Aqueous solvent polishing pad and preparation method thereof

Abstract

The invention relates to the technical field of polishing materials, and particularly discloses an aqueous solvent polishing pad and a preparation method thereof. Aliphatic waterborne polyurethane resin, waterborne acrylic resin, an amine curing agent and deionized water in specific parts by weight are mixed to obtain waterborne solvent resin. The resin is electrostatically sprayed on a pretreated polyester non-woven fabric, and is cured at 100-150 DEG C for 1-2 hours to obtain a polishing pad finished product. The resin raw material may also contain nanoparticles. The prepared aqueous solvent polishing pad has the advantages of being high in polishing efficiency, low in abrasion, excellent in polishing uniformity, long in service life and the like, the preparation process is environmentally friendly, and the sustainable development requirement is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of polishing materials, in particular to a water-based solvent polishing pad and a preparation method thereof. BACKGROUND

[0002] In the field of polishing pad production and manufacturing, traditional solvent-based impregnation processes have long dominated. This process mainly relies on organic solvents such as dimethylformamide (DMF), butanone, etc. for impregnation treatment to improve the performance of the polishing pad, so that it can meet the polishing needs in different scenarios.

[0003] However, this traditional process has many drawbacks that cannot be ignored. First, the environmental pollution problem is serious. DMF, butanone and other organic solvents are volatile and will be released into the air during production, forming volatile organic compounds (VOCs), which pollute the atmospheric environment and harm human health. At the same time, if these organic solvents are not properly treated and directly discharged, they may also pollute the soil and water. Second, the cost of solvent recovery is high. In order to reduce the impact of organic solvents on the environment, enterprises need to invest a lot of money to establish a special solvent recovery system, but even so, the energy consumption, equipment maintenance and recovery efficiency in the recovery process make the cost of solvent recovery high. In addition, the uniformity of the product is difficult to guarantee. In the impregnation process, the impregnation degree and distribution uniformity of the organic solvent and the substrate such as non-woven fabric are affected by many factors, such as temperature, pressure, stirring speed, etc., which leads to unstable quality of the final product, and different batches or even the same batch of products may have performance differences.

[0004] In view of these problems, there are some tentative solutions in the industry. For example, by improving the type of solvent, selecting relatively environmentally friendly organic solvents, but this cannot fundamentally eliminate the environmental pollution risk brought by organic solvents; or optimizing the recovery system to improve the recovery efficiency, but it still cannot solve the problem of high cost. Moreover, the effect of these improvement measures on the improvement of product quality is limited, and the uniformity and stability of the product are still outstanding.

[0005] In view of the above related technologies, the inventors believe that a new type of polishing pad preparation process that can overcome the defects of traditional processes needs to be developed. SUMMARY

[0006] In order to solve the technical defects of the prior art, the present application provides a water-based solvent polishing pad and a preparation method thereof.

[0007] In a first aspect, the present application provides a preparation method of a water-based solvent polishing pad, which adopts the following technical solution: A preparation method of a water-based solvent polishing pad, comprising the following steps: S1: 60-65 parts by weight of aliphatic waterborne polyurethane resin and 25-30 parts by weight of waterborne acrylic resin, 2-5 parts by weight of amine curing agent and deionized water to 100 parts by weight are added to the reaction kettle, and stirred uniformly to obtain a water-based solvent resin; S2: the water-based solvent resin prepared in step S1 is uniformly sprayed on the non-woven fabric; S3: the sprayed non-woven fabric is heat cured to obtain a finished polishing pad.

[0008] By adopting the above technical scheme, the reasonable matching and uniform mixing of the resin raw materials are realized, the toughness of the aliphatic waterborne polyurethane resin and the stability of the waterborne acrylic resin form a synergy, and the crosslinking effect of the amine curing agent and the adjusting effect of the deionized water can preliminarily build a stable water-based solvent resin system. The subsequent spraying and heat curing treatment can make the resin uniformly adhere to the non-woven fabric substrate and form, providing a basic grinding processing adaptability for the polishing pad, ensuring that the polishing pad has a certain polishing efficiency and structural strength.

[0009] Preferably, the raw materials of the water-based solvent resin further include 1-3 parts by weight of nanoparticles, and the nanoparticles are one or more of nanosilica or nanoalumina.

[0010] By adopting the above technical scheme, the nanoparticles can be uniformly dispersed in the water-based solvent resin as a reinforcing component, filling the internal micro gaps of the resin by using its micro size effect, enhancing the density and structural strength of the resin coating, and further improving the hardness and wear resistance of the polishing pad, reducing the wear during polishing, and prolonging the service life of the polishing pad. At the same time, the use of multiple nanoparticles can further integrate the performance advantages of different particles to achieve a synergistic improvement in reinforcing effect.

[0011] Preferably, the waterborne acrylic resin in step S1 is a combination of soft acrylic acid and hard acrylic acid.

[0012] By adopting the above technical scheme, the elasticity of the soft acrylic resin and the rigidity of the hard acrylic resin can form a complement, which can accurately adjust the "rigidity-elasticity balance" of the water-based solvent resin coating, avoiding the low polishing efficiency caused by the insufficient rigidity of single soft resin, and preventing the poor surface adhesion of workpieces and easy scratches caused by the lack of elasticity of single hard resin. The polishing pad can better adapt to the micro surface of the workpiece while having stable cutting and grinding ability, and improve the polishing precision.

[0013] Preferably, the spraying process of step S2 is electrostatic spraying.

[0014] By adopting the technical scheme, the electrostatic spraying makes the water-based solvent resin droplets charged by means of a high-voltage electric field, which can make the resin droplets more uniformly and densely deposited on the surface of the non-woven fabric, effectively reducing the defects such as local uneven thickness and agglomeration of the coating that are prone to occur in conventional spraying, ensuring the uniformity of the distribution of the resin coating on the non-woven fabric substrate, and further enabling the polishing pad to realize stable transmission of the polishing force during the grinding process, reducing the difference in polishing speed in different areas, improving the uniformity of the polishing process, and reducing the problem of local excessive grinding or insufficient grinding caused by uneven coating.

[0015] Preferably, the non-woven fabric in the S2 step is a polyester non-woven fabric.

[0016] By adopting the technical scheme, the polyester material itself has excellent mechanical strength, wear resistance and chemical stability, and as a polishing pad substrate material, it can provide a stable support carrier for the water-based solvent resin coating, effectively resist the mechanical force and erosion of the polishing liquid during the polishing process, avoid deformation and damage of the substrate during use, and ensure the stability and service life of the polishing pad structure. At the same time, the fiber structure of the polyester non-woven fabric also facilitates the adhesion and penetration of the resin, enhancing the bonding force between the coating and the substrate.

[0017] Preferably, the non-woven fabric in the S2 step is soaked in phosphoric acid with a pH of 1-3 for 20-50 minutes before use.

[0018] By adopting the technical scheme, the phosphoric acid solution can slightly etch the surface of the polyester non-woven fabric, increase the surface roughness and hydrophilicity of the non-woven fabric fibers, improve the wettability of the water-based solvent resin and the non-woven fabric surface, make the resin more easily and uniformly adhere and penetrate into the gap between the non-woven fabric fibers, reduce the risk of peeling between the resin coating and the substrate, and enhance the interfacial bonding strength between the two, avoiding the decline in polishing performance and the increase in wear caused by the peeling of the coating during polishing, and further ensuring the use stability of the polishing pad.

[0019] Preferably, the heat curing is at 100-150°C for 1-2 hours.

[0020] By adopting the technical scheme, this temperature and time range can provide suitable conditions for the cross-linking and curing of the water-based solvent resin: it can ensure that the aliphatic water-based polyurethane resin, water-based acrylic resin and amine curing agent fully undergo cross-linking reaction to form a three-dimensional network resin coating with dense structure and stable performance, avoiding the problem of insufficient cross-linking and loose coating structure caused by low temperature and short time curing; it can also prevent defects such as resin degradation and substrate damage caused by high temperature and long time curing, ensuring that the polishing pad has good hardness, toughness and wear resistance after curing and forming, meeting the grinding processing requirements.

[0021] In a second aspect, the present application provides a water-based solvent polishing pad, which adopts the following technical scheme: A water-based solvent polishing pad is prepared by the method for preparing a water-based solvent polishing pad according to any one of claims 1-7.

[0022] By adopting the above technical solutions, the polishing pad can fully inherit the advantages of each preparation step, integrate the performance improvement effects of resin compatibility, nano-reinforcement, process optimization, etc., and finally form a comprehensive performance with high polishing efficiency, low wear loss, excellent polishing uniformity and long service life. It can adapt to the grinding and processing needs of workpieces such as silicon carbide, reduce the generation of scratches during the polishing process, and ensure the quality and stability of polishing processing.

[0023] In summary, this application has the following beneficial effects: 1. The preparation process of this application uses an aqueous solvent resin system, which can reduce the emission of volatile organic compounds and reduce environmental pollution compared with solvent-based resins. At the same time, the substrate is made of polyester non-woven fabric. Polyester material has good recyclability and is easy to recycle after disposal, reducing solid waste pollution. Overall, it meets the requirements of environmental protection and sustainable development.

[0024] 2. This application employs multiple technical means to ensure uniform and stable product performance. On the one hand, an electrostatic spraying process is used to uniformly deposit water-based solvent resin droplets onto the surface of the non-woven fabric, avoiding uneven coating thickness in certain areas. On the other hand, the non-woven fabric is pretreated with phosphoric acid to improve the uniformity of resin adhesion and penetration. Combined with appropriate thermosetting conditions, this ensures that the resin is fully cross-linked to form a dense and stable coating structure. At the same time, the soft and hard composite of water-based acrylic resin and the precise compatibility of resin raw materials further reduce product performance fluctuations, enabling the polishing pad to stably transmit grinding force during use and avoiding processing deviations caused by uneven performance.

[0025] 3. The nano-silica and nano-alumina added to the resin system of this application can fill the resin gaps, enhance the density and hardness of the coating, and reduce wear and tear; the high strength and wear resistance of the polyester nonwoven fabric substrate also provide stable support for the polishing pad and extend its service life. In terms of polishing effect, the compounding of aliphatic waterborne polyurethane resin and waterborne acrylic resin balances the rigidity and elasticity of the coating, ensuring efficient cutting and grinding while adapting to the microscopic surface of the workpiece to reduce scratches; the reinforcement of nanoparticles and the uniform coating structure further improve polishing precision, achieving the dual effect of "high polishing efficiency + low scratch risk". Detailed Implementation

[0026] The present application will be further described in detail below with reference to the embodiments.

[0027] The raw materials used in the embodiments and comparative examples of this application are all conventional commercially available products.

[0028] The nonwoven fabric used is polyester (polyethylene terephthalate) nonwoven fabric, which was purchased from Shanghai Guocheng Nonwoven Products Co., Ltd.

[0029] An aqueous solvent polishing pad is prepared by the following method: S1: Add 60-65 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40-50% and 25-30 parts by weight of waterborne acrylic resin with a solid content of 50-60% to a reactor and stir at 200-300 rpm for 10-15 minutes to mix evenly; add 2-5 parts by weight of amine curing agent and deionized water to 100% to the reactor and continue stirring at 200-300 rpm for 10-15 minutes to obtain waterborne solvent resin; S2: The aqueous solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 100-150℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0030] Example 1 An aqueous solvent polishing pad is prepared by the following method: S1: Add 60 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40% and 25 parts by weight of waterborne acrylic resin with a solid content of 50% to the reactor and stir at 200 rpm for 10 min to mix evenly; add 5 parts by weight of amine curing agent and 10 parts by weight of deionized water to the reactor and continue stirring at 200 rpm for 10 min to obtain waterborne solvent resin. S2: The aqueous solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 100℃ and the curing time to 1 hour. After curing, cool to room temperature to obtain the finished polishing pad.

[0031] Example 2 An aqueous solvent polishing pad is prepared by the following method: S1: Add 65 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 50% and 30 parts by weight of waterborne acrylic resin with a solid content of 60% to the reactor and stir at 300 rpm for 15 min to mix evenly; add 5 parts by weight of amine curing agent to the reactor and continue stirring at 300 rpm for 15 min to obtain waterborne solvent resin. S2: The aqueous solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 2 for 20 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 150℃ and the curing time to 1.5 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0032] Example 3 An aqueous solvent polishing pad is prepared by the following method: S1: Add 62 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 45% and 28 parts by weight of waterborne acrylic resin with a solid content of 55% to the reactor and stir at 250 rpm for 12 min to mix evenly; add 3 parts by weight of amine curing agent and 8 parts by weight of deionized water to the reactor and continue stirring at 250 rpm for 12 min to obtain waterborne solvent resin. S2: The aqueous solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 2.5 for 30 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 120℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0033] Example 4 An aqueous solvent polishing pad is prepared by the following method: S1: Add 60 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 45% and 30 parts by weight of waterborne acrylic resin with a solid content of 55% to the reactor and stir at 250 rpm for 12 min to mix evenly; add 3 parts by weight of amine curing agent and 7 parts by weight of deionized water to the reactor and continue stirring at 250 rpm for 12 min to obtain waterborne solvent resin. The waterborne acrylic resin is a blend of soft acrylic resin and hard acrylic resin, with a mass ratio of soft acrylic resin to hard acrylic resin of 1:2. S2: The water-based solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric using an electrostatic spraying process; the voltage of the electrostatic spraying is 70kV and the atomizing pressure is 0.3MPa. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 3 for 50 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 140℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0034] Example 5 An aqueous solvent polishing pad is prepared by the following method: S1: Add 60 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40%, 25 parts by weight of waterborne acrylic resin with a solid content of 50%, and 2 parts by weight of nanoparticles to a reactor and stir at 200 rpm for 10 min to mix evenly; add 5 parts by weight of amine curing agent and 7 parts by weight of deionized water to the reactor and continue stirring at 200 rpm for 10 min to obtain waterborne solvent resin. Among them, the nanoparticles are nano-silica, and the particle size of nano-silica is 50nm; S2: The water-based solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric using an electrostatic spraying process; the voltage of the electrostatic spraying is 60kV and the atomizing pressure is 0.4MPa. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 1 for 30 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 130℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0035] Example 6 An aqueous solvent polishing pad is prepared by the following method: S1: Add 60 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40%, 25 parts by weight of waterborne acrylic resin with a solid content of 50%, and 3 parts by weight of nanoparticles to a reactor and stir at 200 rpm for 10 min to mix evenly; add 5 parts by weight of amine curing agent and 7 parts by weight of deionized water to the reactor and continue stirring at 200 rpm for 10 min to obtain waterborne solvent resin. The nanoparticles are a mixture of nano-silica and nano-alumina in a mass ratio of 2:1. The nano-silica has a particle size of 100 nm, and the nano-alumina has a particle size of 50 nm.

[0036] S2: The water-based solvent resin obtained in step S1 is uniformly sprayed onto the non-woven fabric using an electrostatic spraying process; the voltage of the electrostatic spraying is 50kV and the atomizing pressure is 0.3MPa. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 1 for 25 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 130℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0037] Example 7 An aqueous solvent polishing pad is prepared by the following method: S1: Add 60 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40%, 25 parts by weight of waterborne acrylic resin with a solid content of 50%, and 2 parts by weight of nanoparticles to a reactor and stir at 200 rpm for 10 min to mix evenly; add 5 parts by weight of amine curing agent and 7 parts by weight of deionized water to the reactor and continue stirring at 200 rpm for 10 min to obtain waterborne solvent resin. The nanoparticles are nano-alumina, and the particle size of nano-alumina is 100nm. S2: The water-based solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric using an electrostatic spraying process; the voltage of the electrostatic spraying is 70kV and the atomizing pressure is 0.4MPa. The nonwoven fabric is pretreated by soaking it in a phosphoric acid solution with a pH of 2 for 40 minutes. S3: Transfer the sprayed nonwoven fabric to the heat curing chamber. Set the temperature of the heat curing chamber to 130℃ and the curing time to 2 hours. After curing, cool to room temperature to obtain the finished polishing pad.

[0038] Comparative Example 1 A water-based solvent polishing pad, the difference between this comparative example and Example 1 is that the nonwoven fabric is not pretreated during preparation.

[0039] Comparative Example 2 A water-based solvent polishing pad, the difference between this comparative example and Example 1 is that the thermosetting temperature during preparation is 80°C and the thermosetting time is 90 min.

[0040] Comparative Example 3 A water-based solvent polishing pad, the difference between this comparative example and Example 1 is that only 80 parts by weight of aliphatic waterborne polyurethane resin with a solid content of 40% is used in its preparation, and waterborne acrylic resin is not used.

[0041] The following performance tests were performed on the water-based solvent polishing pads of Examples 1-7 and Comparative Examples 1-4: 1. Hardness test The hardness of the non-woven abrasive pad was tested using a Shore A hardness tester, and the test results were recorded. 2. Grinding effect test Use grinding equipment and control the grinding equipment parameters: the upper grinding disc speed is 40 r / min, the lower grinding disc speed is 40 r / min, and the grinding pressure is 0.6 MPa; use commercially available grinding fluid. The object being ground is a silicon carbide wafer. The formula for calculating the polishing rate (unit: nm / min) is: Polishing rate = (thickness before polishing - thickness after polishing) / polishing time; 3. Wear rate test Wear rate (μm / min) = average wear amount.

[0042] 4 non-uniformity First, 49 locations were selected on the surface of the object to be polished for measurement, and the thickness at the selected points before and after the polishing test was recorded. The grinding rate non-uniformity can be calculated using the maximum (Max) and minimum (Min) difference in thickness at 25 locations measured before and after the test, and the average thickness. The calculation formula is: Grinding rate non-uniformity = 100 * (Max - Min) / average value.

[0043] The results are detailed in Table 1.

[0044] Table 1 Performance Test Results As shown in Table 1, the overall performance of the water-based solvent polishing pads in Examples 1-7 is significantly better than that in Comparative Examples 1-3: the polishing rate is stable at 621-643 nm / min, far exceeding the 543-600 nm / min of Comparative Examples 1-3; the wear rate is only 1.8-2.4 μm / min, lower than the 2.2-2.6 μm / min of the Comparative Examples; the non-uniformity is controlled at 3.36%-3.63%, significantly better than the 5.32%-5.86% of the Comparative Examples, and the hardness is maintained within a reasonable range of 72-77 HA, meeting the requirements of "high efficiency, low consumption, and precision" in polishing. This is due to the core technology combination of "non-woven fabric phosphoric acid pretreatment + aliphatic waterborne polyurethane-waterborne acrylic resin compounding + thermosetting parameter limitation". Some examples further optimized the performance by adding nanoparticles and using electrostatic spraying technology.

[0045] Comparing the specific groups, Comparative Example 1, due to the lack of phosphoric acid pretreatment on the nonwoven fabric, resulted in uneven resin adhesion on the nonwoven fabric surface compared to Example 1, leading to a decrease in hardness to 69HA and a polishing rate as low as 543nm / min. Conversely, the wear rate and non-uniformity increased to 2.5μm / min and 5.32%, respectively. Comparative Example 2, using a low-temperature short-time curing at 80℃ / 90min, resulted in insufficient cross-linking between the resin and the curing agent, leading to a loose coating structure and a polishing rate of only 568nm / min and a non-uniformity of 5.62%, indicating significant performance degradation. Comparative Example 3, using only aliphatic waterborne polyurethane resin without adding waterborne acrylic resin, achieved a hardness of 78HA, but lacked the "rigid-elastic balance" between the two resins, resulting in poor adhesion, a polishing rate of 600nm / min, and a non-uniformity as high as 5.86%.

[0046] The performance optimization within the examples also follows a clear pattern: Examples 5-7 added nanoparticles to the resin. The nanoparticles filled the resin gaps and reinforced the coating structure, increasing the hardness to 74-77HA and reducing the wear rate to 1.8-2.0μm / min. Among them, Example 6 had the lowest wear rate due to the synergistic effect of the two types of nanoparticles. Example 4 set the waterborne acrylic resin to a blend ratio of soft acrylic and hard acrylic, and used electrostatic spraying with a voltage of 70kV and an atomization pressure of 0.3MPa. This not only adjusted the rigidity and elasticity of the coating through resin blending, but also achieved uniform resin deposition through electrostatic spraying. The final hardness increased to 76HA and the wear rate decreased to 2.2μm / min, while maintaining a stable polishing rate and non-uniformity.

[0047] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A method for preparing an aqueous solvent polishing pad, characterized in that, Includes the following steps: S1: Add 60-65 parts by weight of aliphatic waterborne polyurethane resin, 25-30 parts by weight of waterborne acrylic resin, 2-5 parts by weight of amine curing agent, and deionized water to a reactor and stir until homogeneous to obtain waterborne solvent resin. S2: The aqueous solvent resin obtained in step S1 is uniformly sprayed onto the nonwoven fabric. S3: The non-woven fabric after spraying is subjected to heat curing treatment to obtain the finished polishing pad.

2. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: The raw materials of the aqueous solvent resin also include 1 to 2 parts by weight of nanoparticles, wherein the nanoparticles are one or more of nano-silica or nano-alumina.

3. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: The waterborne acrylic resin in step S1 is a blend of soft acrylic acid and hard acrylic acid.

4. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: The spraying process in step S2 is electrostatic spraying.

5. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: The nonwoven fabric used in step S2 is a polyester nonwoven fabric.

6. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: In step S2, the nonwoven fabric is pretreated by soaking it in phosphoric acid with a pH of 1 to 3 for 20 to 50 minutes before use.

7. The method for preparing an aqueous solvent polishing pad according to claim 1, characterized in that: The heating and curing process involves curing at 100-150℃ for 1-2 hours.

8. A water-based solvent polishing pad, characterized in that: It is prepared by the method of any one of claims 1-7 for preparing an aqueous solvent polishing pad.

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