Electroplating monitoring method and system for probe

By using a closed-loop control system combining a circulating pump and cyclic voltammetry scanning with a calibration model, the problem of real-time monitoring of additive concentration in nickel plating solution was solved, achieving stability of plating quality and efficient utilization of resources, and improving the probe's pass rate.

CN121781256APending Publication Date: 2026-04-03MAXONE SEMICON CO LTD
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Patent Information

Application Number
CN202511906518.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing technologies cannot monitor the concentration of additives in nickel plating solutions in real time, resulting in unstable coating quality. Furthermore, traditional offline analysis methods are lagging and cannot adjust the additive concentration in a timely manner, affecting the probe's pass rate and wasting resources.

Method used

A closed-loop control system is constructed by continuously collecting plating solution samples using a circulating pump and scanning them using cyclic voltammetry, combined with a calibration model to calculate the additive concentration in real time. This system includes modules for online sampling, electrochemical detection, data analysis, and automatic replenishment, enabling real-time monitoring of the additive concentration in the nickel plating solution.

Benefits of technology

It enables real-time and precise control of the additive concentration in nickel plating solution, improves the probe qualification rate, reduces resource waste, and ensures the stability and optimization of electroplating production.

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Abstract

The invention relates to an electroplating monitoring method and system for a probe. The method comprises the following steps: continuously collecting a plating solution from a main plating tank by using a circulating pump, conveying the plating solution to a test tank, and scanning the plating solution in the test tank based on a preset scanning interval time by using a cyclic voltammetry to obtain a cyclic voltammetry curve; performing characteristic analysis on the basis of the cyclic voltammetry curve to obtain a characteristic signal value; inputting the characteristic signal value into a preset calibration model to calculate the current additive concentration in real time; and comparing the current additive concentration with a preset concentration range to obtain a concentration adjustment scheme. According to the scheme, the concentration of the nickel plating solution additive can be monitored online in real time, and accurate control over probe bending is achieved.
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