Texture coating, LED display module, preparation method of LED display module and LED display screen

Abstract

The invention discloses a texture coating, an LED display module, a preparation method of the LED display module and an LED display screen, and relates to the technical field of display. The texture coating comprises a texture layer and a shading layer, the texture layer comprises a plurality of texture parts, and any two adjacent texture parts are vertically arranged at intervals; the light shielding layer at least comprises a plurality of first light shielding parts, any two adjacent first light shielding parts are vertically arranged at intervals, the texture parts are arranged on one sides of the first light shielding parts, light holes are formed between any two adjacent first light shielding parts and between any two adjacent texture parts, and the texture coating is used for emitting light entering the texture coating from the light holes. But the light is not emitted through the first shading part and the texture part; the texture part is further used for displaying texture patterns under the condition that no active light rays are emitted to the texture part. Interference between the bright dipping performance and the texture effect of the texture coating is reduced as much as possible, and balance is achieved.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a textured coating, an LED display module and its preparation method, and an LED display screen. Background Technology

[0002] Light-emitting diode (LED) displays are increasingly widely researched and applied due to their high contrast and wide color gamut, high brightness and wide viewing angle, high refresh rate and low latency, and good reliability, making them suitable for a variety of display scenarios.

[0003] With the improvement of users' aesthetic concepts and the increasing demand for the integration of display devices with the environment, LED displays with screen-off texture decoration functions have emerged. These LED displays typically have a texture film attached to their surface, which allows them to present a variety of realistic texture effects in the screen-off state while retaining the display performance of traditional LED displays. This makes the LED display a highlight of the space decoration even when it is not in operation, perfectly blending into various environmental styles.

[0004] However, the various surface textures in current textured films are usually achieved by a variety of texture inks of different colors. Different texture inks have different absorption and reflection of light, which causes serious interference between the light emission performance and texture effect of the textured film, making it impossible to achieve a balance and resulting in poor performance of the textured film. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned shortcomings of the prior art and provide a textured coating, an LED display module and its preparation method, and an LED display screen, so as to minimize the interference between the light emission performance and texture effect of the textured coating, so as to achieve a balance.

[0006] To achieve the aforementioned objectives, a first aspect of this application provides a textured coating, comprising: a textured layer including a plurality of textured portions, wherein any two adjacent textured portions are disposed independently and spaced apart; a light-shielding layer including at least a plurality of first light-shielding portions, wherein any two adjacent first light-shielding portions are disposed independently and spaced apart, wherein the textured portions are disposed on one side of the first light-shielding portions, and light-transmitting holes are provided between any two adjacent first light-shielding portions and between any two adjacent textured portions, wherein the textured coating is used to allow light incident thereon to exit through the light-transmitting holes, but the light does not exit through the first light-shielding portions and the textured portions; the textured portions are also used to display texture patterns when no active light is incident thereon.

[0007] The textured coating provided in this application embodiment has multiple separate and spaced first light-shielding parts, with a light-transmitting hole between any two adjacent first light-shielding parts, and a textured part is provided on the first light-shielding part along the light-emitting direction of the textured coating. In this way, when no active light enters the light-transmitting hole in the textured coating, the textured part can display a realistic and natural textured art effect, while also reducing or even avoiding interference with light, so that the texture effect and display performance can be balanced.

[0008] A second aspect of this application provides an LED display module, comprising: an LED display panel; the aforementioned textured coating, wherein a first light-shielding portion is disposed on the light-emitting side of the LED display panel, and the textured portion is disposed on the side of the first light-shielding portion away from the LED display panel, wherein light emitted from the LED display panel enters the textured coating and is used to exit from the light-transmitting hole, but the light does not pass through the first light-shielding portion and the textured portion; the textured portion is also used to display a textured pattern when the LED display module is in a screen-off state.

[0009] The LED display module provided in this application embodiment has a first light-shielding part located on the light-emitting surface of the LED display panel, which can effectively block the light emitted by the LED beads. Furthermore, the texture part is located on the surface of the first light-shielding part away from the LED panel, so that when the LED display module is in the off state, the texture part can display realistic and natural textures. In addition, the first light-shielding part can also reduce the risk of interference to the display, meet the requirements of large-scale industrial production, and facilitate the rapid promotion and application of the technology.

[0010] A third aspect of this application provides an LED display screen, including the LED display module described above.

[0011] The LED display screen provided in this application embodiment can achieve a balance between texture appearance and display function while maintaining realistic and natural textures in a screen-off state, thus reducing the risk of interference with display performance. In addition, it can meet the requirements of large-scale industrial production, so as to facilitate the rapid promotion and application of the technology.

[0012] A fourth aspect of this application provides a method for manufacturing an LED display module, comprising the following steps: providing an LED display panel; forming a textured coating on the light-emitting side of the LED display panel; wherein the textured coating includes at least a first light-shielding portion and a textured portion, the textured portion being disposed on the side of the first light-shielding portion away from the LED display panel, light emitted from the LED display panel entering the textured coating and being emitted from the light-transmitting hole, but the light not being emitted through the first light-shielding portion and the textured portion; the textured portion is also used to display a textured pattern when the LED display module is in a screen-off state.

[0013] The method for preparing the LED display module provided in this application is simple and easy to implement, and is conducive to industrial production and application.

[0014] Compared with the prior art, this application has the following technical effects: The textured coating, LED display module and its preparation method, and LED display screen provided in this application embodiment are provided with at least a plurality of discrete and spaced first light-shielding parts. A light-transmitting hole is provided between any two adjacent first light-shielding parts, and a textured part is provided on the first light-shielding part along the light-emitting direction of the textured coating. In this way, when no active light enters the light-transmitting hole in the textured coating, the textured part can display a realistic and natural texture art effect while reducing or even avoiding interference with light, so that the texture effect and display performance can be balanced, thereby making the LED display module and LED display screen perform better. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a surface texture structure provided by related technologies; Figure 2 This is a schematic diagram of the structure of a textured coating provided in an embodiment of this application; Figure 3 This is a schematic diagram of another textured coating structure provided in an embodiment of this application; Figure 4 This is a schematic diagram of another textured coating provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the first type of light-transmitting hole provided in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the second type of light-transmitting hole provided in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the third type of light-transmitting hole provided in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of the fourth type of light-transmitting hole provided in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of the fifth type of light-transmitting hole provided in the embodiments of this application; Figure 10 This is a schematic diagram of the sixth type of light-transmitting hole provided in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of an LED display module provided in an embodiment of this application; Figure 12 This is a schematic diagram of another LED display module provided in an embodiment of this application; Figure 13 This is a schematic diagram of the structure of another LED display module provided in the embodiments of this application; Figure 14 This is a schematic diagram of another LED display module provided in the embodiments of this application; Figures 15(a) to 15(h) are process flow diagrams of an LED display module provided in the embodiments of this application; Figures 16(a) to 16(h) are process flow diagrams of another LED display module provided in the embodiments of this application; Figures 17(a) to 17(c) are process flow diagrams of another LED display module provided in the embodiments of this application. Detailed Implementation

[0017] The specific embodiments described in this application are merely illustrative and not intended to limit the scope of this application. The term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. In this application, "at least one" refers to one or more, and "multiple" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, "at least one of a, b, or c," or "at least one of a, b, and c," can all represent: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0018] In today's era of rapid digital information dissemination, LED displays, as an important information display medium, have gradually become one of the mainstream display technologies in the market, ranging from large outdoor advertising screens on bustling city streets to information display equipment in conference rooms and exhibition halls, and even display equipment in home theaters, thanks to their advantages such as self-illumination, high brightness, high contrast, long lifespan, fast response speed, and vibrant colors.

[0019] As users' aesthetic standards improve and their demands for seamless integration of display devices with their environments increase, traditional LED displays are gradually revealing some limitations in terms of appearance and functionality. For example, when the screen is off, traditional LED displays typically only present a single black or gray appearance, making it difficult to meet the needs of application scenarios with high requirements for spatial aesthetics (such as high-end commercial spaces, art galleries, or smart home environments). These scenarios generally expect LED displays to not only provide high-quality visual effects when the screen is on, but also to blend naturally with the surrounding environment when the screen is off, becoming part of the space's decoration.

[0020] To meet these needs, LED displays with textured decorations when the screen is off have been developed and are gradually becoming a new direction for industry development. These LED displays retain the excellent display performance of traditional LED displays while also incorporating a textured film on their outermost surface. This surface texture design allows the LED display to display realistic textures such as wood grain and stone grain when the screen is off, making it a highlight of interior decoration even when not in use, perfectly blending into various environmental styles.

[0021] Figure 1 A schematic diagram of a surface texture film is shown. However, research has found that various surface textures in related technologies are usually achieved by a variety of texture inks of different colors. Different texture inks have different absorption and reflection of light, which directly leads to serious interference between light emission performance and texture effect, making it impossible to achieve a balance, resulting in poor performance of the surface texture film.

[0022] This application provides a textured coating, with reference to... Figures 2 to 4 As shown, the texture coating 1 in this embodiment may include a texture layer and a light-shielding layer 11. The light-shielding layer 11 includes at least a plurality of first light-shielding parts 1-2, with any two adjacent first light-shielding parts 1-2 being separate and spaced apart. The texture layer includes a plurality of texture parts 10, which are disposed on one side of the light-shielding layer 11, with any two adjacent texture parts 10 being separate and spaced apart. A light-transmitting hole 3 is provided between any two adjacent first light-shielding parts 1-2 and between any two adjacent texture parts 10. The texture coating 1 is used to allow light entering it to exit through the light-transmitting hole 3, but the light entering it does not pass through the first light-shielding parts 1-2 and the texture parts 10. The texture parts 10 are also used to display texture patterns when no active light is directed toward them.

[0023] In applications, the materials, shapes, and structures of the multiple first light-shielding parts 1-2 may be the same or different. For ease of manufacturing, in this embodiment, the materials, shapes, and structures of the multiple first light-shielding parts 1-2 are all the same.

[0024] The material of the first light-shielding part 1-2 may include a single modified or multiple mutually modified photosensitive curable inks, such as epoxy resin, acrylic resin, polyurethane resin, silicone resin, etc. Furthermore, the optical density (OD) value of the first light-shielding part 1-2 can be set to be greater than or equal to 1. Specifically, the color of the ink in the first light-shielding part 1-2 can be black, in which case the first light-shielding part 1-2 is completely opaque.

[0025] Each first light-shielding part 1-2 is along the first direction ( Figures 2 to 4 The thickness d1 (in the oz direction) can be 5μm to 20μm. For example, d1 can be 5μm, 8μm, 11μm, 15μm, or 20μm, etc. It should be noted that the oz direction is the direction parallel to the thickness direction of circuit boards 1-4.

[0026] In practical applications, the texture portion 10 can be one layer or multiple layers; no specific limitation is made here. When the texture portion 10 is a single layer, its thickness along the oz direction can be 5μm to 20μm; when the texture portion 10 is multi-layered, for example, refer to... Figures 2 to 4 As shown, the texture section 10 includes a first sub-texture layer 1-1 and a second sub-texture layer 1-3. The first sub-texture layer 1-1 is different from the second sub-texture layer 1-3. The first sub-texture layer 1-1 is disposed between the second sub-texture layer 1-3 and the first light-shielding section 1-2. The thickness d3 of the first sub-texture layer 1-1 along the oz direction can be 5μm to 20μm, and the thickness d4 of the second sub-texture layer 1-3 along the oz direction can be 5μm to 20μm. For example, the thickness of a single-layer texture section or any single-layer sub-texture layer along the oz direction can be 5μm, 8μm, 11μm, 15μm, or 20μm, etc.

[0027] The material of the texture section 10 may include single-modified or multi-modified photosensitive curable inks, such as epoxy resin, acrylic resin, polyurethane resin, silicone resin, etc. The ink colors of the single-layer sub-texture layers in the texture section 10 can be freely selected and matched according to the desired texture pattern. For example, the ink color of the first sub-texture layer 1-1 can be white, and the color and pattern of the second sub-texture layer 1-3 can be as follows: Figure 1 As shown, no specific limitations are made here.

[0028] In practical applications, since there are no first light-shielding parts 1-2 and textured parts 10 at the light-transmitting hole 3, light rays directed toward the textured coating 1 can be emitted from the light-transmitting hole 3.

[0029] The textured coating provided in this application embodiment has multiple separate and spaced first light-shielding parts, with a light-transmitting hole between any two adjacent first light-shielding parts, and a textured part is provided on the first light-shielding part along the light-emitting direction of the textured coating. In this way, when no active light enters the light-transmitting hole in the textured coating, the textured part can display a realistic and natural textured art effect, while also reducing or even avoiding interference with light, so that the texture effect and display performance can be balanced.

[0030] In some implementations, reference Figures 5 to 8 As shown, in the textured coating provided in this application embodiment, the arrangement of the light-transmitting holes 3 includes any one of the following: grid arrangement, array arrangement, and surround arrangement.

[0031] As a first example, when the arrangement of the light-transmitting holes 3 is a grid arrangement, refer to... Figure 5 As shown, the light-transmitting holes 3 between any two adjacent first light-shielding parts 1-2 are arranged in a regular and equidistant grid pattern. Specifically, the shape of the outline of each light-transmitting hole 3 can be cubic (e.g., rectangle, square, etc.). A regular and equidistant grid pattern means that the cubic shapes are the same size. Of course, it is also possible to set at least some of the cubic shapes to be different in size; no specific limitation is made here.

[0032] Furthermore, Figure 5 The arrangement direction of the grid-like light-transmitting holes shown can be vertical (along the second direction, i.e.) Figure 5 (in the oy direction), lateral (along the third direction, i.e.) Figure 5 The light-transmitting holes can be oriented in the ox direction or at an angle (forming an angle with both the ox and oy directions). The width w1 of the grid-type light-transmitting hole along the ox direction can be 5μm to 200μm. The remaining non-hole area is the first light-shielding part 1-2, preferably w1 can be 25μm to 150μm. For example, w1 can be 25μm, 40μm, 80μm, 100μm, 130μm, or 150μm. It should be noted that both the ox and oy directions are perpendicular to the thickness direction of the circuit board 1-4, that is, both the ox and oy directions are perpendicular to the oz direction, and the ox direction is perpendicular to the oy direction.

[0033] As a second example, when the arrangement of the light-transmitting holes 3 is an array arrangement, refer to... Figure 6As shown, the light-transmitting holes 3 between any two adjacent first light-blocking parts 1-2 are arranged in a regular and equidistant array. Specifically, the shape of the outline of each light-transmitting hole 3 can be a geometric shape such as a circle, ellipse, rectangle, or triangle. When the shape of the outline of the light-transmitting hole 3 is selected as a circle, the regular and equidistant array arrangement means that all circles are the same size. Of course, it is also possible to set that at least some of the circles are the same size; no specific limitation is made here.

[0034] As a third example, when the arrangement of the light-transmitting holes 3 is a wraparound arrangement, refer to... Figure 7 and Figure 8 As shown, the light-transmitting holes 3 between any two adjacent first light-blocking parts 1-2 are arranged in a regular, surrounding pattern. Specifically, the spacing between any two adjacent first light-blocking parts 1-2 along the ox direction and / or along the oy direction can be the same.

[0035] Furthermore, Figure 8 The width w2 of the surrounding light-transmitting hole along the ox direction can be 5μm to 200μm, and the remaining non-hole area is the first light-shielding part 1-2. Preferably, w2 can be 25μm to 150μm. For example, w2 can be 25μm, 40μm, 80μm, 100μm, 130μm or 150μm, etc.

[0036] Based on the above, along the oz direction, the depth of the light-transmitting hole 3 of any shape can be determined by the superimposed thickness of the first light-shielding part 1-2 and the textured part 10. Preferably, the thickness d1 of the first light-shielding part 1-2 along the oz direction can be 10μm to 30μm. Therefore, the depth of the light-transmitting hole 3 along the oz direction can be 25μm to 100μm. For example, the depth of the light-transmitting hole 3 along the oz direction can be 25μm, 40μm, 80μm, 100μm, 130μm or 150μm, etc.

[0037] The textured coating provided in this application embodiment can achieve a variety of texture patterns with different structures by setting the light-transmitting holes in various arrangements, and can achieve a good light emission effect for the light passing through it, so as to achieve the purpose of high color accuracy and good brightness uniformity.

[0038] In some embodiments, the main light emission efficiency of the textured coating provided in this application can be determined by the proportion of the area of ​​the light-transmitting hole region to the area of ​​the light-emitting surface region of the textured coating.

[0039] Therefore, if the proportion of the area of ​​the light-emitting surface region of the light-transmitting hole in the textured coating is set to value A, then the light emission efficiency of the textured coating is approximately value A. For example, the error between the light emission efficiency and value A is between -2 and 2.

[0040] Furthermore, the light extraction efficiency of the textured coating is value A.

[0041] The textured coating provided in this application optimizes the light emission efficiency of the textured coating by designing the area occupied by the light-emitting holes in the light-emitting surface area of ​​the textured coating.

[0042] In some implementations, reference Figure 3 and Figure 4 As shown, the light-shielding layer 11 in the textured coating provided in this application embodiment may further include at least one second light-shielding part 1-6, each second light-shielding part 1-6 being disposed within a light-transmitting hole 3.

[0043] In practical applications, each second light-shielding part 1-6 can occupy a portion of each light-transmitting hole 3; or, each second light-shielding part 1-6 can occupy the entirety of each light-transmitting hole 3.

[0044] The OD value of the second light-shielding portion 1-6 can be greater than 0 and less than 0.5. Therefore, the second light-shielding portion 1-6 has a certain transmittance to the light incident upon it. For example, the transmittance of the second light-shielding portion 1-6 can be greater than or equal to 10% and less than 100%. Exemplarily, the transmittance of the second light-shielding portion 1-6 can be 10%, 40%, 60%, 80%, or 90%, etc. Further, if the transmittance of the second light-shielding portion 1-6 is set to a value B, then the light emission efficiency of the textured coating is approximately A value × B value. Thus, the light-transmitting hole 3 can transmit a portion of the light, that is, light is partially transmitted through the light-transmitting hole 3.

[0045] Based on this, the thickness of the second light-shielding part 1-6 needs to be slightly thinner; otherwise, excessive thickness may affect the transmission of light. Therefore, in this embodiment, the thickness d2 of the second light-shielding part 1-6 along the oz direction can be 10% to 90% of the thickness d1 of the first light-shielding part 1-2 along the oz direction. For example, d2=10% d1, d2=30% d1, d2=50% d1, d2=70% d1, or d2=90% d1, etc.

[0046] The textured coating provided in this application embodiment, by providing a second light-shielding part in the light-transmitting hole area, can make the light transmittance adjustable range larger based on the semi-transparent effect of the second light-shielding part; at the same time, when the textured coating is applied to an LED display screen, if the displayed color is significantly different from the color of the textured coating, it can also highlight the texture and make the texture display effect better.

[0047] In some implementations, reference Figures 2 to 4 As shown, the textured portion 10 of the textured coating provided in this application embodiment may include at least: a first sub-texture layer 1-1 and a second sub-texture layer 1-3. The second sub-texture layer 1-3 is disposed on the side of the first sub-texture layer 1-1 away from the first light-shielding portion 1-2. The texture pattern of the first sub-texture layer 1-1 is different from the texture pattern of the second sub-texture layer 1-3.

[0048] Of course, each texture section 10 can also include more sub-texture layers, commonly 1 to 4 layers, which can be freely combined and matched with materials, colors, etc. according to the texture style requirements, depending on the actual application.

[0049] It should be noted that the transmittance of inks of the same color can be controlled by adjusting the ink thickness. However, in pursuit of realistic texture layers, the transmittance of textured films with different texture patterns varies significantly in related technologies. This makes it difficult to maintain uniform optical performance in mass-produced textured coatings.

[0050] The textured coating provided in this application embodiment, through the design of the texture structure, can ensure that textured coatings with different texture patterns maintain consistency in key optical indicators such as light extraction efficiency as much as possible, so that the optical performance of textured coatings in mass production can be as uniform as possible, meeting the requirements of large-scale industrial production, and facilitating the rapid promotion and application of the technology.

[0051] In some implementations, reference Figures 2 to 4 As shown, the texture coating 1 provided in this application embodiment may further include: a hardening layer 4, which is disposed on the side of the texture portion 10 away from the light-shielding layer 11. The hardening layer 4 at least covers the texture portion 10 and the first light-shielding portion 1-2 and fills the light-transmitting hole 3.

[0052] In practical applications, as an example, when the light-shielding layer 11 only includes the first light-shielding part 1-2, the hardening layer 4 covers the top and side surfaces of the textured part 10, as well as the side surfaces of the first light-shielding part 1-2, and the hardening layer 4 fills the light-transmitting hole 3.

[0053] As another example, when the light-shielding layer 11 includes a first light-shielding portion 1-2 and a second light-shielding portion 1-6, the hardening layer 4 covers the top and side surfaces of the textured portion 10 and the top surface of the second light-shielding portion 1-6, and the hardening layer 4 fills the light-transmitting hole 3.

[0054] The material of the hardening layer 4 may include ultraviolet (UV) curing resin, thermosetting resin, etc. For example, the material of the hardening layer 4 may be at least one of epoxy resin, acrylic resin, polyurethane resin, or silicone resin, and it is necessary to ensure that the hardening layer 4 is transparent, with a light transmittance greater than or equal to 90%, to ensure that it does not affect light emission as much as possible. In addition, a certain proportion of filler may be added to the UV curing resin, thermosetting resin, etc., to achieve a surface gloss effect for the hardening layer 4.

[0055] Furthermore, the surface pencil hardness of the hardened layer 4 can be greater than or equal to 2H. For example, the surface pencil hardness of the hardened layer 4 can be 2H, 3H, 4H, 5H, 6H, or 7H, etc.

[0056] Furthermore, the thickness of the hardened layer 4 along the oz direction needs to be greater than the sum of the thickness of the textured portion 10 along the oz direction and the thickness d1 of the first light-shielding portion 1-2 along the oz direction.

[0057] Furthermore, along the oz direction, the depth of any shape of the light-transmitting hole 3 can be determined by the superimposed thickness of the light-shielding layer 11, the texture portion 10, and the hardening layer 4. Preferably, the thickness of the light-shielding layer 11 along the oz direction can be 10μm to 30μm, the thickness of the texture portion 10 along the oz direction can be 10μm to 50μm, and the thickness of the hardening layer 4 along the oz direction can be 5μm to 20μm. Therefore, the depth of the light-transmitting hole 3 along the oz direction can be 25μm to 100μm.

[0058] The textured coating provided in this application embodiment provides good protection for the textured part, the first light-shielding part, and the light-transmitting hole by setting a hardened layer that at least covers the textured part and the first light-shielding part and fills the light-transmitting hole.

[0059] In some implementations, reference Figure 4 As shown, the textured coating 1 provided in this embodiment may further include: an optical substrate 1-4, wherein the optical substrate 1-4 is disposed on the side of the light-shielding layer 11 away from the textured portion 10.

[0060] In practical applications, optical substrates 1-4 can be thermoplastic optical films such as polyethylene terephthalate (PET), triacetyl cellulose (TAC), semi-reinforcing furnace black (SRF), polycarbonate (PC), or acrylonitrile butadiene styrene copolymer (ABS).

[0061] Furthermore, the optical substrates 1-4 need to be transparent; for example, the overall light transmittance of the optical substrates 1-4 can be greater than or equal to 90%.

[0062] Furthermore, the thickness d5 of the optical substrate 1-4 along the oz direction can be 25μm to 200μm. For example, d5 can be 25μm, 50μm, 100μm, 150μm or 200μm, etc.

[0063] The textured coating provided in this application embodiment has an optical substrate on the surface of the light-shielding layer away from the textured layer. The optical substrate can provide good support for the film layer located thereon.

[0064] This application provides an LED display module, see reference. Figures 11 to 14 As shown, the LED display module in this application embodiment may include: an LED display panel and the texture coating in the above embodiment one. The texture coating in embodiment one is disposed on the light-emitting side of the LED display panel, and the texture part 10 is disposed on the side of the first light-shielding part 1-2 away from the LED display panel. The light emitted by the LED display panel enters the texture coating and is used to be emitted from the light-transmitting hole 3, but does not pass through the first light-shielding part 1-2 and the texture part 10. The texture part 10 is also used to display the texture when the LED display panel is in the off state.

[0065] The LED display module provided in this application embodiment has a first light-shielding part located on the light-emitting surface of the LED display panel, which can effectively block the light emitted by the LED beads. Furthermore, the texture part is located on the surface of the first light-shielding part away from the LED display panel, so that the LED display panel, i.e., the LED display module, can display realistic and natural texture patterns in the texture part when the screen is off. In addition, the first light-shielding part can also reduce the risk of interference to the display, meet the requirements of large-scale industrial production, and facilitate the rapid promotion and application of the technology.

[0066] In some implementations, reference Figure 11 and Figure 12 As shown, in the LED display module provided in this application embodiment, the LED display board may include: a circuit board 2-1, at least one LED bead 2-2, and an encapsulation layer 2-3. The circuit board 2-1 includes a front side, and the LED bead 2-2 is disposed on the front side of the circuit board 2-1. Any two adjacent LED beads 2-2 are separated and spaced apart. Solder resist ink 2-5 is disposed between any two adjacent LED beads 2-2. Each LED bead 2-2 has multiple pins 2-4. Each LED bead 2-2 is soldered to the front side of the circuit board 2-1 through the pins 2-4. The encapsulation layer 2-3 covers the LED bead 2-2, the pins 2-4, and the front side of the circuit board 2-1. A textured coating is disposed on the side of the encapsulation layer 2-3 away from the circuit board 2-1.

[0067] In practical applications, circuit board 2-1 can be a printed circuit board (PCB), etc.

[0068] The number of LED beads 2-2 can be one or more, and the number of pins 2-4 of each LED bead 2-2 can be, for example, four, depending on the actual application.

[0069] It should be understood that in this embodiment, the light-transmitting hole 3 is the textureless coating area of ​​the encapsulation layer 2-3 on the side opposite to the circuit board 2-1. Thus, the light emitted by the LED lamp bead 2-2 is emitted through the light-transmitting hole 3. The main light output efficiency of the LED display module is determined by the proportion of the area of ​​the light-transmitting hole 3 to the area of ​​the light-emitting surface of the encapsulation layer 2-3.

[0070] The aforementioned encapsulation layer 2-3 covers the front of the LED beads 2-2, pins 2-4, and circuit board 2-1, and serves to encapsulate and protect the circuit board 2-1 and LED beads 2-2, as well as provide optical control. The material of the encapsulation layer 2-3 may include encapsulating adhesives, such as UV-curable resins, thermosetting resins, etc. For example, at least one of epoxy resin, acrylic resin, polyurethane resin, or silicone resin can be selected. Furthermore, a certain proportion of light-diffusing filler can be added to the resin to ensure the transparency of the encapsulating adhesive 2-3. For example, the light transmittance of the encapsulating adhesive 2-3 can be set to be greater than or equal to 80% to ensure minimal impact on display functionality. Moreover, the Shore hardness of the encapsulation layer 2-3 can be greater than or equal to 60D. For example, the Shore hardness of the encapsulation layer 2-3 can be 60D, 70D, 80D, 90D, 100D, or 110D. Furthermore, the overall thickness of the encapsulation layer 2-3 along the oz direction can be 1 to 3 times the thickness of the LED bead 2-2 along the oz direction. For example, the overall thickness of the encapsulation layer 2-3 along the oz direction can be 1, 2, or 3 times the thickness of the LED bead 2-2 along the oz direction.

[0071] In this embodiment, Figure 5 and Figure 9 The arrangement direction of the grid-type light-transmitting holes on the LED display panel can be vertical, horizontal, or diagonal, and there are no requirements for the relative position of the grid-type light-transmitting holes to the position of the pixels in the LED display panel.

[0072] Figure 6 and Figure 10 The shape of the array of light-transmitting holes can be selected from geometric shapes such as circles, ellipses, rectangles, or triangles, and must correspond one-to-one with the pixel positions in the LED display panel. Furthermore, if the area of ​​the array of light-transmitting holes is larger than the pixel area in the LED display panel, the shape of the holes can be chosen arbitrarily. However, when the area of ​​the array of light-transmitting holes is smaller than the pixel area in the LED display panel, the shape of the holes must be rectangular to ensure consistent coverage of pixels of different colors in the LED display panel, such as red (R) pixels, green (G) pixels, and blue (B) pixels.

[0073] Figure 7 and Figure 8There are no requirements for the horizontal position of the surrounding light-transmitting hole on the LED display panel, but the surrounding light-transmitting hole or the first light-shielding part 1-2 located in the center cannot be set above the pixels in the LED display panel, and the area of ​​the surrounding light-transmitting hole in the center needs to be smaller than the spacing between the pixels in the LED display panel.

[0074] The LED display module provided in this application embodiment has a first light-shielding part located on the surface of the encapsulation layer opposite to the circuit board, and a texture part located on the surface of the first light-shielding part opposite to the circuit board. In this way, the first light-shielding part can cover the light emitted by the LED beads, making the texture pattern of the LED display module realistic and natural in the screen-off state, and reducing the risk of interference with display performance. That is, the texture and display are balanced, which meets the requirements of large-scale industrial production, so as to facilitate the rapid promotion and application of the technology.

[0075] In some implementations, reference Figures 11 to 14 As shown, in the LED display module of this application embodiment, the proportion of the area of ​​the light-emitting surface region of the light-transmitting hole 3 in the LED display lamp board is defined as the A value, and the light emission efficiency of the LED display module is approximately the same as the A value.

[0076] The LED display module provided in this application optimizes the light output efficiency of the LED display module by setting the proportion of the area of ​​the light-emitting surface of the light-transmitting hole in the LED display lamp board.

[0077] In some implementations, reference Figure 13 As shown, the LED display module of this application embodiment may further include: an adhesive layer 1-5, which is disposed between the optical substrate 1-4 and the encapsulation layer 2-3 of the LED display panel in the textured coating, and the adhesive layer 1-5 is used to bond the textured coating to the LED display panel.

[0078] In practical applications, adhesive layers 1-5 can be adhesive backing, which may include UV-curable resins, thermosetting resins, etc. For example, at least one of epoxy resin, acrylic resin, polyurethane resin, or silicone resin can be selected. Furthermore, the adhesive backing is required to be transparent; for example, its light transmittance can be greater than or equal to 90% to ensure that it does not affect the display function as much as possible.

[0079] The thickness of the adhesive layer 1-5 along the oz direction can be 25μm to 100μm. For example, the thickness of the adhesive layer 1-5 along the oz direction can be 25μm, 30μm, 50μm, 80μm or 100μm, etc.

[0080] In this embodiment, the light-transmitting hole 3 is the area on the surface of the optical substrate 1-4 where there is no first light-shielding part 1-2 and texture part 10.

[0081] Additionally, please refer to [the relevant documentation / reference]. Figure 14 As shown, Figure 14 The encapsulation layer 2-3 in the middle also serves as the adhesive layer 1-5, and in this case, the two are equivalent.

[0082] The LED display module provided in this application uses an adhesive layer to bond the textured coating and the optical substrate to the surface of the LED light board, thereby enabling these structures to adhere well.

[0083] This application provides an LED display screen, which may include the LED display module described in Embodiment 2 above.

[0084] In practical applications, the LED display screen in the embodiments of this application may also be called a texture screen, including but not limited to LED displays obtained by using surface mount device glue on board (SMD GOB), chip on board (COB), or micro light emitting diodes on integrated passive substrates (MIP) based on surface mount technology.

[0085] The LED display screen provided in this application embodiment can present realistic and natural texture patterns when the screen is off, and can reduce the risk of interference with display performance, achieving a balance between texture appearance and display function. In addition, it can also meet the requirements of large-scale industrial production, so as to facilitate the rapid promotion and application of the technology.

[0086] This application provides various methods for manufacturing LED display modules.

[0087] As an example, in this embodiment, when the light-shielding layer 11 only includes the first light-shielding portion 1-2, Figure 11 , Figure 13 and Figure 14 The methods for manufacturing the LED display module shown can include the following four types.

[0088] Method 1: The mask exposure process may include the following steps: S111, Referring to Figure 15(a), an LED display panel is provided.

[0089] The LED display board includes a circuit board 2-1, LED beads 2-2 (with pins 2-4), solder resist ink 2-5, and an encapsulation layer 2-3. The LED beads 2-2 are soldered to one side surface of the circuit board 2-1 through pins 2-4. The solder resist ink 2-5 is disposed between any two adjacent pins 2-4 on one side surface of the circuit board 2-1.

[0090] S112. Referring to Figure 15(b), uncured black photosensitive ink 01 is prepared on the side of the encapsulation layer 2-3 away from the circuit board 2-1 by screen printing, transfer printing, spraying, coating and other coating processes.

[0091] S113, as shown in Figure 15(c), the black photosensitive ink 01 is exposed to UV light and a mask and cured locally.

[0092] S114. Referring to Figure 15(d), clean the uncured black photosensitive ink 01 and then dry it to obtain the first light-shielding part 1-2.

[0093] S115. Referring to Figure 15(e), uncured textured photosensitive ink 02 is prepared by sequentially applying coating processes such as screen printing, transfer printing, spraying, and coating on the surface of the first light-shielding part 1-2 and the encapsulation layer 2-3 on the side opposite to the circuit board 2-1.

[0094] S116, as shown in Figure 15(f), the textured photosensitive ink 02 is exposed to UV light and a mask and cured locally.

[0095] S117. Referring to Figure 15(g), clean the uncured texture photosensitive ink 02 and then dry it to obtain the first sub-texture layer 1-1 and the second sub-texture layer 1-3.

[0096] It should be noted that when there are multiple sub-texture layers in each texture section, steps S15 to S17 can be repeated.

[0097] S118. Referring to Figure 15(h), the first sub-texture layer 1-1 and the second sub-texture layer 1-3 on the side away from the circuit board 2-1 are sequentially subjected to screen printing, transfer printing, spraying, coating and other coating processes, and then cured to obtain the hardened layer 4.

[0098] Method 2: Laser etching exposure process.

[0099] The difference between the mask exposure process in this embodiment and Method 1 is that the mask exposure in Method 1 is replaced with laser exposure, followed by coating curing. The remaining steps are the same as in Method 1 and will not be described again here.

[0100] Method 3: Screen printing for partial application may include the following steps: S121, Provide LED display light panel.

[0101] The LED display board includes a circuit board, LED beads (with pins), solder resist ink, and a packaging layer.

[0102] S122. Using a partially perforated screen that matches the hole position of the light-shielding layer, black photosensitive ink is printed on the surface of the encapsulation layer away from the circuit board, and then dried and cured to obtain the first light-shielding part.

[0103] S123. Using a partially perforated screen that matches the hole position of the texture layer, print texture photosensitive ink on the surface of the first light-shielding part away from the circuit board, and then dry and cure it to obtain the first sub-texture layer and the second sub-texture layer.

[0104] S124. On the surfaces of the first and second sub-texture layers facing away from the circuit board, screen printing, transfer printing, spraying, coating and other coating processes are performed sequentially, and then dried and cured to obtain a hardened layer.

[0105] Method 4: Inkjet printing process may include the following steps: S131, Provide LED display light panel.

[0106] The LED display board includes a circuit board, LED beads (with pins), solder resist ink, and a packaging layer.

[0107] S132. Using inkjet printing technology, black photosensitive ink is locally sprayed onto the surface of the encapsulation layer away from the circuit board, and then dried and cured to obtain the first light-shielding part.

[0108] S133. Using inkjet printing technology, a photosensitive ink for printing texture is locally sprayed onto the surface of the first light-shielding part away from the circuit board, and then dried and cured to obtain the first sub-texture layer and the second sub-texture layer.

[0109] S134. On the surfaces of the first and second sub-texture layers facing away from the circuit board, screen printing, transfer printing, spraying, coating and other coating processes are performed sequentially, and then dried and cured to obtain a hardened layer.

[0110] As another example, in this embodiment, when the light-shielding layer 11 includes a first light-shielding portion 1-2 and a second light-shielding portion 1-6, Figure 12 The methods for manufacturing the LED display module shown can include the following three.

[0111] Method 1: Use mask exposure process.

[0112] As an example, a mask exposure process may include the following steps: S211. Referring to Figure 16(a), an LED display panel is provided.

[0113] The LED display board includes a circuit board 2-1, LED beads 2-2 (with pins 2-4), solder resist ink 2-5, and encapsulation layer 2-3.

[0114] S2112. Referring to Figure 16(b), uncured positive black photosensitive ink 03 is prepared on the side of the encapsulation layer 2-3 away from the circuit board 2-1 by screen printing, transfer printing, spraying, coating and other coating processes.

[0115] It should be noted that the positive black photosensitive ink 03 can be decomposed and washed away in the irradiated area.

[0116] S2113, as shown in Figure 16(c), the positive black photosensitive ink 03 is exposed and developed from the front by UV light and a partial semi-transparent mask.

[0117] It should be noted that the semi-transparent mask needs to have a certain degree of light transmittance in some areas. In this way, the semi-transparent mask will only cause a chemical reaction at a certain depth on the surface of the positive black photosensitive ink 03, and will hardly affect the deeper layers of the positive black photosensitive ink 03.

[0118] S2114. Referring to Figure 16(d), the developed positive black photosensitive ink 03 is washed away and then dried to prepare the first light-blocking part 1-2 and the second light-blocking part 1-6.

[0119] It should be noted that when the same material is used, since the thickness of the second light-shielding part 1-6 along the first direction is less than the thickness of the first light-shielding part 1-2 along the first direction, the light transmittance of the second light-shielding part 1-6 is greater than that of the first light-shielding part 1-2.

[0120] S2115. Referring to Figure 16(e), uncured textured photosensitive ink 02 is prepared by sequentially applying coating processes such as screen printing, transfer printing, spraying, and coating to the surfaces of the first light-shielding part 1-2, the second light-shielding part 1-6, and the encapsulation layer 2-3 on the side opposite to the circuit board 2-1.

[0121] S2116, as shown in Figure 16(f), is a textured photosensitive ink 02 that is exposed to UV light and a mask and then cured locally.

[0122] S2117. Referring to Figure 16(g), clean the uncured texture photosensitive ink 02 and then dry it to obtain the first sub-texture layer 1-1 and the second sub-texture layer 1-3.

[0123] It should be noted that when there are multiple sub-texture layers in each texture section, steps S2115 to S2117 can be repeated.

[0124] S2118. Referring to Figure 16(h), the first sub-texture layer 1-1 and the second sub-texture layer 1-3 on the side away from the circuit board 2-1 are sequentially subjected to screen printing, transfer printing, spraying, coating and other coating processes, and then cured to obtain the hardened layer 4.

[0125] As another example, the mask exposure process may also include the following steps: S2211, Provides LED display light panel.

[0126] The LED display board includes a circuit board, LED beads (with pins), solder resist ink, and a packaging layer.

[0127] S2212. A positive black photosensitive ink layer or a negative black photosensitive ink layer is formed on the side of the encapsulation layer away from the circuit board.

[0128] It should be noted that the negative black photosensitive ink in the negative black photosensitive ink layer can be decomposed and washed away in areas that are not exposed to light.

[0129] S2213. Expose and develop a portion of the positive black photosensitive ink layer from the front of the LED display panel using UV light and a partial semi-transparent mask, or expose and develop a portion of the negative black photosensitive ink layer from the back of the LED display panel using UV light and a partial semi-transparent mask.

[0130] It should be noted that the front of the LED display panel refers to the light-emitting surface of the LED display panel, while the back is the opposite of the front, specifically the side of the circuit board that faces away from the LED beads.

[0131] Furthermore, exposing and developing a portion of the negative black photosensitive ink layer from the back is simpler and easier to achieve than exposing and developing a portion of the negative black photosensitive ink layer from the front.

[0132] S2214. The developed positive or negative black photosensitive ink is washed away and then dried to prepare the first light-shielding part.

[0133] S2215. A second light-shielding part is formed between any two adjacent first light-shielding parts.

[0134] S2216. Uncured textured photosensitive ink is prepared by sequentially applying coating processes such as screen printing, transfer printing, spraying, and coating to the surfaces of the first light-shielding part, the second light-shielding part, and the encapsulation layer on the side away from the circuit board.

[0135] S2217. A textured photosensitive ink is exposed to UV light and a mask and then cured locally.

[0136] S2218. Clean the uncured texture photosensitive ink and then dry it to obtain the first sub-texture layer and the second sub-texture layer.

[0137] It should be noted that when there are multiple sub-texture layers in each texture section, steps S2216 to S2218 can be repeated.

[0138] S2219. On the surfaces of the first and second sub-texture layers facing away from the circuit board, screen printing, transfer printing, spraying, coating and other coating processes are performed sequentially, and then cured to obtain a hardened layer.

[0139] Method 2: Laser etching exposure process.

[0140] The laser etching exposure process in this embodiment may include the following steps: S221, Provide LED display light panel.

[0141] The LED display board includes a circuit board, LED beads (with pins), solder resist ink, and a packaging layer.

[0142] S222. Prepare a full-layer light-shielding layer and a texture layer sequentially on the side of the encapsulation layer away from the circuit board.

[0143] S223. Use laser ablation to process the light-shielding layer and texture layer to obtain light-transmitting holes.

[0144] It should be noted that when the light-shielding layer only includes a first light-shielding part and lacks a second light-shielding part, the light-transmitting hole is completely exposed. In this case, if a laser ablation process is used, the laser is difficult to control, and it cannot be guaranteed that the LED display panel will not be damaged. However, when the light-shielding layer includes a first light-shielding part but lacks a second light-shielding part, the second light-shielding part will protect the LED display panel. In this case, during the laser ablation process, the thickness of the light-shielding layer can be controlled by adjusting the laser power, preventing the LED display panel from being ablated and allowing the light-transmitting hole to be obtained.

[0145] S224. Uncured texture photosensitive ink is prepared by sequentially applying coating processes such as screen printing, transfer printing, spraying, and coating to the surfaces of the first light-shielding part, the second light-shielding part, and the encapsulation layer on the side away from the circuit board. Then, it is exposed to UV light and a mask to cure the local texture photosensitive ink. After cleaning the uncured texture photosensitive ink, it is dried to obtain the first sub-texture layer and the second sub-texture layer.

[0146] It should be noted that when there are multiple sub-texture layers in each texture section, step S224 can be repeated.

[0147] S225. On the surfaces of the first and second sub-texture layers facing away from the circuit board, screen printing, transfer printing, spraying, coating and other coating processes are performed sequentially, and then cured to obtain a hardened layer.

[0148] Method 3: For example Figure 13 and Figure 14 As shown, it has a second light-shielding part ( Figure 13 and Figure 14 The screen printing process for LED display modules (not shown) may include the following steps: S321, Provides LED display light panel.

[0149] The LED display board includes a circuit board, LED beads (with pins), solder resist ink, and a packaging layer.

[0150] S322. As shown in Figure 17(a), an optical substrate 1-4 is provided, and a negative black photosensitive ink layer 04 is formed on one side of the optical substrate 1-4 through processes such as coating and screen printing.

[0151] S323, as shown in Figure 17(b), the negative black photosensitive ink layer 04 is partially exposed and developed from the back side of the optical substrate 1-4 by UV light and a partial semi-transparent mask.

[0152] It should be noted that the back side is the side of the optical substrate 1-4 that faces away from the negative black photosensitive ink layer 04.

[0153] S324. As shown in Figure 17(c), by controlling the curing depth, the outermost layer of negative black photosensitive ink in the light-transmitting hole area is left uncured. Then, the uncured negative black photosensitive ink layer is cleaned to obtain the first light-blocking part 1-2 and the second light-blocking part 1-6, which is to obtain the light-transmitting hole.

[0154] S325, Provide adhesive backing and attach it between the optical substrate and the encapsulation layer.

[0155] S226. Uncured texture photosensitive ink is prepared by sequentially applying coating processes such as screen printing, transfer printing, spraying, and coating to the surfaces of the first light-shielding part, the second light-shielding part, and the encapsulation layer on the side away from the circuit board. Then, it is exposed to UV light and a mask to cure the local texture photosensitive ink. After cleaning the uncured texture photosensitive ink, it is dried to obtain the first sub-texture layer and the second sub-texture layer.

[0156] It should be noted that when there are multiple sub-texture layers in each texture section, step S226 can be repeated.

[0157] S227. On the surfaces of the first and second sub-texture layers facing away from the circuit board, screen printing, transfer printing, spraying, coating and other coating processes are performed sequentially, and then cured to obtain a hardened layer.

[0158] The method for preparing the LED display module provided in this application is simple and easy to implement, and is conducive to industrial production and application.

Claims

1. A textured coating, characterized in that, include: A texture layer includes multiple texture sections, with any two adjacent texture sections being independent and spaced apart; The light-shielding layer includes at least a plurality of first light-shielding portions, with any two adjacent first light-shielding portions being disposed independently and spaced apart. The texture portion is disposed on one side of the first light-shielding portion. A light-transmitting hole is provided between any two adjacent first light-shielding portions and between any two adjacent texture portions. The texture coating is used to allow light incident thereon to exit through the light-transmitting hole, but the light does not exit through the first light-shielding portion and the texture portion. The texture portion is also used to display a texture pattern when no active light is incident on it.

2. The textured coating according to claim 1, characterized in that, The arrangement of the light-transmitting holes can be any one of the following: grid arrangement, array arrangement, or surround arrangement.

3. The textured coating according to claim 2, characterized in that, When the arrangement of the light-transmitting holes is the grid arrangement, the shape of the outline of each light-transmitting hole is cubic, and the width of the light-transmitting hole along the second direction is 5μm~200μm; wherein, the second direction is perpendicular to the thickness direction of the circuit board; When the arrangement of the light-transmitting holes is the array arrangement, the shape of the outline of each light-transmitting hole is at least one of the following: circle, ellipse, rectangle or triangle; When the arrangement of the light-transmitting holes is the surrounding arrangement, the width of the light-transmitting holes along the second direction is 5μm~200μm.

4. The textured coating according to any one of claims 1 to 3, characterized in that, The thickness of the first light-shielding portion along the first direction is 10μm~30μm, the thickness of the textured portion along the first direction is 10μm~50μm, and the depth of the light-transmitting hole along the first direction is 25μm~100μm; wherein, the first direction is parallel to the thickness direction of the circuit board.

5. The textured coating according to any one of claims 1 to 3, characterized in that, The material of the first light-shielding part includes photosensitive curable ink, and the optical density value of the photosensitive curable ink is greater than or equal to 1; And / or, the thickness of the first light-shielding portion along the first direction is 5μm~20μm; wherein, the first direction is parallel to the thickness direction of the circuit board.

6. The textured coating according to any one of claims 1 to 3, characterized in that, The area of ​​the light-transmitting hole is set as a percentage of the area of ​​the light-emitting surface of the textured coating, and the light emission efficiency of the textured coating is set as the value A.

7. The textured coating according to any one of claims 1 to 3, characterized in that, The light-shielding layer further includes at least one second light-shielding part, and each second light-shielding part is disposed within one of the light-transmitting holes; The optical density value of the second light-shielding part is greater than 0 and less than 0.5; And / or, the light transmittance of the second light-shielding portion is greater than or equal to 10% and less than 100%; And / or, the area of ​​the light-transmitting hole is set to a value A, which is the proportion of the area of ​​the light-emitting surface of the textured coating; the light transmittance of the second light-shielding part is set to a value B; and the light emission efficiency of the textured coating is set to a value A × a value B.

8. An LED display module, characterized in that, include: LED display panel; According to any one of claims 1 to 7, the first light-shielding part is disposed on the light-emitting side of the LED display panel, and the texture part is disposed on the side of the first light-shielding part away from the LED display panel. The light emitted by the LED display panel enters the texture coating and is used to exit from the light-transmitting hole, but the light does not pass through the first light-shielding part and the texture part. The texture part is also used to display a texture pattern when the LED display module is in a screen-off state.

9. The LED display module according to claim 8, characterized in that, The LED display panel includes: a circuit board, at least one LED bead, and an encapsulation layer. The circuit board has a front side, the LED bead is disposed on the front side, any two adjacent LED beads are separated and spaced apart, and the encapsulation layer covers the LED bead and the front side. The textured coating is disposed on the side of the encapsulation layer opposite to the circuit board.

10. The LED display module according to claim 9, characterized in that, The LED display module further includes an optical substrate and an adhesive layer. The optical substrate is disposed between the texture coating and the adhesive layer, and the adhesive layer is disposed between the optical substrate and the encapsulation layer and is used to bond the optical substrate and the encapsulation layer.

11. The LED display module according to claim 9, characterized in that, The LED display module further includes an optical substrate disposed between the texture coating and the encapsulation layer, wherein the encapsulation layer also serves as an adhesive layer and is used to bond with the optical substrate.

12. An LED display screen, characterized in that, Includes the LED display module as described in any one of claims 8 to 11.

13. A method for manufacturing an LED display module, characterized in that, Includes the following steps: Provide LED display panels; A textured coating is formed on the light-emitting side of the LED display panel; wherein the textured coating includes at least a first light-shielding part and a textured part, the textured part being disposed on the side of the first light-shielding part away from the LED display panel, light emitted from the LED display panel enters the textured coating and is used to exit from the light-transmitting hole, but the light does not exit through the first light-shielding part and the textured part; the textured part is also used to display a textured pattern when the LED display module is in a screen-off state.

14. The method for preparing an LED display module according to claim 13, characterized in that, The LED display panel includes at least a circuit board, a plurality of LED beads, and an encapsulation layer. The plurality of LED beads are disposed on one side of the circuit board, and the encapsulation layer covers the LED beads and the circuit board. The light-shielding layer includes only a first light-shielding portion. The preparation method includes: On the side of the encapsulation layer facing away from the circuit board, an uncured black photosensitive ink is formed through screen printing, transfer, spraying, and coating processes. This ink is then exposed to ultraviolet light and a mask, or to ultraviolet light and a laser, to cure the localized black photosensitive ink. The uncured black photosensitive ink is then cleaned and dried to form the first light-shielding area. Next, on the first light-shielding area and the surface of the encapsulation layer facing away from the circuit board, an uncured texture photosensitive ink is formed through screen printing, transfer, spraying, and coating processes. This ink is then exposed to ultraviolet light and a mask, to cure the localized texture photosensitive ink. The uncured texture photosensitive ink is then cleaned and dried to form the textured area. Finally, on the surface of the textured area facing away from the circuit board, a screen printing, transfer, spraying, and coating process is performed, followed by drying to form a hardened layer, thus forming the LED display module. Alternatively, the black photosensitive ink is printed on the surface of the encapsulation layer opposite to the circuit board using a partially perforated screen matching the aperture positions of the light-shielding layer, and then dried to form the first light-shielding portion; then, texture photosensitive ink is printed on the surface of the first light-shielding portion opposite to the circuit board using a partially perforated screen matching the aperture positions of the texture layer, and then dried to form the texture portion; finally, the entire surface of the texture portion opposite to the circuit board is subjected to screen printing, transfer, spraying, and coating processes, and then dried and cured to form a hardened layer, thus forming the LED display module; Alternatively, the black photosensitive ink is locally sprayed onto the surface of the encapsulation layer opposite to the circuit board using inkjet printing and dried to form the first light-shielding part; then, the texture photosensitive ink is locally sprayed onto the surface of the first light-shielding part opposite to the circuit board using inkjet printing and dried to form the texture part; the entire surface of the texture part opposite to the circuit board is then subjected to screen printing, transfer printing, spraying and coating processes and dried and cured to form a hardened layer, thus forming the LED display module.

15. The method for preparing an LED display module according to claim 14, characterized in that, The light-shielding layer also includes a second light-shielding portion; The preparation method includes: A positive black photosensitive ink layer or a negative black photosensitive ink layer is formed on the surface of the encapsulation layer opposite to the circuit board. The positive black photosensitive ink layer is exposed and developed from the front using ultraviolet light and a partial semi-transparent mask, or the negative black photosensitive ink layer is exposed and developed from the back using ultraviolet light and a partial semi-transparent mask. The developed positive or negative black photosensitive ink is cleaned and dried to form the first light-shielding portion. A second light-shielding portion is formed between any two adjacent first light-shielding portions. The light-emitting part; uncured textured photosensitive ink is formed on the surface of the first light-shielding part, the second light-shielding part, and the encapsulation layer away from the circuit board through screen printing, transfer, spraying, and coating processes; after exposure to ultraviolet light and the partial semi-transparent mask, and curing of the local textured photosensitive ink, the uncured textured photosensitive ink is cleaned and dried to form the textured part; the surface of the textured part away from the circuit board is subjected to screen printing, transfer, spraying, and coating processes and dried and cured to form a hardened layer, thus forming the LED display module; Alternatively, a full-layer light-shielding layer and a texture layer are sequentially prepared on the side of the encapsulation layer opposite to the circuit board. Then, the light-shielding layer and the texture layer are processed using a laser ablation process to form a light-transmitting hole. An uncured texture photosensitive ink is formed through screen printing, transfer, spraying, and coating processes. This ink is then exposed to ultraviolet light and a partial semi-transparent mask, and the local texture photosensitive ink is dried. The uncured texture photosensitive ink is then cleaned and dried to form a textured area. The surface of the textured area opposite to the circuit board is then subjected to screen printing, transfer, spraying, and coating processes and dried and cured to form a hardened layer, thus forming the LED display module. Alternatively, an optical substrate is provided, and a negative black photosensitive ink layer is formed on one side of the optical substrate through coating and screen printing processes. The negative black photosensitive ink layer is exposed and developed locally from the back of the optical substrate through the ultraviolet light and the local semi-transparent mask. By controlling the curing depth, the outermost layer of the negative black photosensitive ink layer in the light-transmitting hole area is left uncured. The uncured negative black photosensitive ink layer is then cleaned to form a light-transmitting hole. An adhesive layer is used to bond the optical substrate to the encapsulation layer. Then, the area is exposed through the ultraviolet light and the local semi-transparent mask, and the local texture photosensitive ink is dried. The uncured texture photosensitive ink is then cleaned and dried to form a textured area. The surface of the textured area facing away from the circuit board is screen printed, transferred, sprayed, and coated, and then dried and cured to form a hardened layer, thus forming the LED display module.

Images