LED display screen film pasting device and film pasting method

Abstract

The invention provides an LED display screen film pasting device and method. The LED display screen film pasting device comprises a base, a film bearing seat and a pressing piece, and the base is provided with a first installation position used for installing an LED display screen; the first mounting position is provided with a first alignment structure used for limiting the mounting position of the LED display screen, the diaphragm bearing seat is arranged on the base and is arranged opposite to the side, provided with the first mounting position, of the base, and the side, facing the first mounting position, of the diaphragm bearing seat is provided with a second mounting position used for mounting an optical diaphragm; a second alignment structure for limiting the mounting position of the optical film is arranged on the film bearing seat; an included angle is formed between the surface, provided with the first installation position, of the base and the surface, provided with the second installation position, of the diaphragm bearing seat. When the press-fit piece translates in the preset direction, the press-fit piece can abut against the part, exceeding the edge of the film bearing base, of the optical film, and the optical film is made to be separated from the second installation position so as to be attached to the LED display screen.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and mainly to an LED display screen film application device and film application method. Background Technology

[0002] An LED display screen is a screen that uses LED chips / beads soldered onto a substrate to display various information such as text, graphics, images, animations, market data, videos, and recorded signals.

[0003] LED display packaging methods include COB (Chip On Board), GOB (Glue On Board), COG (Chip On Glass), as well as SMD (Surface Mount Devices) and DIP (Dual In-line Package), among other mainstream and emerging packaging types. Currently, for COB, GOB, and COG packaged LED boards, an optical film can be applied to the packaged surface to improve the color consistency of the LED boards after splicing, and also improve the display effect.

[0004] Because LED displays emit light from individual pixels, a single LED board can contain tens of thousands of LED chips / beads. After die bonding / mounting, encapsulation, film application, milling, and assembly, when delivered to the customer, solder joint failures or LED chip failures may occur. In such cases, the entire LED board needs to be reworked, involving film removal, adhesive stripping, rework, and film application. Since the board edges are already cut before delivery to the customer, there are no marker points for positioning, making it impossible to use traditional marker point recognition film application machines. Therefore, there is an urgent need to invent a device for rework of LED films applied to end-user LED displays that can handle edge-less film application. Summary of the Invention

[0005] The purpose of this invention is to provide an LED display screen film application device and method, which effectively reduces the difficulty of rework and film application after the LED display light board used in the terminal has had its process edges cut off.

[0006] To address the aforementioned technical problems, this invention provides an LED display screen film application device, comprising: a base with a first mounting position for mounting an LED display screen; a first alignment structure defining the mounting position of the LED display screen; a film carrier disposed on the base with a second mounting position for mounting an optical film, the second mounting position being opposite to the first mounting position; a second alignment structure defining the mounting position of the optical film; and a pressing member disposed on the side of the base with the first mounting position, the pressing member being movable along a preset direction; wherein the surface of the base with the first mounting position and the surface of the film carrier with the second mounting position are arranged at an angle; when the pressing member moves along the preset direction, the pressing member can press the portion of the optical film extending beyond the edge of the film carrier, so that the optical film can detach from the second mounting position and adhere to the LED display screen.

[0007] According to some technical solutions of this application, the surface of the base with the first mounting position is arranged along the horizontal direction of the LED display film application device, and the surface of the film carrier with the second mounting position is an inclined surface, which is inclined away from the preset direction of the pressing component toward the surface of the base with the first mounting position.

[0008] According to some technical solutions of this application, the angle between the surface of the diaphragm support having the second mounting position and the surface of the base having the first mounting position is in the range of 30°~60°.

[0009] According to some technical solutions of this application, the first alignment structure includes a mounting groove, the mounting groove having an opening facing the diaphragm support, and the sidewall of the mounting groove being used to embed the LED display screen.

[0010] According to some technical solutions of this application, the second alignment structure includes a first scale and a second scale, which are respectively arranged on adjacent sides of the second mounting position.

[0011] According to some technical solutions of this application, the LED display screen film application device further includes a support frame, the length direction of which extends along the height direction of the film application device; the film carrier is movably disposed on the support frame and can move along the length direction of the support frame to drive the optical film closer to or away from the LED display screen.

[0012] According to some technical solutions of this application, the diaphragm carrier is rotatably disposed on the support frame, and a rotating shaft is provided between the diaphragm carrier and the support frame. The diaphragm carrier can rotate relative to the base around the rotating shaft so that the second mounting position is arranged opposite to the first mounting position or opposite to the first mounting position.

[0013] According to some technical solutions of this application, the LED display screen film application device further includes a driving device, which is connected to the pressing member in a transmission manner. The driving device is used to drive the pressing member to move toward the surface of the base where the first mounting position is provided, either close to or away from the base.

[0014] According to some technical solutions of this application, the LED display screen film application device further includes a guide member, which is connected to the base and extends along a preset direction of movement of the pressing member; the pressing member is slidably connected to the guide member to reciprocate along the guide member.

[0015] According to some technical solutions of this application, the LED display screen film application device includes a mounting plate, and two mounting plates are provided. The two mounting plates are arranged on opposite sides of the surface of the base where the first mounting position is provided. The pressing component includes a roller, and the two ends of the roller are respectively rotatably connected to one of the mounting plates. The roller can rotate relative to the mounting plate so that when the roller moves along the preset direction, the roller can roll relative to the optical film.

[0016] Another aspect of the present invention provides a film application method, wherein the film application method is implemented by an LED display screen film application device as described in any of the above embodiments, the film application method comprising: Install the LED display screen in the first mounting position; The optical film is mounted on the second mounting position, with the protective layer of the optical film facing the second mounting position, and a portion of the optical film extending beyond the film support. Peel off the release layer of the optical film that extends beyond the area of ​​the film support; The pressing component is controlled to move along the preset direction, and the release layer in the remaining area of ​​the optical film is peeled off.

[0017] As can be seen from the above technical solution, the present invention has at least the following advantages and positive effects: By setting a first alignment structure on the first mounting position and a second alignment structure on the second mounting position for dual positioning, the first alignment structure directly defines the mounting position of the LED product at the first mounting position, while the second alignment structure ensures the accurate initial position of the optical film on the film carrier. Thus, after the two are aligned, mechanical positioning of the LED display and the optical film is achieved. When the LED product to be processed and the optical film are fixed by the first and second alignment structures respectively, their relative positions in the equipment coordinate system are determined. Even without a Mark point, the pressing component can still adhere the film to the designated area of ​​the product according to a preset path. The positioning reference formed by the first alignment structure on the first mounting position and the second alignment structure on the second mounting position can replace the visual alignment function of the Mark point, structurally solving the problem of film positioning for products without process edges and significantly reducing the risk of film deviation caused by positioning deficiencies.

[0018] Moreover, since the base with the first mounting position surface and the film carrier with the second mounting position are arranged at an angle, the optical film can be gradually bonded to the LED display surface by the pressing component. This helps to avoid stretching deformation and local wrinkles caused by uneven force or sudden changes in film tension, which would affect the film bonding effect. It can effectively disperse the local stress of the film and also simplifies the processing difficulty of re-bonding film on LED display products without process edges. Attached Figure Description

[0019] Figure 1 This is a perspective view of an LED display screen film application device according to an embodiment of this application; Figure 2 yes Figure 1 A schematic diagram showing the installation of an LED display screen. Figure 3 yes Figure 1 A schematic diagram of the first mounting position; Figure 4 yes Figure 1 A diagram from another perspective; Figure 5 yes Figure 1 Schematic diagram of the diaphragm support; Figure 6 yes Figure 1 Another perspective illustration; Figure 7 This is a schematic flowchart of a film application method in one embodiment of this application; The correspondence between the reference numerals and the component names is as follows: 100. LED display screen; 200. Optical film; 1. Base; 11. First mounting position; 12. First alignment structure; 13. First fixture; 14. Support block; 2. Diaphragm support; 201. Adsorption hole; 21. Second mounting position; 22. Second alignment structure; 221. First scale; 222. Second scale; 3. Pressing component; 4. Support frame; 401. Slide groove; 41. Sliding plate; 5. Drive device; 6. Guide component; 7. Mounting plate; 71. Sliding connecting seat; 72. Handle; 8. Rotating shaft. Detailed Implementation

[0020] This invention provides an LED display screen film application device and method. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the scope of protection of the invention.

[0021] In the description of this invention, it should be understood that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] LED displays typically consist of a substrate and multiple LED chips / LED beads. LED display packaging methods include COB (Chip On Board), GOB (Glue On Board), COG (Chip On Glass), as well as SMD (Surface Mount Devices), DIP (Dual In-line Package), and many other mainstream and emerging packaging types. Since LED displays emit light from pixels, a single LED board can contain tens of thousands of LED chips / beads. After die bonding / surface mounting, encapsulation, film application, milling, and assembly, the LED chips / beads are delivered to the customer. Epoxy resin protects the LED chips / beads from external damage. To further improve the light and color of the LED display, and to give the display product high contrast and overall color consistency, an optical film is applied to the surface of the encapsulated LED board.

[0024] In the manufacturing process of LED displays, the main method involves utilizing the process edges of LED light boards, which have multiple mark points distributed along them. The LED light board to be coated is placed in a coating fixture, and a film adsorption device equipped with a CCD camera takes pictures to identify the mark points on the light board for alignment. Once aligned, the adsorption device moves down to the coating position, and the film is then attached to the light board. Currently, during the end-user use of LED displays, solder joint failures or LED chip / bead failures may occur. In such cases, rework of individual light boards is necessary, involving film removal, adhesive removal, rework, and recoating.

[0025] However, since the LED display board used in the terminal has had its process edge cut off, it is impossible to locate it according to the Mark on the process edge, and it is impossible to use the existing film application machine that uses Mark point recognition to apply the film, which increases the difficulty of reworking the LED display board.

[0026] Therefore, in order to further reduce the operational difficulty of re-repairing LED display panels after the process edges have been cut off, this application proposes the following LED display screen film application device, which can easily perform re-repair film application on LED displays after the process edges have been cut off. It should be noted that the LED display screen film application device of this application can also apply film to LED display panels with process edges.

[0027] Figure 1 This is a perspective view of an LED display screen film application device according to an embodiment of this application; Figure 2 yes Figure 1 A schematic diagram showing the installation of an LED display screen. Figure 3 yes Figure 1 A schematic diagram of the first mounting position. like Figure 1 , Figure 2 and Figure 3 As shown, this application provides an LED display screen film application device, including a base 1, a film support 2, and a pressing component 3.

[0028] The base 1 can be placed on the plane to be fixed and is used to support the LED display screen 100. The base 1 has a first mounting position 11 for mounting the LED display screen 100. The first mounting position 11 has a first alignment structure 12 for defining the mounting position of the LED display screen 100. By providing the first alignment structure 12 on the first mounting position 11, the first alignment structure 12 can be used for mechanical positioning of the LED display screen 100 without relying on the mark points on the process edge.

[0029] It should be noted that LED display screen 100 can refer to an LED display screen 100 product that needs to be reworked and film-applied after the process edge is cut off, or an LED module that needs to be further laminated with an optical film 200 after encapsulation.

[0030] Figure 4 yes Figure 1 A diagram from another perspective; Figure 5 yes Figure 1 Schematic diagram of the diaphragm support.

[0031] like Figure 1 , Figure 4 and Figure 5 As shown, the diaphragm carrier 2 is used to mount the optical diaphragm 200. The diaphragm carrier 2 is disposed on the base 1, and a second mounting position 21 for mounting the optical diaphragm 200 is provided on the side of the diaphragm carrier 2 facing the first mounting position 11. The second mounting position 21 is arranged opposite to one side of the first mounting position 11. The diaphragm carrier 2 can be arranged perpendicular to the plane where the first mounting position 11 is located, and the diaphragm carrier 2 can be arranged at intervals above the first mounting position 11.

[0032] The diaphragm support 2 is provided with a second alignment structure 22, which is used to define the mounting position of the optical diaphragm 200. By providing the second alignment structure 22 on the second mounting position 21, the second alignment structure 22 can be used to mechanically position the optical diaphragm 200 on the second mounting position 21, so that the optical diaphragm 200 can be arranged opposite to the LED display screen 100.

[0033] In this way, by setting a first alignment structure 12 on the first mounting position 11 and a second alignment structure 22 on the second mounting position 21 for dual positioning, the first alignment structure 12 directly defines the mounting position of the LED product on the first mounting position 11, and the second alignment structure 22 ensures the initial position of the optical film 200 on the film carrier 2. Thus, after the two are aligned, mechanical positioning of the LED display 100 and the optical film 200 is achieved. After the LED product to be processed and the optical film 200 are fixed by the first alignment structure 12 and the second alignment structure 22 respectively, their relative positions in the equipment coordinate system are determined. Even without a Mark point, the pressing component 3 can still attach the film to the designated area of ​​the product according to the preset path. The positioning reference formed by the first alignment structure 12 on the first mounting position 11 and the second alignment structure 22 on the second mounting position 21 can replace the visual alignment function of the Mark point, structurally solving the problem of film positioning for products without process edges and greatly reducing the risk of film deviation caused by positioning loss.

[0034] The pressing component 3, as an active driving component, is arranged on the side of the base 1 where the first mounting position 11 is located. The pressing component 3 can move along a preset direction. Specifically, the preset direction can refer to moving along the surface of the base 1 where the first mounting position 11 is located. The pressing component 3 translates along the surface of the base 1 where the first mounting position 11 is located, thereby gradually pressing the optical film 200 onto the LED display screen 100 along the direction of movement of the pressing component 3.

[0035] The base 1 has a first mounting position 11 on its surface and a diaphragm support 2 has a second mounting position 21 on its surface, which are arranged at an angle. When the pressing member 3 moves along a preset direction, the pressing member 3 can press the portion of the optical diaphragm 200 that extends beyond the edge of the diaphragm support 2 and cause the optical diaphragm 200 to detach from the second mounting position 21 and adhere to the LED display screen 100.

[0036] Specifically, since the surface of the base 1 with the first mounting position 11 and the surface of the diaphragm carrier 2 with the second mounting position 21 are arranged at an angle, one side of the optical diaphragm 200 can be closer to the first mounting position 11, and the pressing member 3 is arranged on the side where the first mounting position 11 and the second mounting position 21 are close. During the installation of the optical film 200 at the second mounting position 21, the area of ​​the optical film 200 is larger than that of the LED display screen 100. Most of the optical film 200 is confined to the second mounting position 21 by the second alignment structure 22. Moreover, by setting part of the optical film 200 beyond the film carrier 2, when the optical film 200 is positioned opposite the LED display screen 100 and ready to be applied, the pressing member 3 moves in a preset direction and can first contact and abut against the part of the optical film 200 that extends beyond the edge of the film carrier 2. At this time, the pressing member 3 is arranged above the side of the optical film 200 away from the first mounting position 11, thereby pressing the part of the optical film 200 that extends beyond the edge of the film carrier 2 to the edge of the first mounting position 11. As the pressing member 3 continues to move, the pressing force of the pressing member 3 will gradually detach the optical film 200 located at the second mounting position 21 from the contact point and adhere it to the surface of the LED product.

[0037] In the aforementioned pressing process, by arranging the surface of the base 1 with the first mounting position 11 and the surface of the diaphragm carrier 2 with the second mounting position 21 at an angle, a progressive bonding path is formed in conjunction with the movable pressing component 3. This is unlike the traditional overall pressing bonding process, which gradually removes air between the diaphragm and the product surface, effectively suppressing the formation of bubbles and wrinkles after bonding, and improving the flatness and tightness of the bonding. Simultaneously, the progressive bonding force is more uniform, avoiding diaphragm stretching deformation or product surface damage caused by instantaneous overall pressing.

[0038] The LED display screen film application device provided in this application integrates the base 1, the film carrier 2, and the pressing component 3 into the same device. The first mounting position 11 is provided with a first alignment structure 12 and the second mounting position 21 is provided with a second alignment structure 22. Through the dual positioning of the first alignment structure 12 and the second alignment structure 22, the mechanical limiting and positioning of the LED display screen 100 and the optical film 200 are respectively realized. This can effectively eliminate the offset error when manually placing the LED light board or the optical film 200, so that the positions of the LED display screen 100 and the optical film 200 on the film application device are relatively determined. In this way, without relying on the Mark points on the process edge, the pressing component 3 can still apply the optical film 200 to the LED display screen 100 according to the preset path. On the other hand, since the surface of the base 1 with the first mounting position 11 and the surface of the film carrier 2 with the second mounting position 21 are arranged at an angle, the optical film 200 can be gradually adhered to the surface of the LED display screen 100 by the action of the pressing component 3. This helps to avoid stretching deformation and local wrinkles caused by uneven force or sudden changes in film tension, which would affect the film application effect. It can effectively disperse the local stress of the film and also simplifies the processing difficulty of re-applying film to LED display products without process edges.

[0039] Of course, the LED display screen film application device of this application can also perform film application operations on other LED display products that require film application. The LED display screen or LED product to be processed referred to in this document is not limited to the COB, GOB, and COG packaged LED display screens mentioned above.

[0040] like Figure 5 As shown, in some specific embodiments, the second mounting position 21 is provided with a plurality of spaced adsorption holes 201, which are used to connect to a vacuum generating device.

[0041] The multiple adsorption holes 201 of the second mounting position 21 form a negative pressure adsorption force through a vacuum generator, which can stably adsorb the optical film 200 onto the surface of the second mounting position 21. Moreover, the adsorption force on the optical film 200 can be adjusted by adjusting the vacuum degree inside the adsorption holes 201.

[0042] When the optical film 200 is positioned opposite the LED display screen 100 and is ready to be applied, the pressing member 3 moves in a preset direction. It can first abut against the part of the optical film 200 that extends beyond the edge of the film support seat 2. As the pressing member 3 continues to move, the pressing force is greater than the vacuum adsorption force of the adsorption hole 201 on the optical film 200. This causes the optical film 200 to gradually detach from the second mounting position 21 from the contact point with the pressing member 3 and adhere to the surface of the LED product. Meanwhile, the remaining area of ​​the film remains adhered to the second mounting position 21 under the negative pressure adsorption.

[0043] This allows the optical film 200 to form a gradual bonding trajectory along the advancing direction of the pressing member 3, avoiding bonding loss caused by the instantaneous detachment of the optical film 200 as a whole. Moreover, as the pressing member 3 advances towards the far end of the optical film 200, its pressing force can be applied simultaneously to different areas of the optical film 200, causing the area where the optical film 200 is detached from the adsorption to gradually expand as the pressing member 3 moves. This achieves the process of the pressing member 3 gradually advancing, allowing the optical film 200 to gradually detach from the second position and adhere to the surface of the LED display screen 100. During this process, the adsorption force in the area that has not detached from the second mounting position 21 can maintain the flatness and tension of the optical film 200, allowing the film to remain flat without loosening or wrinkling due to local detachment, which is beneficial for maintaining the bonding effect at each position.

[0044] like Figure 1 and Figure 3 As shown, in some embodiments, the LED display screen film application device may include a first fixture 13, which is detachably mounted on the base 1 and has a first mounting position 11. The LED display screen 100 can be mounted on the first fixture 13. Correspondingly, the film carrier 2 is also detachably mounted on the base 1.

[0045] By detachably mounting the first fixture 13 on the base 1, the first fixture 13 of corresponding specifications can be customized for LED products without process edges of different sizes and models. This allows for adjustment of the size of the first mounting position 11 and the position of the first alignment structure 12. Correspondingly, the film bearing seat 2 can be replaced to adapt to the film application process of products of multiple specifications.

[0046] like Figure 3 As shown, in some embodiments, the surface of the base 1 with the first mounting position 11 is arranged along the horizontal direction of the LED display film application device, and the surface of the film carrier 2 with the second mounting position 21 is an inclined surface, and is inclined from the preset direction of the pressing member 3 toward the surface of the base 1 with the first mounting position 11 away from it.

[0047] In this design, by configuring the surface of the base 1 with the first mounting position 11 as a horizontal plane, the LED display screen 100 can be horizontally mounted on the first mounting position 11 and maintain a stable horizontal position. The surface of the second mounting position 21 is tilted away from the horizontal direction along the preset direction of the pressing member 3, so that the optical film 200 is initially lower on the side closer to the pressing member 3 and higher on the side farther from the pressing member 3. When the pressing member 3 moves along the preset direction, it first abuts against the lower edge of the optical film 200, and then drives the optical film 200 to gradually extend from the near end to the far end and adhere to the horizontal LED product surface, forming a progressive adhesion path. In this way, during the film application process, the air gap between the optical film 200 and the LED product surface can be gradually discharged along the unattached far end direction, avoiding the retention problem caused by air diffusion in multiple directions in traditional adhesion methods, and the entire film application process is more stable.

[0048] It should be noted that in some other embodiments, the surface of the diaphragm support 2 with the second mounting position 21 can be arranged horizontally, and the surface of the base 1 with the first mounting position 11 can be an inclined surface, and is inclined from the preset direction of the pressing member 3 toward the surface of the base 1 with the first mounting position 11 away from it.

[0049] like Figure 4 As shown, in some embodiments, the angle between the surface of the diaphragm support 2 with the second mounting position 21 and the surface of the base 1 with the first mounting position 11 is in the range of 30° to 60°.

[0050] Specifically, when the second mounting position 21 is positioned opposite the first mounting position 11 and the film application begins, the operator needs to first peel off the release layer of the optical film 200 that extends beyond the film carrier 2 using an easy-tear adhesive. By setting the angle between the surface of the film carrier 2 with the second mounting position 21 and the surface of the base 1 with the first mounting position 11 to a range of 30° to 60°, suitable installation space can be provided for the film application process within this range, allowing the operator to peel off the film more easily and quickly, avoiding the increased difficulty of operation due to a small angle. Moreover, since an angle is formed between the surface of the film carrier 2 with the second mounting position 21 and the surface of the base 1 with the first mounting position 11, the pressing component 3 needs to overcome the excessive adhesive force applied to the optical film 200 by the second mounting position 21 when pressing the optical film 200 onto the product surface. The larger the angle between the surface of the diaphragm carrier 2 with the second mounting position 21 and the surface of the base 1 with the first mounting position 11, the greater the adhesive force required for the second mounting position 21 to apply to the optical diaphragm 200. This results in a greater force being required during the pressing process using the pressing component 3. By ensuring that the angle between the surface of the diaphragm carrier 2 with the second mounting position 21 and the surface of the base 1 with the first mounting position 11 does not exceed 60°, the excessive adhesive force required for the second mounting position 21 to apply to the optical diaphragm 200 can be avoided. This reduces the need for greater pressing force to apply the film, thereby reducing the risk of damage to the diaphragm surface and its optical performance when the flexible optical diaphragm 200 is locally stretched, deformed, or torn.

[0051] like Figure 1 and Figure 3 As shown, in some embodiments, the first alignment structure 12 includes a mounting groove having an opening facing the diaphragm carrier 2, and the sidewalls of the mounting groove are used to mount the LED display 100.

[0052] The opening of the mounting groove faces the film support 2. The side wall of the mounting groove can form a stable and reliable fit with the edge of the LED display screen 100. That is, the edge contour of the mounting groove can be directly used as a positioning reference to ensure the initial position accuracy of the LED display screen 100 before film application. In this way, the horizontal position of the fitted product in the first mounting position 11 can be directly limited by mechanical limiting, so that there is no need to rely on the Mark points on the process edge for visual alignment.

[0053] Moreover, the mounting slot can be customized according to the shape of the LED product. Its side wall shape can fit perfectly with the edge contour of the product. The corresponding shape of the mounting slot can be processed on the first fixture 13. By changing the fixture, different irregular products can be quickly switched and positioned, which greatly improves the device's adaptability to special specifications of products.

[0054] In some embodiments, a support block 14 may be provided in the mounting groove, and multiple support blocks 14 may be provided, spaced apart from each other. Furthermore, the IC components on the back of the LED display screen 100 are correspondingly located in the clearance area formed between the support blocks 14. In this way, the support blocks 14 can support only the substrate of the LED display screen 100, preventing direct contact between the IC components and the bottom of the mounting groove or the support blocks 14. During the film lamination process, when the force of the pressing member 3 is transmitted through the product substrate, the support blocks 14 can bear and distribute the load. Since the clearance area formed between the support blocks 14 has no rigid support, it will not cause compression or impact to the IC components, making it more suitable for LED display products with high-density IC integration.

[0055] It should be noted that in some other embodiments, the first alignment structure 12 can be configured as an adjustable stop (not shown in the figure), a limiting block (not shown in the figure), or other structures. The stop and the limiting block can be set on the first mounting position 11 to mechanically limit the area around the LED display screen 100.

[0056] like Figure 5 As shown, in some embodiments, the second alignment structure 22 includes a first scale 221 and a second scale 222. The first scale 221 and the second scale 222 are respectively arranged on adjacent sides of the second mounting position 21.

[0057] The first scale 221 and the second scale 222 are respectively arranged on the adjacent sides of the second mounting position 21, so that a vertical two-dimensional scale reference can be formed. The operator can quickly calibrate the position of the diaphragm on the X-axis and Y-axis of the second mounting position 21 by aligning the edge of the optical diaphragm 200 with the scale of the scale, without relying on a complex vision alignment system, thus simplifying the operation process of diaphragm installation.

[0058] In this way, the mounting slot mechanically embeds and positions the LED display screen 100, while the dual scales provide visual calibration and positioning for the optical film 200, creating a complementary system. The mounting slot provides a stable mounting reference for the LED product to be processed, while the dual scales provide a precise mounting reference for the optical film 200. The combination of these two features ensures that the relative position of the optical film 200 and the LED display screen 100 remains aligned, achieving high-precision film application even without marker points and a visual alignment system. Simultaneously, the composite positioning system formed between the mounting slot and the scales works synergistically with the angled film application structure of the film application device. The precise initial position of the optical film 200 ensures that the path from the contact point to the overall bonding is always controllable during the progressive bonding process, further improving the film application effect to be bubble-free and wrinkle-free.

[0059] It should be noted that in some other embodiments, the second alignment structure 22 can be configured as a limiting block structure (not shown in the figure), and the limiting block can be raised on the second mounting position 21 to mechanically align the optical film 200.

[0060] Figure 6 yes Figure 1 This is another illustration from a different perspective.

[0061] like Figure 6 As shown, in some embodiments, the LED display screen film application device further includes a support frame 4, which can be used to support the film carrier 2. The support frame 4 can be arranged perpendicular to the bottom of the base 1, and the length direction of the support frame 4 extends along the height direction of the LED display screen film application device. The film carrier 2 is movably disposed on the support frame 4 and can move along the length direction of the support frame 4 to drive the optical film 200 closer to or away from the LED display screen 100.

[0062] When the diaphragm carrier 2 is close to the LED display screen 100, the portion of the optical diaphragm 200 that extends beyond the edge of the diaphragm carrier 2 can contact the peripheral edge of the first mounting position 11.

[0063] The support frame 4 extends along the height direction, and the film carrier 2 can be raised and lowered along the length direction of the support frame 4, which allows for flexible adjustment of the vertical distance between the optical film 200 and the LED display screen 100. Specifically, before applying the film, the film carrier 2 can be raised to a high position to reserve sufficient operating space for clamping the LED product, installing and positioning the optical film 200; after positioning is completed, the film carrier 2 is driven down to a preset height, and the part of the optical film 200 that extends beyond the edge of the film carrier 2 can contact the peripheral edge of the first mounting position 11, so that the pressing member 3 that moves to the part of the optical film 200 that extends beyond the edge of the film carrier 2 can press against the part of the optical film 200 that extends beyond the edge of the film carrier 2, and make it fit against the outside of the mounting groove.

[0064] In the above-mentioned lifting and lowering movement adjustment of the film carrier 2, the film carrier 2 can drive the optical film 200 to approach the LED display screen 100 in an inclined posture. When the side of the optical film 200 close to the first mounting position 11 can contact the outside of the mounting groove, and then the pressing member 3 can move it in a preset direction, which can effectively squeeze out the air between the optical film 200 and the LED display screen 100, and improve the film application effect.

[0065] like Figure 6As shown, in some specific embodiments, the LED display screen film application device may include a sliding plate 41 and an adjusting member (not shown in the figure). One end of the sliding plate 41 is connected to the film carrier 2, and the other side of the sliding plate 41 is slidably connected to the support frame 4. The support frame 4 may be provided with a sliding groove 401, which extends along the height direction of the support frame 4. The vertical distance between the film carrier 2 and the first mounting position 11 can be adjusted by adjusting the relative position of the sliding plate 41 and the support frame 4. The adjusting member passes through the sliding groove 401 and the sliding plate 41, and locks the sliding plate 41 to the support frame 4, thereby achieving the positioning between the sliding plate 41 and the support frame 4.

[0066] like Figure 1 As shown, in some embodiments, the diaphragm carrier 2 is rotatably mounted on the support frame 4, and a rotating shaft 8 is provided between the diaphragm carrier 2 and the support frame 4. The diaphragm carrier 2 can rotate relative to the base 1 around the rotating shaft 8 so that the second mounting position 21 is arranged opposite to the first mounting position 11, or opposite to the first mounting position 11.

[0067] Specifically, the rotating shaft 8 can be arranged as an inclined shaft extending along the inclined arrangement direction of the diaphragm support 2, so that the diaphragm support 2 can rotate around the rotating shaft 8 and be inclined relative to the surface of the base 1 where the first mounting position 11 is provided.

[0068] The diaphragm support 2 can rotate relative to the base 1 around the rotation axis 8, and can flexibly switch between the positions where the second mounting position 21 is opposite to the first mounting position 11 and the positions where the second mounting position 21 is opposite to the first mounting position 11. When it is necessary to install and position the LED display 100 and the optical film 200, the diaphragm support 2 can be rotated to a position opposite to the first mounting position 11. At this time, the second mounting position 21 is set in a direction away from the first mounting position 11. This will not obstruct the operating area of ​​the first mounting position 11, and will also provide an unobstructed operating space for the manual or automated feeding and scale calibration installation of the optical film 200. This allows the operator to more easily align the edge and scale lines of the optical film, reducing visual errors caused by tilting operations. At the same time, the first mounting position 11 is completely exposed, and the installation and calibration of the LED display 100 can be completed more smoothly. This avoids the space restriction caused by the second mounting position 21 being in a relative position to the first mounting position 11.

[0069] like Figure 4 and Figure 6 As shown, in some embodiments, the LED display screen film application device may include a driving device 5, which is connected to the pressing member 3 in a transmission manner. The driving device 5 is used to drive the pressing member 3 to move toward a surface of the base 1 that has a first mounting position 11, either close to or away from it.

[0070] The driving device 5 is used to drive the pressing component 3 to move up and down, so as to adjust the distance between the pressing component 3 and the surface of the base 1 with the first mounting position 11, and to adjust the pressing force between the pressing component 3 and the optical film 200.

[0071] Specifically, the driving device 5 can drive the pressing component 3 to move upward, increasing the vertical distance between the pressing component 3 and the surface of the first mounting position 11, thus reserving sufficient operating space for the embedding and positioning of the LED product to be processed and the calibration of the optical film 200. After the LED product to be processed and the film are positioned, the pressing component 3 is driven to move downward to a preset height, so that it is precisely aligned with the part of the film that exceeds the edge of the carrier, providing a stable initial contact posture for subsequent progressive bonding. Moreover, in the initial contact stage between the pressing component 3 and the optical film 200, the distance between the pressing component 3 and the surface of the first mounting position 11 can be controlled by the driving device 5 to output a smaller pressing force, avoiding direct high pressure that could cause film wrinkles or damage to the product chip; in the extension bonding stage of the optical film 200, the distance between the pressing component 3 and the surface of the base 1 with the first mounting position 11 can be adjusted by the driving device 5 to adjust the appropriate pressing force, so that the optical film 200 and the surface of the LED display screen 100 can be tightly bonded. In this way, the driving device 5 can set a low pressing force for the thin and easily deformable optical film 200, and the optical film 200 can be prevented from being damaged by pressure through precise pressure control, so that the LED display film application device can adapt to different film application needs for various types of optical films 200 or LED displays 100.

[0072] In some specific embodiments, the drive device 5 can be a cylinder.

[0073] like Figure 4 and Figure 6 As shown, in some embodiments, the LED display screen film application device may further include a guide member 6, which is connected to the base 1 and extends along a preset direction of movement of the pressing member 3; the pressing member 3 is slidably connected to the guide member 6 so as to reciprocate along the guide member 6.

[0074] To further improve the pressing accuracy of the pressing component 3 in moving the film, the guide component 6 is extended along the preset direction of the pressing component 3. The pressing component 3 and the guide component 6 slide together, which can constrain the movement trajectory of the pressing component 3. This is beneficial for the pressing component 3 to always move along the preset straight line direction, and avoids problems such as lateral displacement and angular deflection of the pressing component 3 during the pressing and film application process.

[0075] The extension direction of the guide 6 can be aligned with the proximal to distal direction of the inclined second mounting position 21. When the pressing member 3 moves along the guide 6, it can abut against the same side edge of the optical film 200 and advance at a uniform speed, so that the optical film 200 can gradually adhere to the surface of the LED product to be processed along a preset trajectory from the proximal to the distal end of the second position, and cooperate with the exhaust path of the inclined film carrier 2.

[0076] Specifically, a sliding connecting seat 71 is provided between the pressing part 3 and the guide part 6. The sliding connecting seat 71 is sleeved on the guide rod body. The pressing part 3 is connected to the sliding connecting seat 71. The sliding connecting seat 71 may also be provided with a movable handle 72. By holding the movable handle 72, the sliding connecting seat 71 is driven to drive the pressing part 3 to reciprocate along the length direction of the guide rod body.

[0077] It should be noted that in some other embodiments, the process of pressing the pressing member 3 along a preset direction to press the optical film 200 onto the surface of the LED display screen 100 can be driven by other driving components.

[0078] like Figure 1 and Figure 6 As shown, in some embodiments, the LED display screen film application device may include two mounting plates 7, which are arranged on opposite sides of the surface of the base 1 where the first mounting position 11 is provided.

[0079] The pressing component 3 includes a roller, and two mounting plates 7 can be arranged on the axial ends of the roller. The axial ends of the roller are respectively rotatably connected to a mounting plate 7. The roller can rotate relative to the mounting plate 7 so that when the roller moves in a preset direction, the roller can roll relative to the optical film 200.

[0080] The two mounting plates 7 are connected to the two ends of the roller in the axial direction, which can limit the roller and ensure that the roller is always in a horizontal state. When the roller moves in the preset direction, the contact position between the roller and the optical film 200 can form a uniform pressing contact surface, so that the bonding force is evenly distributed along the film bonding direction, effectively reducing the risk of local pressure concentration during the film bonding process, and ensuring that every area of ​​the film from the edge to the center can obtain stable and balanced bonding pressure.

[0081] Correspondingly, there can be two drive devices 5, which are respectively located on the two ends of the roller in the axial direction. They can output power synchronously to drive the roller to move, thus avoiding problems such as axial sway and tilt of the roller caused by unbalanced force when driven from one end.

[0082] In some embodiments, the pressing member 3 may be made of an antistatic material. The surface of the roller may be provided with an antistatic layer, which may be made of silicone. Furthermore, the edge of the mounting groove at the first mounting position 11 may also be provided with an antistatic layer. The antistatic layer can suppress the generation of static electricity, which helps reduce the risk of dust and debris in the air being adsorbed onto the optical film 200 or the product surface.

[0083] Figure 7 This is a schematic flowchart of a film application method in one embodiment of this application.

[0084] like Figure 7 As shown, one embodiment of the present invention provides a film application method, which is implemented using the LED display film application device of any of the above embodiments. The film application method includes: S10. Install the LED display screen 100 on the first mounting position 11; S20. The optical film 200 is installed on the second mounting position 21, wherein the protective layer of the optical film 200 is placed facing the second mounting position 21, and a portion of the optical film 200 extends beyond the film support 2. S30. Peel off the release layer of the optical film 200 in the area beyond the film support 2; S40, control the pressing component 3 to move along the preset direction and peel off the release layer in the remaining area of ​​the optical film 200.

[0085] Specifically, in step S10, the first fixture 13 with the first mounting position 11 can be fixed on the base 1 first, and then the LED display screen 100 can be placed on the first mounting position 11, so that the processed LED product is embedded in the mounting groove.

[0086] In step S20, the optical film 200 is installed. The optical film 200 is installed on the second mounting position 21, and the installation position of the optical film 200 is aligned and defined according to the second alignment structure 22. The film carrier 2 is rotatably mounted on the support frame 4. To facilitate installation, the film carrier 2 can be reversed so that the second mounting position 21 is opposite to the first mounting position 11. This increases the installation operation space of the second mounting position 21, making it easier to adjust the installation of the optical film 200 using the second alignment structure 22. After the optical film 200 is installed, the film carrier 2 can be flipped so that the optical film 200 is positioned opposite the LED display screen 100, and the alignment of the two is completed. This allows the optical film 200 to be aligned and bonded to the LED display screen 100 light board without process edges and without mark points, meeting the needs of customer end-product repair and film application when defects occur.

[0087] In the above steps, since the optical film 200 has a protective layer and a release layer, the protective layer of the optical film 200 needs to be set away from the product substrate, and the release layer is connected between the product substrate and the optical film 200. When installing the optical film 200, the side of the optical film 200 with the protective layer can be arranged facing the second mounting position 21, and the side of the optical film 200 with the release layer can be arranged away from the second mounting position 21. When the optical film 200 is arranged opposite to the product, the side of the optical film 200 with the release layer can be set towards the first mounting position 11.

[0088] It should be noted that during the relative arrangement of the optical film 200 and the LED display screen 100, the projection position of the second mounting position 21 relative to the first mounting position 11 can be finely adjusted by moving the support frame 4 according to the actual product size and installation requirements. In addition, the height interval between the film carrier 2 and the surface of the first fixture 13 where the first mounting position 11 is located can be adjusted so that one side of the optical film 200 can be arranged close to the first mounting position 11. This allows the optical film 200 that extends beyond the edge of one side of the film carrier 2 to first serve as the pressing contact position of the pressing member 3. The remaining optical films 200 located in the second mounting position 21 on the film carrier 2 can gradually detach from the second mounting position 21 by using the portion that extends beyond the film carrier 2 as the contact point.

[0089] In step S30, the operator can first peel off the release layer of the optical film 200 that extends beyond the area of ​​the film support 2 using an easy-tear adhesive. During the peeling process, this part of the optical film 200 that extends beyond the film support 2 can be pulled and contact the outer peripheral edge of the mounting groove, forming the initial contact position with the pressing part 3.

[0090] In step S40, the pressing member 3 is controlled to move along a preset direction, while the remaining release layer of the optical film 200 is peeled off. Specifically, the operator can move the pressing member 3 with one hand. The pressing member 3 can first abut against the optical film 200 that extends beyond the film support 2, so that the portion of the optical film 200 extending beyond the film support 2 is attached to the edge of the first mounting position 11. As the pressing member 3 continues to move, the optical film 200 is gradually detached from the second mounting position 21 and pressed onto the product surface by the pressure of the pressing member 3. During the aforementioned lamination process, since the optical film 200 is arranged at an angle to the product, the pressing component 3 presses against one side of the optical film 200 and gradually peels off the release layer from the remaining areas of the optical film 200. This allows the optical film 200 to gradually detach from the second mounting position 21 from the contact point with the pressing component 3 and adhere to the surface of the LED product. This gradually removes air between the film and the product surface, effectively suppressing the generation of bubbles and wrinkles after lamination, and improving the flatness and tightness of the lamination. At the same time, the progressive lamination force is more uniform, avoiding film stretching deformation or product surface damage caused by instantaneous overall pressing.

[0091] It is understood that those skilled in the art can make equivalent substitutions or changes to the technical solution and inventive concept of the present invention, and all such changes or substitutions should fall within the protection scope of the present invention.

Claims

1. An LED display screen film application device, characterized in that, include: A base, wherein a first mounting position is provided on the base for mounting an LED display screen; a first alignment structure is provided on the first mounting position for defining the mounting position of the LED display screen; A diaphragm carrier is disposed on the base. The diaphragm carrier has a second mounting position for mounting an optical diaphragm, which is opposite to the first mounting position. The diaphragm carrier has a second alignment structure for defining the mounting position of the optical diaphragm. A pressing component is arranged on the side of the base where the first mounting position is provided, and the pressing component can move along a preset direction; The surface of the base with the first mounting position is arranged at an angle to the surface of the diaphragm support with the second mounting position. When the pressing member moves along the preset direction, the pressing member can press the portion of the optical film that extends beyond the edge of the film support, so that the optical film can be disengaged from the second mounting position and attached to the LED display screen.

2. The LED display screen film application device according to claim 1, characterized in that, The surface of the base with the first mounting position is arranged along the horizontal direction of the LED display film application device. The surface of the film carrier with the second mounting position is an inclined surface, and it is inclined away from the preset direction of the pressing component toward the surface of the base with the first mounting position.

3. The LED display screen film application device according to claim 2, characterized in that, The angle between the surface of the diaphragm support with the second mounting position and the surface of the base with the first mounting position is in the range of 30° to 60°.

4. The LED display screen film application device according to claim 1, characterized in that, The first alignment structure includes a mounting groove having an opening facing the diaphragm support, and the sidewalls of the mounting groove are used for mounting the LED display screen; and / or The second alignment structure includes a first scale and a second scale, which are respectively arranged on adjacent sides of the second mounting position.

5. The LED display screen film application device according to any one of claims 1 to 4, characterized in that, The LED display screen film application device also includes a support frame, the length of which extends along the height of the film application device. The diaphragm carrier is movably mounted on the support frame and can move along the length of the support frame to move the optical diaphragm closer to or further away from the LED display screen.

6. The LED display screen film application device according to claim 5, characterized in that, The diaphragm support is rotatably mounted on the support frame. A rotating shaft is provided between the diaphragm support and the support frame. The diaphragm support can rotate relative to the base around the rotating shaft so that the second mounting position is arranged opposite to the first mounting position or away from the first mounting position.

7. The LED display screen film application device according to any one of claims 1 to 4, characterized in that, The LED display screen film application device also includes a driving device, which is connected to the pressing component. The driving device is used to drive the pressing component to move toward or away from the surface of the base where the first mounting position is provided.

8. The LED display screen film application device according to any one of claims 1 to 4, characterized in that, The LED display screen film application device also includes a guide member, which is connected to the base and extends along a preset direction for the pressing member to move; the pressing member is slidably connected to the guide member to reciprocate along the guide member.

9. The LED display screen film application device according to any one of claims 1 to 4, characterized in that, The LED display screen film application device includes two mounting plates, which are arranged on opposite sides of the surface of the base where the first mounting position is located. The pressing component includes a roller, with its two axial ends rotatably connected to a mounting plate. The roller is rotatable relative to the mounting plate so that when the roller moves along the preset direction, it can roll relative to the optical film.

10. A method for applying a film, characterized in that, The film application method is implemented using the LED display screen film application device as described in any one of claims 1 to 9, and the film application method includes: Install the LED display screen in the first mounting position; An optical film is installed on the second mounting position, with the protective layer of the optical film facing the second mounting position, and a portion of the optical film extending beyond the film support. Peel off the release layer from the region of the optical film that extends beyond the film support; The pressing component is controlled to move along the preset direction, and the release layer in the remaining area of ​​the optical film is peeled off.

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