Flexible building integrated photovoltaic structure and self-monitoring application system

Abstract

The invention relates to the field of flexible photovoltaic technology, and discloses a flexible building integrated photovoltaic structure and a self-monitoring application system, the flexible building integrated photovoltaic structure comprises a flexible CIGS thin film assembly, the bottom of the flexible CIGS thin film assembly is bonded with a square-shaped adhesive tape, and the middle part of the bottom of the flexible CIGS thin film assembly is fixedly bonded with an X-shaped reinforcing adhesive tape. According to the invention, real-time monitoring of the operation state and bonding reliability of the assembly is realized, so that the photovoltaic assembly is lighter and more suitable for an existing structure with low bearing capacity, the strain and bonding state of the mounting adhesive layer can be monitored in real time, and an alarm can be given in time for abnormal conditions; the photovoltaic module effectively improves the use safety and reliability after installation, is suitable for infrastructures such as urban traffic sound insulation screens and highway guardrails, and not only can provide clean energy, but also does not damage the original structural beauty and functions.

Description

Technical Field

[0001] This invention relates to the field of flexible photovoltaic technology, and in particular to a flexible photovoltaic building integrated structure and self-monitoring application system. Background Technology

[0002] Photovoltaic power generation is a technology that directly converts solar energy into electrical energy through the photovoltaic effect of semiconductor materials. The core device is the solar cell. When light shines on a solar cell and is absorbed at the interface layer, photons with sufficient energy can excite electrons from covalent bonds in P-type and N-type silicon, creating electron-hole pairs. Before recombination, the electrons and holes near the interface layer are separated by the electric field of the space charge. Electrons move towards the positively charged N-region and holes move towards the negatively charged P-region. This charge separation at the interface layer generates a measurable outward voltage between the P- and N-regions. Electrons can then be added to both sides of the silicon wafer and a voltmeter connected. For crystalline silicon solar cells, the typical open-circuit voltage is 0.5–0.6V. The more electron-hole pairs generated at the interface layer, the greater the current. The more light energy absorbed by the interface layer, and the larger the interface layer (i.e., the cell area), the greater the current generated in the solar cell.

[0003] Existing traditional crystalline silicon modules are often bulky and require metal supports, resulting in a large load per unit area of ​​the entire photovoltaic (PV) structure. This makes them unsuitable for existing structures with low load-bearing capacity, thus reducing the applicability of PV structures. Therefore, some PV modules use flexible photovoltaic materials as the substrate to reduce the load on the modules. However, existing flexible PV modules still rely on metal supports, joists, and drilling for installation, resulting in a relatively heavy load. Furthermore, the lack of a structure for real-time monitoring of the fixed status of flexible PV modules leads to poor safety and reliability after installation. Summary of the Invention

[0004] To address the technical problems existing in the prior art, this invention provides a flexible photovoltaic building integrated structure and a self-monitoring application system.

[0005] The present invention is achieved by the following technical solution: a flexible building-integrated photovoltaic structure, including a flexible CIGS thin film module, wherein a square-shaped adhesive strip is bonded to the bottom of the flexible CIGS thin film module, and an X-shaped reinforcing adhesive strip is fixedly bonded to the middle part of the bottom of the flexible CIGS thin film module.

[0006] The flexible CIGS thin-film module includes a back sheet, a first adhesive film is bonded to the top of the back sheet, a flexible CIGS thin-film photovoltaic cell is bonded to the top of the first adhesive film, a second adhesive film is bonded to the top of the flexible CIGS thin-film photovoltaic cell, a front cover film is bonded to the top of the second adhesive film, a junction box is fixedly installed on the flexible CIGS thin-film photovoltaic cell, a lead wire is fixedly connected to the junction box, and the junction box is sleeved with the second adhesive film and the front cover film. The junction box passes through the second adhesive film and the front cover film and extends out from the top of the front cover film.

[0007] It also includes a testing system for testing flexible CIGS thin film modules;

[0008] The detection system includes a central control chip, a flexible photovoltaic power supply module, a remote communication module, a remote operation and maintenance terminal, an alarm module, a strain sensor module, and a debonding detection sensor.

[0009] As a further improvement to the above solution, the bottom of the back panel is coated with a waterproof coating, which is distributed in a square shape and located around the square-shaped adhesive strip.

[0010] As a further improvement to the above solution, the outer ring of the flexible CIGS film module is fixedly bonded with multiple sealing and protective strips, and the multiple sealing and protective strips are connected end to end to form a rectangular frame structure.

[0011] As a further improvement to the above solution, the flexible photovoltaic power supply module is located between the central control chip and the flexible CIGS thin-film photovoltaic cell. The central control chip is connected to the remote communication module, alarm module, strain sensor module and debonding detection sensor. The remote operation and maintenance terminal is connected to the remote communication module through electrical signals.

[0012] As a further improvement to the above solution, the strain sensor module includes multiple U-shaped adhesive strip monitoring sensors and a central area monitoring sensor disposed at the bottom of the back plate. The multiple U-shaped adhesive strip monitoring sensors are connected in series, and the multiple U-shaped adhesive strip monitoring sensors and the central area monitoring sensor are evenly distributed in the inner circle of the U-shaped adhesive strip. The central area monitoring sensor is arrayed along the axis of the X-shaped reinforcing adhesive strip.

[0013] As a further improvement to the above solution, the debonding detection sensor includes multiple scanning emission sensors and signal receiving sensors that are uniformly fixed to the bottom of the back plate. The multiple scanning emission sensors are evenly distributed on the outer ring of the U-shaped adhesive strip, and the multiple signal receiving sensors are located on the inner ring of the U-shaped adhesive strip. The output port of the scanning emission sensor is connected to the input port of the signal receiving sensor.

[0014] As a further improvement to the above solution, the alarm module includes a light alarm module and a sound alarm module, and the light alarm module and the sound alarm module are connected to the central control chip.

[0015] As a further improvement to the above solution, the central control chip is located at the bottom of the back panel, the remote communication module is fixedly connected to the central control chip, and the remote communication module extends upward to the top of the windshield film.

[0016] As a further improvement to the above solution, the alarm module extends upward to the top of the windshield film, and the alarm module is powered by a flexible photovoltaic power supply module.

[0017] As a further improvement to the above solution, both the strain sensor module and the debonding detection sensor are powered by a flexible photovoltaic power supply module.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] 1. This invention utilizes a designed U-shaped adhesive strip and an X-shaped reinforcing adhesive strip. The flexible CIGS film module possesses bendable characteristics, allowing it to be directly bonded to curved building surfaces or domes with a certain curvature, achieving basic integration. Furthermore, by employing a structural bonding scheme combining the U-shaped and X-shaped adhesive strips, the U-shaped strip transfers the majority of the adhesive from the inefficient central area to the most efficient high-stress edge area. The continuous closed-loop adhesive line forms a reinforcing frame at the edge, providing a larger bonding area and structural stiffness to withstand and disperse peak edge stress, significantly increasing the crack initiation threshold. The continuous frame creates a superior force flow path. External forces are transmitted through the module to this rigid frame, and then more evenly and smoothly across the entire perimeter of the frame to the building substrate. This avoids drastic stress fluctuations, optimizing load transfer from surface to more efficient line and frame transfer, thus achieving higher connection stiffness and strength. The X-shaped reinforcing strip in the middle prevents the module from bulging outward under wind suction, evenly transferring wind load, snow load, and other external forces to the building substrate, making the photovoltaic module an integral part of the building envelope system, sharing the load. This eliminates the need for traditional metal brackets, keels, and drilling for fixing, avoiding damage to the waterproof layer and the integrity of the original structure. In addition, large-area photovoltaic modules can be modularly segmented according to the building size. After installation, the joints are aligned with the original facade joints, roof joints, or decorative lines of the building. Customized edge strips are then used to cover the edges and joints of the modules, enabling safe installation of flexible photovoltaic modules without brackets. This effectively improves the convenience of installing flexible CIGS thin-film modules and significantly reduces the load after installation, making photovoltaic modules lighter and more suitable for existing structures with low load-bearing capacity.

[0020] 2. This invention, through its designed self-monitoring application system, utilizes the sampling function of strain sensors to capture the vibration acceleration signal of the structure, achieving real-time monitoring of the peak vibration acceleration. When the vibration amplitude exceeds the safety threshold set according to the structural safety factor, an alarm module is immediately triggered. The central control chip periodically or upon instruction drives the scanning transmission sensor in a pair of debonding detection sensors to emit scanning signals of a specific frequency. The signal receiving sensor receives the signal penetrating the adhesive layer. Once local debonding occurs, air gaps appear at the interface, and acoustic impedance mismatch occurs, leading to severe signal energy attenuation. When the amplitude of the received signal is lower than 70% of the average value of the channel during the previous 30 days of normal operation... When the signal reception time is significantly longer than that of the channel during normal operation, it indicates the presence of air in the wave propagation path, i.e., debonding has occurred. Debonding leads to energy attenuation or the addition of new resonance peaks in specific frequency components. This change in frequency response can serve as an auxiliary basis for judging debonding. Furthermore, by comparing the strain data of strain sensors, it can be determined whether local peeling has occurred. Under the same load, the strain distribution of a healthy interface should exhibit a certain regularity. If the strain value of a certain area is significantly lower than that of the surrounding area, it indicates that debonding may have occurred in that area, and stress cannot be effectively transmitted. At the same time, when the temperature or wind load changes, the strain response of the debonded area will be significantly slower than that of the normally bonded area. By performing real-time multi-level monitoring of the installation site of the flexible CIGS thin film module, the installation status of the flexible CIGS thin film module can be monitored in real time. This allows for real-time monitoring of the strain and bonding status of the installation adhesive layer and timely alarms for abnormal situations, effectively improving the safety and reliability of photovoltaic modules after installation. Attached Figure Description

[0021] Figure 1 This is a structural schematic diagram of a flexible photovoltaic building integrated structure provided by the present invention;

[0022] Figure 2 This is a bottom schematic diagram of a flexible photovoltaic building integrated structure provided by the present invention;

[0023] Figure 3 A bottom view of a flexible photovoltaic building integrated structure provided by the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the flexible CIGS thin film module provided by the present invention;

[0025] Figure 5 Provided by the present invention Figure 3 A partially enlarged structural diagram;

[0026] Figure 6 This is a schematic diagram of the detection system provided by the present invention;

[0027] Figure 7 This is a schematic diagram of the detection system provided by the present invention.

[0028] Explanation of key symbols:

[0029] 1. Flexible CIGS thin-film module; 11. Backsheet; 12. First adhesive film; 13. Flexible CIGS thin-film photovoltaic cell; 14. Second adhesive film; 15. Front cover film; 16. Junction box; 17. Lead wire; 18. Waterproof coating; 19. Sealing and protective tape; 20. Central control chip; 21. Flexible photovoltaic power supply module; 22. Remote communication module; 24. Alarm module; 25. Strain sensor module; 251. U-shaped adhesive strip monitoring sensor; 252. Central area monitoring sensor; 26. Debonding detection sensor; 261. Scanning emission sensor; 262. Signal receiving sensor. Detailed Implementation

[0030] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0031] Example 1:

[0032] Please combine Figures 1-7 The flexible building-integrated photovoltaic structure of this embodiment includes a flexible CIGS thin film module 1, a square-shaped adhesive strip 2 is bonded to the bottom of the flexible CIGS thin film module 1, and an X-shaped reinforcing adhesive strip 3 is fixedly bonded to the middle part of the bottom of the flexible CIGS thin film module 1.

[0033] The flexible CIGS thin-film module 1 includes a backplate 11, a first adhesive film 12 is bonded to the top of the backplate 11, a flexible CIGS thin-film photovoltaic cell 13 is bonded to the top of the first adhesive film 12, a second adhesive film 14 is bonded to the top of the flexible CIGS thin-film photovoltaic cell 13, a front cover film 15 is bonded to the top of the second adhesive film 14, a junction box 16 is fixedly installed on the flexible CIGS thin-film photovoltaic cell 13, a lead wire 17 is fixedly connected to the junction box 16, and the junction box 16 is sleeved with the second adhesive film 14 and the front cover film 15. The junction box 16 passes through the second adhesive film 14 and the front cover film 15 and extends out from the top of the front cover film 15.

[0034] The flexible CIGS thin-film module 1, with its bendable properties, can be directly bonded to curved building surfaces or domes with a certain curvature, achieving basic integration. A structural bonding scheme combining a U-shaped adhesive strip 2 and an X-shaped reinforcing adhesive strip 3 is then used. Common adhesives used for photovoltaic module bonding include epoxy resin and silicone structural adhesive. Epoxy resin exhibits excellent weather resistance and maintains stable performance even in harsh environments. Silicone structural adhesive has a significant advantage in weather resistance, but its bonding strength is relatively low, requiring mixing with other adhesives to improve performance. To enhance the bonding strength and weather resistance of silicone adhesives, novel modified silicone materials, such as nano-modified silicone and organic-inorganic hybrid silicone, are used as adhesives for the U-shaped adhesive strip 2 and the X-shaped reinforcing adhesive strip 3, significantly improving bonding stability. The U-shaped adhesive strip 2 transfers most of the adhesive from the inefficient central area to the most efficient, high-stress edge area. A continuous, closed-loop adhesive line forms a reinforcing frame at the edge. This frame, with its larger bonding area and structural stiffness, withstands and disperses peak stresses at the edge, significantly increasing the crack initiation threshold. The continuous frame creates a superior force flow path. External forces are transmitted through the component to this rigid frame, and then more evenly and smoothly across the entire perimeter of the frame to the building substrate. This avoids drastic stress fluctuations, optimizing load transfer from surface to more efficient line and frame transfer, thereby achieving higher connection stiffness and strength. The X-shaped reinforcing strip 3 in the middle is to prevent the middle of the module from bulging outward under wind suction, and to evenly transfer external forces such as wind load and snow load to the building base, making the photovoltaic module an integral part of the building envelope system and sharing the load. This eliminates the traditional fixing methods of metal brackets, keels and drilling, avoiding damage to the waterproof layer and the integrity of the original structure. In addition, large-area photovoltaic modules can be modularly divided according to the building size. The joints after installation are aligned with the original facade joints, roof joints or decorative lines of the building. Then, customized edge strips are used to cover the edges of the modules, glue joints and other parts, enabling the safe installation of flexible photovoltaic modules without brackets. This effectively improves the convenience of installing flexible CIGS thin film modules 1 and can significantly reduce the load after installation of flexible CIGS thin film modules 1, making photovoltaic modules lighter and more suitable for existing structures with low load-bearing capacity.

[0035] The bottom of the back panel 11 is coated with a waterproof coating 18, which is distributed in a square shape and is located around the square-shaped adhesive strip 2.

[0036] The waterproof coating 18 can provide a waterproof seal at the installation connection between the flexible CIGS film assembly 1 and the building, preventing long-term rainwater erosion from causing a decrease in bonding strength. Compared with ordinary adhesive, this solution significantly improves bonding reliability and durability.

[0037] The outer ring of the flexible CIGS film module 1 is fixedly bonded with multiple sealing and protective strips 19, which are connected end to end to form a rectangular frame structure.

[0038] The sealing and protective strip 19 can seal and protect the edges of the flexible CIGS film module 1, thereby improving the structural strength and service life of the flexible CIGS film module 1.

[0039] Example 2:

[0040] A self-monitoring application system for a flexible building-integrated photovoltaic (BIPV) structure includes a central control chip 20, a flexible photovoltaic power supply module 21, a remote communication module 22, a remote operation and maintenance terminal, an alarm module 24, a strain sensor module 25, and a debonding detection sensor 26. The flexible photovoltaic power supply module 21 is disposed between the central control chip 20 and the flexible CIGS thin-film photovoltaic cell 13. The central control chip 20 is connected to the remote communication module 22, the alarm module 24, the strain sensor module 25, and the debonding detection sensor 26. The remote operation and maintenance terminal is connected to the remote communication module 22 via an electrical signal.

[0041] In use, the sampling function of the strain sensor module 25 can capture the vibration acceleration signal of the structure, achieving real-time monitoring of the peak value of vibration acceleration. When the vibration amplitude exceeds the safety threshold set according to the structural safety factor, the alarm module 24 is immediately triggered to sound an alarm. The central control chip 20 periodically or on command drives the scanning emission sensor 261 of a pair of debonding detection sensors 26 to emit scanning signals of a specific frequency. The signal receiving sensor 262 receives the signal passing through the adhesive layer. Once local peeling occurs, air gaps will appear at the interface, and acoustic impedance mismatch will cause severe signal energy attenuation. When the amplitude of the received signal is lower than 70% of the average value of the channel in the 30 days before normal operation, the signal will be attenuated. When the signal reception time is significantly longer than that of the channel during normal operation, it indicates the presence of air in the wave propagation path, i.e., debonding has occurred. Debonding leads to energy attenuation or the addition of new resonance peaks in specific frequency components. This change in frequency response can serve as an auxiliary basis for judging debonding. Furthermore, by comparing the strain data of the strain sensor, it can be determined whether local peeling has occurred. Under the same load, the strain distribution of a healthy interface should exhibit a certain regularity. If the strain value of a certain area is significantly lower than that of the surrounding area, it indicates that debonding may have occurred in that area, and stress cannot be effectively transmitted. At the same time, when the temperature or wind load changes, the strain response of the debonded area will be significantly slower than that of the normally bonded area. By performing real-time multi-level monitoring on the installation site of the flexible CIGS thin film module 1, the installation status of the flexible CIGS thin film module 1 can be monitored in real time. This allows for real-time monitoring of the strain and bonding status of the installation adhesive layer and timely alarms for abnormal situations, effectively improving the safety and reliability of photovoltaic modules after installation.

[0042] The strain sensor module 25 includes multiple U-shaped adhesive strip monitoring sensors 251 and a central area monitoring sensor 252 disposed at the bottom of the back plate 11. The multiple U-shaped adhesive strip monitoring sensors 251 are connected in series. The multiple U-shaped adhesive strip monitoring sensors 251 and the central area monitoring sensor 252 are evenly distributed in the inner circle of the U-shaped adhesive strip 2. The central area monitoring sensor 252 is arrayed along the axis of the X-shaped reinforcing adhesive strip 3.

[0043] The U-shaped adhesive strip monitoring sensors 251 need to be arranged in series along the inner circle of the adhesive line around the U-shaped adhesive strip 2 at intervals of 20-30cm. Since the edge area of ​​the U-shaped adhesive strip 2 is the part with the most concentrated stress, it is most likely to be the first to suffer fatigue damage or cracks. The dense arrangement of U-shaped adhesive strip monitoring sensors 251 in this area can obtain the most critical strain data. At the same time, it is also necessary to embed a central area monitoring sensor 252 near the central reinforcing X-shaped adhesive strip 3. The reason is that the stress in the central area is smaller. The purpose of arranging the central area monitoring sensor 252 is to monitor the overall deformation consistency of the component and compare and verify it with the edge data to help determine the load type.

[0044] By utilizing the sampling function of the strain sensor module 25, the vibration acceleration signal of the structure can be captured, achieving the effect of real-time monitoring of the peak value of vibration acceleration. When the vibration amplitude exceeds the safety threshold set according to the structural safety factor, an alarm is immediately triggered. This threshold is set through experimental analysis. Furthermore, by analyzing the vibration acceleration signal, it can be determined that the main frequency of structural vibration is usually low during normal operation. If abnormal high-frequency components appear in the spectrum or the main frequency shifts significantly, it can be judged as abnormal vibration.

[0045] The debonding detection sensor 26 includes multiple scanning emission sensors 261 and signal receiving sensors 262 that are uniformly fixed to the bottom of the back plate 11. The multiple scanning emission sensors 261 are uniformly distributed on the outer ring of the U-shaped adhesive strip 2, and the multiple signal receiving sensors 262 are located on the inner ring of the U-shaped adhesive strip 2. The output port of the scanning emission sensor 261 is connected to the input port of the signal receiving sensor 262.

[0046] The central control chip 20 periodically or on command drives the scanning emission sensor 261 of a pair of debonding detection sensors 26 to emit scanning signals at a specific frequency, and the signal receiving sensor 262 receives the signal passing through the adhesive layer. Once local peeling occurs, air gaps will appear at the interface, and acoustic impedance mismatch will occur, resulting in severe signal energy attenuation. When the amplitude of the received signal is lower than 70% of the average value of the channel in the 30 days before normal operation, the signal energy will be significantly reduced. When the signal reception time is significantly longer than that of the channel during normal operation, it indicates that air has appeared in the wave propagation path, i.e., debonding has occurred. Debonding will cause energy attenuation or new resonance peaks of specific frequency components. This change in frequency response can be used as an auxiliary basis for judging debonding. It can also be determined whether local peeling has occurred by comparing the strain data of the strain sensor. Under the same load, the strain distribution of the healthy interface should show a certain regularity. If the strain value of a certain area is significantly lower than that of the surrounding area, it indicates that debonding may have occurred in that area, and stress cannot be effectively transmitted. At the same time, when the temperature or wind load changes, the strain response of the debonded area will be significantly slower than that of the normally bonded area. By performing real-time multi-level monitoring on the installation part of the flexible CIGS thin film module 1, the installation status of the flexible CIGS thin film module 1 can be monitored in real time. This allows for real-time monitoring of the strain and bonding status of the installation adhesive layer and timely alarm for abnormal situations, effectively improving the safety and reliability of photovoltaic modules after installation.

[0047] Alarm module 24 includes a light alarm module and a sound alarm module, which are connected to the central control chip 20.

[0048] The light alarm module can emit a bright light to sound an alarm, and the sound alarm module can emit a sound to sound an alarm. The combination of sound and light can improve the alarm effect.

[0049] The central control chip 20 is located at the bottom of the back panel 11, and the remote communication module 22 is fixedly connected to the central control chip 20. The remote communication module 22 extends upward to the top of the front windshield 15.

[0050] The top of the remote communication module 22 is located above the front baffle 15, which ensures that the signal can be effectively sent out and avoids the flexible CIGS film assembly 1 from blocking or shielding the signal of the remote communication module 22, thereby improving the smoothness of remote monitoring of the flexible CIGS film assembly 1.

[0051] The alarm module 24 extends upward to the top of the front windshield film 15, and the alarm module 24 is powered by the flexible photovoltaic power supply module 21;

[0052] By exposing the alarm module 24 to the outside of the photovoltaic module, it is easy to observe and thus the alarm information of the alarm module 24 can be observed in a timely manner. The alarm module 24 is connected to the remote communication module 22, which can transmit the alarm signal to the remote operation and maintenance terminal 23 in a timely manner, so that the operation and maintenance personnel can receive the alarm information remotely and carry out maintenance in a timely manner, effectively improving the reliability of the flexible CIGS thin film module 1.

[0053] Both the strain sensor module 25 and the debonding detection sensor 26 are powered by the flexible photovoltaic power supply module 21;

[0054] By powering the strain sensor module 25 and the debonding detection sensor 26 through the flexible photovoltaic power supply module 21, the photovoltaic power generation module can be self-powered without the need for an external power source, ensuring smooth operation of the photovoltaic module and reducing usage costs.

[0055] The flexible CIGS thin-film module 1, with its bendable properties, can be directly bonded to curved building surfaces or domes with a certain curvature, achieving basic integration. A structural bonding scheme combining a U-shaped adhesive strip 2 and an X-shaped reinforcing adhesive strip 3 is then used. Common adhesives used for photovoltaic module bonding include epoxy resin and silicone structural adhesive. Epoxy resin exhibits excellent weather resistance and maintains stable performance even in harsh environments. Silicone structural adhesive has a significant advantage in weather resistance, but its bonding strength is relatively low, requiring mixing with other adhesives to improve performance. To enhance the bonding strength and weather resistance of silicone adhesives, novel modified silicone materials, such as nano-modified silicone and organic-inorganic hybrid silicone, are used as adhesives for the U-shaped adhesive strip 2 and the X-shaped reinforcing adhesive strip 3, significantly improving bonding stability. The U-shaped adhesive strip 2 transfers most of the adhesive from the inefficient central area to the most efficient, high-stress edge area. A continuous, closed-loop adhesive line forms a reinforcing frame at the edge. This frame, with its larger bonding area and structural stiffness, withstands and disperses peak stresses at the edge, significantly increasing the crack initiation threshold. The continuous frame creates a superior force flow path. External forces are transmitted through the component to this rigid frame, and then more evenly and smoothly across the entire perimeter of the frame to the building substrate. This avoids drastic stress fluctuations, optimizing load transfer from surface to more efficient line and frame transfer, thereby achieving higher connection stiffness and strength. The X-shaped reinforcing strip 3 in the middle is to prevent the middle of the module from bulging outward under wind suction, and to evenly transfer external forces such as wind load and snow load to the building base, making the photovoltaic module an integral part of the building envelope system and sharing the load. This eliminates the traditional fixing methods of metal brackets, keels and drilling, avoiding damage to the waterproof layer and the integrity of the original structure. In addition, large-area photovoltaic modules can be modularly divided according to the building size. The joints after installation are aligned with the original facade joints, roof joints or decorative lines of the building. Then, customized edge strips are used to cover the edges of the modules, glue joints and other parts, enabling the safe installation of flexible photovoltaic modules without brackets. This effectively improves the convenience of installing flexible CIGS thin film modules 1 and can significantly reduce the load after installation of flexible CIGS thin film modules 1, making photovoltaic modules lighter and more suitable for existing structures with low load-bearing capacity.

[0056] In use, the sampling function of the strain sensor module 25 can capture the vibration acceleration signal of the structure, achieving real-time monitoring of the peak value of vibration acceleration. When the vibration amplitude exceeds the safety threshold set according to the structural safety factor, the alarm module 24 is immediately triggered to sound an alarm. The central control chip 20 periodically or on command drives the scanning emission sensor 261 of a pair of debonding detection sensors 26 to emit scanning signals of a specific frequency. The signal receiving sensor 262 receives the signal passing through the adhesive layer. Once local peeling occurs, air gaps will appear at the interface, and acoustic impedance mismatch will cause severe signal energy attenuation. When the amplitude of the received signal is lower than 70% of the average value of the channel in the 30 days before normal operation, the signal will be attenuated. When the signal reception time is significantly longer than that of the channel during normal operation, it indicates the presence of air in the wave propagation path, i.e., debonding has occurred. Debonding leads to energy attenuation or the addition of new resonance peaks in specific frequency components. This change in frequency response can serve as an auxiliary basis for judging debonding. Furthermore, by comparing the strain data of the strain sensor, it can be determined whether local peeling has occurred. Under the same load, the strain distribution of a healthy interface should exhibit a certain regularity. If the strain value of a certain area is significantly lower than that of the surrounding area, it indicates that debonding may have occurred in that area, and stress cannot be effectively transmitted. At the same time, when the temperature or wind load changes, the strain response of the debonded area will be significantly slower than that of the normally bonded area. By performing real-time multi-level monitoring on the installation site of the flexible CIGS thin film module 1, the installation status of the flexible CIGS thin film module 1 can be monitored in real time. This allows for real-time monitoring of the strain and bonding status of the installation adhesive layer and timely alarms for abnormal situations, effectively improving the safety and reliability of photovoltaic modules after installation.

[0057] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A flexible building-integrated photovoltaic structure, characterized in that, The flexible CIGS film assembly (1) is provided with a square-shaped adhesive strip (2) bonded to the bottom of the flexible CIGS film assembly (1) and an X-shaped reinforcing adhesive strip (3) fixedly bonded to the middle part of the bottom of the flexible CIGS film assembly (1). The flexible CIGS thin film module (1) includes a back plate (11), a first adhesive film (12) is bonded to the top of the back plate (11), a flexible CIGS thin film photovoltaic cell (13) is bonded to the top of the first adhesive film (12), a second adhesive film (14) is bonded to the top of the flexible CIGS thin film photovoltaic cell (13), a front cover film (15) is bonded to the top of the second adhesive film (14), a junction box (16) is fixedly installed on the flexible CIGS thin film photovoltaic cell (13), a lead wire (17) is fixedly connected to the junction box (16), and the junction box (16) is sleeved with the second adhesive film (14) and the front cover film (15). The junction box (16) passes through the second adhesive film (14) and the front cover film (15) and extends out from the top of the front cover film (15). It also includes a testing system for testing flexible CIGS thin film modules (1); The detection system includes a central control chip (20), a flexible photovoltaic power supply module, a remote communication module (22), a remote operation and maintenance terminal, an alarm module (24), a strain sensor module (25), and a debonding detection sensor (26).

2. The flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The bottom of the back panel (11) is coated with a waterproof coating (18), which is distributed in a square shape and is located around the square-shaped adhesive strip (2).

3. The flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The outer ring of the flexible CIGS film assembly (1) is fixedly bonded with multiple sealing and protective strips (19), and the multiple sealing and protective strips (19) are connected end to end to form a rectangular frame structure.

4. The flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The flexible photovoltaic power supply module (21) is located between the central control chip (20) and the flexible CIGS thin-film photovoltaic cell (13). The central control chip (20) is connected to the remote communication module (22), the alarm module (24), the strain sensor module (25) and the debonding detection sensor (26). The remote operation and maintenance terminal is connected to the remote communication module (22) via electrical signals.

5. A flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The strain sensor module (25) includes multiple U-shaped adhesive strip monitoring sensors (251) and central area monitoring sensors (252) disposed at the bottom of the back plate (11). The multiple U-shaped adhesive strip monitoring sensors (251) are connected in series. The multiple U-shaped adhesive strip monitoring sensors (251) and central area monitoring sensors (252) are evenly distributed in the inner circle of the U-shaped adhesive strip (2). The central area monitoring sensors (252) are arrayed along the axis of the X-shaped reinforcing adhesive strip (3).

6. The flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The debonding detection sensor (26) includes multiple scanning emission sensors (261) and signal receiving sensors (262) that are uniformly fixed to the bottom of the back plate (11). The multiple scanning emission sensors (261) are evenly distributed on the outer ring of the U-shaped adhesive strip (2), and the multiple signal receiving sensors (262) are located on the inner ring of the U-shaped adhesive strip (2). The output port of the scanning emission sensor (261) is connected to the input port of the signal receiving sensor (262).

7. A flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The alarm module (24) includes a light alarm module and a sound alarm module, and the light alarm module and the sound alarm module are connected to the central control chip (20).

8. A flexible building-integrated photovoltaic structure as described in claim 1, characterized in that, The central control chip (20) is located at the bottom of the back panel (11), and the remote communication module (22) is fixedly connected to the central control chip (20). The remote communication module (22) extends upward to the top of the front windshield (15).

9. A flexible photovoltaic building integrated structure as described in claim 1, characterized in that, The alarm module (24) extends upward to the top of the front windshield film (15), and the alarm module (24) is powered by a flexible photovoltaic power supply module (21).

10. A flexible building-integrated photovoltaic structure as described in claim 1, characterized in that, Both the strain sensor module (25) and the debonding detection sensor (26) are powered by the flexible photovoltaic power supply module (21).

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