Haptic actuator and display device including haptic actuator

Abstract

A haptic actuator and a display device including the same are provided. The haptic actuator includes a reinforcing member in which a support extends downward from a long side of a body having a rectangular planar shape disposed on a piezoelectric element. The cavity is positioned along a relatively long side of the reinforcement member. Vibration generated in the piezoelectric element can be efficiently transmitted to the cavity positioned along the long side of the reinforcing member.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0140621, filed in Korea on October 15, 2024, the entire contents of which are expressly incorporated herein by reference. Technical Field

[0003] This disclosure relates to a tactile actuator, and more specifically, to a tactile actuator capable of efficiently transmitting vibrations from a piezoelectric element, and a display device including the tactile actuator. Background Technology

[0004] Touch interfaces are already used in mobile electronic devices such as smartphones, tablet PCs, and laptops. Haptic technology, which provides the use of touch associated with touch interfaces to enhance the user experience, has attracted attention. Compared to conventional electronic devices, electronic devices using haptic technology can provide users with a more realistic touch interface.

[0005] Vibration motors are known to be tactile devices that provide users with a sense of touch. To drive a vibration motor, the size or dimensions of the modules constituting the electronic device must be increased. As the overall size of electronic devices using vibration motors increases, there are limitations to reducing the size of the electronic device. Furthermore, vibration motor methods, as a tactile technology, only achieve a simple vibration effect of shaking the entire electronic device, making it difficult to provide various feedback to the user.

[0006] Other haptic technologies applied to electronic devices achieve "point" vibration, resulting in a narrow vibration generation area. Therefore, they are difficult to apply to increasingly larger mobile devices. To address these issues, the proposed haptic technology has a highly complex structure, requiring not only individual components but also exhibiting the problem of vibration concentration in specific areas. Summary of the Invention

[0007] Therefore, one or more embodiments of this disclosure relate to display devices that substantially eliminate one or more problems caused by the limitations and disadvantages of related technologies.

[0008] One aspect of this disclosure is to provide a tactile actuator capable of efficiently transmitting vibrations by increasing the vibration-generating area, and a display device including the tactile actuator.

[0009] Another aspect of this disclosure is to provide a haptic actuator that can be easily manufactured using a simple structure and that can achieve various feedbacks without the use of other components, as well as a display device including the haptic actuator.

[0010] Additional features and aspects will be set forth in the following description and will become apparent in part from the description, or may be learned by practicing the disclosed concepts provided herein. Other features and aspects of the disclosed concepts may be realized and obtained by means of structures particularly pointed out in or derived from the draft specification, its claims, and the accompanying drawings.

[0011] To achieve these and other aspects of the inventive concept as implemented and broadly described, this disclosure provides a tactile actuator comprising: a piezoelectric element having a hexahedral shape; and a reinforcing member disposed on the piezoelectric element, wherein the reinforcing member comprises: a body having a rectangular planar shape, the body having a first side and a second side, the second side being adjacent to the first side and having a length shorter than the length of the first side, and the body being disposed on an upper surface of the piezoelectric element; and a support extending downward from the first side of the body.

[0012] The support member may include: a connecting portion extending downward from a first side; and a supporting portion extending outward from the connecting portion.

[0013] In one embodiment, the connecting portion may have an outwardly inclined cross-sectional shape.

[0014] As an example, the connection may have a cross-sectional shape that slopes outward at an angle between approximately 30° and approximately 60°.

[0015] In another embodiment, the length of the first side may be approximately 2 to approximately 5 times the length of the second side.

[0016] Reinforcing components may include metallic materials.

[0017] In one embodiment, the piezoelectric element may include: a vibrator in the form of a single-layer thin film; and an electrode connected to one side of the vibrator.

[0018] Vibrators may include electroactive materials or piezoelectric ceramic materials.

[0019] As an example, electroactive materials may include materials selected from the group consisting of: silicone-containing resins, acryloyl-containing resins, urethane-containing resins, natural reinforced rubbers, polyvinylidene fluoride (PVDF), polyvinylidene fluoride-trifluoroethylene copolymer (P(VDF-TrFE)), and combinations thereof.

[0020] Piezoelectric ceramic materials may include materials selected from the group consisting of: lead zirconate titanate (PZT), zirconium modified zirconium titanate, barium titanate (BT), lanthanum modified lead barium metaniobate (PBLN), aluminum nitride (AlN), zinc oxide (ZnO), and combinations thereof.

[0021] Electrodes may include materials selected from the group consisting of: carbon grease, rubber, metals, and combinations thereof.

[0022] Piezoelectric elements can have a cuboid shape.

[0023] In another aspect, this disclosure provides a display device including a haptic actuator and a display panel located on the haptic actuator.

[0024] As an example, a display panel may include a substrate having pixel areas; light-emitting diodes disposed on the substrate; and a touch sensor disposed on the light-emitting diodes.

[0025] Alternatively or optionally, the display panel may further include: a color filter layer disposed on a light-emitting diode; and a thin-film transistor disposed on a substrate and electrically connected to the light-emitting diode.

[0026] In one or more embodiments, a support member is positioned along the long side of a body having a rectangular planar shape, and a reinforcing member is arranged on a piezoelectric element having a hexahedral shape (e.g., a rectangular hexahedral shape) in a tactile actuator.

[0027] Vibrations generated from a piezoelectric element with a hexahedral shape can be transmitted to a cavity formed by a support extending from the rectangular planar body constituting the reinforcing member. Through the cavity structure formed by the support formed on the long side of the body, vibrations generated from the piezoelectric element can be efficiently transmitted to the entire area of ​​the reinforcing member with the longitudinally extending support.

[0028] By applying a reinforcing member with a rectangular planar shape, vibrations generated from the piezoelectric element can be transmitted to the entire area of ​​the reinforcing member, rather than being transmitted as point vibrations. By applying a haptic actuator according to this disclosure, the area of ​​vibration transmitted from the piezoelectric element can be expanded. By applying a haptic actuator according to this disclosure, a display device that provides a more realistic tactile experience to the user can be realized. Attached Figure Description

[0029] The accompanying drawings, which provide a further understanding of this disclosure, are incorporated in and constitute a part of this application. The drawings illustrate embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0030] Figure 1 An example exploded perspective view of a tactile actuator according to one or more embodiments of the present disclosure is shown.

[0031] Figure 2 A schematic perspective view of a tactile actuator according to the present disclosure is shown.

[0032] Figure 3 It shows along Figure 2 The cross-sectional view taken by line A-A' in the diagram.

[0033] Figure 4 A cross-sectional view of only the reinforced component is shown.

[0034] Figure 5 It shows along Figure 2 The cross-sectional view taken by line B-B' in the diagram only shows the reinforcing component.

[0035] Figure 6 A schematic cross-sectional view of a component showing a piezoelectric element in a tactile actuator is shown.

[0036] Figure 7 A schematic perspective view of a tactile actuator manufactured by means of a comparative example is shown.

[0037] Figure 8 It shows along Figure 7 The cross-sectional view taken by line C-C' in the diagram.

[0038] Figure 9 A schematic exploded perspective view of a display device including a haptic actuator according to the present disclosure is shown.

[0039] Figure 10 A schematic cross-sectional view of a display device including a haptic actuator according to the present disclosure is shown.

[0040] Figure 11 A schematic circuit diagram of a display panel in a display device according to the present disclosure is shown.

[0041] Figure 12 A schematic cross-sectional view of a display panel according to this disclosure is shown.

[0042] Figures 13 to 16 A graph showing the vibration acceleration measured in a haptic actuator manufactured according to this disclosure is shown. Detailed Implementation

[0043] The advantages and features of this disclosure, as well as methods for implementing them, will become clear from the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. The embodiments are provided so that this disclosure will be comprehensive and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0044] The shapes, dimensions, ratios, angles, numbers, etc., disclosed in the accompanying drawings to describe embodiments of this disclosure are merely illustrative examples, and therefore this disclosure is not limited to the examples shown. Unless otherwise stated, the same reference numerals refer to the same parts throughout this disclosure. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted or briefly discussed where such detailed descriptions might unnecessarily obscure the key points of this disclosure.

[0045] Where terms such as “including,” “having,” or “comprising” are used in this disclosure, additional terms may be added unless more restrictive terms such as “only” are used herein. Furthermore, where a component is expressed in the singular, the plural is included unless otherwise stated, and where a component is expressed in the plural, the singular is included unless otherwise stated.

[0046] When analyzing components, the error range should be interpreted as being included, even if there is no explicit description.

[0047] When describing positional relationships, for example, when describing the positional relationship between two parts / layers as "above", "on", "above", "below", "below", "next to", etc., one or more other parts / layers may be placed between the two parts / layers unless more restrictive terms such as "closely to" or "directly" are used with them.

[0048] When a component or layer is referred to as being "on" another component or layer, it includes either the other component or layer being directly on the other component or layer, or the presence of another component or layer between them.

[0049] When describing temporal relationships, such as when describing temporal precedence as "after," "following," "next," "before," etc., non-continuous or non-sequential cases may also be included unless more restrictive terms such as "immediately" or "directly" are used. Furthermore, the term "can" fully encompasses all the meanings and scope of the term "may," and the term "can" fully encompasses all the meanings and scope of the term "able."

[0050] While the terms first, second, etc., can be used to describe various components, these components are not substantially limited by these terms. These terms are used only to refer to a component separate from another component and do not limit any particular order or sequence. Therefore, within the technical scope of this disclosure, the first component described below can be substantially the second component, and the second component described below can be substantially the first component.

[0051] Features of the various embodiments of this disclosure may be partially or completely incorporated or combined with each other, and technically, various interlocks and drives are possible, and each of the embodiments may be implemented independently of each other or together in an interdependent relationship.

[0052] All components of each display device according to all embodiments of this disclosure are operatively coupled and configured.

[0053] Reference will now be made in detail to various aspects of this disclosure, examples of which are shown in the accompanying drawings. Where possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts.

[0054] Figure 1 An example exploded perspective view of a tactile actuator according to one or more embodiments of the present disclosure is shown. Figure 2 A schematic perspective view of a tactile actuator according to the present disclosure is shown. Figure 3 It shows along Figure 2 The cross-sectional view taken by line A-A' in the diagram. Figure 4 A cross-sectional view of only the reinforced component is shown. Figure 5 It shows along Figure 2 The cross-sectional view taken by line B-B' in the diagram only shows the reinforcing component.

[0055] Reference Figures 1 to 5 The tactile actuator 100 according to this disclosure includes a piezoelectric element 110 and a reinforcing member 120 disposed on the piezoelectric element 110. The piezoelectric element 110 may have a hexahedral shape, for example, a rectangular hexahedron or a cuboid shape.

[0056] The reinforcing member 120 disposed on the piezoelectric element 110 may have a body 121 having a rectangular planar shape. The rectangular planar body 121 has a first side (long side, major axis) 122 extending along a first direction (X-axis direction) and facing each other, and a second side (short side, minor axis) 124 extending along a second direction perpendicular to the first direction (Y-axis direction) and facing each other. The first side 122 and the second side 124 define the rectangular planar shape of the body 121. As an example, the body 121 may have a flat upper surface and a flat lower surface.

[0057] Reinforcing members with square or dome shapes can only receive vibrations concentrated in the central region in the form of dots or points. In contrast, the reinforcing member 120 of the body 121 with a rectangular planar shape can efficiently receive vibrations across the entire surface.

[0058] The body 121 can have a structure with substantially flat upper and lower surfaces. If the lower surface of the body 121 is not flat, the body 121 is difficult to process, and vibrations generated from the piezoelectric element 110 cannot be transmitted efficiently because an additional thick film structure must be formed. In addition, there is a problem that vibrations are concentrated only in specific areas (e.g., peripheral areas such as edges).

[0059] However, since the main body 121 of the reinforcing member 120 constituting this disclosure is flat on both its upper and lower surfaces, the main body 121 can be easily processed. In addition, since a separate thick film is not required, vibrations generated from the piezoelectric element 110 can be efficiently and uniformly transmitted to the entire reinforcing member 120.

[0060] The first length L1 of the first side 122 of the body 121 defining the rectangular planar shape is longer than the second length L2 of the second side 124. For example, the first length L1 of the first side 122 may be extended to about 2 to about 5 times the length of the second length L2 of the second side 124. In an exemplary embodiment, the first length L1 of the first side 122 may be between about 90 mm and about 150 mm, and the second length L2 of the second side 124 may be between about 30 mm and about 50 mm, but is not limited thereto.

[0061] A support member or support structure 126 is connected to a first side 122 defining the body 121 and has a relatively long length L1 extending downward. When the support member 126 is arranged, the body 121 can be arranged to be spaced apart from the upper surface of the piezoelectric element 110 by a predetermined height H. On the other hand, no support member is formed on the second side 124 of the body 121 defining the shape of the reinforcing member 120 and having a relatively short length L2.

[0062] The support member 126 connected to the first side 122 may include a connecting portion 127 extending downward from the first side 122 and a support portion 128 extending outward from the connecting portion 127. Therefore, the body 121, arranged to be spaced a predetermined height H from the upper surface of the piezoelectric element 110, has a cavity that, when viewed from the second side 124 having a relatively short length L2, extends a long distance along the first side 122 having a relatively long length L1. On the other hand, when viewed from the first side 122, the body 121 does not have any cavity along the second side 124 having a relatively short length L2.

[0063] The reinforcing member 120 has a cavity structure extending along a long distance along a first side 122 having a relatively long length L1. Vibrations generated from the piezoelectric element 110 having a hexahedral shape can be efficiently transmitted to the reinforcing member 120 through the cavity structure extending along the first side 122.

[0064] In an exemplary embodiment, the connecting portion 127 may extend downward in a vertical direction relative to the cross-section of the first side 122 defining the body 121. In another embodiment, the connecting portion 127 may have a cross-sectional shape that extends outward as the connecting portion 127 extends downward relative to the cross-section of the first side 122. When the connecting portion 127 has a cross-sectional shape that slopes outward, vibrations generated in the piezoelectric element 110 can be transmitted to the reinforcing member 120 more efficiently.

[0065] In one embodiment, the length L3 of the inclined connecting portion 127 can be between about 3 mm and about 30 mm, for example, between about 5 mm and about 20 mm, but is not limited thereto. In another embodiment, the inclination θ of the support member 126 between the connecting portion 127 and the upper surface of the piezoelectric element 110, or the angle between the connecting portion 127 and the cross-section of the body 121, can be, but is not limited to, about 30° to about 60°. In another embodiment, the length of the support portion 128 extending from the end of the connecting portion 127 to the outside can be, but is not limited to, about 2 mm to about 10 mm.

[0066] A connecting portion 127 extends downward from a first side 122 defining the planar shape of the body 121, and a support portion 128 extends outward from the end of the connecting portion 127. The support portion 128 may be arranged on the peripheral region of the piezoelectric element 110. Therefore, the body 121 may have a height H spaced apart from the upper surface of the piezoelectric element 110. For example, the height H between the lower surface of the body 120 and the upper surface of the piezoelectric element 110 may be, but is not limited to, about 3 mm to about 7 mm.

[0067] The thickness T of the reinforcing member 120 (including the body 121 and the support member 126 extending downward from the first side 122, which is the relatively longer of the two sides defining the rectangular planar shape of the body 121) can be, but is not limited to, about 0.1 mm to about 1 mm, for example, about 0.1 mm to about 0.5 mm.

[0068] In one exemplary embodiment, the reinforcing member 120 may include a metallic material or component. For example, the reinforcing member 120 may include, but is not limited to, a metallic material selected from aluminum, titanium, alloys thereof, or combinations thereof.

[0069] On the other hand, refer to Figure 7 and Figure 8 When the tactile actuator 200 includes the following reinforcing member 220, the vibration generated in the piezoelectric element 110 cannot be efficiently transmitted to the reinforcing member 220: the reinforcing member 220 has a body 221 with a rectangular planar shape defining a long side 222 and a short side 224, and a support member 226 with a connecting portion 227 connected to the short side 224 and a support portion 228.

[0070] The components in the piezoelectric element 110 will be described in more detail. Figure 6 A schematic cross-sectional view of a component demonstrating a piezoelectric element in a haptic actuator is shown.

[0071] Reference Figure 1 and Figure 6 The piezoelectric element 110 may include protective films 130A and 130B surrounding the vibrator 112. As an example, the protective films may include, but are not limited to, an upper protective film 130A surrounding the upper side and upper surface of the vibrator 112 of the piezoelectric element 110 and a lower protective film 130B surrounding the lower side and lower surface of the vibrator 112. For example, the protective films 130A and 130B may include, but are not limited to, polymers, such as polyethylene terephthalate (PET).

[0072] The vibrator 112 may have a hexahedral shape, such as a rectangular hexahedral shape. As an example, the vibrator 112 may have a single-layer thin-film shape and may include an electroactive material or a piezoelectric ceramic material. The electroactive material may be an electroactive polymer.

[0073] Electroactive polymers are polymers that reproducibly exhibit expansion, contraction, and bending phenomena upon electrical stimulation. Depending on the method of operation, electroactive polymers can include ionic electroactive polymers (ionic EAPs) and electronic electroactive polymers (EEPs). In ionic electroactive polymers, the polymer undergoes a “contraction-expansion-deformation” process through the movement and diffusion of ions, while in electronic electroactive polymers, polarization occurs due to an externally applied electric field, resulting in deformation. Electroactive polymers can be electronically electroactive polymers that possess beneficial mechanical properties, high driving force and durability, and fast response speeds.

[0074] As an example, the electroactive polymer may include, but is not limited to, piezoelectric materials selected from silicone-containing resins (e.g., polydimethylsiloxane (PDMS)), acryloyl-containing resins, natural reinforced rubber, polyvinylidene fluoride (PVDF), polyvinylidene fluoride-trifluoroethylene copolymer (P(VDF-TrFe)), and combinations thereof, and may be processed into thin films.

[0075] Piezoelectric materials may include, but are not limited to, materials selected from the group consisting of: lead zirconate titanate (PZT), zirconium modified zirconate, barium titanate (BT), lanthanum modified lead barium metaniobate (PBLN), aluminum nitride (AlN), zinc oxide (ZnO), and combinations thereof.

[0076] In one exemplary embodiment, the first electrode 118a can be connected to the upper side of the vibrator 112 via the first conductive layer 116a, and the second electrode 118b can be connected to the lower side of the vibrator via the second conductive layer 116b. For example, each of the first conductive layer 116a and the second conductive layer 116b can be, respectively, a highly conductive metallic material such as silver (Ag), copper (Cu), and aluminum (Al). The first electrode 118a and the second electrode 118b can be connected to an external power source.

[0077] As an example, each of the first electrode 118a and the second electrode 118b may be, respectively, including but not limited to, carbon grease, rubber, metal (e.g., aluminum, copper and / or silver) and combinations thereof.

[0078] The voltage applied to the piezoelectric element 110 can be from about 50Vp-p to about 200Vp-p, for example, from about 50Vp-p to about 100Vp-p, and can be applied to the first electrode 118a and the second electrode 118b respectively, including voltage frequencies from about 130Hz to about 250Hz. For example, the first electrode 118a and the second electrode 118b can be formed on one side of the vibrator 112, which can be made of an electroactive material, and spaced apart by a predetermined interval, for example, an interval of about 10mm, but are not limited thereto.

[0079] The first electrode 118a and the second electrode 118b have a potential difference due to the applied voltage, and therefore can generate vibration by repeated contraction and expansion. For example, the force of the electric field used to deform the electroactive material included in the vibrator 112 can be, but is not limited to, about 100 V / μm to about 200 V / μm.

[0080] When a driving voltage is applied to the vibrator 112, the electroactive material included in the vibrator 112 contracts from a high potential (e.g., ~10V) to a low potential (e.g., 0V) due to the potential difference between the first electrode 118a and the second electrode 118b. Conversely, when the driving voltage is cut off, the electroactive material becomes common potential and changes from a contracted state to an expanded state. As this contraction-expansion occurs continuously, vibration is generated, and this vibration is transmitted to the reinforcing member 120 arranged on top of the piezoelectric element 110.

[0081] In one embodiment, when a voltage is applied to the piezoelectric element 110, the main body 121 constituting the reinforcing member 120 arranged on the top of the piezoelectric element 10 and the connecting portion 127 extending downward from the first side 122, which defines the rectangular planar shape of the main body 121 and has a relatively long first length L1, can move in the vertical direction d1 within the cross-section of the piezoelectric element 110. On the other hand, the support portion 128, which is the end of the reinforcing member 120, is connected to the piezoelectric element 110 by an adhesive or the like. Therefore, the vertical movement of the support portion 128 is restricted, and the support portion 128 moves in the horizontal direction d2 due to vibrations generated in the piezoelectric element 110.

[0082] In another embodiment, the operating frequency of the haptic actuator 100 can be from about 130 Hz to about 250 Hz, which is based on, but not limited to, the frequency band of the mechanical receiver that the human senses to perceive the roughness and smoothness of an object. When the haptic actuator 100 has a vibration acceleration of 130 Hz to 250 Hz, it includes a response frequency of 130 Hz to 250 Hz when receiving vibrational stimulation from the innermost layer of human skin. Therefore, various tactile sensations can be fed back to the user based on changes in contact time or pressure of the touch input.

[0083] A display device that includes a haptic actuator according to this disclosure will be described in more detail. Figure 9 A schematic exploded perspective view of a display device including a haptic actuator according to the present disclosure is shown. Figure 10 A schematic cross-sectional view of a display device including a haptic actuator according to the present disclosure is shown.

[0084] Reference Figure 9 and Figure 10 The display device 300, such as a light-emitting display device, may include a tactile actuator 100 that generates vibration, a lower frame 310 disposed on the tactile actuator 100, a cover window 320 disposed on the opposite side of the lower frame 310, a display panel 400, an inner panel 330 and a drive circuit board 340 disposed sequentially between the lower frame 310 and the cover window 320.

[0085] In one embodiment, air gaps may be formed between the cover window 320 and the display panel 400, between the display panel 400 and the inner panel 330, between the inner panel 330 and the drive circuit board 340, and / or between the drive circuit board 340 and the lower frame 310. These components or members, as well as the lower frame and the tactile actuator 100, may be connected or linked to each other using bonding devices such as adhesives and / or foam tape.

[0086] In some embodiments, any of the adhesive, tape components, and adhesive sheets may be inserted between the inner panel 330 and the lower frame 310. For example, an adhesive such as an epoxy-containing adhesive, an acrylate-containing adhesive, and / or a urethane-containing adhesive may be applied when assembling the inner panel 330 and the lower frame 310, or the adhesive may be pre-laminated onto the lower surface of the inner panel 330 or the upper surface of the lower frame 310, and these components may then be processed for assembly.

[0087] The lower frame 310 may be a cover bottom or a back panel. Located behind the inner panel 330 and / or the drive circuit board 340, the lower frame 310 has an internal space such that it can accommodate the display panel 400, the inner panel 330, and the drive circuit board 340. Alternatively, the lower frame 310 may cover at least a portion of the sides of the display panel 400 and the inner panel 330.

[0088] In one embodiment, the lower frame 310 may include a metallic material or component. In another embodiment, the lower frame 310 may include fibers, such that the lower frame 310 can have beneficial rigidity. For example, the lower frame 310 may include, but is not limited to, at least one of glass fiber, carbon fiber, metal wire, and metal fibers.

[0089] The cover window 320 forms the outer periphery of the display device 300. The cover window 320 is located outside the side of the display panel 400 where the image is displayed, and transmits the image of the display panel 400 while protecting the display panel 400 from external impacts or stress. For example, the cover window 320 may be provided on the upper surface of the display panel 400.

[0090] Cover 320 may comprise tempered glass or tempered plastic. For example, cover 320 may be made of materials selected from, but not limited to, high-strength tempered glass, polyethylene terephthalate (PET), acrylic resins (e.g., polymethyl methacrylate (PMMA)), and resins containing (meth)acrylates to prevent scratches from the outside. Cover 320 may be injection molded using in-mold lamination or co-extrusion methods utilizing these materials. When flexibility is required in the display device 300, cover 320 may be made of plastic materials.

[0091] The inner panel 330 can be positioned below the display panel 400. The size or dimensions of the inner panel 330 can be smaller than the size or dimensions of the display panel 400. For example, double-sided tape, foam tape, etc., can be used to attach the inner panel 330 to the lower surface of the display panel 400.

[0092] In another embodiment, the inner panel 330 may include a ferromagnetic and / or paramagnetic material. In this case, the inner panel 330 can provide rigidity to the display panel 400. The inner panel 330 can dissipate heat generated in the display panel 400 to the outside.

[0093] The inner plate 330 has high heat dissipation performance and may include metal components. For example, the inner plate 330 may include aluminum and / or aluminum alloys. In another embodiment, the inner plate 330 may be configured to include at least one of copper (Cu), silver (Ag), nickel (Ni), and tungsten (W), or may be formed of a heat-dissipating metal plate having an outer surface plated with at least one of nickel (Ni), silver (Ag), and gold (Au).

[0094] The driving circuit board 340 may be disposed on the lower surface of the inner plate 330. The inner plate 330 and the driving circuit board 340 are spaced apart to form an air gap. The air gap can serve as an insulating layer, preventing heat emitted from the driving circuit board 340 from being transferred to the display panel 400.

[0095] As an example, the driver circuit board 340 may include circuit components such as a timing controller. However, the configuration of the driver circuit board 340 is not limited to this, and may include various circuit components that generate signals for driving the display panel 400.

[0096] The display panel 400 can be modular, with its edges surrounded by a lower frame 310 and a cover window 330 disposed on the upper surface of the display panel 400. The display panel 400 may include a substrate, light-emitting diodes, and optionally a color filter layer and / or thin-film transistors. The display panel 400 of the display device 300 will be described in more detail.

[0097] Figure 11 A schematic circuit diagram of a display panel in a display device according to the present disclosure is shown.

[0098] Reference Figure 11 The display panel 400 includes gate lines GL, data lines DL, and power lines PL that are spaced parallel to or parallel to the data lines DL or gate lines GL, intersecting each other to define a pixel region P. Switching thin-film transistors Ts, driving thin-film transistors Td, storage capacitors Cst, and light-emitting diodes D may be disposed in the pixel region P. The pixel region P may include red sub-pixels, green sub-pixels, blue sub-pixels, and / or white sub-pixels.

[0099] The switching thin film transistor Ts is connected to the gate line GL and the data line DL. The driving thin film transistor Td and the storage capacitor Cst are connected between the switching thin film transistor Ts and the power line PL, and the light emitting diode D is connected to the driving thin film transistor Td.

[0100] In the display device 300 or the display panel 400, when the switching thin film transistor Ts is turned on by a gate signal applied to the gate line GL, the data signal applied to the data line DL is applied to the gate electrode 414 ( Figure 12 ) and one electrode of the storage capacitor Cst through the switching thin film transistor Ts.

[0101] The driving thin film transistor Td is turned on by the data signal applied to the gate electrode 414, so that a current proportional to the data signal is supplied from the power line PL to the light emitting diode D through the driving thin film transistor Td. And then, the light emitting diode D emits light with a brightness proportional to the current flowing through the driving thin film transistor Td. In this case, the storage capacitor Cst is charged with a voltage proportional to the data signal, so that the voltage of the gate electrode 414 in the driving thin film transistor Td remains constant during one frame. Therefore, the display device 100 can display a desired image.

[0102] Figure 12 A schematic cross-sectional view of a display panel in a display device according to the present disclosure is shown.

[0103] Referring to Figure 12 , the display panel 400 includes a substrate 402 and a light emitting diode D disposed on the substrate 402, and optionally a thin film transistor Tr disposed on the substrate 402 and a color filter layer 472 disposed on the light emitting diode D.

[0104] The substrate 402 defines a pixel region P including red sub-pixels, green sub-pixels, and blue sub-pixels. Alternatively or additionally, the pixel region P may further include white sub-pixels. The substrate 402 may be a glass substrate and / or a flexible substrate. For example, the substrate 402 may be one of a polyimide (PI) substrate, a polyethersulfone (PS) substrate, a polyethylene naphthalate (PEN) substrate, a polyethylene terephthalate (PET) substrate, and a polycarbonate (PC) substrate, but is not limited thereto.

[0105] The thin film transistor Tr is disposed on the substrate 402. In Figure 12 , the thin film transistor Tr is directly disposed on the substrate 402. Alternatively, a buffer layer is disposed on the substrate 402, and the thin film transistor Tr may be disposed on the buffer layer. For example, the buffer layer may include, but is not limited to, an inorganic insulating material, such as silicon oxide (SiO x , x , Figure 12 , where 0 < x ≤ 2), silicon nitride (SiN x, where 0 < x ≤ 2), etc.

[0106] The thin film transistor Tr may include a semiconductor layer 410, a gate electrode 414, a source electrode 430, and a drain electrode 432. The thin film transistor Tr may be a driving thin film transistor Td( Figure 11 ).

[0107] The semiconductor layer 410 is provided on the substrate 402. In one embodiment, the semiconductor layer 410 may include an oxide semiconductor material. The oxide semiconductor material may include, but is not limited to, zinc oxide (ZnO), indium zinc oxide (IZO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and / or indium tin zinc oxide (ITZO).

[0108] When the semiconductor layer 410 includes an oxide semiconductor material, a light shielding pattern may be provided under the semiconductor layer 410. The light shielding pattern may prevent light from incident on the semiconductor layer 410, and thus prevent or reduce the deterioration of the semiconductor layer 210 due to light.

[0109] In another embodiment, the semiconductor layer 410 may include polysilicon. In this case, the opposite edges of the semiconductor layer 410 may be doped with impurities.

[0110] A gate insulating layer 412 including an insulating material is provided on the semiconductor layer 410 over the entire substrate 402. The gate insulating layer 412 may include, but is not limited to, an inorganic insulating material, for example, silicon oxide (SiO x , where 0 < x ≤ 2), silicon nitride (SiN x , where 0 < x ≤ 2).

[0111] The gate electrode 414 made of a conductive material such as a metal component is provided on the gate insulating layer 412 corresponding to the center of the semiconductor layer 410. For example, the gate electrode 414 may include, but is not limited to, metals such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), gold (Au), and / or silver (Ag). The gate electrode 414 may have a single-layer structure or a multi-layer structure. <??

[0112] Although the gate insulating layer 412 is provided on Figure 12 the entire area of the substrate 402 in

[0113] An interlayer insulating layer 420 including an insulating material is provided on the gate electrode 414 and covers the entire surface of the substrate 402. For example, the interlayer insulating layer 420 may include, but is not limited to, silicon oxide (SiO x , where 0 < x ≤ 2) and silicon nitride (SiN x, an inorganic insulating material where 0 < x ≤ 2), or an organic insulating material such as benzocyclobutene or photoacrylic acid. The interlayer insulating layer 420 may have a single-layer structure or a multi-layer structure.

[0114] The interlayer insulating layer 420 has a first semiconductor layer contact hole 422 and a second semiconductor layer contact hole 424, and the first semiconductor layer contact hole 422 and the second semiconductor layer contact hole 424 expose or do not cover a part of the surface of the semiconductor layer 410 that is closer to the opposite end than the center. The first semiconductor layer contact hole 422 and the second semiconductor layer contact hole 424 are provided on opposite sides of the gate electrode 414 and are spaced apart from the gate electrode 414. The first semiconductor layer contact hole 422 and the second semiconductor layer contact hole 424 are formed in Figure 12 the gate insulating layer 412 and the interlayer insulating layer 420 therein. Alternatively, in some embodiments, when the gate insulating layer 412 is patterned in the same manner as the gate electrode 414, the first semiconductor layer contact hole 422 and the second semiconductor layer contact hole 424 may be formed only in the interlayer insulating layer 420.

[0115] A source electrode 430 and a drain electrode 432 made of a conductive material such as metal are provided on the interlayer insulating layer 420. The source electrode 430 and the drain electrode 432 are spaced apart from each other on opposite sides of the gate electrode 414, and contact both sides of the semiconductor layer 410 through the first semiconductor layer contact hole 422 and the second semiconductor layer contact hole 424, respectively.

[0116] For example, each of the source electrode 430 and the drain electrode 432 may include, but is not limited to, metal components such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), gold (Au), and / or silver (Ag). Each of the source electrode 430 and the drain electrode 432 may have a single-layer structure or a multi-layer structure.

[0117] The semiconductor layer 410, the gate electrode 414, the source electrode 430, and the drain electrode 432 constitute a thin film transistor Tr used as a driving element. Figure 12 The thin film transistor Tr in has a coplanar structure in which the gate electrode 414, the source electrode 430, and the drain electrode 432 are provided on the semiconductor layer 410. Alternatively, the thin film transistor Tr may have an interleaved structure in which the gate electrode is provided under the semiconductor layer, and the source electrode and the drain electrode are provided on the semiconductor layer. In this case, the semiconductor layer may include amorphous silicon.

[0118] A passivation layer 434 is provided on the source electrode 430 and the drain electrode 432. The passivation layer 434 covers the thin film transistor Tr over the entire substrate 402. The passivation layer 434 has a flat top surface and a drain contact hole (or contact hole) 436 that exposes or does not cover the drain electrode 432 of the thin film transistor Tr. For example, the passivation layer 434 may include, but is not limited to, inorganic insulating materials such as silicon oxide (SiO x , where 0 < x ≤ 2) and silicon nitride (SiN x , where 0 < x ≤ 2), or organic insulating materials such as benzocyclobutene or photoacrylic acid.

[0119] A light-emitting diode D is provided on the passivation layer 434. The light-emitting diode D includes a first electrode 440 that is provided on the passivation layer 434 and connected to the drain electrode 432 of the thin film transistor Tr. The light-emitting diode D further includes a light-emitting layer 442 and a second electrode 444 that are sequentially provided on the first electrode 440. The light-emitting diode D may be provided as each of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and may emit red light, green light, and blue light, respectively.

[0120] One of the first electrode 440 and the second electrode 444 may be an anode, and the other of the first electrode 440 and the second electrode 444 may be a cathode. One of the first electrode 440 and the second electrode 444 may be a reflective electrode, and the other of the first electrode 440 and the second electrode 444 may be a transmissive electrode.

[0121] The first electrode 440 is provided individually in each pixel region P. In one embodiment, the first electrode 440 may be an anode and include a conductive material having a relatively high work function value, such as a transparent conductive oxide (TCO). For example, the first electrode 440 may include, but is not limited to, indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), tin oxide (SnO), zinc oxide (ZnO), indium copper oxide (ICO), and / or aluminum: zinc oxide (Al:ZnO; AZO).

[0122] [[ID=1s]]The first electrode 440 may have a single-layer structure of a transparent conductive oxide. In another embodiment, the first electrode 440 may further include a reflective layer such that the first electrode 440 may have a bilayer or a trilayer structure. The first electrode 440 may be a reflective electrode.

[0123] For example, the reflective layer may include, but is not limited to, silver (Ag) or silver (Ag) alloys, and at least one of palladium (Pd), copper (Cu), indium (In), neodymium (Nd), and aluminum-palladium-copper (APC) alloys. As an example, the first electrode 440 may have, but is not limited to, a two-layer structure of Ag / ITO or APC / ITO, or a three-layer structure of ITO / Ag / ITO or ITO / APC / ITO.

[0124] Additionally, a dam layer 446 is disposed on the passivation layer 434 to cover the edge of the first electrode 440. The dam layer 446 may or may not cover the center of the first electrode 440 corresponding to the pixel region P. A spacer 448 may be disposed on the dam layer 446. The dam layer 446 and the spacer 448 may comprise the same material. For example, each of the dam layer 446 and the spacer 448 may comprise, but is not limited to, a material that blocks or absorbs light.

[0125] A light-emitting layer 442 is disposed on the first electrode 440. In one embodiment, the light-emitting layer 442 may have a single-layer structure of a light-emitting material layer (EML). The EML may include organic light-emitting materials or inorganic light-emitting materials. The display device 300 of this disclosure may include, but is not limited to, an organic light-emitting display device or an inorganic light-emitting display device.

[0126] In organic light-emitting display devices, the EML (Emitting Microarray) can include a substrate and dopants as light emitters. In a red sub-pixel, the EML can include a red substrate and red dopants. In a green sub-pixel, the EML can include a green substrate and green dopants. In a blue sub-pixel, the EML can include a blue substrate and blue dopants. In inorganic light-emitting display devices, the EML can include light-emitting particles, such as quantum dots (QDs) and quantum rods (QRs).

[0127] In another embodiment, the light-emitting layer 442 may have a multilayer structure. For example, the light-emitting layer 442 may further include at least one of the following: a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) sequentially disposed between the first electrode 440 and the EML, and / or a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL) disposed between the EML and the second electrode 444.

[0128] In one embodiment, the light-emitting diode D can emit white light in each of the red sub-pixels, green sub-pixels, and blue sub-pixels. For example, the light-emitting layer 442 of the light-emitting diode D can include a first emission portion including a first light-emitting material layer, a second emission portion including a second light-emitting material layer, and a charge generation layer (CGL) disposed between the first emission portion and the second emission portion, such that the light-emitting layer 442 can have a double-stack structure. In this case, one of the first light-emitting material layer and the second light-emitting material layer can be a blue light-emitting material layer, and the other of the first light-emitting material layer and the second light-emitting material layer can be a yellow-green light-emitting material layer, or can include a red light-emitting material layer and a green light-emitting material layer.

[0129] In another embodiment, the light-emitting layer 442 of the light-emitting diode D can further include a third emission portion including a third light-emitting material layer, and a second charge generation layer disposed between the second emission portion and the third emission portion, such that the light-emitting layer 442 can have a triple-stack structure. In this case, the third light-emitting material layer can be a blue light-emitting material layer.

[0130] The second electrode 444 is disposed on the substrate 402 on which the light-emitting layer 442 is disposed. The second electrode 444 can be disposed on the light-emitting region. The second electrode 444 can include a conductive material having a relatively low work function value compared to the first electrode 440, such that the second electrode 444 can act as a cathode. For example, the second electrode can include, but is not limited to, aluminum (Al), magnesium (Mg), calcium (Ca), silver (Ag), and / or an alloy thereof, such as a magnesium-silver alloy (Mg:Ag). The second electrode 444 is thin to have a light-transmitting (semi-transmitting) property.

[0131] In addition, a packaging layer or packaging film 450 is disposed on the second electrode 444 to prevent or reduce external moisture from penetrating into the light-emitting diode D. For example, the packaging layer can have, but is not limited to, a laminated structure of a first inorganic insulating layer 452, an organic insulating layer 454, and a second inorganic insulating layer 456.

[0132] For example, each of the first inorganic insulating layer 452 and the second inorganic insulating layer 456 can include, but is not limited to, an inorganic insulating material such as silicon oxide (SiO x , where 0 < x ≤ 2) or silicon nitride (SiN x , where 0 < x ≤ 2). For example, the organic insulating layer 454 can include, but is not limited to, an organic insulating material such as epoxy resin, photoacrylic acid, and / or photosensitive acrylic polymer.

[0133] The organic insulating layer 454 is disposed between the first inorganic insulating layer 452 and the second inorganic insulating material 456. The organic insulating layer 454 flattens the bottom step and provides a flat surface.

[0134] A touch sensor 460 including a first touch electrode 466 and a second touch electrode 468 may be disposed on the encapsulation layer 450. For example, a connection electrode or a bridging electrode 462 may be disposed on the encapsulation layer 450, a first insulating material layer 464a having a first contact hole and a second contact hole exposing both sides of the connection electrode 462 may be disposed on the connection electrode 462, and the first touch electrode 466 and the second touch electrode 468 may be disposed on the first insulating material layer 464a.

[0135] The first touch electrodes 466 disposed adjacent to each other may contact the connection electrode 462 through the first contact hole and the second contact hole to be electrically connected to each other. For example, the first insulating material layer 464a may include, but is not limited to, an inorganic insulating material such as silicon oxide (SiO x , where 0 < x ≤ 2) or silicon nitride (SiN x , where 0 < x ≤ 2).

[0136] A buffer layer may be disposed between the second inorganic insulating layer 456 of the encapsulation layer 450 and the first insulating material layer 464a. For example, the buffer layer may include, but is not limited to, an inorganic insulating material such as silicon oxide (SiO x , where 0 < x ≤ 2) or silicon nitride (SiN x , where 0 < x ≤ 2).

[0137] A second insulating material layer 464b may be disposed on the first touch electrode 466 and the second touch electrode 468. For example, the second insulating material layer 464b may include, but is not limited to, an inorganic insulating material such as silicon oxide (SiO x , where 0 < x ≤ 2) or silicon nitride (SiN x , where 0 < x ≤ 2), or an organic insulating material such as benzocyclobutene or photoacrylic acid.

[0138] A black matrix 470 and a color filter layer 472 may be disposed on the second insulating material layer 464b. Alternatively, the touch sensor 460 including the connection electrode 462, the first insulating material layer 464a, the first touch electrode 466, the second touch electrode 468, and the second insulating material layer 464b may be omitted, and the black matrix 470 and the color filter layer 472 may be disposed on the encapsulation layer 450.

[0139] The black matrix 470 is disposed in a non-light-emitting area at the edge of the pixel region P and has an opening corresponding to the light-emitting diode D. For example, the black matrix 470 may include, but is not limited to, a light-shielding or light-absorbing material, such as a black resin and / or carbon black.

[0140] The color filter layer 472 is disposed in a light-emitting region corresponding to an opening of the black matrix 470. When the pixel region P includes red sub-pixels, green sub-pixels, and blue sub-pixels, the color filter layer 472 may include a red color filter pattern corresponding to the red sub-pixels, a green color filter pattern corresponding to the green sub-pixels, and a blue color filter pattern corresponding to the blue sub-pixels. The red color filter pattern may include at least one of a red dye and a red pigment, the green color filter pattern may include at least one of a green dye and a green pigment, and the blue color filter pattern may include at least one of a blue dye and a blue pigment.

[0141] The passivation layer may be disposed on the second insulating material layer 464b, and the black matrix 470 and the color filter layer 472 may be disposed on the passivation layer. The passivation layer may include, but is not limited to, an inorganic insulating material such as silicon oxide (SiO x , where 0 < x ≤ 2) or silicon nitride (SiN x , where 0 < x ≤ 2).

[0142] The first insulating layer 480 may be disposed on the color filter layer 472 and the black matrix 470. For example, the first insulating layer 480 may include, but is not limited to, an organic insulating material such as epoxy resin and / or photoacrylic. Alternatively, a second insulating layer may be disposed on the first insulating layer 480.

[0143] The vibration generated in the haptic actuator 100 is transmitted to the display device 300, so that the user can receive various feedbacks on the vibration generated in the haptic actuator 100.

[0144] Hereinafter, the present disclosure will be described in more detail by way of exemplary examples, but the present disclosure is not limited to the following examples.

[0145] [Comparative Example 1] (Reference 1) Manufacturing a haptic actuator

[0146] As Figure 7 and Figure 8 shown, a reinforcing member made of aluminum was manufactured, in which the support member 226 was connected to extend downward from the short side 224 of the main body 221, and a cavity was formed along the short side 224. The aluminum thickness was set to 0.2 mm, and the adhesive width between the reinforcing element 220 and the piezoelectric element 110 was set to 5 mm. The downward-extending support member 226 was connected to the short side 224 of the main body 221 constituting the reinforcing member 200. The length of the long side 222 of the main body 221 was set to 70 mm, the length of the short side 224 was set to 60 mm, the height H of the main body 221 was set to 5 mm, the length L3 of the connecting portion 227 was set to 20 mm, the inclination angle θ of the connecting portion 227 was set to 60°, and the vibration area of the reinforcing member 220 was set to 40 mm 2The reinforcing member 220 is placed on top of the piezoelectric element 110, which has a hexahedral shape, using an adhesive, and a tactile actuator is manufactured. [Comparative Examples 2] to [Comparative Examples 6] (Refs. 2 to 6) Manufacturing of the tactile actuator

[0147] In addition to changing the aluminum thickness, adhesive width, length of the connection, and inclination angle of the connection constituting the reinforcing member 200, as shown in Table 1 below, the support member 226 is designed to extend downward from the short side 224 of the body 221, such that a cavity is formed along the short side 224, and the reinforcing member 200 is manufactured in the same manner as in Comparative Example 1, and then the member 200 is placed on top of the piezoelectric element 110. In Comparative Example 6, the support member 226 is connected to both the long side 222 and the short side 224. [Comparative Example 7] (Ref. 7) Manufacturing of the tactile actuator

[0148] As shown in Table 1 below, except for the design of the support member, neither the long side 222 of the main body 221 nor the short side 224 is formed. The reinforcing member 200 is manufactured in the same manner as in Comparative Example 1, and then placed on top of the piezoelectric element to manufacture the tactile actuator 200.

[0149] Table 1: Shape of Reinforcing Components

[0150]

[0151] [Example 1] to [Example 4] (Example 1 to Example 4) Manufacturing of reinforced components

[0152] The tactile actuator is manufactured by fabricating a reinforcing member 120 made of aluminum, wherein a support member 126 is connected and formed along the long side 122 extending downward from the body 121, and then placing the reinforcing member 120 on top of the piezoelectric element 110. The shapes of the reinforcing members 120 manufactured in Examples 1 to 4 are shown in Table 2 below.

[0153] Table 2: Shape of Reinforcing Components

[0154]

[0155] [Experimental Example 1] Measurement of Vibration Acceleration

[0156] Electrodes were connected to the tactile actuators manufactured in Comparative Examples 1 to 7 and Examples 1 to 4, respectively, and the electrodes were attached to the underside of the glass. A voltage of 60V was applied to measure the vibration acceleration. When the vibration acceleration was less than 10, it was indicated as 0 (zero). See Table 3 below and... Figures 13 to 16 The measurement results are shown in the figure.

[0157] Table 3: Vibration acceleration of tactile actuators

[0158]

[0159] As shown in Table 3, Figure 13 and 16 As shown, compared to tactile actuators manufactured such as in Comparative Examples 1, 2, 3, and 5, where the support member 226 is formed on the short side and the cavity is arranged along the short side, the tactile actuators manufactured such as in Examples 1 to 4, where the support member 126 is formed on the long side and the cavity is arranged along the long side, have a smaller vibration area but a significantly increased vibration acceleration. Figure 14 As shown, the vibration acceleration decreases when the thickness of the aluminum metal component constituting the reinforcing member increases. Figure 15 As shown, it is confirmed that the vibration area of ​​the reinforcing component is not directly related to the vibration acceleration.

[0160] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from its scope. Therefore, this disclosure is intended to cover such modifications and variations as long as they fall within the scope of the appended claims.

Claims

1. A tactile actuator, comprising: A piezoelectric element having a hexahedral shape; as well as The reinforcing member arranged on the piezoelectric element, The reinforcing component includes: A body having a rectangular planar shape, the body having a first side and a second side, the second side being adjacent to the first side and shorter in length than the first side, and the body being disposed on the upper surface of the piezoelectric element; and A support member that extends downward from a first side of the body.

2. The haptic actuator of claim 1, wherein, The support member includes: A connecting portion, the connecting portion extending downward from the first side; and A support portion that extends outward from the connecting portion.

3. The haptic actuator of claim 2, wherein, The connecting part has an outwardly inclined cross-sectional shape.

4. The haptic actuator of claim 3, wherein, The connecting part has a cross-sectional shape that is inclined outward at an angle between 30° and 60°.

5. The haptic actuator of claim 1, wherein, The length of the first side is 2 to 5 times the length of the second side.

6. The haptic actuator of claim 1, wherein, The reinforcing component comprises a metallic material.

7. The haptic actuator of claim 1, wherein, The piezoelectric element includes: Vibrators in the form of single-layer thin films; and An electrode connected to one side of the vibrator.

8. The haptic actuator of claim 7, wherein, The vibrator comprises an electroactive material or a piezoelectric ceramic material.

9. The haptic actuator of claim 8, wherein, The electroactive material includes materials selected from the group consisting of: silicone-containing resins, acryloyl-containing resins, carbamate-containing resins, natural reinforced rubber, polyvinylidene fluoride (PVDF), polyvinylidene fluoride-trifluoroethylene copolymer P(VDF-TrFE), and combinations thereof.

10. The haptic actuator of claim 8, wherein, The piezoelectric ceramic material includes materials selected from the group consisting of: lead zirconate titanate (PZT), zirconium zirconate modified zirconium, barium titanate (BT), lanthanum modified lead barium niobate (PBLN), aluminum nitride (AlN), zinc oxide (ZnO), and combinations thereof.

11. The haptic actuator of claim 7, wherein, The electrode comprises a material selected from the group consisting of: carbon grease, rubber, metal, and combinations thereof.

12. The tactile actuator according to claim 1, wherein, The piezoelectric element has a cuboid shape.

13. The haptic actuator of claim 7, wherein, The electrode includes a first electrode and a second electrode, and the first electrode and the second electrode have a potential difference.

14. A display device, comprising: The tactile actuator according to any one of claims 1 to 13; as well as A display panel located on the haptic actuator.

15. The display device of claim 14, wherein, The display panel includes: A substrate having pixel regions; Light-emitting diodes disposed on the substrate; and A touch sensor is mounted on the light-emitting diode.

16. The display device of claim 15, wherein, The display panel also includes: A color filter layer, wherein the color filter layer is disposed on the light-emitting diode; and A thin-film transistor, disposed on the substrate and electrically connected to the light-emitting diode.

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