Wafer ultrasonic scanning detection mechanism
The fully enclosed water boot design and high-rigidity mounting base solved the problem of air bubble accumulation in the coupling fluid, improving the accuracy and imaging quality of ultrasonic scanning detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-10
- Publication Date
- 2026-03-24
AI Technical Summary
In existing ultrasonic scanning and testing mechanisms, the water boot structure causes the coupling fluid to accumulate bubbles or voids, affecting the detection accuracy and imaging quality. Furthermore, the structural rigidity is insufficient, resulting in a jagged image shape.
The device features a fully enclosed water boot design, with the ultrasonic probe enclosed inside the boot. The coupling fluid is concentrated at the center by water pressure, and the ultrasonic waves propagate through the central water column. Combined with a high-rigidity mounting base and drive components, this design ensures the stability of the probe's movement.
It improves ultrasonic wave propagation and imaging quality, avoids the influence of bubbles or voids, and enhances detection accuracy and imaging stability.
Smart Images
Figure CN121721159A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of ultrasonic scanning and inspection technology, and specifically relates to a wafer ultrasonic scanning and inspection mechanism. Background Technology
[0002] An ultrasonic scanning microscope is a non-destructive testing device that utilizes a transmission medium. In operation, it employs scanning methods such as reflection or transmission to inspect internal defects such as delamination, voids, and cracks in components, materials, and wafers. Wafers are generally inspected using either immersion or spray methods. Immersion involves placing the wafer in a testing solution and then examining it with an ultrasonic probe; however, this method can easily lead to the testing solution seeping into the wafer, affecting wafer quality. Spray methods, on the other hand, spray the testing solution onto the wafer surface and then examine it with an ultrasonic probe, without damaging the wafer's internal structure.
[0003] like Figure 6 As shown, in existing ultrasonic scanning detection mechanisms, the water boot adopts an open structure. The coupling fluid flows out along the outer edge of the ultrasonic probe and gathers from the edge of the ultrasonic probe towards the center. Since the ultrasonic waves reflected by the ultrasonic probe and the loop are both located at the center of the ultrasonic probe, the coupling fluid gathered directly below the ultrasonic probe is prone to generating bubbles or voids, resulting in black dots or black lines on the ultrasonic image, affecting the detection accuracy. In addition, the overall structure of the water boot has poor rigidity, and the ultrasonic image scanned by the ultrasonic probe is prone to producing a sawtooth shape, affecting the image quality.
[0004] Therefore, it is necessary to improve upon the shortcomings of existing technologies in order to overcome their deficiencies in practical applications. Summary of the Invention
[0005] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this invention is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this invention is to provide a wafer ultrasonic scanning inspection mechanism that meets one or more of the aforementioned requirements.
[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:
[0007] This invention provides a wafer ultrasonic scanning inspection mechanism, including a mounting base, an ultrasonic generator, a drive assembly, a water boot, and an ultrasonic probe. Several drive assemblies and ultrasonic generators are mounted on the mounting base. Each drive assembly is connected to the water boot and the ultrasonic probe, respectively. The ultrasonic generator is electrically connected to the ultrasonic probe, and the ultrasonic probe is installed inside the water boot. The water boot has an open end located directly below the ultrasonic probe.
[0008] The water boot is filled with coupling fluid, which is sprayed onto the wafer surface directly along the opening. The ultrasonic waves emitted and received by the ultrasonic probe penetrate the coupling fluid at the opening to scan and inspect the wafer.
[0009] As a preferred embodiment, the ultrasonic probe is positioned directly opposite the opening end, and the projected area of the ultrasonic probe is larger than the projected area of the opening end.
[0010] As a preferred embodiment, the distance between the bottom end face of the ultrasonic probe and the wafer surface is 0.5 to 15 mm.
[0011] As a preferred embodiment, the distance between the bottom end face of the water boot and the wafer surface is 0.1 to 10 mm.
[0012] As a preferred embodiment, the frequency of the ultrasonic probe is 5 to 400 MHz.
[0013] As a preferred embodiment, one side of the drive assembly is fixedly connected to the mounting base, and the other side is drivenly connected to the probe base.
[0014] As a preferred embodiment, the bottom end of the probe base is connected to the ultrasonic probe and the water boot. The water boot is provided with a water inlet. By applying hydraulic pressure to the coupling fluid, the coupling fluid flows out along the opening end.
[0015] As a preferred embodiment, the drive component is configured as one of an electric cylinder, a servo motor, or a pneumatic cylinder.
[0016] As a preferred embodiment, the number of ultrasonic generators is at least one, the ultrasonic generator is configured with dual channels, and each ultrasonic generator is electrically connected to the ultrasonic probe.
[0017] As a preferred embodiment, a coupling liquid column is formed between the water boot and the wafer, and the loop formed by the ultrasonic waves emitted and received by the ultrasonic probe penetrates the coupling liquid column.
[0018] Compared with the prior art, the beneficial effects of this invention are:
[0019] This invention provides a wafer ultrasonic scanning inspection mechanism. The water boot adopts a fully enclosed structure design, with the ultrasonic probe completely enclosed inside the water boot. The bottom of the water boot has a central opening, and the coupling fluid is concentrated in the center by the action of water pressure. The transmission and reception of ultrasonic waves are carried out through the centrally concentrated water column, which can avoid the formation of bubbles or voids in the concentrated coupling fluid, thereby improving the propagation of ultrasonic waves and imaging quality.
[0020] This invention provides a wafer ultrasonic scanning and inspection mechanism. The ultrasonic probe is connected to the drive assembly through a probe base. The high-speed reciprocating motion improves the overall structural rigidity and ensures the quality of ultrasonic imaging. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of a wafer ultrasonic scanning inspection mechanism according to an embodiment of the present invention;
[0023] Figure 2 This is a cross-sectional view of a wafer ultrasonic scanning inspection mechanism according to an embodiment of the present invention;
[0024] Figure 3 This is a schematic diagram of the ultrasonic scanning principle in an embodiment of the present invention;
[0025] Figure 4 This is a schematic diagram of the structure of the water boots according to an embodiment of the present invention;
[0026] Figure 5 This is a schematic diagram of the structure of the ultrasonic probe according to an embodiment of the present invention;
[0027] Figure 6 This is a schematic diagram of the structure of the water boot in the comparative example of the present invention;
[0028] In the diagram: 0 wafer, 1 mounting base, 2 ultrasonic generator, 3 drive assembly, 4 probe base, 41 water boot, 411 water inlet, 412 opening end, 42 ultrasonic probe, 5 coupling fluid, 51 coupling fluid column. Detailed Implementation
[0029] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.
[0030] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.
[0031] According to some embodiments of this application, please refer to Figures 1 to 5 As shown, a wafer ultrasonic scanning inspection mechanism is provided, including a mounting base 1, an ultrasonic generator 2, a drive assembly 3, a water boot 41, and an ultrasonic probe 42. Several drive assemblies 3 and ultrasonic generators 2 are mounted on the mounting base 1. Each drive assembly 3 is connected to the water boot 41 and the ultrasonic probe 42, respectively. The ultrasonic generator 2 is electrically connected to the ultrasonic probe 42, and the ultrasonic probe 42 is installed inside the water boot 41. The bottom center of the water boot 41 has an opening end 412, which is located directly below the ultrasonic probe 42. The water boot 41 is filled with a coupling fluid 5, which is sprayed directly onto the surface of the wafer 0 along the opening end 412. The ultrasonic waves emitted and received by the ultrasonic probe 42 penetrate the coupling fluid 5 at the opening end to scan and inspect the wafer 0.
[0032] According to some embodiments of this application, the mounting base 1 is made of high-strength metal material, which can ensure the stability of the entire detection mechanism during operation. The mounting base 1 is provided with multiple mounting holes for fixing the drive assembly 3 and the ultrasonic generator 2. The position and size of the mounting holes are designed according to the actual dimensions of the drive assembly 3 and the ultrasonic generator 2.
[0033] According to some embodiments of this application, the ultrasonic probe 42 is positioned directly opposite the opening end 412, and the projected area of the ultrasonic probe 42 is larger than the projected area of the opening end 412 of the water boot 41. The coupling fluid is drawn towards the center of the water boot by pressure, and the transmission and reception of ultrasonic waves are achieved through the centrally gathered water column. This avoids the formation of bubbles or voids in the gathered coupling fluid, thereby improving the propagation and imaging quality of the ultrasonic waves.
[0034] In some embodiments of this application, the distance between the bottom end face of the ultrasonic probe 42 and the surface of the wafer 0 is 0.5 to 15 mm, preferably 1.0 mm, and can be set according to actual needs.
[0035] Specifically, the distance between the bottom end face of the ultrasonic probe 42 and the surface of the wafer 0 is precisely controlled within the range of 0.5 to 15 mm. This design helps to ensure that the ultrasonic waves can effectively penetrate the coupling fluid 5 and accurately act on the wafer 0, while avoiding detection errors caused by the distance being too close or too far.
[0036] In some embodiments of this application, the distance between the bottom end face of the water boot 41 and the surface of the wafer 0 is 0.1 to 10 mm, preferably 0.3 mm, and can be set according to actual needs.
[0037] Specifically, the distance between the bottom end face of the water boot 41 and the surface of the wafer 0 is set to 0.1 to 10 mm. This design further optimizes the spraying effect of the coupling fluid 5 and the propagation path of the ultrasonic waves, making the detection process more stable and reliable.
[0038] In some embodiments of this application, the frequency of the ultrasonic probe 42 is 5 to 400 MHz, preferably 300 MHz, and can be set according to actual needs.
[0039] Specifically, the frequency of the ultrasonic probe 42 is set between 5 and 400 MHz. This frequency range can meet the testing needs of wafers with different materials and thicknesses, improving the flexibility and accuracy of the testing.
[0040] According to some embodiments of this application, one side of the drive assembly 3 is fixedly connected to the mounting base 1, and the other side is driven to the probe base 4. The drive assembly 3 is used to move the probe base 4 up and down in conjunction with the probe base 4. The bottom end of the probe base 4 is simultaneously connected to the ultrasonic probe 42 and the water boot 41, which makes the entire detection mechanism more stable during the movement and reduces the detection error caused by vibration.
[0041] Furthermore, during operation, the drive assembly 3 drives the probe base 4 to move up and down via a transmission connection, thereby achieving synchronous movement of the ultrasonic probe 42 and the water boot 41. During this movement, the transmission accuracy of the drive assembly 3 directly affects the relative positional accuracy between the ultrasonic probe 42 and the wafer surface, thus impacting the accuracy of the detection results.
[0042] To ensure structural strength and lightweight design, the probe base 4 can be made of aluminum alloy. The probe base 4 has mounting interfaces that match the ultrasonic probe 42 and the water boot 41, ensuring a secure and airtight connection.
[0043] Furthermore, the bottom end of the probe base 4 is connected to the ultrasonic probe 42 and the water boot 41. The water boot 41 is provided with a water inlet 411. By filling the water inlet 411 with coupling fluid and applying hydraulic pressure to the coupling fluid, the coupling fluid is sprayed along the opening end 411 of the water boot onto the surface of the wafer 0. This not only ensures the continuous supply of coupling fluid 5, but also avoids detection problems caused by insufficient or excessive coupling fluid 5.
[0044] Furthermore, the edge of the opening end 412 of the water boot 41 is smoothed to reduce splashing during the injection of the coupling fluid 5 and improve the utilization rate of the coupling fluid 5.
[0045] In some embodiments of this application, the drive component 3 is configured as an electric cylinder, a servo motor, or a pneumatic cylinder. When an electric cylinder is selected, its precise control characteristics enable smooth up-and-down movement of the probe base. When a servo motor is selected, its high response speed and precise positioning capability improve detection efficiency. When a pneumatic cylinder is selected, its simple structure and low cost make it suitable for low-cost applications. In practical applications, the drive component can be configured according to requirements.
[0046] In some embodiments of this application, the number of ultrasonic generators 2 is at least one, the ultrasonic generator 2 is configured with dual channels, and each ultrasonic generator 2 is electrically connected to two ultrasonic probes 42 respectively.
[0047] Specifically, the ultrasonic generator features a dual-channel design, enabling a single generator to drive two ultrasonic probes simultaneously. This not only improves testing efficiency but also reduces the overall cost of the equipment. In practical applications, the number of ultrasonic generators can be flexibly configured according to testing needs to meet testing tasks of varying scales and complexities.
[0048] In some embodiments of this application, a coupling liquid column 51 is formed between the water boot 41 and the wafer 0. The loop formed by the ultrasonic waves emitted and received by the ultrasonic probe 42 penetrates the coupling liquid column 51, effectively avoiding the generation of bubbles or voids in the coupling liquid 5, thereby significantly improving the propagation and imaging quality of ultrasonic waves.
[0049] In some embodiments of this application, the ultrasonic probe 42 is configured to emit and receive ultrasonic waves toward the wafer 0 to perform scanning detection. The loop of the ultrasonic probe 42 emitting and receiving ultrasonic waves passes through the opening end of the water boot 41 and is positioned facing the surface of the wafer 0. The ultrasonic waves penetrate the coupling fluid 5 to scan the wafer 0.
[0050] Furthermore, during the transmission and reception of ultrasonic waves, the performance parameters of the ultrasonic probe 42, such as frequency and bandwidth, directly affect the detection resolution and sensitivity. The ultrasonic probe 42 selected in this embodiment has high frequency stability and a wide bandwidth, which can meet the detection requirements for minute defects inside the wafer.
[0051] During the actual scanning and inspection of the wafer, the wafer 0 is first placed in the inspection position, and then the drive assembly 3 is activated to move the ultrasonic probe 42 and the water boot 41 to a suitable height. Next, coupling fluid 5 is injected into the water boot 41 through the inlet 411, and a certain amount of hydraulic pressure is applied, causing the coupling fluid 5 to be sprayed onto the surface of the wafer 0 along the opening end 412. Simultaneously, the ultrasonic generator 2 is activated, and the ultrasonic probe 42 emits and receives ultrasonic waves to scan and inspect the wafer 0. The inspection results are analyzed and displayed by the corresponding data processing system.
[0052] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0053] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation based on the ideas provided by this invention, and these changes should also be considered within the scope of protection of this application.
Claims
1. A wafer ultrasonic scanning inspection mechanism, characterized in that, The device includes a mounting base, an ultrasonic generator, a drive assembly, a water boot, and an ultrasonic probe. Several drive assemblies and ultrasonic generators are mounted on the mounting base. Each drive assembly is connected to the water boot and the ultrasonic probe, respectively. The ultrasonic generator is electrically connected to the ultrasonic probe, and the ultrasonic probe is installed inside the water boot. The water boot has an open end, which is located directly below the ultrasonic probe. The water boot is filled with coupling fluid, which is sprayed onto the wafer surface directly along the opening. The ultrasonic waves emitted and received by the ultrasonic probe penetrate the coupling fluid at the opening to scan and inspect the wafer.
2. The wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The ultrasonic probe is positioned directly opposite the opening, and the projected area of the ultrasonic probe is larger than the projected area of the opening.
3. The wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The distance between the bottom end face of the ultrasonic probe and the wafer surface is 0.5–15 mm.
4. The wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The distance between the bottom end face of the water boot and the wafer surface is 0.1 to 10 mm.
5. A wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The frequency of the ultrasonic probe is 5–400 MHz.
6. The wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, One side of the drive assembly is fixedly connected to the mounting base, and the other side is drivenly connected to the probe base.
7. A wafer ultrasonic scanning inspection mechanism according to claim 6, characterized in that, The bottom of the probe base is connected to the ultrasonic probe and the water boot. The water boot has a water inlet. By applying hydraulic pressure to the coupling fluid, the coupling fluid flows out along the opening.
8. The wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The drive component is configured as one of an electric cylinder, a servo motor, or a pneumatic cylinder.
9. A wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, The number of ultrasonic generators is at least one, the ultrasonic generator is configured with dual channels, and each ultrasonic generator is electrically connected to the ultrasonic probe.
10. A wafer ultrasonic scanning inspection mechanism according to claim 1, characterized in that, A coupling liquid column is formed between the water boot and the wafer, and the loop formed by the ultrasonic waves emitted and received by the ultrasonic probe penetrates the coupling liquid column.