A position detection method, device and equipment for wafer transfer process
By using real-time image acquisition and position comparison methods, the problem of damage caused by positional deviation during wafer transport was solved, achieving precise wafer position monitoring and cost savings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING XINYE TECHNOLOGY CO LTD
- Filing Date
- 2026-01-08
- Publication Date
- 2026-05-29
Smart Images
Figure CN121487559B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a method, apparatus, and equipment for position detection during wafer transfer. Background Technology
[0002] During the wafer manufacturing process, the robotic arm on the production equipment extends into the wafer cassette to grab the wafer. Due to long-term use, the parts of the robotic arm may wear down and become misaligned, causing collisions or slippage during the grabbing or placement of the wafer, which can damage the wafer.
[0003] In existing technologies, the state of a wafer is usually determined by the value of the adsorption pressure vacuum or by attaching sensors to the arm. However, existing wafer state monitoring methods are difficult to determine whether the wafer has shifted, which can easily lead to errors and increase the difficulty and cost of wafer transport. Summary of the Invention
[0004] This invention provides a method, apparatus, and equipment for position detection during wafer transport, in order to reduce wafer breakage rate and save costs.
[0005] In a first aspect, the present invention provides a position detection method for a wafer transfer process, comprising:
[0006] Acquire real-time images at at least one operating station during the wafer transfer process;
[0007] The wafer position is extracted based on the real-time image;
[0008] Obtain the preset calibration position corresponding to the operation station;
[0009] The spacing value is determined based on the wafer position and the preset calibration position, and the wafer position state is determined based on the spacing value.
[0010] Optionally, the at least one operating station includes a first operating station after the wafer gripping unit grips the wafer via the material bin; the wafer position includes a first wafer edge position; the preset calibration position information includes a first preset calibration position located on the wafer gripping unit; the wafer position state includes the first wafer position state where the wafer is located in the wafer gripping unit.
[0011] Acquire real-time images at at least one operating station during the wafer transfer process, including:
[0012] Acquire the first real-time image at the first operating station during the wafer transfer process;
[0013] Extracting the wafer position based on the real-time image includes:
[0014] The edge position of the first wafer is extracted based on the first real-time image;
[0015] Obtaining the preset calibration position corresponding to the operation station includes:
[0016] Obtain the first preset calibration position corresponding to the first operation station;
[0017] Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, includes:
[0018] The first spacing value is determined based on the edge position of the first wafer and the first preset calibration position, and the position state of the first wafer is determined based on the first spacing value.
[0019] Optionally, determining the position state of the first wafer based on the first spacing value includes:
[0020] Obtain the first preset spacing range;
[0021] When the first spacing value is within the first preset spacing range, it is determined that there is no deviation in the state of the first wafer, and the wafer is allowed to enter the next operation station;
[0022] When the first spacing value exceeds the first preset spacing range, it is determined that there is a deviation in the state of the first wafer.
[0023] Optionally, after determining that there is a deviation in the state of the first wafer, the method further includes:
[0024] Output the first warning signal.
[0025] Optionally, the at least one operating station includes a second operating station of the wafer in the wafer calibration unit; the wafer position includes a second wafer edge position and a third wafer edge position, the second wafer edge position and the third wafer edge position are located on the same first straight line, the first straight line passes through the center of the wafer; the preset calibration position information includes a second preset calibration position located on the wafer calibration unit, the second preset calibration position is located on the side of the third wafer edge position away from the second wafer edge position; the wafer position state includes the second wafer position state of the wafer in the wafer calibration unit;
[0026] Acquire real-time images at at least one operating station during the wafer transfer process, including:
[0027] Acquire a second real-time image of the wafer during the second operation station;
[0028] Extracting the wafer position based on the real-time image includes:
[0029] The edge positions of the second wafer and the third wafer are extracted based on the second real-time image;
[0030] Obtaining the preset calibration position corresponding to the operation station includes:
[0031] Obtain the second preset calibration position corresponding to the second operation station;
[0032] Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, including:
[0033] A second spacing value is determined based on the second wafer edge position and the third wafer edge position, and a third spacing value is determined based on the third wafer edge position and the second preset calibration position. The second wafer position state is determined based on at least one of the second spacing value and the third spacing value.
[0034] Optionally, determining the second wafer position state based on at least one of the second spacing value and the third spacing value includes:
[0035] Obtain the second preset spacing range and the third preset spacing range;
[0036] When the second spacing value is within the second preset spacing range and when the third spacing value is within the third preset spacing range, it is determined that there is no deviation in the state of the second wafer, and the wafer is allowed to enter the next operation station;
[0037] When at least one of the following conditions is met: the second spacing value exceeds the second preset spacing range or the third spacing value exceeds the third preset spacing range, it is determined that there is a deviation in the state of the second wafer.
[0038] Optionally, the at least one operating station includes a third operating station after the wafer gripping unit grips the wafer via the wafer calibration unit; the wafer position includes a fourth wafer edge position, a fifth wafer edge position, a sixth wafer edge position, and a seventh wafer edge position, the fourth wafer edge position and the fifth wafer edge position are located on the same second straight line, the sixth wafer edge position and the seventh wafer edge position are located on the same third straight line, both the second straight line and the third straight line pass through the wafer center, and the second straight line intersects the third straight line; the preset calibration position information includes a third preset calibration position located on the wafer gripping unit, the third preset calibration position being located on the side of the fourth wafer edge position away from the fifth wafer edge position; the wafer position state includes the third wafer position state of the wafer being located in the wafer calibration unit;
[0039] Acquire real-time images at at least one operating station during the wafer transfer process, including:
[0040] Acquire a third real-time image of the wafer transfer process at the third operating station;
[0041] Extracting the wafer position based on the real-time image includes:
[0042] The edge positions of the fourth, fifth, sixth, and seventh wafers are extracted based on the third real-time image.
[0043] Obtaining the preset calibration position corresponding to the operation station includes:
[0044] Obtain the third preset calibration position corresponding to the third operation station;
[0045] Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, including:
[0046] A fourth spacing value is determined based on the fourth wafer edge position and the fifth wafer edge position; a fifth spacing value is determined based on the fourth wafer edge position and the third preset calibration position; a sixth spacing value is determined based on the second straight line and the sixth wafer edge position; and a seventh spacing value is determined based on the second straight line and the seventh wafer edge position. The third wafer position state is determined based on at least one of the fourth spacing value, the fifth spacing value, the sixth spacing value, and the seventh spacing value.
[0047] Optionally, the third wafer position state is determined based on at least one of the fourth spacing value, the fifth spacing value, the sixth spacing value, and the seventh spacing value, including:
[0048] Obtain the fourth preset spacing range, the fifth preset spacing range, the sixth preset spacing range, and the seventh preset spacing range;
[0049] When the fourth spacing value is within the fourth preset spacing range, when the fifth spacing value is within the fifth preset spacing range, when the sixth spacing value is within the sixth preset spacing range, and when the seventh spacing value is within the seventh preset spacing range, it is determined that the third wafer state has no deviation, and the wafer is allowed to enter the next operation station;
[0050] When at least one of the following conditions is met: the fourth spacing value exceeds the fourth preset spacing range, the fifth spacing value exceeds the fifth preset spacing range, the sixth spacing value exceeds the sixth preset spacing range, and the seventh spacing value exceeds the seventh preset spacing range, it is determined that there is a deviation in the state of the third wafer.
[0051] Thirdly, the present invention provides a position detection device for a wafer transfer process, which performs the position detection method for a wafer transfer process as described in any one of the first aspects.
[0052] The real-time image acquisition module is used to acquire real-time images at at least one operating station during the wafer transfer process.
[0053] A wafer position extraction module is used to extract the wafer position based on the real-time image;
[0054] The preset calibration position acquisition module is used to acquire the preset calibration position corresponding to the operation station;
[0055] The spacing value determination module is used to determine the spacing value based on the wafer position and the preset calibration position, and to determine the wafer position state based on the spacing value.
[0056] Thirdly, the present invention provides an electronic device, the electronic device comprising:
[0057] At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the position detection method for the wafer transfer process as described in any one aspect.
[0058] The technical solution of this invention provides a position detection method for a wafer transfer process, comprising: acquiring real-time images of the wafer at at least one operating station during the wafer transfer process; extracting the wafer position from the real-time images; acquiring a preset calibration position corresponding to the operating station; determining a spacing value based on the wafer position and the preset calibration position; and determining the wafer position status based on the spacing value. By judging the wafer position status in real time during the wafer transfer process, the wafer breakage rate is effectively reduced, and costs are saved.
[0059] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description
[0060] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0061] Figure 1 A flowchart of a position detection method for a wafer transfer process provided in an embodiment of the present invention;
[0062] Figure 2 This is a schematic diagram of the structure of a position detection device for a wafer transfer process provided in an embodiment of the present invention;
[0063] Figure 3 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0064] Figure 4 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0065] Figure 5 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0066] Figure 6 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0067] Figure 7 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0068] Figure 8 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0069] Figure 9 This is a schematic diagram of another position detection device for a wafer transfer process provided in an embodiment of the present invention;
[0070] Figure 10 A flowchart of another position detection method for wafer transfer process provided in an embodiment of the present invention;
[0071] Figure 11 This is a schematic diagram of another position detection device for a wafer transfer process provided in an embodiment of the present invention;
[0072] Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation
[0073] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.
[0074] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0075] Figure 1 This is a flowchart of a position detection method for a wafer transfer process provided by an embodiment of the present invention. This embodiment is applicable to position detection in a wafer transfer process. The method can be executed by a position detection device for the wafer transfer process. The position detection device for the wafer transfer process can be implemented in hardware and / or software and can be configured in an electronic device. Figure 2 This is a schematic diagram of the structure of a position detection device for a wafer transfer process provided in an embodiment of the present invention, as shown below. Figure 1 and Figure 2 As shown, the method includes:
[0076] S101, acquire real-time images at at least one operating station during wafer transfer.
[0077] The wafer transfer process includes at least one operating station. When the at least one operating station can include a first operating station after the wafer gripping unit 101 grips the wafer 103 via the material box 102, a second operating station where the wafer 103 is in the wafer calibration unit 104, and a third operating station after the wafer gripping unit 101 grips the wafer 103 via the wafer calibration unit 104, the first, second, and third operating stations are sequential stations. If the wafer position is normal at the first operating station, it can sequentially enter the second and third operating stations. Alternatively, at least one operating station may also include a fourth operating station, where the wafer gripping unit 101 prepares the wafer 103 to enter the work chamber. If the wafer calibration unit 104 is not included in the position detection device during the wafer transfer process, the wafer enters the fourth operating station after the wafer position is normal at the first operating station. If the wafer condition is abnormal at any operating station, entry to the next operating station is stopped so that inspection or wafer position correction can be performed at the current operating station. The position detection device in the wafer transfer process is equipped with an image acquisition unit 105, which can be a camera. It can acquire real-time images at each operating station to determine the position of the wafer 103 at different operating stations and reduce the breakage rate.
[0078] S102, extract the wafer position based on the real-time image.
[0079] Among them, the wafer position is extracted according to the real-time image. The wafer position can be set according to the actual design requirements. The wafer position obtained under different operating positions can be different and the number of wafer positions can be different.
[0080] S103, obtain the preset calibration position corresponding to the operation station.
[0081] Each operating station is equipped with a preset calibration position to determine the wafer position, ensuring accurate positioning during wafer transfer.
[0082] S104, determine the spacing value based on the wafer position and the preset calibration position, and determine the wafer position status based on the spacing value.
[0083] Specifically, the wafer position is determined by the vertical distance between the wafer position at each operating station and the corresponding preset calibration position, and then the wafer position status is determined based on the vertical distance. Specifically, if the spacing value exceeds a threshold range, the wafer position status is considered abnormal, and the transfer process is stopped; if the spacing value is within the threshold range, the wafer position status is considered normal, and the transfer process can continue to avoid damage to wafer 103 during transfer.
[0084] This invention provides a method for determining the wafer position during wafer transfer by acquiring real-time images at at least one operating station; extracting the wafer position from the real-time images; obtaining a preset calibration position corresponding to the operating station; determining a spacing value based on the wafer position and the preset calibration position; and determining the wafer position status based on the spacing value. This real-time assessment of the wafer position status during wafer transfer effectively reduces wafer breakage rate and saves costs.
[0085] Optionally, at least one operating station includes a first operating station after the wafer gripping unit 101 grips the wafer 103 via the material box 102; the wafer position includes a first wafer edge position A2; the preset calibration position information includes a first preset calibration position A1 located on the wafer gripping unit 101; the wafer position status includes a first wafer position status of the wafer 103 located in the wafer gripping unit 101. Figure 3 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 2 and 3 As shown, the method includes:
[0086] S201, acquire the first real-time image at the first operating station during the wafer transfer process.
[0087] When the wafer gripping unit 101 grips the target wafer 103 from the material box 102 that stores multiple wafers, the wafer 103 is located on the wafer gripping unit 101, and the image acquisition unit 105 needs to be controlled to acquire the first real-time image of the first operation station.
[0088] S202, extract the edge position of the first wafer based on the first real-time image.
[0089] Specifically, the first wafer edge position A2 of wafer 103 is extracted according to the first real-time image. The first wafer edge position A2 is located on the side edge of wafer 103 away from wafer gripping unit 101. The first wafer edge position A2 is a target point located on the circumference of wafer 103.
[0090] S203, Obtain the first preset calibration position corresponding to the first operation station.
[0091] Specifically, a first preset calibration position A1 is pre-set at the first operating station. This first preset calibration position A1 can be selected according to actual design requirements. For example, a calibration area 11 can be set on the robotic arm carrying the wafer 103 on the wafer gripping unit 101. The calibration area 11 is rectangular, and the target point on the edge of the calibration area 11 near the wafer 103 is used as the first preset calibration position A1. The first wafer edge position A2 is located on a straight line perpendicular to the target point on the edge of the calibration area and passing through the center of the wafer 103.
[0092] S204, determine the first spacing value based on the edge position of the first wafer and the first preset calibration position, and determine the position state of the first wafer based on the first spacing value.
[0093] The first spacing value is determined based on the first wafer edge position A2 and the first preset calibration position A1, such as... Figure 2 The A1-A2 values are used to determine the wafer position status based on the first spacing value, so as to prevent abnormal wafer position from causing collisions during subsequent transmission and damaging wafer 103.
[0094] This invention provides an embodiment of the invention that acquires a first real-time image of the wafer during the wafer transfer process at a first operating station; extracts the edge position of the first wafer from the first real-time image; acquires a first preset calibration position corresponding to the first operating station; determines a first spacing value based on the edge position of the first wafer and the first preset calibration position; and determines the position state of the first wafer based on the first spacing value. This effectively reduces the wafer breakage rate and saves costs.
[0095] Optional, Figure 4 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 2 and Figure 4 As shown, the method includes:
[0096] S301, acquire the first real-time image at the first operating station during the wafer transfer process.
[0097] S302, extract the edge position of the first wafer based on the first real-time image.
[0098] S303, Obtain the first preset calibration position corresponding to the first operation station.
[0099] S304, determine the first spacing value based on the edge position of the first wafer and the first preset calibration position.
[0100] S305, obtain the first preset spacing range.
[0101] The first preset spacing range can be selected according to actual design requirements, and this embodiment of the invention does not impose specific limitations. Typically, the first preset calibration position A1 is a fixed position on the wafer gripping unit 101, which needs to be calibrated and determined based on the dimensions of the wafer 103 before the transfer process begins. However, the dimensions of the wafer 103 may vary, so the first spacing value will change according to the size of the wafer 103. Accordingly, the first preset spacing range value can be set accordingly based on the size of the wafer 103. Furthermore, the dimensions of the wafer 103 to be transferred are recorded in the position detection device during the wafer transfer process. If an error in the size of the wafer 103 is detected during transfer, the transfer needs to be stopped to avoid calculation errors during transfer that could damage the wafer.
[0102] S306, when the first spacing value is within the first preset spacing range, it is determined that there is no deviation in the state of the first wafer, and the wafer is allowed to enter the next operation station.
[0103] S307, when the first spacing value exceeds the first preset spacing range, it is determined that there is a deviation in the state of the first wafer.
[0104] Specifically, when the first spacing value is within the first preset spacing range, it is considered that the first wafer state of wafer 103 at the first operating station is without deviation, and the wafer edge will not collide during subsequent wafer transfer. Therefore, wafer 103 can be allowed to enter the next operating station, i.e., it can enter the second operating station, where the wafer gripping unit 101 carries wafer 103 to the wafer calibration unit 104; or it can enter the fourth operating station, where the wafer gripping unit 101 carries wafer 103 to prepare for entering the work chamber. When the first spacing value exceeds the first preset spacing range, it is considered that the first wafer state of wafer 103 at the first operating station is deviated, and the edge of wafer 103 will collide during subsequent wafer transfer, causing damage to wafer 103. In this case, the transfer process needs to be stopped.
[0105] This invention, in its embodiments, determines a first spacing value based on the edge position of a first wafer and a first preset calibration position; obtains a first preset spacing range; when the first spacing value is within the first preset spacing range, it is determined that the first wafer state has no deviation, and the wafer is allowed to enter the next operation station; when the first spacing value exceeds the first preset spacing range, it is determined that the first wafer state has a deviation. At the first operation station, the position state of the first wafer is determined based on the first spacing value and the first preset spacing range, effectively reducing the wafer breakage rate.
[0106] Optional, Figure 5 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 2 and Figure 5 As shown, the method includes:
[0107] S401, acquire the first real-time image at the first operating station during the wafer transfer process.
[0108] S402, extract the edge position of the first wafer based on the first real-time image.
[0109] S403, obtain the first preset calibration position corresponding to the first operation station.
[0110] S404, determine the first spacing value based on the edge position of the first wafer and the first preset calibration position.
[0111] S405, obtain the first preset spacing range.
[0112] S406, when the first spacing value is within the first preset spacing range, it is determined that there is no deviation in the state of the first wafer, and the wafer is allowed to enter the next operation station.
[0113] S407, when the first spacing value exceeds the first preset spacing range, it is determined that there is a deviation in the state of the first wafer.
[0114] S408 outputs the first warning signal.
[0115] When the first spacing value exceeds the first preset spacing range, the wafer 103 cannot continue the transfer process. Therefore, a first warning signal needs to be output to facilitate timely anomaly detection, prevent the wafer 103 from entering the next operation station, avoid collision and fragmentation risks, and improve yield.
[0116] This invention determines that a deviation exists in the state of the first wafer when the first spacing value exceeds a first preset spacing range; and outputs a first warning signal. By outputting warning information when the first wafer exceeds the first preset spacing range, the operation is stopped, reducing the breakage rate.
[0117] Optionally, at least one operating station includes a second operating station of wafer 103 in wafer calibration unit 104; the wafer position includes a second wafer edge position B2 and a third wafer edge position B3, the second wafer edge position B2 and the third wafer edge position B3 are located on the same first straight line L1, the first straight line L1 passes through the center of the wafer; the preset calibration position information includes a second preset calibration position B1 located on wafer calibration unit 104, the second preset calibration position B1 is located on the side of the third wafer edge position B3 away from the second wafer edge position B2; the wafer position state includes the second wafer position state of wafer 103 in wafer calibration unit 104. Figure 6 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 2 and Figure 6 As shown, the method includes:
[0118] S501, acquire the second real-time image at the second operating station during the wafer transfer process.
[0119] In this process, when there is no deviation in the first wafer state of the first operating station, the wafer transfer process continues. The wafer gripping unit 101 drives the wafer 103 to the wafer calibration unit 104. The wafer 103 is located on the wafer calibration unit 104. The wafer calibration unit 104 performs orientation correction on the wafer, finds the physical center of the wafer 103, and aligns the center of the wafer 103 with the center of the wafer calibration unit 104, as well as eliminates the rotation angle error of the wafer 103. After the correction is completed, the image acquisition unit 105 needs to be controlled to acquire the second real-time image at the second operating station.
[0120] S502, extract the edge positions of the second wafer and the third wafer based on the second real-time image.
[0121] Specifically, the second and third wafer edge positions of wafer 103 are extracted based on the second real-time image. The second and third wafer edge positions are located at two points on the circumference of wafer 103, and the second and third wafer edge positions are located on the same first straight line L1, which passes through the center of wafer 103.
[0122] S503, obtain the second preset calibration position corresponding to the second operation station.
[0123] Specifically, when operating at the second workstation, a corresponding second preset calibration position B1 is pre-set. The second preset calibration position B1 can be selected according to actual design requirements. For example, calibration lines can be set on the wafer calibration unit 104, and the second preset calibration position B1 is set on the calibration lines.
[0124] S504, determine a second spacing value based on the second wafer edge position and the third wafer edge position, and determine a third spacing value based on the third wafer edge position and the second preset calibration position, and determine the second wafer position state based on at least one of the second spacing value and the third spacing value.
[0125] The second spacing value is determined based on the edge positions B2 and B3 of the second and third wafers, respectively. Figure 2 B2-B3 in the middle; and the third spacing value is determined based on the third wafer edge position B3 and the second preset calibration position B1, such as Figure 2 The B1-B3 values in the diagram are used to determine the position of the second wafer based on the second and / or third spacing values. This allows for the determination of the correction effect and, when the position of the second wafer meets the requirements for continued transfer, the wafer enters the third operating station. This prevents abnormal wafer position from causing collisions during subsequent transfers, which could damage the wafer 103 and effectively reduce the breakage rate.
[0126] This invention, in its embodiments, acquires a second real-time image during wafer transfer at a second operating station; extracts the edge positions of a second and third wafer based on the second real-time image; acquires a second preset calibration position corresponding to the second operating station; determines a second spacing value based on the second and third wafer edge positions; and determines a third spacing value based on the third wafer edge position and the second preset calibration position. Finally, it determines the positional state of the second wafer based on at least one of the second and third spacing values. This effectively reduces wafer breakage rate and saves costs.
[0127] Optional, Figure 7 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 2 and Figure 7 As shown, the method includes:
[0128] S601, acquire the second real-time image at the second operating station during the wafer transfer process.
[0129] S602, extract the edge positions of the second wafer and the third wafer based on the second real-time image.
[0130] S603, obtain the second preset calibration position corresponding to the second operation station.
[0131] S604, determine the second spacing value based on the second wafer edge position and the third wafer edge position, and determine the third spacing value based on the third wafer edge position and the second preset calibration position.
[0132] S605, obtain the second preset spacing range and the third preset spacing range.
[0133] The second preset spacing range and the third preset spacing range can both be selected according to actual design requirements, and the embodiments of the present invention do not impose specific limitations. Typically, the second preset calibration position is a fixed position on the wafer calibration unit 104, which needs to be calibrated and determined in conjunction with the dimensions of the wafer 103 before the transfer process begins. However, the dimensions of the wafer 103 may vary, therefore the second and third spacing values will change according to the changes in the dimensions of the wafer 103. Accordingly, the second and third preset spacing range values can be set correspondingly according to the dimensions of the wafer 103.
[0134] S606, when the second spacing value is within the range of the second preset spacing and when the third spacing value is within the range of the third preset spacing, it is determined that there is no deviation in the state of the second wafer, and the wafer is allowed to enter the next operation station.
[0135] S607, when at least one of the following conditions is met: the second spacing value exceeds the second preset spacing range or the third spacing value exceeds the third preset spacing range, it is determined that there is a deviation in the state of the second wafer.
[0136] Specifically, when the second spacing value is within the second preset spacing range and the third spacing value is within the third preset spacing range, it is considered that the second wafer state of wafer 103 at the second operating station is without deviation. During subsequent wafer transfer, the edge of wafer 103 will not collide, thus allowing wafer 103 to enter the next operating station, i.e., the third operating station. The wafer gripping unit 101, via the wafer calibration unit 104, grips wafer 103, preparing to send it into the work chamber. When at least one of the second spacing value or the third spacing value exceeds the third preset spacing range, it is considered that the second wafer state of wafer 103 at the second operating station is deviated. During subsequent wafer transfer, the edge of wafer 103 will collide, causing damage to wafer 103. In this case, the transfer process must be stopped, and a warning signal will be output to alert the user to the abnormality.
[0137] This invention, in its embodiments, determines a second spacing value based on the edge positions of a second wafer and a third wafer, and a third spacing value based on the edge position of the third wafer and a second preset calibration position; it also obtains a second preset spacing range and a third preset spacing range; when the second spacing value is within the second preset spacing range and when the third spacing value is within the third preset spacing range, it is determined that the second wafer state has no deviation, and the wafer is allowed to enter the next operation station; when at least one of the following conditions is met, it is determined that the second wafer state has a deviation. At the second operation station, the second wafer position state is determined based on the second spacing value, the third spacing value, the second preset spacing range, and the third preset spacing range, effectively reducing wafer breakage rate and saving costs.
[0138] Optionally, at least one operating station includes a third operating station after the wafer gripping unit 101 grips the wafer via the wafer calibration unit 104; the wafer position includes a fourth wafer edge position C1, a fifth wafer edge position C2, a sixth wafer edge position C3, and a seventh wafer edge position C4, the fourth wafer edge position C1 and the fifth wafer edge position C2 are located on the same second straight line L2, the sixth wafer edge position C3 and the seventh wafer edge position C4 are located on the same third straight line L3, the second straight line L2 and the third straight line L3 both pass through the center of the wafer 103, and the second straight line L2 intersects the third straight line L3; the preset calibration position information includes a third preset calibration position C5 located on the wafer gripping unit 101, the third preset calibration position C5 is located on the side of the fourth wafer edge position C1 away from the fifth wafer edge position C2; the wafer position state includes the third wafer position state of the wafer being located in the wafer calibration unit 104; Figure 8 A flowchart of another position detection method for wafer transfer process provided by an embodiment of the present invention. Figure 9 This is a schematic diagram of another position detection device for a wafer transfer process provided in an embodiment of the present invention, as shown below. Figure 2 , Figure 8 and Figure 9 As shown, the method includes:
[0139] S701, acquire the third real-time image at the third operating station during the wafer transfer process.
[0140] When there is no deviation in the second wafer state of the second operating station, the wafer transfer process continues. The wafer gripping unit 101 grips the wafer 103 located in the wafer calibration unit 104. At this time, the wafer 103 is located on the wafer gripping unit 101. Before it is ready to be sent into the work chamber, the image acquisition unit 105 needs to be controlled to acquire the third real-time image at the third operating station.
[0141] S702, extract the edge positions of the fourth, fifth, sixth, and seventh wafers based on the third real-time image.
[0142] Specifically, based on the third real-time image, the fourth wafer edge position C1, the fifth wafer edge position C2, the sixth wafer edge position C3, and the seventh wafer edge position C4 of wafer 103 are extracted. The fourth wafer edge position C1, the fifth wafer edge position C2, the sixth wafer edge position C3, and the seventh wafer edge position are located at four points on the circumference of wafer 103. The fourth wafer edge position C1 and the fifth wafer edge position C2 are located on the same second straight line L2, and the sixth wafer edge position C3 and the seventh wafer edge position C4 are located on the same third straight line L3. The second straight line L2 and the third straight line L3 both pass through the center of wafer 103, and the second straight line L2 intersects the third straight line L3.
[0143] S703, obtain the third preset calibration position corresponding to the third operation station.
[0144] Specifically, a third preset calibration position C5 is pre-set at the third operating station. This third preset calibration position C5 can be selected according to actual design requirements. For example, a calibration area 11 can be set on the robotic arm carrying the wafer on the wafer gripping unit 101. The calibration area 11 is rectangular, and the target point near the edge of the calibration area 11 close to the wafer 103 is used as the third preset calibration position C5. The third preset calibration position C5 and the first preset calibration position A1 can be the same location, allowing the first preset calibration position A1 to be reused.
[0145] S704, determine a fourth spacing value based on the fourth wafer edge position and the fifth wafer edge position, determine a fifth spacing value based on the fourth wafer edge position and the third preset calibration position, determine a sixth spacing value based on the second straight line and the sixth wafer edge position, and determine a seventh spacing value based on the second straight line and the seventh wafer edge position, and determine a third wafer position state based on at least one of the fourth spacing value, the fifth spacing value, the sixth spacing value and the seventh spacing value.
[0146] The fourth spacing value is determined based on the edge position C1 of the fourth wafer and the edge position C2 of the fifth wafer, such as... Figure 9 C1-C2; the fifth spacing value is determined based on the fourth wafer edge position C1 and the third preset calibration position, such as... Figure 9 C1-C5; the sixth spacing value is determined based on the second straight line L2 and the sixth wafer edge position C3, as follows. Figure 9 C2-C3; the seventh spacing value is determined based on the second straight line L2 and the position C4 at the edge of the seventh wafer, as shown in the figure. Figure 9 C2-C4. Furthermore, based on the fourth, fifth, sixth, and seventh spacing values, the wafer position is determined, identifying deviations in the X and Y directions. The X and Y directions intersect; the X direction is the extension direction of the second straight line L2, and the Y direction is the extension direction of the third straight line. This prevents abnormal wafer positioning from causing collisions during subsequent transport and damaging wafer 103.
[0147] This invention, in its embodiments, acquires a third real-time image of the wafer during the wafer transfer process at the third operating station; extracts the fourth, fifth, sixth, and seventh wafer edge positions from the third real-time image; acquires a third preset calibration position corresponding to the third operating station; determines a fourth spacing value based on the fourth and fifth wafer edge positions, a fifth spacing value based on the fourth wafer edge position and the third preset calibration position, a sixth spacing value based on the second straight line and the sixth wafer edge position, and a seventh spacing value based on the second straight line and the seventh wafer edge position; and determines the third wafer position state based on at least one of the fourth, fifth, sixth, and seventh spacing values. This effectively reduces wafer breakage rate and saves costs.
[0148] Optional, Figure 10 A flowchart of another wafer transfer process position detection method provided in an embodiment of the present invention is shown below. Figure 9 and Figure 10 As shown, the method includes:
[0149] S801, acquire the third real-time image at the third operating station during the wafer transfer process.
[0150] S802, extract the edge positions of the fourth, fifth, sixth, and seventh wafers based on the third real-time image.
[0151] S803, obtain the third preset calibration position corresponding to the third operation station.
[0152] S804, obtain the fourth preset spacing range, the fifth preset spacing range, the sixth preset spacing range and the seventh preset spacing range.
[0153] The fourth, fifth, sixth, and seventh preset spacing ranges can all be selected according to actual design requirements, and this embodiment of the invention does not impose specific limitations. The sixth and seventh preset spacing ranges can have the same range value. Typically, the third preset calibration position C5 is a fixed position on the wafer calibration unit 104, which needs to be calibrated and determined in conjunction with the dimensions of the wafer 103 before the transfer process begins. However, the dimensions of the wafer 103 may vary, therefore the fourth, fifth, sixth, and seventh preset spacing values will change according to the dimensions of the wafer 103. Accordingly, the fourth, fifth, sixth, and seventh preset spacing ranges can be set accordingly based on the dimensions of the wafer 103.
[0154] S805, when the fourth spacing value is within the fourth preset spacing range, when the fifth spacing value is within the fifth preset spacing range, when the sixth spacing value is within the sixth preset spacing range, and when the seventh spacing value is within the seventh preset spacing range, it is determined that there is no deviation in the state of the third wafer, and wafer 103 is allowed to enter the next operation station.
[0155] S806, when at least one of the following conditions is met: the fourth spacing value exceeds the fourth preset spacing range, the fifth spacing value exceeds the fifth preset spacing range, the sixth spacing value exceeds the sixth preset spacing range, and the seventh spacing value exceeds the seventh preset spacing range, it is determined that there is a deviation in the state of the third wafer.
[0156] Specifically, when the fourth spacing value is within the fourth preset spacing range, the fifth spacing value is within the fifth preset spacing range, the sixth spacing value is within the sixth preset spacing range, and the seventh spacing value is within the seventh preset spacing range, it is considered that the third wafer state of wafer 103 on the third operating station is without deviation, and the wafer edge will not collide during subsequent wafer transfer. Therefore, the wafer gripping unit 101 can send wafer 103 into the work chamber. When the second spacing value exceeds the second preset spacing range or the third spacing value exceeds the third preset spacing range, it is considered that the third wafer state of wafer 103 on the second operating station is deviated. During subsequent wafer transfer, the edge of wafer 103 will collide, causing wafer damage. At this time, the transfer process needs to be stopped, and a warning signal will be output to remind the user of the abnormality.
[0157] This invention obtains a fourth, fifth, sixth, and seventh preset spacing range. When the fourth spacing value is within the fourth preset spacing range, the fifth spacing value is within the fifth preset spacing range, the sixth spacing value is within the sixth preset spacing range, and the seventh spacing value is within the seventh preset spacing range, it is determined that the third wafer state has no deviation, and the wafer is allowed to enter the next operation station. When at least one of the following conditions is met: the fourth spacing value exceeds the fourth preset spacing range, the fifth spacing value exceeds the fifth preset spacing range, the sixth spacing value exceeds the sixth preset spacing range, and the seventh spacing value exceeds the seventh preset spacing range, it is determined that the third wafer state has a deviation. This effectively reduces the wafer breakage rate and saves costs.
[0158] Based on the same inventive concept, embodiments of the present invention also provide a position detection device for a wafer transfer process. This position detection device is used to execute the position detection method for a wafer transfer process provided in any embodiment of the present invention. The position detection device for the wafer transfer process can be implemented by software and / or hardware. Figure 11 This is a schematic diagram of another position detection device for a wafer transfer process provided in an embodiment of the present invention, as shown below. Figure 11 As shown, the position detection device in the wafer transfer process includes:
[0159] The real-time image acquisition module 201 is used to acquire real-time images at at least one operating station during the wafer transfer process.
[0160] The wafer position extraction module 202 is used to extract the wafer position based on real-time images;
[0161] The preset calibration position acquisition module 203 is used to acquire the preset calibration position corresponding to the operation station;
[0162] The spacing value determination module 204 is used to determine the spacing value based on the wafer position and the preset calibration position, and to determine the wafer position status based on the spacing value.
[0163] It should be noted that the wafer transfer process position detection device provided in the embodiments of the present invention includes the technical features of the wafer transfer process position detection method provided in any embodiment of the present invention, and can achieve the beneficial effects of the wafer transfer process position detection method provided in any embodiment of the present invention. The similarities can be referred to the above description of the wafer transfer process position detection method provided in the embodiments of the present invention, and will not be repeated here.
[0164] Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Figure 12 A schematic diagram of an electronic device 10, which can be used to implement embodiments of the present invention, is shown. The electronic device 10 is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.
[0165] like Figure 12 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.
[0166] Multiple components in electronic device 10 are connected to input / output (I / O) interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of monitors, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.
[0167] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the position detection method in a wafer transfer process.
[0168] In some embodiments, the wafer transfer process position detection method can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 10 via read-only memory (ROM) 12 and / or communication unit 19. When the computer program is loaded into random access memory (RAM) 13 and executed by processor 11, one or more steps of the wafer transfer process position detection method described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the wafer transfer process position detection method by any other suitable means (e.g., by means of firmware).
[0169] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.
[0170] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.
[0171] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. A position detection method for a wafer transfer process, characterized in that, include: Acquire real-time images at at least one operating station during the wafer transfer process; the at least one operating station includes a first operating station after the wafer gripping unit grips the wafer via the material box, a second operating station where the wafer is in the wafer calibration unit, and a third operating station after the wafer gripping unit grips the wafer via the wafer calibration unit. Extract the wafer position based on the real-time image; Obtain the preset calibration position corresponding to the operation station; The spacing value is determined based on the wafer position and the preset calibration position, and the wafer position state is determined based on the spacing value; The wafer position includes a first wafer edge position; the preset calibration position information includes a first preset calibration position located on the wafer gripping unit; the wafer position state includes the first wafer position state of the wafer located on the wafer gripping unit; Acquire real-time images at at least one operating station during the wafer transfer process, including: Acquire a first real-time image of the wafer transfer process at the first operating station; Extracting the wafer position based on the real-time image includes: The edge position of the first wafer is extracted based on the first real-time image; Obtaining the preset calibration position corresponding to the operation station includes: Obtain the first preset calibration position corresponding to the first operation station; Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, includes: The first spacing value is determined based on the edge position of the first wafer and the first preset calibration position, and the position state of the first wafer is determined based on the first spacing value.
2. The position detection method for the wafer transfer process according to claim 1, characterized in that, Determining the position state of the first wafer based on the first spacing value includes: Obtain the first preset spacing range; When the first spacing value is within the first preset spacing range, it is determined that there is no deviation in the position of the first wafer, and the wafer is allowed to enter the next operation station; When the first spacing value exceeds the first preset spacing range, it is determined that there is a deviation in the position state of the first wafer.
3. The position detection method for the wafer transfer process according to claim 2, characterized in that, After determining that there is a deviation in the positional state of the first wafer, the process further includes: Output the first warning signal.
4. The position detection method for the wafer transfer process according to claim 1, characterized in that, The wafer position includes a second wafer edge position and a third wafer edge position, the second wafer edge position and the third wafer edge position are located on the same first straight line, the first straight line passes through the wafer center; the preset calibration position information includes a second preset calibration position located on the wafer calibration unit, the second preset calibration position is located on the side of the third wafer edge position away from the second wafer edge position; the wafer position state includes the second wafer position state of the wafer located in the wafer calibration unit; Acquire real-time images at at least one operating station during the wafer transfer process, including: Acquire a second real-time image of the wafer during the second operation station; Extracting the wafer position based on the real-time image includes: The edge positions of the second wafer and the third wafer are extracted based on the second real-time image; Obtaining the preset calibration position corresponding to the operation station includes: Obtain the second preset calibration position corresponding to the second operation station; Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, including: A second spacing value is determined based on the second wafer edge position and the third wafer edge position, and a third spacing value is determined based on the third wafer edge position and the second preset calibration position. The second wafer position state is determined based on at least one of the second spacing value and the third spacing value.
5. The position detection method for the wafer transfer process according to claim 4, characterized in that, Determining the second wafer position state based on at least one of the second spacing value and the third spacing value includes: Obtain the second preset spacing range and the third preset spacing range; When the second spacing value is within the second preset spacing range and when the third spacing value is within the third preset spacing range, it is determined that there is no deviation in the position of the second wafer, and the wafer is allowed to enter the next operation station; When at least one of the following conditions is met: the second spacing value exceeds the second preset spacing range or the third spacing value exceeds the third preset spacing range, it is determined that there is a deviation in the position state of the second wafer.
6. The position detection method for the wafer transfer process according to claim 1, characterized in that, The wafer positions include a fourth wafer edge position, a fifth wafer edge position, a sixth wafer edge position, and a seventh wafer edge position. The fourth and fifth wafer edge positions are located on the same second straight line, and the sixth and seventh wafer edge positions are located on the same third straight line. Both the second and third straight lines pass through the wafer center, and the second and third straight lines intersect. The preset calibration position information includes a third preset calibration position located on the wafer gripping unit. The third preset calibration position is located on the side of the fourth wafer edge position away from the fifth wafer edge position. The wafer position state includes the third wafer position state in which the wafer is located in the wafer calibration unit. Acquire real-time images at at least one operating station during the wafer transfer process, including: Acquire a third real-time image of the wafer transfer process at the third operating station; Extracting the wafer position based on the real-time image includes: The edge positions of the fourth, fifth, sixth, and seventh wafers are extracted based on the third real-time image. Obtaining the preset calibration position corresponding to the operation station includes: Obtain the third preset calibration position corresponding to the third operation station; Determining the spacing value based on the wafer position and the preset calibration position, and determining the wafer position state based on the spacing value, including: A fourth spacing value is determined based on the fourth wafer edge position and the fifth wafer edge position; a fifth spacing value is determined based on the fourth wafer edge position and the third preset calibration position; a sixth spacing value is determined based on the second straight line and the sixth wafer edge position; and a seventh spacing value is determined based on the second straight line and the seventh wafer edge position. The third wafer position state is determined based on at least one of the fourth spacing value, the fifth spacing value, the sixth spacing value, and the seventh spacing value.
7. The position detection method for the wafer transfer process according to claim 6, characterized in that, Determining the position state of the third wafer based on at least one of the fourth, fifth, sixth, and seventh spacing values includes: Obtain the fourth preset spacing range, the fifth preset spacing range, the sixth preset spacing range, and the seventh preset spacing range; When the fourth spacing value is within the fourth preset spacing range, when the fifth spacing value is within the fifth preset spacing range, when the sixth spacing value is within the sixth preset spacing range, and when the seventh spacing value is within the seventh preset spacing range, it is determined that the position state of the third wafer is not deviated, and the wafer is allowed to enter the next operation station; When at least one of the following conditions is met: the fourth spacing value exceeds the fourth preset spacing range, the fifth spacing value exceeds the fifth preset spacing range, the sixth spacing value exceeds the sixth preset spacing range, and the seventh spacing value exceeds the seventh preset spacing range, it is determined that the position state of the third wafer is deviated.
8. A position detection device for a wafer transfer process, characterized in that, The wafer transfer process position detection device performs the wafer transfer process position detection method according to any one of claims 1-7; A real-time image acquisition module is used to acquire real-time images at at least one operating station during the wafer transfer process; the at least one operating station includes a first operating station after the wafer gripping unit grips the wafer via the material box, a second operating station where the wafer is in the wafer calibration unit, and a third operating station after the wafer gripping unit grips the wafer via the wafer calibration unit. A wafer position extraction module is used to extract the wafer position based on the real-time image; The preset calibration position acquisition module is used to acquire the preset calibration position corresponding to the operation station; The spacing value determination module is used to determine the spacing value based on the wafer position and the preset calibration position, and to determine the wafer position state based on the spacing value.
9. An electronic device, characterized in that, The electronic device includes: At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the wafer transfer process position detection method according to any one of claims 1-7.