the blue light chip emits blue light between the first barrier wall and the second barrier wall, the R medium absorbs the blue light and forms a red color of the three primary colors by photoexcitation; Part of the red color transmits through the first barrier wall to the optical transparent glue part in the cavity of the packaging module, and the other part is reflected to the optical transparent glue part after encountering the peripheral barrier wall.

[0014] In an implementation manner, the optical transparent glue is arranged between the two barrier walls and the third barrier wall, and has a height consistent with the peripheral barrier wall, and the diffusion particle layer is arranged on the optical transparent glue and the peripheral barrier wall; When the blue light chip emits blue light between the first barrier wall and the third barrier wall, the green light chip emits green light into the optical transparent glue part, and the blue light and the green light superimpose the red light in the optical transparent glue part to perform first light mixing to obtain target color light, wherein the optical transparent glue contains first mixed diffusion particles to enhance the light mixing effect; The target color light enters the diffusion particle layer to perform second light mixing to obtain uniform target color light, wherein the diffusion particle layer contains second mixed diffusion particles, and the concentration of the second mixed diffusion particles contained in the diffusion particle layer is greater than the concentration of the first mixed diffusion particles in the optical transparent glue.

[0015] In an implementation manner, the LED assembly includes three primary color pads and the same number of green light chips, blue light chips and red light chips. When the blue light chip emits blue light into the optical transparent glue part, the green light chip emits green light into the optical transparent glue part, and the red light chip emits red light into the optical transparent glue part, the blue light, the green light and the red light perform light mixing in the optical transparent glue part, and then enter the diffusion particle layer to perform second light mixing to obtain uniform target color light.

[0016] In a second aspect, the present application also provides a preparation method of an RGB backlight partition display LED packaging module, wherein the preparation method of the RGB backlight partition display LED packaging module comprises: Three primary color LED chip pads are made on the top surface of the circuit substrate, packaging pads are made on the bottom surface of the circuit substrate, and double-sided circuit conduction of the substrate is realized in a through-hole manner; The first barrier wall and the peripheral barrier wall dam array are made by molding or printing, each cell is divided into a first slot and a second slot by the first barrier wall, and the first slot is larger than the second slot; After the LED array is arranged in the slot bottom area between the barrier walls, the R medium is injected into the second slot, and the R medium is red fluorescent glue or red quantum dot glue; Optical transparent glue is injected into each peripheral barrier wall dam cell, the optical transparent glue protects the chip, and a three-primary-color mixed light area is formed; A diffusion layer glue layer containing diffusion particles is coated or molded on the top; A dense circuit substrate is cut along the peripheral barrier wall dam to form a plurality of target LED packaging modules.

[0017] In a third aspect, the embodiment of the present application further provides a terminal device, wherein the terminal device comprises a memory, a processor, and an RGB backlight partition display LED packaging module preparation program stored in the memory and executable on the processor; when the processor executes the RGB backlight partition display LED packaging module preparation program, the steps of the RGB backlight partition display LED packaging module preparation method described in the above solution are implemented.

[0018] Advantages: Compared with the prior art, the present application provides an RGB backlight partition display LED packaging module and a preparation method thereof. The RGB backlight partition display LED packaging module provided by the present application comprises a substrate, an LED assembly, a barrier wall assembly, and an optical transparent glue diffusion particle layer. The LED assembly is arranged on the substrate and is used to provide a light source to form a target color. The barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls, which are used to isolate light paths. The optical transparent glue is used to isolate contaminants and perform first light mixing on the color light emitted by the LED assembly. The diffusion particle layer is used to convert directional light into spatially random distribution to eliminate glare spots caused by mirror reflection and perform second light mixing on the color light emitted by the LED assembly. The RGB backlight partition display LED packaging module provided by the present application solves the problem that the low-cost compatible high-energy efficiency, high-quality true television picture quality effect cannot be achieved in the prior art. An LED packaging module capable of providing higher picture quality and energy efficiency is provided. The red, green, and blue three primary colors of the LED packaging can be controlled by changing the current size to control the color brightness, effectively enriching the color level of the display, improving the picture quality, and reducing the power consumption of the machine. At the same time, the production efficiency is high and the cost is low. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure principle diagram of the embodiment of the RGB backlight partition display LED packaging module provided by the present application. Figure 2 A top view of the structure of an embodiment of the RGB backlight zoned display LED packaging module provided by the present invention; Figure 3 A schematic diagram of another embodiment of the RGB backlight zone display LED packaging module provided by the present invention; Figure 4 This is a flowchart illustrating an embodiment of the method for preparing an RGB backlight zoned display LED packaging module provided by the present invention. Figure 5 A partition wall molding diagram of an embodiment of the method for manufacturing an RGB backlight zoned display LED packaging module provided by the present invention; Figure 6 A top view of a partition wall showing an embodiment of the method for manufacturing an RGB backlight zoned display LED packaging module provided by the present invention; Figure 7 A wall-mounting diagram illustrating an embodiment of the RGB backlight zoned display LED packaging module fabrication method provided by the present invention. Figure 8 This is a packaging cut-out diagram of an embodiment of the RGB backlight zone display LED packaging module manufacturing method provided by the present invention; Figure 9 A schematic diagram of a terminal device provided in an embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0021] Example 1 In today's display technology field, as Mini LED chips and related driving technologies gradually mature, the market share of Mini LED backlit displays is increasing significantly year by year. Because Mini LED backlit displays are positioned in the mid-to-high-end product category, they have high requirements for the contrast of the displayed image and are usually paired with high color gamut displays to achieve a superior visual effect. Currently, the mainstream display method uses a combination of white light source backlighting and LCD panels.

[0022] Regarding backlighting, there are three main ways to achieve high color gamut displays: one is to combine red, green and blue electroluminescent chips; the second is to use a combination of blue light chip with KsF powder and β-iALON phosphor; and the third is to use a combination of blue light chip and quantum film.

[0023] Specifically, while the combination of blue LED chip, KsF powder, and β-SiALON phosphor offers the advantage of lower cost, its NTSC color gamut only reaches approximately 85%, a significant drawback. The combination of blue LED chip and quantum dot film, however, achieves a much higher color gamut, typically easily exceeding 100% NTSC. However, this method also has some limitations, such as the larger amount of quantum dots used in the quantum dot film and the higher cost of the required water and oxygen barrier film. This is particularly problematic in large-screen TVs, especially in ultra-large displays exceeding 85 inches or even 100 inches, where the price of quantum dot film becomes extremely high. Furthermore, the photoelectric conversion efficiency of quantum dot film is relatively low, leading to higher overall power consumption for the same brightness. As for the combination of red, green, and blue electroluminescent chips, its ability to individually control the brightness of the three primary colors in the backlight significantly improves color gradation and effectively reduces dynamic power consumption. Unfortunately, the red light chip used in this method is made of GaAs material, which is relatively brittle, resulting in a low yield rate for the lamp board; moreover, the cost of the red light chip is twice that of the blue light chip, which keeps the cost of the entire backlight system high.

[0024] As Mini LED backlight technology becomes increasingly popular, consumers' demands for TV picture quality and energy efficiency are also constantly rising. Against this backdrop, existing phosphor and quantum film technologies are unlikely to achieve further breakthroughs in product technology.

[0025] Specifically, the problems and shortcomings of existing technologies can be summarized as follows: existing technical solutions are difficult to achieve high energy efficiency, high contrast, high color gamut, and low grayscale image fidelity in television picture quality at the same time while maintaining low cost.

[0026] In view of the problems existing in the prior art, the purpose of this embodiment is to provide an RGB backlight zone display LED packaging module to solve the problems of energy efficiency, cost and low grayscale image distortion in existing backlight display devices.

[0027] To achieve this goal, such as Figure 1 As shown, in this embodiment, the RGB backlight zone display LED packaging module provided includes a substrate, LED components, a barrier wall component, and an optically transparent adhesive diffusion particle layer. The LED assembly is disposed on the substrate and is used to provide a light source to form the target color; The barrier wall assembly is disposed on the substrate and includes multiple barrier walls, which are used to isolate the optical path; The optically transparent adhesive is used to isolate contaminants and to perform the first light mixing on the colored light emitted by the LED component; The diffused particle layer is used to convert directionally propagating light into a spatially random distribution to eliminate glare spots caused by specular reflection and to perform a second light mixing on the colored light emitted by the LED component.

[0028] Specifically, in this embodiment, the RGB backlight zone display LED packaging module mainly consists of several key parts: the substrate, the LED components, the barrier wall components, the optical transparent adhesive, and the diffusion particle layer. These components work together to achieve excellent display effects.

[0029] Specifically, the LED components are precisely positioned on the substrate to provide a light source to form the target color.

[0030] The barrier wall assembly, also mounted on the substrate, consists of multiple barriers. These barriers are not ordinary physical barriers, but highly specialized optical isolation devices. Their main function is to effectively isolate light paths, preventing interference and crosstalk between light emitted from different color chips. By precisely controlling parameters such as the position, height, and shape of the barriers, it is ensured that each light path propagates along a predetermined path, allowing light of various colors to be transmitted and mixed in an orderly manner within their respective areas. This guarantees the purity and accuracy of the final color, avoiding color deviations or blurring.

[0031] The optically transparent adhesive also plays a crucial protective role in the encapsulation module. Its main function is to isolate contaminants, preventing external impurities from intruding into the delicate internal structure. Dust, moisture, and other minute particles cannot penetrate this transparent protective barrier to enter the module. This highly efficient sealing performance not only extends the module's lifespan but also ensures its stability and reliability during long-term operation. Simultaneously, the optically transparent adhesive possesses excellent optical properties, minimizing the impact on light propagation and ensuring that light can pass smoothly through all layers, thereby achieving efficient light transmission and utilization.

[0032] The diffused particle layer is key to achieving uniform light distribution. Its main task is to transform directional light into a spatially randomized distribution. In practical applications, if light is too concentrated in one direction, it can easily create strong specular reflections, resulting in glare that not only affects visual perception but can also harm the eyes. The tiny particles in the diffused particle layer scatter the light, causing it to disperse in all directions, effectively eliminating glare caused by specular reflections. As a result, the light emitted from the module can illuminate the target area more softly and evenly, providing users with a comfortable and clear visual experience.

[0033] Specifically, the RGB backlight zone display LED packaging module achieves efficient, accurate, and stable backlight display functions through the organic combination and synergistic work of the substrate, LED components, barrier wall components, optical transparent adhesive, and diffusion particle layer, providing strong technical support for various high-end display devices.

[0034] In this embodiment, the LED component includes three primary color pads and a first number of green light chips and a second number of blue light chips, wherein the second number is twice the first number.

[0035] In this embodiment, the meticulously constructed LED component exhibits highly specialized and precise design features. Specifically, the LED component mainly consists of three primary color pads and a specific number of green and blue light chips, forming a complete and efficient light-emitting system. Specifically, in this embodiment, the LED component includes a first number of green light chips and a second number of blue light chips, and the quantity relationship between the green and blue light chips is clearly defined—that is, the second number is exactly twice the first number. This facilitates the subsequent conversion of the blue light emitted by the first number of blue light chips into red light, thereby forming more colors based on the three primary colors RGB. This precise quantity ratio is not arbitrary but a scientific design based on optical principles, color mixing theory, and practical application requirements, aiming to achieve optimal color performance and luminous efficiency.

[0036] Specifically, refer to Figure 2 Each independent packaging unit has the LED group mounted on top of its substrate. In the diagram, G represents the green light chip, and B represents the blue light chip. The internal structure of the LED group consists of n green G chips and 2n blue B chips arranged in an orderly fashion, where n represents a natural number. This layout not only ensures a reasonable spacing between the chips to facilitate heat dissipation and electrical connection stability, but also optimizes the light propagation path through a specific arrangement, resulting in more uniform, softer, and more vibrant light.

[0037] Reference Figure 1 Below the substrate are corresponding three-primary-color pads. The B pad connects to the blue LED chip on the left (without the R dielectric), the G pad connects to the green LED chip, and the R pad connects to the blue LED chip covered by the R dielectric. Specifically, these three-primary-color pads play a crucial electrical connection role, and their circuit attributes encompass various types, including R-, B-, G-, R+, B+, and G+. Notably, the R+, B+, and G+ circuits offer high design flexibility—they can be set up separately according to actual needs, operating independently, or connected in a common-anode configuration to simplify the circuit structure and improve production efficiency. This flexible circuit design allows the LED component to be widely applicable to various application scenarios and electronic devices, easily handling both display devices requiring high-precision color control and large-scale production projects with stringent cost and efficiency requirements.

[0038] Specifically, in this embodiment, the RGB backlight zoned display LED packaging module further includes an R medium, which is used to convert the blue light emitted by the blue light chip into red light.

[0039] In this embodiment, an innovative R-dielectric layer is introduced—a functional material layer specifically responsible for efficiently converting the blue light generated by the blue LED chip into red light. Its working principle is based on precisely controlled photoluminescence: when the powered blue LED chip emits high-energy photons of a specific wavelength (typically peaking at approximately 450-460 nm), this blue light penetrates and interacts with the functional material system in the R-dielectric layer. The R-dielectric can be implemented using different methods: in one application example, the R-dielectric can be a phosphor solution: by doping with rare-earth ions (such as...) An activated nitride or oxysulfide system forms a light conversion layer, which absorbs blue light energy using the Stokes shift effect and then radiates pure red light with a peak value in the range of 620-630nm. The R medium can also be a red quantum dot: using a CdSe / ZnS core-shell structure or cadmium-free environmentally friendly InP-based quantum dot material, precise wavelength tuning can be achieved by relying on the quantum confinement effect, which can accurately downconvert blue light into narrow bandwidth red light.

[0040] In terms of optical path design, the light cone emitted from the blue light chip is collimated and then directed onto the R dielectric layer. Through multiple scattering within the material and the enhancement effect of the resonant cavity, the photons are fully absorbed and utilized. Notably, this conversion process maintains a balance between excited-state lifetime and radiative recombination efficiency, with a measured quantum efficiency exceeding 85%. Furthermore, the converted red light exhibits excellent angular uniformity and Lambertian radiation characteristics. This innovative architecture breaks through the traditional RGB mixing model that relies on multiple chips emitting light independently. It achieves the supply of red light from the three primary colors using only the blue light chip and the R dielectric, significantly simplifying the complexity of the optical system.

[0041] As can be seen, this embodiment can finely adjust the full width at half maximum (FWHM) of red light (FWHM < 60nm) by controlling the phosphor particle size distribution or quantum dot density, avoiding crosstalk with adjacent color gamuts. Simultaneously, the use of high-temperature resistant silicone encapsulation ensures that over 90% of the initial brightness is maintained even under long-term high-temperature operating conditions (Tj ≤ 150℃). Furthermore, compared to a separate red light chip design, this approach saves approximately 40% of the active device cost while reducing the complexity of the driving circuit. It is suitable for applications with stringent color purity requirements.

[0042] Furthermore, the barrier wall assembly includes a peripheral barrier wall and a first barrier wall. The peripheral barrier wall includes a second barrier wall, a third barrier wall, a fourth barrier wall, and a fifth barrier wall. The second and third barrier walls are peripheral barrier walls parallel to the first barrier wall, and the fourth and fifth barrier walls are peripheral barrier walls perpendicular to the first barrier wall. The first barrier wall is placed inside the encapsulation module and is connected to the fourth and fifth barrier walls. The height of the first barrier wall is less than the height of the surrounding barrier walls; The width between the first barrier wall and the second barrier wall is less than the width between the first barrier wall and the third barrier wall.

[0043] The first number of blue light chips are disposed between the first barrier wall and the second barrier wall; The first number of blue light chips and the first number of green light chips are disposed between the first barrier wall and the third barrier wall.

[0044] The R medium is disposed between the first barrier wall and the second barrier wall, enclosing the blue light chip between the first barrier wall and the second barrier wall, and its height is not higher than the first barrier wall; When the blue light chip between the first barrier wall and the second barrier wall emits blue light, the R medium absorbs the blue light and forms the red light color among the three primary colors through photoexcitation; A portion of the red light passes through the first barrier wall and shines into the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the surrounding barrier wall.

[0045] The optically transparent adhesive is disposed between the second barrier wall and the third barrier wall, with the same height as the surrounding barrier wall; the diffused particle layer is disposed on the optically transparent adhesive and the surrounding barrier wall. When the blue light chip between the first barrier wall and the third barrier wall emits blue light into the optically transparent adhesive portion, and the green light chip emits green light into the optically transparent adhesive portion, the blue light and the green light are superimposed on the red light in the optically transparent adhesive portion to perform the first light mixing to obtain the target color light. The optically transparent adhesive contains first mixed diffusion particles to enhance the light mixing effect. The target color light enters the diffusion particle layer and undergoes a second mixing to obtain uniform target color light. The diffusion particle layer contains second mixed diffusion particles, and the concentration of the second mixed diffusion particles in the diffusion particle layer is greater than the concentration of the first mixed diffusion particles in the optically transparent adhesive.

[0046] Specifically, LED packaging is an extremely precise and complex process involving the coordinated combination and ingenious design of multiple key components. A complete LED packaging system encompasses numerous important elements, including the core LED element, the substrate serving as the supporting base, the first, second, and third barrier walls that provide isolation and guidance, the optically transparent adhesive with optical conduction capabilities, and the diffusion layer used to optimize light distribution. These components are not simply stacked together, but rather carefully planned and arranged to achieve efficient and stable optical performance and reliable electrical connections.

[0047] In this embodiment, each of the encapsulation modules contains a barrier wall assembly comprising barrier walls of varying heights. Specifically, the barrier wall assembly includes a peripheral barrier wall and a first barrier wall, wherein the peripheral barrier wall includes a second barrier wall, a third barrier wall, a fourth barrier wall, and a fifth barrier wall. The second and third barrier walls are peripheral barrier walls parallel to the first barrier wall, and the fourth and fifth barrier walls are peripheral barrier walls perpendicular to the first barrier wall. The first barrier wall is located inside the encapsulation module and is connected to the fourth and fifth barrier walls. Figure 1 Only the first barrier wall, the second barrier wall, and the third barrier wall are shown in the diagram.

[0048] Specifically, the first barrier wall has a first height, while the second and third barrier walls have a second height, and the height of the first barrier wall is less than the height of the second barrier wall. This height difference design is not accidental, but based on in-depth research and optimization of the light propagation path. Within the space between the first and second barrier walls, n (the first number) blue B-light chips are precisely positioned; while within the space between the first and third barrier walls, a combination of n (the first number) blue light chips and n (the first number) green light chips is rationally arranged, as detailed in the following reference. Figure 1 .

[0049] It is worth mentioning that a special material is coated on the blue light chip between the first barrier wall and the second barrier wall. In this embodiment, it is referred to as the R medium. The R medium can be either red phosphor or red quantum dot adhesive.

[0050] Furthermore, the optically transparent adhesive is uniformly disposed between the second and third barrier walls of the entire encapsulation, and the diffusion particle layer is disposed above the optically transparent adhesive. Since the width between the first and second barrier walls is smaller than the width between the first and third barrier walls, it is perfectly suited for placing the first number of blue light chips. Figure 2 and Figure 3 As shown, when the blue light emitted by the blue LED chip is powered on enters the R medium, both the fluorescent material and the red quantum dot material efficiently absorb the blue light and form red light, one of the three primary colors, through photoexcitation. Because the height of the first barrier wall is lower than the second barrier wall, the red light encountering the second barrier wall is reflected and then shines into the encapsulation cavity. In the region between the first and third barrier walls, the blue LED chip emits blue light, and the green LED chip emits green light. These three primary colors (red, green, and blue) undergo thorough mixing within the transparent adhesive layer to obtain the target color light, which then enters the diffusion particle layer together. In the diffusion particle layer, the middle diffusion particles scatter and reflect these three primary colors, further achieving a mixing effect and obtaining a uniform target color light. When all three chips are powered on simultaneously, the entire packaging device can emit a uniform spot of colored light; while when only the right blue chip is powered on, the surface of the packaging device will emit a uniform spot of red light.

[0051] Through this ingenious design, both the basic red, green, and blue primary colors, and various mixed colors, can emit a uniform light spot on the package surface. Furthermore, the peripheral barrier walls play a crucial role in optical control, effectively reflecting the large-angle portions of the three primary color light back into the package cavity, allowing the overall light to be more concentrated and processed by the diffuser layer. This design significantly reduces stray light generation and dramatically improves light extraction efficiency, ensuring that the LED package can exhibit high-quality, highly uniform light output in practical applications, meeting various demanding application requirements, such as high-end display devices and professional lighting fields.

[0052] In actual manufacturing, this precise quantity ratio and flexible circuit design provide strong support for efficient assembly on automated production lines. Standardized production processes and precise equipment control ensure that each LED component possesses consistent performance indicators and quality levels. Furthermore, the design fully considers ease of maintenance and replacement; when a chip fails, simply replacing the corresponding single chip restores the entire system to normal operation, significantly reducing maintenance costs and downtime.

[0053] In summary, this embodiment provides an RGB backlight zone display LED packaging module, which includes a substrate, LED components, a barrier wall component, and an optically transparent adhesive diffusion particle layer. The LED components are disposed on the substrate and are used to provide a light source to form a target color. The barrier wall component is disposed on the substrate and includes multiple barrier walls, which are used to isolate the light path. The optically transparent adhesive is used to isolate contaminants and to perform a first light mixing on the colored light emitted by the LED components. The diffusion particle layer is used to convert directional light into spatially random distribution to eliminate glare spots caused by specular reflection and to perform a second light mixing on the colored light emitted by the LED components. This embodiment provides an RGB backlight zone display LED packaging module that solves the problem in the prior art of not being able to achieve low-cost compatibility with high energy efficiency and high image fidelity in television picture quality. It provides an LED packaging module that can provide higher picture quality and energy efficiency. The red, green, and blue primary colors of the LED package can be individually controlled by changing the current, effectively enriching the color levels of the display, improving picture quality, and reducing machine power consumption. At the same time, it has high production efficiency and low cost.

[0054] Example 2 Reference Figure 4 In another embodiment, without the R medium, the LED assembly includes three primary color pads and the same number of green, blue and red light chips; When the blue light chip emits blue light into the optically transparent adhesive, the green light chip emits green light into the optically transparent adhesive, and the red light chip emits red light into the optically transparent adhesive, the blue, green, and red light are mixed in the optically transparent adhesive and then mixed a second time in the diffused particle layer to obtain uniform target color light.

[0055] Specifically, in this embodiment, the LED assembly includes the three primary color pads and an equal number of green, blue, and red light chips. These three primary color pads, serving as crucial hubs for electrical connections, correspond one-to-one with the blue, green, and red light colors, and are made of high-precision metal materials and advanced processing techniques. Their surfaces undergo special treatment to ensure excellent conductivity and extremely low contact resistance, thereby enabling stable and efficient current transmission to each corresponding chip. Each pad is laid out and sized strictly according to industry standards to ensure perfect fit and reliable connection with other components.

[0056] In actual operation, when current passes through the circuit to excite the blue light chip, the chip efficiently emits pure and stable blue light, which then precisely enters the optically transparent adhesive portion. Simultaneously, the green light chip, working in tandem, is also activated, releasing a green beam that is also accurately directed into the optically transparent adhesive portion. The red light chip, upon receiving an electrical signal, generates red light, which is then accurately injected into the optically transparent adhesive portion. After the blue, green, and red light colors are mixed in the optically transparent adhesive portion, they undergo a second mixing in the diffusion particle layer, resulting in uniform target color light.

[0057] Example 3 Based on Embodiment 1, the present invention also provides a method for manufacturing an RGB backlight zone display LED packaging module, such as... Figure 5 As shown, the method for manufacturing an RGB backlight zoned display LED packaging module provided in this embodiment includes the following steps: S100. Make LED chip pads with three primary colors on the top surface of the circuit board, and make encapsulation pads on the bottom surface of the circuit board. Achieve circuit connection on both sides of the board through through holes. S200. The first barrier wall and the surrounding barrier wall dam array are made by molding or printing. Each cell is divided into a first slot and a second slot by the first barrier wall. The first slot is larger than the second slot. S300. After setting the LED array in the bottom area of ​​the slot between the barrier walls, fill the second slot with R medium, which is red fluorescent adhesive or red quantum dot adhesive. S400. Optical transparent adhesive is applied to each of the surrounding barrier wall grids. The optical transparent adhesive protects the chip and forms a three-primary-color mixing area. S500: A diffusion layer adhesive layer containing diffusion particles is coated or molded on top. S600: The densely packed circuit board is cut along the surrounding barrier wall to form multiple target LED packaging modules.

[0058] Specifically, refer to Figure 6 In the manufacturing process of RGB LED packaging, an advanced multilayer composite substrate process is used to start the entire process. Specifically, a ceramic-metal composite material with a highly matched coefficient of thermal expansion is selected as the base material. The top surface of the substrate is formed with a micron-level precision LED chip pad array by magnetron sputtering. Each pad surface is treated with OSP anti-oxidation to ensure welding reliability. The bottom surface of the substrate is used to create miniaturized packaging pad patterns using laser direct imaging technology, and through-hole arrays with a diameter of no more than 0.1 mm are processed by high-precision drilling equipment. These through-holes are filled with copper by electroplating to form a three-dimensional conductive network to achieve double-sided circuit interconnection.

[0059] Figure 6 In the structural forming stage, nanoimprint lithography is used to mass-produce the three-dimensional barrier architecture. First, a photosensitive resist layer is spin-coated onto the substrate. Then, through molding or printing, the first barrier wall and the surrounding barrier wall array are formed with sub-micron level sidewall roughness, providing a precise positioning reference for subsequent cutting. Each cell is designed with a stepped double-groove structure, divided into a first groove and a second groove by the first barrier wall. The first groove is larger than the second groove. Figure 7 As can be seen, the first slot is on the left side of each packaging module, and the second slot is on the right side of each packaging module.

[0060] Reference Figure 8 After setting the LED array at the bottom of the slot between the barrier walls, red fluorescent adhesive or red quantum dot adhesive is poured into the second slot. Next, the optically transparent adhesive is applied to the surrounding grid of each encapsulation module. This optically transparent adhesive not only effectively protects the chip but also cleverly forms an area for the mixed emission of the three primary colors.

[0061] After the aforementioned steps are successfully completed, a diffusion layer adhesive layer is applied to the top by coating or molding. The adhesive layer contains uniformly distributed diffusion particles, and its substrate is made of the same material as the transparent optical adhesive.

[0062] Finally, as Figure 9 As shown, the meticulously crafted dense LED light panel is precisely cut along the surrounding barrier wall, thereby separating individual RGB LED packaged devices one by one. It is worth mentioning that after the surrounding barrier wall is cut, a second barrier wall, a third barrier wall, a fourth barrier wall, and a fifth barrier wall are formed, thus completing the fabrication of the RGB backlight zoned display LED packaged module.

[0063] In summary, this embodiment provides a method for fabricating an RGB backlight zoned display LED packaging module. During the fabrication of the packaging module, LED chip pads for the three primary colors are fabricated on the top surface of the circuit substrate, and packaging pads are fabricated on the bottom surface of the circuit substrate. Through-holes are used to achieve double-sided circuit connectivity on the substrate. Then, a first barrier wall and a peripheral barrier wall array are fabricated by molding or printing. Each cell is divided into a first slot and a second slot by the first barrier wall, with the first slot being larger than the second slot. Afterward, the LED array is placed in the bottom area of ​​the slots between the barrier walls. An R-medium, which is red fluorescent adhesive or red quantum dot adhesive, is then injected into the second slot. Optical transparent adhesive is then applied to each of the peripheral barrier wall squares. This optical transparent adhesive protects the chip and simultaneously forms a three-primary-color mixing area. A diffusion layer containing diffusion particles is then coated or molded onto the top. Finally, the densely fabricated circuit substrate is cut along the peripheral barrier wall array to form multiple target LED packaging modules. This embodiment provides a method for manufacturing an RGB backlight zone display LED package module, solving the problem in existing technologies that cannot achieve low-cost compatibility with high energy efficiency and high image fidelity in television picture quality. It provides a method for manufacturing an LED package module that offers higher image quality and energy efficiency. This allows the red, green, and blue primary colors of the LED package to have their brightness controlled individually by changing the current, effectively enriching the color gradations of the display, improving image quality, and reducing power consumption. Simultaneously, it offers high production efficiency and low cost.

[0064] It should be understood that although the steps in the flowcharts shown in the accompanying drawings are displayed sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of the steps in this invention, and these steps can be executed in other orders. Moreover, at least a portion of the steps in this invention may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least a portion of the sub-steps or stages of other steps.

[0065] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program using signal-related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided by this invention can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchlink, DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0066] Example 4 Based on the above embodiment three, the present invention also provides a terminal device, the principle block diagram of which can be as follows: Figure 9 As shown. The terminal device may include one or more processors 100 ( Figure 9 (Only one is shown in the image), memory 101, and computer program 102 stored in memory 101 and executable on one or more processors 100, such as a method program for manufacturing an RGB backlight zone display LED packaging module. When one or more processors 100 execute computer program 102, they can implement the various steps in the embodiment of the method for manufacturing an RGB backlight zone display LED packaging module. Alternatively, when one or more processors 100 execute computer program 102, they can implement the functions of each module / unit in the embodiment of the method for manufacturing an RGB backlight zone display LED packaging module, which is not limited here.

[0067] In one embodiment, the processor 100 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0068] In one embodiment, memory 101 may be an internal storage unit of an electronic device, such as a hard drive or RAM. Memory 101 may also be an external storage device of the electronic device, such as a plug-in hard drive, smart media card (SMC), secure digital (SD) card, flash card, etc. Furthermore, memory 101 may include both internal and external storage units. Memory 101 is used to store computer programs and other programs and data required by the terminal device. Memory 101 can also be used to temporarily store data that has been output or will be output.

[0069] Those skilled in the art will understand that ​ The block diagram shown is merely a partial structural diagram related to the present invention and does not constitute a limitation on the terminal device to which the present invention is applied. The specific terminal device may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An RGB backlight zoned display LED packaging module, characterized in that, The RGB backlight zone display LED packaging module includes a substrate, LED components, barrier wall components, and an optically transparent adhesive diffusion particle layer, characterized in that: The LED assembly is disposed on the substrate and is used to provide a light source to form the target color; The barrier wall assembly is disposed on the substrate and includes multiple barrier walls, which are used to isolate the optical path; The optically transparent adhesive is used to isolate contaminants and to perform the first light mixing on the colored light emitted by the LED component; The diffused particle layer is used to convert directionally propagating light into a spatially random distribution to eliminate glare spots caused by specular reflection and to perform a second light mixing on the colored light emitted by the LED component.

2. The RGB backlight zone display LED packaging module according to claim 1, characterized in that, The LED component includes three primary color pads and a first number of green light chips and a second number of blue light chips, wherein the second number is twice the first number.

3. The RGB backlight zoned display LED packaging module according to claim 2, characterized in that, The RGB backlight zoned display LED packaging module also includes an R medium, which is used to convert the blue light emitted by the blue light chip into red light.

4. The RGB backlight zone display LED packaging module according to claim 3, characterized in that, The barrier wall assembly includes a peripheral barrier wall and a first barrier wall. The peripheral barrier wall includes a second barrier wall, a third barrier wall, a fourth barrier wall, and a fifth barrier wall. The second and third barrier walls are peripheral barrier walls parallel to the first barrier wall, and the fourth and fifth barrier walls are peripheral barrier walls perpendicular to the first barrier wall. The first barrier wall is placed inside the encapsulation module and is connected to the fourth and fifth barrier walls. The height of the first barrier wall is less than the height of the surrounding barrier walls; The width between the first barrier wall and the second barrier wall is less than the width between the first barrier wall and the third barrier wall.

5. The RGB backlight zoned display LED packaging module according to claim 4, characterized in that, The first number of blue light chips are disposed between the first barrier wall and the second barrier wall; The first number of blue light chips and the first number of green light chips are disposed between the first barrier wall and the third barrier wall.

6. The RGB backlight zoned display LED packaging module according to claim 5, characterized in that, The R medium is disposed between the first barrier wall and the second barrier wall, enclosing the blue light chip between the first barrier wall and the second barrier wall, and its height is not higher than the first barrier wall; When the blue light chip between the first barrier wall and the second barrier wall emits blue light, the R medium absorbs the blue light and forms the red light color among the three primary colors through photoexcitation; A portion of the red light passes through the first barrier wall and shines into the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the surrounding barrier wall.

7. The RGB backlight zone display LED packaging module according to claim 6, characterized in that, The optically transparent adhesive is disposed between the second barrier wall and the third barrier wall, with the same height as the surrounding barrier wall; the diffused particle layer is disposed on the optically transparent adhesive and the surrounding barrier wall. When the blue light chip between the first barrier wall and the third barrier wall emits blue light into the optically transparent adhesive portion, and the green light chip emits green light into the optically transparent adhesive portion, the blue light and the green light are superimposed on the red light in the optically transparent adhesive portion to perform the first light mixing to obtain the target color light. The optically transparent adhesive contains first mixed diffusion particles to enhance the light mixing effect. The target color light enters the diffusion particle layer and undergoes a second mixing to obtain uniform target color light. The diffusion particle layer contains second mixed diffusion particles, and the concentration of the second mixed diffusion particles in the diffusion particle layer is greater than the concentration of the first mixed diffusion particles in the optically transparent adhesive.

8. The RGB backlight zone display LED packaging module according to claim 1, characterized in that, The LED component includes three primary color pads and the same number of green, blue and red light chips; When the blue light chip emits blue light into the optically transparent adhesive, the green light chip emits green light into the optically transparent adhesive, and the red light chip emits red light into the optically transparent adhesive, the blue, green, and red light are mixed in the optically transparent adhesive and then mixed a second time in the diffused particle layer to obtain uniform target color light.

9. A method for manufacturing an RGB backlight zoned display LED packaging module, characterized in that, The method of using the RGB backlight zone display LED packaging module as described in any one of claims 1-7 includes: LED chip pads with three primary colors are fabricated on the top surface of the circuit board, and encapsulation pads are fabricated on the bottom surface of the circuit board. The circuit on both sides of the board is made conductive through through holes. The first barrier wall and the surrounding barrier wall dam array are made by molding or printing. Each cell is divided into a first slot and a second slot by the first barrier wall, and the first slot is larger than the second slot. After setting the LED array in the bottom area of ​​the slot between the barrier walls, the second slot is filled with R medium, which is red fluorescent glue or red quantum dot glue; Optical transparent adhesive is applied to each of the surrounding barrier wall grids. The optical transparent adhesive protects the chip and simultaneously forms a three-primary-color mixing area. A diffusion layer adhesive layer containing diffusion particles is applied or molded onto the top. The densely packed circuit board is cut along the surrounding barrier wall to form multiple target LED packaging modules.

10. A terminal device, characterized in that, The terminal device includes a memory, a processor, and an RGB backlight zone display LED packaging module manufacturing program stored in the memory and capable of running on the processor. When the processor executes the RGB backlight zone display LED packaging module manufacturing program, it implements the steps of the RGB backlight zone display LED packaging module manufacturing method as described in claim 9.

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