Glue pouring device for packaging LED (light-emitting diode)

Abstract

The invention discloses a glue pouring device for packaging an LED (light-emitting diode), which comprises a working table, a fixing part for fixing the diode is arranged on the working table, an inclined part for enabling the working table to incline left and right is arranged at the bottom end of the working table, and a temperature control part for changing the environment temperature during glue pouring is arranged at the top end of the working table. A partition piece is arranged on the temperature control piece; the first hydraulic rod of the inclined part stretches out and draws back to drive the workbench to incline bidirectionally around the first rotating seat, angle switching of low left and high right and high left and low right is accurately achieved, the technological requirements of hot water outflow preheating, hot water backflow, cold water outflow cooling and cold water backflow are met, temperature control liquid automatically flows and flows back through gravity, additional conveying equipment is not needed, and the production cost is reduced. The technology is simplified, energy consumption is reduced, epoxy resin viscosity and bubbles are reduced through preheating before glue pouring, curing and shaping are accelerated through cooling after glue pouring, the compactness of a glue layer is improved, the LED light attenuation risk is greatly reduced, and the service life of a product is prolonged.

Description

Technical Field

[0001] This invention relates to the field of diode packaging equipment technology, specifically a potting device for LED light-emitting diode packaging. Background Technology

[0002] LED encapsulation potting technology is a core process in LED device encapsulation. It refers to the process of filling the gap between the LED bracket and the chip, the chip surface, and the optical cavity with special polymer potting adhesive through processes such as dispensing, potting, self-leveling, or vacuum degassing. After curing, it forms a dense and stable adhesive layer or optical lens. It is a key link connecting the LED chip, bracket, gold wire, and external environment.

[0003] Existing potting processes mostly use room temperature potting and natural curing, which cannot achieve precise temperature control of the potting compound in stages. The initial viscosity of the potting compound is high, the self-leveling effect is poor, and air bubbles are easily formed inside the compound layer. In addition, the curing speed is slow, the cross-linking of the compound layer is insufficient, and the density is inadequate. This not only reduces the light output efficiency of the LED, but also aggravates the light decay problem during use, significantly shortening the lifespan of the LED device. At the same time, uneven heating and cooling of the compound layer can easily generate internal stress, causing defects such as compound layer cracking and gold wire detachment, affecting product yield and stability. Summary of the Invention

[0004] The purpose of this invention is to address the problems of existing potting processes that mostly rely on room temperature potting and natural curing, which cannot achieve precise temperature control of the potting compound in stages, resulting in high initial viscosity, poor self-leveling effect, easy formation of air bubbles within the compound layer, slow curing speed, insufficient cross-linking and density of the compound layer. This not only reduces the light output efficiency of LEDs but also exacerbates light decay during use, significantly shortening the lifespan of LED devices. Furthermore, uneven heating and cooling of the compound layer can easily generate internal stress, leading to defects such as compound layer cracking and gold wire detachment, affecting product yield and stability. The invention provides a potting device for LED light-emitting diode packaging.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an encapsulation device for LED light-emitting diodes, comprising: a worktable, wherein a fixing component for fixing the diode is provided on the worktable, an tilting component for tilting the worktable left and right is provided at the bottom of the worktable, a temperature control component for changing the ambient temperature during encapsulation is provided at the top of the worktable, and a partition component is provided on the temperature control component. The temperature control component includes two sets of baffles fixedly connected to the front and rear ends of the top of the workbench. A hot liquid tank and a cold liquid tank are fixedly connected to the left and right ends of the top of the workbench, respectively. A connecting groove 1 and a connecting groove 2 are respectively opened through the corresponding surfaces of the hot liquid tank and the cold liquid tank. The baffles, the hot liquid tank, and the cold liquid tank form a U-shaped channel. A heating rod is fixedly connected to the top of the hot liquid tank, and the heating end of the heating rod passes through the top of the hot liquid tank, so that the heating end of the heating rod is located inside the hot liquid tank. A heat-absorbing plate is connected through the top of the cold liquid tank. The heat-absorbing plate is located inside the cold liquid tank. A heat-conducting plate is fixedly connected to the top of the heat-absorbing plate. The heat-conducting plate abuts against the top of the cold liquid tank. A semiconductor refrigeration component is fixedly connected to the top of the heat-conducting plate.

[0006] As a further embodiment of the present invention: a mounting bracket is fixedly connected to the top of the worktable, a Y-axis linear driver is fixedly connected to the top of the mounting bracket, an X-axis linear driver is fixedly connected to the movable end of the Y-axis linear driver, and a glue dispensing actuator is fixedly connected to the movable end of the X-axis linear driver.

[0007] As a further embodiment of the present invention: the fixing member includes a slot opened in the center area of ​​the top of the workbench, a heat-absorbing plate is slidably inserted into the slot, and a heat-supplying plate is fixedly connected to the top of the heat-absorbing plate.

[0008] As a further embodiment of the present invention: a diode mounting hole is provided at the top of the heating plate, and a handle is fixedly connected to the top of the heating plate.

[0009] As a further embodiment of the present invention: the tilting component includes a V-shaped mounting plate fixedly connected to the bottom end of the workbench. The mounting plate is provided in four sets, symmetrically distributed at the bottom end of the workbench. The bottom ends of the two sets of mounting plates on the left side are rotatably connected to a rotating seat, and the bottom end of the rotating seat is fixedly connected to a base plate.

[0010] As a further embodiment of the present invention: two sets of rotating seats are fixedly connected to the top right side of the base plate, and a set of hydraulic rods is fixedly connected to the top of each set of rotating seats. The top end of the extension end of the hydraulic rod is rotatably connected to the mounting plate located on the right side of the bottom of the workbench. In the initial state, the workbench is in a horizontal state, and the hydraulic rod is in an extended state, but not extended to the limit position. When the hydraulic rod is extended to the limit position, the workbench tilts to the left, with the left side lower and the right side higher. When the hydraulic rod is retracted to the limit position, the workbench tilts to the right, with the left side higher and the right side lower.

[0011] As a further embodiment of the present invention: the partition includes a hydraulic rod two fixedly connected to the top of the workbench. The hydraulic rod two is provided in four sets, symmetrically distributed on the outside of two sets of baffles. A set of L-shaped partitions is fixedly connected to the top of each pair of hydraulic rod twos. The two sets of partitions abut against the corresponding surfaces of the hot liquid tank and the cold liquid tank, respectively.

[0012] As a further embodiment of the present invention: each set of partitions has a connecting groove extending through it to the side facing the heat absorption plate. The connecting groove is slidably inserted into the baffle. When all hydraulic rods are in the retracted state, the two sets of partitions respectively block the first and second connecting grooves, so that the two sets of partitions form a U-shaped channel to separate the baffle, the hot liquid tank and the cold liquid tank.

[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, the slot of the fixing component enables quick assembly and disassembly of the heat absorption plate and the heat supply plate. The diode mounting hole ensures accurate diode positioning and avoids glue displacement. The heat absorption plate and the heat supply plate efficiently conduct the hot and cold energy of the temperature control component, so that each group of diodes is heated and cooled evenly, which greatly improves the consistency of glue curing after glue filling. The handle simplifies the loading and unloading process and adapts to the fast-paced needs of mass production. 2. In this invention, the hydraulic rod of the tilting component extends and retracts, causing the worktable to tilt bidirectionally around the rotating seat, precisely achieving angle switching between left-low and right-high and left-high and right-low. This meets the process requirements of hot water outflow for preheating, hot water return, cold water outflow for cooling, and cold water return. The temperature-controlled liquid is gravity-fed and returned, eliminating the need for additional conveying equipment, simplifying the process and reducing energy consumption. Preheating before dispensing reduces the viscosity of the epoxy resin and reduces bubbles. Cooling after dispensing accelerates curing and shaping, improves the density of the adhesive layer, significantly reduces the risk of LED light decay, and extends the product's service life. 3. In this invention, the hydraulic rod of the partition component drives the partition plate to rise and fall, accurately opening and closing the connecting groove one and the connecting groove two. When temperature is controlled, the channel is opened to ensure smooth liquid flow. When temperature is not controlled, the channel is closed to prevent leakage of temperature control liquid. The connecting groove allows the partition plate to slide smoothly along the baffle. The opening and closing process is smooth, effectively avoiding the mixing of hot and cold liquids, ensuring temperature control accuracy, and improving the controllability and stability of the entire potting process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the workbench structure in this invention; Figure 3 This is a schematic diagram of the fastener structure in this invention; Figure 4 In this invention Figure 3 A schematic diagram of the structure at point A; Figure 5 This is a schematic diagram of the tilting component in this invention; Figure 6 This is a schematic diagram of the temperature control component in this invention; Figure 7 This is a schematic diagram of the partition component in this invention; Figure 8 In this invention Figure 7 A schematic diagram of the structure at point B.

[0015] In the diagram: 1. Workbench; 11. Mounting bracket; 12. Y-axis linear driver; 13. X-axis linear driver; 14. Dispensing actuator; 2. Fixing component; 21. Slot; 22. Heat absorber plate; 23. Heat supply plate; 24. Mounting hole; 25. Handle; 3. Tilter; 31. Mounting plate; 32. Hydraulic rod one; 33. Rotating seat two; 34. Base plate; 35. Rotating seat one; 4. Temperature control component; 41. Hot liquid tank; 42. Connecting groove one; 43. Heating rod; 44. Cold liquid tank; 45. Connecting groove two; 46. Heat absorber plate; 47. Heat conduction plate; 48. Semiconductor cooling component; 49. Baffle; 5. Partition; 51. Hydraulic rod two; 52. Partition plate; 53. Connecting groove. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set up" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The following describes embodiments of the invention based on its overall structure.

[0018] Reference Figures 1 to 2In this embodiment of the invention, an LED light-emitting diode encapsulation potting device includes: a worktable 1, a fixing member 2 for fixing the diode on the worktable 1, an inclined member 3 for tilting the worktable 1 left and right at the bottom end of the worktable 1, a temperature control member 4 for changing the ambient temperature during potting at the top end of the worktable 1, a partition member 5 on the temperature control member 4, a mounting bracket 11 fixedly connected to the top end of the worktable 1, a Y-axis linear driver 12 fixedly connected to the top end of the mounting bracket 11, an X-axis linear driver 13 fixedly connected to the movable end of the Y-axis linear driver 12, and a dispensing execution component 14 fixedly connected to the movable end of the X-axis linear driver 13.

[0019] Reference Figures 3 to 4 The fixing component 2 includes a slot 21 located in the center of the top of the workbench 1. A heat-absorbing plate 22 is slidably inserted into the slot 21. A heat-supplying plate 23 is fixedly connected to the top of the heat-absorbing plate 22. A diode mounting hole 24 is provided at the top of the heat-supplying plate 23. A handle 25 is fixedly connected to the top of the heat-supplying plate 23.

[0020] The above solution is adopted: the heat absorption plate 22 and the heat supply plate 23 can be quickly inserted and removed through the slot 21, the diode mounting hole 24 accurately positions and fixes the diode to ensure that the diode position does not shift during potting, the handle 25 facilitates the quick installation and removal of the heat supply plate 23, and the heat absorption plate 22 and the heat supply plate 23 work together to conduct heat and cold, improve the uniformity of diode temperature control, and adapt to the needs of batch potting operations.

[0021] Reference Figure 5 The tilting component 3 includes a V-shaped mounting plate 31 fixedly connected to the bottom of the workbench 1. There are four sets of mounting plates 31, symmetrically distributed at the bottom of the workbench 1. The bottom ends of the two sets of mounting plates 31 on the left are rotatably connected to rotating seats 35. The bottom ends of rotating seats 35 are fixedly connected to a base plate 34. The top right side of the base plate 34 is fixedly connected to two sets of rotating seats 33. The top of each set of rotating seats 33 is fixedly connected to a hydraulic rod 32. The top end of the extension end of the hydraulic rod 32 is rotatably connected to the mounting plate 31 located on the right side of the bottom of the workbench 1. In the initial state, the workbench 1 is in a horizontal state, and the hydraulic rod 32 is in an extended state, but not extended to the limit position. When the hydraulic rod 32 is extended to the limit position, the workbench 1 tilts to the left, with the left side lower and the right side higher. When the hydraulic rod 32 is retracted to the limit position, the workbench 1 tilts to the right, with the left side higher and the right side lower.

[0022] The above solution is adopted: the workbench 1 is securely connected to the rotating seat 35 and the hydraulic rod 32 by four sets of V-shaped mounting plates 31. The extension and retraction of the hydraulic rod 32 drives the workbench 1 to tilt bidirectionally around the rotating seat 35, accurately realizing the switching of tilt angles from left low to right high and from left high to right low, meeting the process requirements of hot liquid outflow, cold liquid outflow and horizontal glue filling. The tilt angle adjustment is stable and without jamming, and is suitable for the core process of temperature-controlled liquid self-flowing backflow.

[0023] Reference Figure 6 The temperature control component 4 includes two sets of baffles 49 fixedly connected to the front and rear ends of the top of the workbench 1. A hot liquid tank 41 and a cold liquid tank 44 are fixedly connected to the left and right ends of the top of the workbench 1, respectively. A connecting groove 1 42 and a connecting groove 2 45 are respectively opened through the corresponding surfaces of the hot liquid tank 41 and the cold liquid tank 44. The baffles 49, the hot liquid tank 41 and the cold liquid tank 44 form a U-shaped channel. A heating rod 43 is fixedly connected to the top of the hot liquid tank 41, and the heating end of the heating rod 43 passes through the top of the hot liquid tank 41, so that the heating end of the heating rod 43 is located inside the hot liquid tank 41. A heat-absorbing plate 46 is connected through the top of the cold liquid tank 44. The heat-absorbing plate 46 is located inside the cold liquid tank 44. A heat-conducting plate 47 is fixedly connected to the top of the heat-absorbing plate 46. The heat-conducting plate 47 abuts against the top of the cold liquid tank 44. A semiconductor cooling component 48 is fixedly connected to the top of the heat-conducting plate 47.

[0024] The above scheme is adopted: the liquid in the hot liquid tank 41 is heated by the heating rod 43, the semiconductor cooling component 48 cools the liquid in the cold liquid tank 44 through the heat conducting plate 47 and the heat absorbing plate 46, the U-shaped channel formed by the baffle 49, the hot liquid tank 41 and the cold liquid tank 44 realizes the orderly flow of the temperature-controlled liquid, and the connecting tank 1 42 and the connecting tank 2 45 ensure the smooth entry and exit of the temperature-controlled liquid, realizing precise temperature control of preheating before dispensing and cooling after dispensing, and improving the curing quality of epoxy resin.

[0025] Reference Figures 7 to 8 The partition 5 includes a hydraulic rod 51 fixedly connected to the top of the workbench 1. There are four sets of hydraulic rods 51, symmetrically distributed on the outside of the two sets of baffles 49. Each pair of hydraulic rods 51 has an L-shaped partition 52 fixedly connected to its top. The two sets of partitions 52 abut against the corresponding surfaces of the hot liquid tank 41 and the cold liquid tank 44, respectively. Each set of partitions 52 has a through groove 53 on the side facing the heat absorption plate 22. The through groove 53 is slidably inserted into the baffle 49. When all hydraulic rods 51 are in the retracted state, the two sets of partitions 52 block the connecting groove 42 and the connecting groove 45, respectively, so that the two sets of partitions 52 form a U-shaped channel to separate the baffle 49, the hot liquid tank 41 and the cold liquid tank 44.

[0026] The above solution is adopted: four sets of hydraulic rods 51 synchronously extend and retract to drive two sets of L-shaped partitions 52 to rise and fall. The connecting groove 53 ensures that the partitions 52 slide smoothly along the baffle 49. When the partitions 52 descend, they precisely block the connecting grooves 42 and 45, thus isolating the U-shaped temperature control channel and preventing leakage of the temperature control fluid. When the partitions 52 rise, they open the channel to ensure the normal flow of the temperature control fluid, thereby realizing the on-demand opening and closing of the temperature control channel and improving the controllability of the temperature control process.

[0027] The working principle of this invention is as follows: In the initial state of the device, hydraulic rod 32 is partially extended, the worktable 1 remains horizontal, hydraulic rod 51 is retracted, and partition 52 blocks connecting slot 42 and connecting slot 45, thus isolating the temperature control channel. Before potting, the diode is precisely inserted into the diode mounting hole 24 of the heating plate 23. Holding the handle 25, the heat absorption plate 22 is inserted into the slot 21 to fix the diode. Then, hydraulic rod 32 is retracted to its limit, the worktable 1 is higher on the left and lower on the right, and then the liquid on one side of the hot liquid tank 41 is... When the pressure rod 51 extends, the partition 52 rises to open the connecting channel 42. The hot water heated by the heating rod 43 in the hot liquid tank 41 flows into the U-shaped channel through the connecting channel 42, covering the inclined worktable 1. The heat is conducted to the diode through the heating plate 23, preheating the epoxy resin to improve its fluidity. After the hot water has fully exchanged heat, the hydraulic rod 32 extends to half-extension, the worktable 1 returns to horizontal, and a constant temperature is maintained. The X-axis linear driver 13 and the Y-axis linear driver 12 are activated to move the dispensing actuator 14, precisely dispensing the diode. After the glue dispensing operation is completed, hydraulic rod 32 is extended to its limit, causing the worktable 1 to tilt from left to right. Hot water flows back to the hot liquid tank 41 via connecting channel 42. After the return flow is complete, hydraulic rod 51 on one side of the hot liquid tank 41 is retracted, and partition 52 moves down to re-sever connecting channel 42. Then, hydraulic rod 51 on one side of the cold liquid tank 44 is extended, opening connecting channel 45. Cold water cooled by the semiconductor cooling device 48 in the cold liquid tank 44 flows into the U-shaped channel via connecting channel 45. Afterward, hydraulic rod 32 retracts to half its original position. The workbench 1 extends and returns to a horizontal position. Cold water absorbs the heat from the diode and epoxy resin, achieving rapid cooling and curing. After cooling, hydraulic rod 32 retracts to its limit, and the workbench 1 becomes higher on the left and lower on the right. Cold water flows back to the cold liquid tank 44 through the connecting channel 45. Hydraulic rod 51 retracts to block the channel. Then, hydraulic rod 32 extends to half-extension, and the workbench 1 returns to a horizontal position. Finally, handle 25 is held to pull out the heating plate 23, completing the diode potting and component removal. The entire process is automated and suitable for batch LED encapsulation potting operations.The heat absorber plate 22 and the heating plate 23 can be quickly assembled and disassembled through the slot 21 of the fixing component 2. The diode mounting hole 24 ensures accurate diode positioning and avoids glue displacement. The heat absorber plate 22 and the heating plate 23 efficiently conduct the hot and cold energy of the temperature control component 4, so that each group of diodes is heated and cooled evenly, which greatly improves the consistency of glue curing after glue filling. The handle 25 simplifies the loading and unloading process and adapts to the fast-paced needs of mass production. The hydraulic rod 32 of the tilting component 3 drives the worktable 1 to tilt bidirectionally around the rotating seat 35, accurately realizing the angle switching of left low and right high and left high and right low, meeting the process requirements of hot water outflow preheating, hot water return, cold water outflow cooling, and cold water return. It relies on gravity to achieve The temperature-controlled liquid undergoes gravity-flow recirculation, eliminating the need for additional conveying equipment, simplifying the process and reducing energy consumption. Preheating before dispensing reduces epoxy resin viscosity and minimizes air bubbles. Cooling after dispensing accelerates curing and shaping, improving the density of the adhesive layer, significantly reducing the risk of LED light decay, and extending product lifespan. Hydraulic rod 51 of partition 5 drives the partition plate 52 to rise and fall, precisely opening and closing connecting channels 42 and 45. During temperature control, the channel is open to ensure smooth liquid flow; during non-temperature control, the channel is closed to prevent leakage of the temperature-controlled liquid. Connecting groove 53 allows the partition plate 52 to slide smoothly along baffle 49. The opening and closing process is seamless, effectively preventing the mixing of hot and cold liquids, ensuring temperature control accuracy, and improving the controllability and stability of the entire dispensing process.

[0028] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A potting apparatus for LED light-emitting diode encapsulation, comprising: The workbench (1) is characterized in that a fixing member (2) for fixing the diode is provided on the workbench (1), an tilting member (3) for tilting the workbench (1) left and right is provided at the bottom of the workbench (1), a temperature control member (4) for changing the ambient temperature during potting is provided at the top of the workbench (1), and a partition member (5) is provided on the temperature control member (4). The temperature control component (4) includes two sets of baffles (49) fixedly connected to the front and rear ends of the top of the workbench (1). A hot liquid tank (41) and a cold liquid tank (44) are fixedly connected to the left and right ends of the top of the workbench (1), respectively. A connecting groove 1 (42) and a connecting groove 2 (45) are respectively opened through the corresponding surfaces of the hot liquid tank (41) and the cold liquid tank (44). The baffles (49), the hot liquid tank (41) and the cold liquid tank (44) form a U-shaped channel. A heating rod is fixedly connected to the top of the hot liquid tank (41). 43), and the heating end of the heating rod (43) penetrates the top of the hot liquid tank (41), so that the heating end of the heating rod (43) is located inside the hot liquid tank (41). The top of the cold liquid tank (44) is connected to a heat-absorbing plate (46), which is located inside the cold liquid tank (44). The top of the heat-absorbing plate (46) is fixedly connected to a heat-conducting plate (47), which abuts against the top of the cold liquid tank (44). The top of the heat-conducting plate (47) is fixedly connected to a semiconductor cooling element (48).

2. The potting apparatus for LED light-emitting diode encapsulation according to claim 1, characterized in that, The top of the worktable (1) is fixedly connected to a mounting bracket (11), the top of the mounting bracket (11) is fixedly connected to a Y-axis linear driver (12), the movable end of the Y-axis linear driver (12) is fixedly connected to an X-axis linear driver (13), and the movable end of the X-axis linear driver (13) is fixedly connected to a glue dispensing actuator (14).

3. The potting apparatus for LED light-emitting diode encapsulation according to claim 2, characterized in that, The fastener (2) includes a slot (21) located in the center of the top of the workbench (1), a heat-absorbing plate (22) is slidably inserted into the slot (21), and a heat-supplying plate (23) is fixedly connected to the top of the heat-absorbing plate (22).

4. The potting apparatus for LED light-emitting diode encapsulation according to claim 3, characterized in that, The top of the heating plate (23) is provided with a diode mounting hole (24), and a handle (25) is fixedly connected to the top of the heating plate (23).

5. The potting apparatus for LED light-emitting diode encapsulation according to claim 4, characterized in that, The tilting component (3) includes a V-shaped mounting plate (31) fixedly connected to the bottom of the workbench (1). The mounting plate (31) is provided in four sets, symmetrically distributed at the bottom of the workbench (1). The bottom ends of the two sets of mounting plates (31) on the left side are rotatably connected to a rotating seat (35). The bottom end of the rotating seat (35) is fixedly connected to a base plate (34).

6. The potting apparatus for LED light-emitting diode encapsulation according to claim 5, characterized in that, Two sets of rotating seats (33) are fixedly connected to the top right side of the base plate (34). Each set of rotating seats (33) is fixedly connected to a set of hydraulic rods (32). The top end of the extension end of the hydraulic rods (32) is rotatably connected to the mounting plate (31) located on the right side of the bottom of the workbench (1). In the initial state, the workbench (1) is in a horizontal state, and the hydraulic rods (32) are in an extended state, but not extended to the limit position. When the hydraulic rods (32) are extended to the limit position, the workbench (1) tilts to the left, with the left side lower and the right side higher. When the hydraulic rods (32) are retracted to the limit position, the workbench (1) tilts to the right, with the left side higher and the right side lower.

7. The potting apparatus for LED light-emitting diode encapsulation according to claim 6, characterized in that, The partition (5) includes a hydraulic rod (51) fixedly connected to the top of the workbench (1). There are four sets of hydraulic rods (51) symmetrically distributed on the outside of the two sets of baffles (49). A set of L-shaped partitions (52) is fixedly connected to the top of each two sets of hydraulic rods (51). The two sets of partitions (52) abut against the corresponding surfaces of the hot liquid tank (41) and the cold liquid tank (44) respectively.

8. The potting apparatus for LED light-emitting diode encapsulation according to claim 7, characterized in that, Each set of partitions (52) has a through-hole (53) on the side facing the heat absorption plate (22). The through-hole (53) is slidably inserted into the baffle (49). When all the hydraulic rods (51) are in the retracted state, the two sets of partitions (52) respectively block the first connecting groove (42) and the second connecting groove (45), so that the two sets of partitions (52) form a U-shaped channel to separate the baffle (49), the hot liquid tank (41) and the cold liquid tank (44).

Images