Light energy metal plate putty as well as preparation method and application thereof

Abstract

The invention belongs to the technical field of sheet metal putty, and particularly relates to light energy sheet metal putty as well as a preparation method and application thereof. The light energy metal plate putty is prepared from the following raw materials: modified resin A, modified resin B, an accelerant, pigment, a thixotropic agent, a photoinitiator, a wetting dispersant, a defoaming agent, an epoxy phosphate adhesion promoter and sulfydryl silane coupling agent modified talcum powder, the light energy sheet metal putty provided by the invention can be cured within 1 min and is not influenced by the environment temperature, the curing time of the sheet metal putty is obviously shortened, the requirements of application scenes needing rapid construction are met, and meanwhile, the light energy sheet metal putty has excellent high and low temperature resistance.

Description

Technical Field

[0001] This invention belongs to the field of sheet metal putty technology, specifically relating to a light-energy sheet metal putty, its preparation method, and its application. Background Technology

[0002] Sheet metal putty, also known as unsaturated polyester resin putty, is mainly used to fill deep depressions, pinholes, scratches and other defects in the substrate, so as to repair the substrate surface and provide a smooth base for subsequent spraying. It is widely used in automobiles, high-speed rail, trains, ships and other fields.

[0003] While sheet metal putty has the advantage of faster curing speed compared to ordinary putty, its drying time is generally 20-30 minutes, and this time is further extended at low temperatures. Therefore, there is still room for improvement in curing time. The applicant has previously developed a sheet metal putty that can cure within 15 minutes and applied for a related patent, with authorization publication number CN118290981B. The technical solution consists of component A and component B. Component A includes: styrene, dicyclopentadiene resin, dispersant, defoamer, wetting agent, rust inhibitor, zinc phosphate rust-inhibiting pigment, aniline black, leveling agent, organosilicon surfactant, and carboxylate-type gemini surfactant. Component B includes the following components: benzoyl peroxide and tert-butyl peroxyneodecanate. Although this technical solution has a shorter curing time than traditional sheet metal putty, it cannot meet the needs of application scenarios requiring rapid construction.

[0004] In addition, traditional sheet metal putty has high strength and hardness, which leads to weak adhesion. It is prone to blistering, cracking or peeling under high and low temperature conditions. The aforementioned technical solution did not address this technical problem. Summary of the Invention

[0005] The purpose of this invention is to provide a light-energy sheet metal putty, its preparation method, and its application. The light-energy sheet metal putty provided by this invention can be cured within 1 minute, is not affected by ambient temperature, significantly shortens the curing time of sheet metal putty, meets the application scenarios that require rapid construction, and also has excellent resistance to high and low temperatures.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] The first aspect of this invention provides a light-energy sheet metal putty, comprising the following raw materials: modified resin A, modified resin B, accelerator, pigment, thixotropic agent, photoinitiator, wetting and dispersing agent, defoamer, epoxy phosphate ester adhesion promoter, mercaptosilane coupling agent modified talc powder;

[0008] The raw materials for the synthesis of the modified resin A include ethylene glycol, trimethylolpropane diallyl ether, tetrahydrophthalic anhydride, maleic anhydride, 3-(triethoxysilyl)propylsuccinic anhydride, tert-butylhydroquinone, styrene, 1,4-naphthoquinone, and antioxidant 264.

[0009] The raw materials for synthesizing the modified resin B include diethylene glycol, triallyl isocyanate, tert-butylhydroquinone, maleic anhydride, styrene, 1,4-naphthoquinone, antioxidant 264, and copper naphthenate.

[0010] Preferably, the photo-energy sheet metal putty, by weight, comprises the following raw materials: 200-260 parts of modified resin A, 60-120 parts of modified resin B, 5-10 parts of accelerator, 5-8 parts of pigment, 4-7 parts of thixotropic agent, 3-6 parts of photoinitiator, 3-5 parts of wetting and dispersing agent, 2-3 parts of defoamer, 0.5-1.5 parts of epoxy phosphate ester adhesion promoter, and 400-600 parts of mercaptosilane coupling agent modified talc.

[0011] Preferably, the modified resin A, by weight, comprises the following raw materials: 220-250 parts of ethylene glycol, 150-200 parts of trimethylolpropane diallyl ether, 300-350 parts of tetrahydrophthalic anhydride, 80-120 parts of maleic anhydride, 50-70 parts of 3-(triethoxysilyl)propylsuccinic anhydride, 300-330 parts of styrene, 0.5-0.7 parts of 1,4-naphthoquinone, 0.5-0.7 parts of antioxidant 264, and 0.4-0.6 parts of tert-butylhydroquinone.

[0012] Preferably, the preparation method of the modified resin A includes the following steps:

[0013] S1. Add ethylene glycol, tetrahydrophthalic anhydride and the first portion of tert-butylhydroquinone into the reaction vessel, evacuate to remove air, raise the temperature, and protect with nitrogen. First, raise the temperature directly to 150-170℃, then raise it to 200-210℃ within 3-5 hours, and finally keep the temperature constant for 5-6 hours without evacuation, so that the acid value is ≤30mgKOH / g.

[0014] S2. After cooling to 90-100℃, add maleic anhydride and 3-(triethoxysilyl)propylsuccinic anhydride. Remove air by vacuuming. First, raise the temperature to 150-170℃, then raise it to 200-210℃ within 2-3 hours. After 3-5 hours, cool down to 160-170℃ and add trimethylolpropane diallyl ether dropwise, controlling the dropwise addition time to 2-3 hours. Then raise the temperature to 200-210℃ within 2-3 hours. React until the acid value is 20-30 mg KOH / g and the viscosity value is 600-700 mPa·s measured by a viscometer.

[0015] S3. First, add styrene and the second part of tert-butylhydroquinone to the dilution vessel, then add the material from step S2, cool down to 120-130℃, start stirring, and when the temperature drops to ≤50℃, add 1,4-naphthoquinone, antioxidant 264 and the third part of tert-butylhydroquinone in sequence, and finally cool down to 45℃ to obtain modified resin A.

[0016] Preferably, the modified resin B, by weight, comprises the following raw materials: 400-450 parts diethylene glycol, 300-350 parts maleic anhydride, 300-350 parts styrene, 150-200 parts triallyl isocyanate, 0.6-0.8 parts antioxidant 264, 0.5-0.7 parts tert-butylhydroquinone, 0.5-0.7 parts 1,4-naphthoquinone, and 0.1-0.2 parts copper naphthenate.

[0017] Preferably, the method for preparing the modified resin B includes the following steps:

[0018] Step 1: Add diethylene glycol, maleic anhydride and the first portion of tert-butylhydroquinone into the reaction vessel, evacuate to remove air, raise the temperature, and protect with nitrogen. First, raise the temperature directly to 150-170℃, then raise it to 200-210℃ over 3-5 hours. Finally, maintain the temperature at this point for 3-4 hours without evacuation, so that the acid value is ≤35mgKOH / g.

[0019] Step 2: Cool down to 160-170℃, add triallyl isocyanate dropwise, control the dropwise addition time to 2-3 hours, maintain the temperature at 165±2℃ throughout the process, keep the temperature constant for 2 hours after the dropwise addition is completed, and then raise the temperature to 190℃ for another 2-3 hours. React until the acid value is <35mgKOH / g, and the viscosity value is measured by a viscometer to be 550-650 mpa.s.

[0020] Step 3: First, add styrene and the second part of tert-butylhydroquinone to the dilution vessel, then add the material from step 2, cool down to 120-130℃, start stirring, and when the temperature drops to ≤50℃, add 1,4-naphthoquinone, antioxidant 264, copper naphthenate and the third part of tert-butylhydroquinone in sequence to obtain modified resin B.

[0021] Preferably, the mass ratio of the first part of tert-butylhydroquinone, the second part of tert-butylhydroquinone, and the third part of tert-butylhydroquinone in the preparation process of modified resin A and modified resin B is 0.044-0.11:0.262-0.343:0.094-0.165.

[0022] Preferably, the accelerator is selected from N,N-diisopropanol-p-toluidine or N,N-dihydroxyethyl-p-toluidine.

[0023] Preferably, the pigment includes, but is not limited to, one or more of carbon black, titanium dioxide, iron oxide red, ultramarine blue, and iron oxide yellow.

[0024] Preferably, the thixotropic agent is selected from one or more of fumed silica, bentonite, cellulose, and hydrogenated castor oil.

[0025] Preferably, the photoinitiator is selected from one or more of 2-hydroxy-2-methyl-1-phenylpropanone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoyl phenylphosphonate, methyl benzoylcarbamate, phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, and 2-isopropylthioxanthrone.

[0026] Preferably, the wetting and dispersing agent is BYK-W966.

[0027] Preferably, the defoamer is selected from one or more of organic defoamers, polyether defoamers, mineral oil defoamers, and higher alcohol defoamers.

[0028] Preferably, the epoxy phosphate adhesion promoter is selected from BETTERSOL 7277 or BETTERSOL 7267.

[0029] Preferably, the talc powder comprises coarse talc powder and fine talc powder in a mass ratio of 2-3:2-3.

[0030] Preferably, the coarse talc powder has a particle size of 300-600 mesh.

[0031] Preferably, the particle size of the fine talc powder is 800-1200 mesh.

[0032] Preferably, the preparation method of the mercaptosilane coupling agent modified talc powder includes the following steps:

[0033] Talc powder was added to an ethanol solution of mercaptosilane coupling agent and stirred at 50-60℃ for 1-4 hours for modification. After modification, the mixture was filtered, washed and dried to obtain mercaptosilane coupling agent modified talc powder.

[0034] Preferably, the mercaptosilane coupling agent is one or more of 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, mercaptopropyldimethoxymethylsilane, or mercaptoethyltriethoxysilane.

[0035] Preferably, the concentration of the ethanol solution of the mercaptosilane coupling agent is 3-5 wt%.

[0036] Preferably, the mass ratio of talc powder to mercaptosilane coupling agent is 1:0.1-0.3.

[0037] The second aspect of this invention provides a method for preparing a photo-energy sheet metal putty, comprising the following steps: first, mixing modified resin A and modified resin B evenly, then sequentially adding an accelerator, a photoinitiator, a wetting and dispersing agent, an epoxy phosphate ester adhesion promoter, an antifoaming agent, a pigment, a thixotropic agent, a mercaptosilane coupling agent, and modified talc powder; finally, dispersing evenly using a high-speed disperser, initially dispersing at a speed of 1000-1500 r / min for 3-5 min; then dispersing at a speed of 3000-3500 r / min for 5-8 min; and finally dispersing at a speed of 5000-6000 r / min for 15-20 min, with the temperature controlled at 51-55℃.

[0038] The second aspect of this invention provides an application of light-energy sheet metal putty in automobiles, high-speed trains, trains, and ships.

[0039] Preferably, when the solar-powered sheet metal putty is used in automobiles, high-speed trains, trains, and ships, a curing agent accounting for 1-3% of the mass of the solar-powered sheet metal putty is added to the solar-powered sheet metal putty.

[0040] Preferably, the curing agent is benzoyl peroxide.

[0041] Compared with the prior art, the advantages and beneficial effects of the present invention are as follows:

[0042] 1. This invention utilizes modified resin A, modified resin B, and mercaptosilane coupling agent-modified talc powder to achieve complete drying of sheet metal putty within 1 minute under UV-LED light. Modified resin A is based on air-drying monomers trimethylolpropane diallyl ether and tetrahydrophthalic anhydride, with maleic anhydride introducing photocurable double bonds into the unsaturated polyester, and 3-(triethoxysilyl)propylsuccinic anhydride introducing siloxanes to improve adhesion and low-temperature resistance. Modified resin B introduces photocurable double bonds into the unsaturated polyester via maleic anhydride. Meanwhile, the heat resistance is improved by introducing triazine aromatic heterocycles into the unsaturated resin through triallyl isocyanurate. On the one hand, under UV-LED irradiation, modified resin A, modified resin B, and styrene can achieve cross-linking and rapid curing. At the same time, the talc modified by mercaptosilane coupling agent not only improves the dispersibility of talc, but also the mercapto groups of the talc modified by mercaptosilane coupling agent can participate in the photocuring reaction, avoiding the defects of incomplete curing and increased internal stress caused by the presence of talc. On the other hand, it also makes the sheet metal putty have excellent heat resistance, low temperature resistance, and temperature change cycle resistance.

[0043] 2. In particular, this invention also incorporates a specific epoxy phosphate ester adhesion promoter. The inventors have discovered that, compared with epoxy silicone adhesion promoters and silicone adhesion promoters containing unsaturated olefin bonds, epoxy phosphate ester adhesion promoters can effectively improve the adhesion, heat resistance, low-temperature resistance, and temperature cycling resistance of sheet metal putty. This may be because the phosphate ester in the epoxy phosphate ester adhesion promoter can be firmly anchored to the sheet metal, while the epoxy groups can react with the mercapto groups in the talc powder modified by the mercaptosilane coupling agent, thereby improving the density of the sheet metal putty after curing. Attached Figure Description

[0044] Figure 1 This is a factory-produced image of the light-energy sheet metal putty used in Example 3;

[0045] Figure 2 This is the factory inspection report for the light-energy sheet metal putty in Example 3. Detailed Implementation

[0046] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0047] The light-powered sheet metal putty, by weight, includes the following raw materials: 200 parts modified resin A, 60 parts modified resin B, 5 parts accelerator, 5 parts pigment, 4 parts thixotropic agent, 3 parts photoinitiator, 3 parts wetting and dispersing agent, 2 parts defoamer, 0.5 parts epoxy phosphate ester adhesion promoter, and 400 parts mercaptosilane coupling agent modified talc.

[0048] Modified resin A, by weight, comprises the following raw materials: 240 parts ethylene glycol, 180 parts trimethylolpropane diallyl ether, 320 parts tetrahydrophthalic anhydride, 100 parts maleic anhydride, 60 parts 3-(triethoxysilyl)propylsuccinic anhydride, 320 parts styrene, 0.6 parts 1,4-naphthoquinone, 0.6 parts antioxidant 264, and 0.5 parts tert-butylhydroquinone.

[0049] The preparation method of modified resin A includes the following steps:

[0050] S1. Ethylene glycol, tetrahydrophthalic anhydride and 0.049 parts of tert-butylhydroquinone are added to the reaction vessel, the air is removed by vacuuming, the temperature is raised and nitrogen protection is applied. First, the temperature is directly raised to 150℃, then raised to 210℃ within 5 hours, and finally kept at a constant temperature for 5 hours without vacuuming, so that the acid value is ≤30mgKOH / g.

[0051] S2. After cooling to 90℃, add 3-(triethoxysilyl)propylsuccinic anhydride and maleic anhydride, remove air by vacuum, first heat to 165℃, then heat to 210℃ within 2 hours, after 3 hours, cool to 165℃, add trimethylolpropane diallyl ether dropwise, control the dropwise addition time to 3 hours, then heat to 210℃ within 3 hours, react until the acid value is 25mgKOH / g, and the viscosity value is 680mpa.s measured by the viscometer.

[0052] S3. First, add styrene and 0.301 parts of tert-butylhydroquinone to the dilution vessel, then add the material from step S2, cool to 130°C, start stirring, and when the temperature drops to ≤50°C, add 1,4-naphthoquinone, antioxidant 264 and 0.15 parts of tert-butylhydroquinone in sequence, and finally cool to 45°C to obtain modified resin A.

[0053] Modified resin B, by weight, comprises the following raw materials: 420 parts diethylene glycol, 320 parts maleic anhydride, 320 parts styrene, 180 parts triallyl isocyanate, 0.7 parts antioxidant 264, 0.6 parts tert-butylhydroquinone, 0.6 parts 1,4-naphthoquinone, and 0.15 parts copper naphthenate.

[0054] The preparation method of modified resin B includes the following steps:

[0055] Step 1: Add diethylene glycol, maleic anhydride and 0.11 parts of tert-butylhydroquinone into the reaction vessel, evacuate to remove air, heat up, and protect with nitrogen. First, directly heat to 160℃, then heat to 210℃ over 3 hours, and finally keep at a constant temperature for 3 hours without evacuation, so that the acid value is ≤35mgKOH / g.

[0056] Step 2: Cool down to 165℃, add triallyl isocyanate dropwise, control the dropwise addition time to 3h, maintain the temperature at 165±2℃ throughout the process, keep the temperature constant for 2h after the dropwise addition is completed, and then raise the temperature to 190℃ for another 3h. React until the acid value is <35mgKOH / g, and the viscosity value is measured to be 600 mpa.s by a viscometer.

[0057] Step 3: First, add styrene and 0.343 parts of tert-butylhydroquinone to the dilution vessel, then add the material from Step 2, cool to 130°C, start stirring, and when the temperature drops to ≤50°C, add 1,4-naphthoquinone, antioxidant 264, copper naphthenate, and 0.147 parts of tert-butylhydroquinone in sequence to obtain modified resin B.

[0058] The accelerator is N,N-diisopropanol-p-toluidine.

[0059] The pigment is titanium dioxide.

[0060] The thixotropic agent is hydrophobic fumed silica, Shandong Hongruitong New Material Technology Co., Ltd., HD171.

[0061] The photoinitiator is 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

[0062] The wetting and dispersing agent is BYK-W966.

[0063] The defoamer is BYK-1799.

[0064] The epoxy phosphate adhesion promoter is BETTERSOL 7277, manufactured by Shanghai Canghong Industrial Co., Ltd.

[0065] Talc powder includes coarse talc powder and fine talc powder in a mass ratio of 2:2.

[0066] The particle size of coarse talc powder is 500 mesh.

[0067] The particle size of fine talc powder is 1000 mesh.

[0068] A method for preparing talc modified with mercaptosilane coupling agent includes the following steps:

[0069] Talc powder was added to an ethanol solution of 3-mercaptopropyltrimethoxysilane and stirred at 60°C for 3 hours for modification. After modification, the mixture was filtered, washed and dried to obtain talc powder modified with mercaptosilane coupling agent.

[0070] The concentration of the ethanol solution of 3-mercaptopropyltrimethoxysilane is 3 wt%.

[0071] The mass ratio of talc to 3-mercaptopropyltrimethoxysilane is 1:0.2.

[0072] The preparation method of the above-mentioned photo-energy sheet metal putty includes the following steps: First, mix modified resin A and modified resin B evenly, then add accelerator, photoinitiator, wetting and dispersing agent, epoxy phosphate ester adhesion promoter, defoamer, pigment, thixotropic agent, mercaptosilane coupling agent, and modified talc powder in sequence. After each raw material is added, it must be stirred evenly before adding another raw material. Finally, disperse evenly using a high-speed disperser. First, disperse at a speed of 1000 r / min for 5 min; then disperse at a speed of 3000 r / min for 8 min; and finally disperse at a speed of 6000 r / min for 20 min. The temperature is controlled at 51-55℃. Example 2

[0073] The light-powered sheet metal putty differs from Example 1 only in that, by weight, it includes the following raw materials: 230 parts modified resin A, 80 parts modified resin B, 7 parts accelerator, 6 parts pigment, 5 parts thixotropic agent, 4 parts photoinitiator, 4 parts wetting and dispersing agent, 2.5 parts defoamer, 1 part epoxy phosphate ester adhesion promoter, and 500 parts mercaptosilane coupling agent modified talc powder; all other components are the same. Example 3

[0074] The light-powered sheet metal putty differs from Example 1 only in that, by weight, it includes the following raw materials: 260 parts modified resin A, 120 parts modified resin B, 10 parts accelerator, 8 parts pigment, 7 parts thixotropic agent, 6 parts photoinitiator, 5 parts wetting and dispersing agent, 3 parts defoamer, 1.5 parts epoxy phosphate ester adhesion promoter, and 600 parts mercaptosilane coupling agent modified talc; all other components are the same.

[0075] Comparative Example 1

[0076] The only difference from Example 3 is that the formulation of modified resin A is different, and 3-(triethoxysilyl)propylsuccinic anhydride is replaced with an equal mass fraction of maleic anhydride; all other aspects are the same.

[0077] Comparative Example 2

[0078] The only difference from Example 3 is that the formulation of modified resin B is different, and triallyl isocyanate is replaced with an equal mass fraction of dicyclopentadiene; all other aspects are the same.

[0079] Comparative Example 3

[0080] The only difference from Example 3 is that modified resin A is replaced with an equal mass of modified resin B; all other aspects are the same.

[0081] Comparative Example 4

[0082] The only difference from Example 3 is that modified resin B is replaced with an equal mass of modified resin A; all else is the same.

[0083] Comparative Example 5

[0084] The only difference from Example 3 is that the epoxy phosphate ester adhesion promoter is replaced with an equal mass of epoxy silicone adhesion promoter, BETTERSOL 7442, Shanghai Canghong Industrial Co., Ltd.; all other aspects are the same.

[0085] Comparative Example 6

[0086] The only difference from Example 3 is that the epoxy phosphate ester adhesion promoter is replaced with an equal mass of an organosilicon adhesion promoter containing unsaturated olefin bonds, BETTERSOL 7443, Shanghai Canghong Industrial Co., Ltd.; all other aspects are the same.

[0087] Comparative Example 7

[0088] The only difference from Example 3 is that the mercaptosilane coupling agent modified talc is replaced with an equal mass of aminosilane coupling agent modified talc. The only difference between the preparation method of the aminosilane coupling agent modified talc and the preparation method of the mercaptosilane coupling agent modified talc is that 3-mercaptopropyltrimethoxysilane is replaced with KH550; all other aspects are the same.

[0089] Performance testing:

[0090] The light-energy sheet metal putty of Examples 1-3 and Comparative Examples 1-7 were mixed evenly with 2% (by weight) of paste-like benzoyl peroxide, and then the following performance tests were performed:

[0091] (1) Drying time (actual dry): Tested according to GB / T 9286-2021, using UV-LED light;

[0092] (2) Adhesion: Tested according to GB / T 9286-2021;

[0093] (3) Heat resistance: The substrate is steel plate and the putty layer is 5mm thick. After baking at 180℃ for 1 hour, observe whether there is blistering, cracking or peeling. If there is no blistering, cracking or peeling, continue to test the adhesion according to GB / T 9286-2021.

[0094] (4) Low temperature resistance: The substrate is steel plate and the putty layer thickness is 5mm. After being placed at -50℃ for 1 hour, observe whether there is blistering, cracking or peeling. If there is no blistering, cracking or peeling, continue to test the adhesion according to GB / T 9286-2021.

[0095] (5) Temperature change cycle number: The substrate is a steel plate with a putty layer thickness of 5mm. After being placed at room temperature for 12 hours, the substrate is placed in a 50℃ constant temperature oven for 12 hours. After being taken out, it is placed at room temperature for 12 hours. Then it is placed in a -50℃ freezer for 12 hours. After being taken out, it is placed at room temperature for 12 hours. If no blistering, cracking or peeling occurs, it is considered one cycle. Every 10 cycles, it is taken out for observation.

[0096] The performance test results are shown in Table 1 below.

[0097] Table 1 Performance Test Results

[0098]

[0099] Note: In the results of the temperature change cycle test: ≥20 cycles means that no blistering, cracking or peeling occurred after 20 temperature change cycles, and no further tests were conducted; 20 cycles means that blistering, cracking or peeling occurred after 20 temperature change cycles; 10 cycles means that blistering, cracking or peeling occurred after 10 temperature change cycles.

[0100] As can be seen from Table 1, the light-energy sheet metal putty provided in Examples 1-3 can be cured in 1 minute and has excellent adhesion, heat resistance, low temperature resistance and temperature change cycle resistance.

[0101] In Comparative Example 1, the modified resin A formulation replaced 3-(triethoxysilyl)propylsuccinic anhydride with maleic anhydride, resulting in a decrease in the adhesion, heat resistance, low-temperature resistance, and temperature cycle resistance of the resulting light energy sheet metal putty.

[0102] In Comparative Example 2, the modified resin B formulation replaced triallyl isocyanate with dicyclopentadiene, resulting in a light-energy sheet metal putty with improved heat resistance, low-temperature resistance, and resistance to temperature cycling.

[0103] In Comparative Example 3, which only contained modified resin B, the curing time of the resulting light-energy sheet metal putty was significantly longer, and its adhesion, heat resistance, low-temperature resistance, and temperature change cycle resistance decreased.

[0104] In Comparative Example 4, which only contained modified resin A, the resulting light-energy sheet metal putty had a longer curing time and decreased adhesion, heat resistance, and temperature change cycle resistance.

[0105] In Comparative Example 5, the epoxy phosphate ester adhesion promoter was replaced with an equal mass of epoxy silicone adhesion promoter; in Comparative Example 6, the epoxy phosphate ester adhesion promoter was replaced with an equal mass of silicone adhesion promoter containing unsaturated olefin bonds. The adhesion, heat resistance, low temperature resistance and temperature change cycle resistance of the resulting light energy sheet metal putty all decreased.

[0106] In Comparative Example 7, replacing the mercaptosilane coupling agent modified talc with the same mass of aminosilane coupling agent modified talc resulted in a significantly longer curing time for the resulting light-energy sheet metal putty.

[0107] The factory inspection report for the light-energy sheet metal putty in Example 3 is as follows: Figure 2 As shown.

[0108] Depend on Figure 2 It can be seen that the light-energy sheet metal putty of Embodiment 3 of the present invention meets the requirements of HG / T 4561-2013.

[0109] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A light-energy sheet metal putty, characterized in that, The raw materials include: modified resin A, modified resin B, accelerator, pigment, thixotropic agent, photoinitiator, wetting and dispersing agent, defoamer, epoxy phosphate ester adhesion promoter, mercaptosilane coupling agent, and modified talc. The raw materials for the synthesis of the modified resin A include ethylene glycol, trimethylolpropane diallyl ether, tetrahydrophthalic anhydride, maleic anhydride, 3-(triethoxysilyl)propylsuccinic anhydride, tert-butylhydroquinone, styrene, 1,4-naphthoquinone, and antioxidant 264. The raw materials for synthesizing the modified resin B include diethylene glycol, triallyl isocyanate, tert-butylhydroquinone, maleic anhydride, styrene, 1,4-naphthoquinone, antioxidant 264, and copper naphthenate.

2. The light-energy sheet metal putty according to claim 1, characterized in that, The light-energy sheet metal putty, by weight, comprises the following raw materials: 200-260 parts of modified resin A, 60-120 parts of modified resin B, 5-10 parts of accelerator, 5-8 parts of pigment, 4-7 parts of thixotropic agent, 3-6 parts of photoinitiator, 3-5 parts of wetting and dispersing agent, 2-3 parts of defoamer, 0.5-1.5 parts of epoxy phosphate ester adhesion promoter, and 400-600 parts of mercaptosilane coupling agent modified talc.

3. The light-energy sheet metal putty according to claim 1 or 2, characterized in that, The modified resin A, by weight, comprises the following raw materials: 220-250 parts ethylene glycol, 150-200 parts trimethylolpropane diallyl ether, 300-350 parts tetrahydrophthalic anhydride, 80-120 parts maleic anhydride, 50-70 parts 3-(triethoxysilyl)propylsuccinic anhydride, 300-330 parts styrene, 0.5-0.7 parts 1,4-naphthoquinone, 0.5-0.7 parts antioxidant 264, and 0.4-0.6 parts tert-butylhydroquinone.

4. The light-energy sheet metal putty according to claim 1 or 2, characterized in that, The modified resin B, by weight, comprises the following raw materials: 400-450 parts diethylene glycol, 300-350 parts maleic anhydride, 300-350 parts styrene, 150-200 parts triallyl isocyanate, 0.6-0.8 parts antioxidant 264, 0.5-0.7 parts tert-butylhydroquinone, 0.5-0.7 parts 1,4-naphthoquinone, and 0.1-0.2 parts copper naphthenate.

5. The light-energy sheet metal putty according to claim 1, characterized in that, The epoxy phosphate adhesion promoter is selected from BETTERSOL 7277 or BETTERSOL 7267.

6. The light-energy sheet metal putty according to claim 1, characterized in that, The talc powder comprises coarse talc powder and fine talc powder in a mass ratio of 2-3:2-3; the particle size of the coarse talc powder is 300-600 mesh; and the particle size of the fine talc powder is 800-1200 mesh.

7. The light-energy sheet metal putty according to claim 6, characterized in that, The preparation method of the talc modified by the mercaptosilane coupling agent includes the following steps: Talc powder was added to an ethanol solution of mercaptosilane coupling agent and stirred at 50-60℃ for 1-4 hours for modification. After modification, the mixture was filtered, washed and dried to obtain mercaptosilane coupling agent modified talc powder.

8. The light-energy sheet metal putty according to claim 7, characterized in that, The mercaptosilane coupling agent is one or more of 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, mercaptopropyldimethoxymethylsilane, or mercaptoethyltriethoxysilane.

9. The method for preparing the light-energy sheet metal putty according to any one of claims 1-8, characterized in that, Includes the following steps: First, mix modified resin A and modified resin B evenly, then add accelerator, photoinitiator, wetting and dispersing agent, epoxy phosphate adhesion promoter, defoamer, pigment, thixotropic agent, mercaptosilane coupling agent, and modified talc powder in sequence. Finally, disperse evenly using a high-speed disperser. First, disperse at a speed of 1000-1500 r / min for 3-5 min; then disperse at a speed of 3000-3500 r / min for 5-8 min; and finally disperse at a speed of 5000-6000 r / min for 15-20 min, with the temperature controlled at 51-55℃.

10. The application of the light-energy sheet metal putty according to any one of claims 1-9 in automobiles, high-speed trains, trains, and ships.

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