Display control panel, preparation method of display control panel and household appliance

Abstract

The invention relates to the technical field of household appliances, in particular to a display control panel, a preparation method of the display control panel and household appliances. The preparation method of the display control panel comprises the following steps: providing a base material with a through hole; a film layer is arranged on one side of the base material, and the film layer is used for sealing one side of the through hole; dispensing equipment is controlled to fill the through hole with a resin material from the side, away from the film layer, of the base material; and curing the resin material to obtain the plate for manufacturing the display control panel. In the preparation process of the display control panel, one side of the through hole is blocked through the film layer, and the situation that the resin material leaks from the side provided with the film layer is avoided. Besides, the dispensing equipment is controlled to fill the resin material into the through hole from the side, away from the film layer, of the base material, the resin material can be accurately filled into the through hole by means of high precision and high stability of the dispensing equipment, and the probability that the resin material leaks out of the through hole is reduced.

Description

Technical Field

[0001] This invention relates to the field of home appliance technology, and in particular to a display and control panel, a method for preparing the display and control panel, and a home appliance device. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] Home appliances typically have display and control panels that show the parameters of the appliances. The manufacturing process of these panels usually involves creating through-holes in a substrate and filling the holes with resin material to obtain the filled substrate. This filled substrate is then used to process the display and control panels.

[0004] During the process of filling the through hole with resin material, it is easy for the resin material to leak out of the through hole. Summary of the Invention

[0005] The objective of embodiments of the present invention is to at least solve the problem of resin material leakage outside the through-hole during the process of filling the through-hole with resin material. This objective is achieved through the following technical solution:

[0006] A first aspect of the present invention provides a method for manufacturing a display control panel, comprising:

[0007] Provide a substrate with through holes;

[0008] A film layer is disposed on one side of the substrate, wherein the film layer is used to close one side of the through hole;

[0009] The dispensing equipment is controlled to fill the interior of the through-hole with resin material from the side of the substrate away from the film layer.

[0010] The resin material is cured to obtain a substrate for manufacturing the display and control panel.

[0011] According to the method for manufacturing a display and control panel of the present invention, a film layer is provided on one side of a substrate, wherein the film layer is used to seal one side of a through-hole. A dispensing device is controlled to fill the through-hole with resin material from the side of the substrate away from the film layer and cure the resin material to obtain a board material for manufacturing the display and control panel. During the manufacturing process of the display and control panel, the film layer effectively seals the through-hole, preventing resin material leakage from the side with the film layer. Furthermore, by controlling the dispensing device to fill the through-hole with resin material from the side of the substrate away from the film layer, the high precision and stability of the dispensing device allow for accurate filling of the through-hole with resin material, reducing the probability of resin material leakage outside the through-hole.

[0012] In addition, the method for manufacturing the display control panel according to the present invention may also have the following additional technical features:

[0013] In some embodiments of the present invention, controlling the dispensing equipment to fill resin material from the side of the substrate away from the film layer into the interior of the through-hole specifically includes:

[0014] The dispensing amount of the dispensing device is determined based on the volume of the through hole;

[0015] The moving speed of the dispensing head and the dispensing flow rate of the dispensing equipment are determined based on the dispensing volume.

[0016] In some embodiments of the present invention, the substrate having the film layer is placed on a working platform and the film layer is made to adhere to the working platform.

[0017] In some embodiments of the present invention, the working platform includes an ultrasonic platform that enables the resin material of the through hole to vibrate so that the resin material uniformly fills the through hole.

[0018] In some embodiments of the present invention, curing the resin material specifically includes curing the resin material by one of ultraviolet light curing, heat curing and electron beam curing.

[0019] In some embodiments of the present invention, in the step of providing a substrate with through holes, the through holes are formed on the substrate by one of mechanical punching, laser drilling, chemical etching, and electrical discharge punching, wherein the through holes are arranged in a vertical direction.

[0020] A second aspect of the present invention provides a display control panel, which is manufactured using the display control panel manufacturing method described in the above embodiments.

[0021] In addition, the display and control panel according to the present invention may also have the following additional technical features:

[0022] In some embodiments of the present invention, the resin material includes at least one selected from acrylic resin, epoxy resin, polyurethane resin, polyester resin, silicone resin, amino resin, and acid alcohol resin.

[0023] In some embodiments of the present invention, the film layer includes at least one of acrylic film, silicone film, polyurethane film and electrostatic film.

[0024] In some embodiments of the present invention, the substrate includes one of a metal plate, a plastic plate, a wood plate, and a composite board.

[0025] In some embodiments of the present invention, the substrate is a metal plate, which includes one of galvanized carbon steel plate, stainless steel plate, galvanized aluminum-magnesium plate and aluminum alloy plate.

[0026] A third aspect of the present invention provides a home appliance comprising the display and control panel mentioned in the above embodiments. Attached Figure Description

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0028] Figure 1 A schematic diagram illustrating the principle of a method for preparing a display and control panel according to an embodiment of the present invention is shown.

[0029] Figure 2 A schematic flowchart illustrating a method for preparing a display and control panel according to an embodiment of the present invention is shown.

[0030] Figure 3 A schematic diagram of the structure of a display and control panel according to an embodiment of the present invention is shown.

[0031] Figure 4 Another structural schematic diagram of a display and control panel according to an embodiment of the present invention is shown schematically;

[0032] Figure 5 A schematic diagram of the structure of a household appliance according to an embodiment of the present invention is shown.

[0033] The attached figures are labeled as follows:

[0034] 100. Home appliances;

[0035] 10. Door panel; 11. Refrigerator door body; 12. Freezer door body; 13. Display and control panel;

[0036] 20. Box body; 21. Back panel;

[0037] 30. Tank liner;

[0038] 40. Machine Room;

[0039] 200. Dispensing equipment;

[0040] 300. Resin material;

[0041] 400, ultraviolet light;

[0042] 500, Substrate; 501, Through hole; 5011, First through hole; 5012, Second through hole;

[0043] 600, film layer. Detailed Implementation

[0044] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0045] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0046] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0047] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.

[0048] According to a first aspect of the present invention, a method for manufacturing a display control panel 13 is provided, such as... Figures 1 to 2 As shown, where, Figure 1 The schematic diagram illustrates the principle of the manufacturing method of the display and control panel 13 according to an embodiment of the present invention. Figure 2 This schematically illustrates a process flow diagram of a method for fabricating a display and control panel 13 according to an embodiment of the present invention. The fabrication method includes multiple processes, as shown below. Figure 1 As shown, Figure 1 The process involves multiple steps to prepare the display and control panel 13. In the first step, a substrate 500 with through holes 501 is prepared. The number of through holes 501 can be one or more. Figure 1 In the first step, there are two through holes 501. However, the number of through holes 501 can be set to four, five, or more as needed. In the second step, a film layer 600 is applied to one side of the substrate 500. This film layer 600 can seal one side of the through holes 501. There can be one film layer 600 simultaneously sealing multiple through holes 501, or multiple film layers 600 can seal at least one through hole 501. When there are multiple film layers 600, their thickness is consistent, facilitating the placement of the film layers 600 onto the platform's working surface and simplifying the processing of the platform's working surface. In the third step, a dispensing device 200 is controlled to fill the through holes 501 with resin material 300. The dispensing device 200 includes at least one dispensing head, which fills the through holes 501 with resin material 300. Figure 1In this process, two dispensing heads are used. Both heads can work simultaneously to fill different through-holes 501 at the same time, or they can work separately to fill different through-holes 501 sequentially. In the fourth step, the resin material 300 inside the filled through-holes 501 is cured by ultraviolet light 400 irradiation, thereby obtaining the substrate for manufacturing the display and control panel 13. These steps are the main steps in the manufacturing method of the display and control panel 13.

[0049] The preparation method will be explained in more detail below.

[0050] like Figure 2 As shown, the method for manufacturing the display and control panel 13 includes:

[0051] S21. Provide a substrate 500 having a through hole 501;

[0052] S22. A film layer 600 is disposed on one side of the substrate 500, wherein the film layer 600 is used to close one side of the through hole 501.

[0053] S23. Control the dispensing equipment 200 to fill the resin material 300 from the side of the substrate 500 away from the film layer 600 into the interior of the through hole 501.

[0054] S24. The resin material 300 inside the through hole 501 is cured to obtain the board material for making the display and control panel 13.

[0055] In S21, the substrate 500 with through holes 501 can be achieved in various ways. The through holes 501 can be processed using mechanical punching, laser drilling, chemical etching, and electrical discharge machining (EDM). Mechanical punching is a common punching method, mainly performed using a stamping press. It is suitable for punching various metal materials, such as steel plates and copper plates. Mechanical punching has advantages such as simple operation, high efficiency, and high precision. Laser drilling is an advanced process that utilizes the high energy and high precision of a laser beam for punching. Laser drilling can achieve punching of micro-holes and fine patterns, and has advantages such as high processing accuracy, high speed, and low heat-affected zone. Chemical etching is a process that removes specific areas from the surface of a material through a chemical reaction, based on the chemical reaction between the material and a specific etching solution. In the etching solution, specific chemical substances can react with the material surface, causing the surface to dissolve or transform into other substances. By controlling parameters such as the composition, concentration, temperature, and etching time of the etching solution, precise etching of the material surface can be achieved. Electrical discharge machining (EDM) is mainly used for processing high-hardness and high-toughness metal materials. It utilizes the principle of electrical discharge to create holes in the material. This process is suitable for small-batch punching tasks with special requirements.

[0056] It is important to note that the substrate 500 is typically a plate-like structure, which can be a rectangular plate, a circular plate, or a racetrack-shaped plate. When the substrate 500 is arranged horizontally, the through hole 501 is arranged vertically, that is, the through hole 501 is perpendicular to the surface of the substrate 500.

[0057] Through holes 501 are processed on substrate 500 by one of mechanical punching, laser drilling, chemical etching and electrical discharge punching. The through holes 501 are arranged in a vertical direction and the walls of the through holes 501 are all arranged in a vertical direction.

[0058] In addition, the through hole 501 here is usually in the millimeter range, and the thickness of the substrate 500 can be from 0.01 mm to 10 mm, such as 0.01 mm, 1 mm, 4 mm, 5 mm, 8 mm, 9 mm or 10 mm, etc. The line spacing of the through hole 501 is from 0.01 mm to 10 mm, such as 0.01 mm, 1 mm, 4 mm, 5 mm, 8 mm, 9 mm or 10 mm, etc. When the through hole 501 has a straight structure, the line spacing of the straight structure is also the line width of the straight line, that is, the width of the through hole 501.

[0059] Optionally, the membrane layer 600 includes one of acrylic film, silicone film, polyurethane film and electrostatic film, which can seal the bottom of the through hole 501, thereby reducing the probability of resin material 300 leaking from the bottom of the through hole 501. Of course, the membrane layer 600 can be made of other materials, which can also play a sealing role.

[0060] Specifically, acrylic films are made from acrylic plastics, an important type of synthetic resin. They possess excellent transparency and optical properties, with high light transmittance exceeding 92%, almost comparable to glass, but lighter, easier to process and shape, and highly weather-resistant. Silicone films are made from silicone. When the silicone has high purity, its light transmittance is also high. When used as a film layer, transparent silicone can be selected to make the film. Besides excellent optical properties, transparent silicone also exhibits high temperature resistance, cold resistance, oxidation resistance, and corrosion resistance. Polyurethane films are made from polyurethane, a high-molecular-weight compound. Polyurethane has a light transmittance exceeding 90% and possesses excellent mechanical properties, chemical stability, and light transmission performance. Electrostatic film is a type of non-adhesive film, mainly made of materials such as PE (Polyethylene) and PVC (Polyvinyl chloride). It relies on the electrostatic adsorption of the product itself to adhere to the item and provide protection. It features high light transmittance, high heat insulation, and strong durability.

[0061] As can be seen from the above, acrylic film, silicone film, polyurethane film and electrostatic film all have good light transmittance. Therefore, the film layer 600 has little impact on the light transmittance of the through hole 501, allowing light to pass through the resin material 300 and the film layer 600 inside the through hole 501 and then pass through.

[0062] Optionally, the substrate 500 includes one of a metal plate, a plastic plate, a wood plate, and a composite board. These materials generally have poor light transmittance, while the resin material 300 inside the through hole 501 has good light transmittance, allowing light to pass through and making it convenient for users to observe the display parameters of the display control panel 13.

[0063] It should be noted that the filling material in the through hole 501 can also be selected from other materials as needed, such as bio-based polymers, natural cellulose and biodegradable polymers.

[0064] Optionally, the resin material 300 here includes at least one of epoxy resin, acrylic resin, polyurethane resin, polyester resin, silicone resin, amino resin and acid alcohol resin. These resin materials 300 or mixtures of different resin materials 300 can be selected according to the characteristics of different resin materials 300 as needed.

[0065] Epoxy resin is a high molecular polymer containing two or more epoxy groups in its molecule. It is usually produced by the polycondensation reaction of epichlorohydrin with bisphenol A or polyols. The main characteristics of epoxy resin include high strength, high wear resistance, corrosion resistance, high temperature resistance, excellent insulation properties, good mechanical properties, simple processing, and environmental safety. Epoxy resin not only has excellent adhesion and mechanical strength, but also can remain stable when subjected to large pressure and impact.

[0066] Furthermore, epoxy resin has high surface hardness, good wear resistance, and is not easily worn away. It also exhibits good corrosion resistance to acids, alkalis, salts, and other chemicals. Epoxy resin can withstand high temperatures and has good thermal stability. It is an excellent insulating material widely used in the encapsulation of electronic components. Its processing is simple, employing various molding methods such as injection molding, extrusion, and compression molding. Most importantly, epoxy resin is a recyclable material that does not pollute the environment, aligning with the concept of sustainable development.

[0067] Acrylic resins are polymers produced by polymerizing acrylic acid or acrylic acid derivatives as monomers, or by copolymerizing them with other unsaturated compounds. Acrylic resins possess excellent transparency, strong weather resistance, chemical corrosion resistance, and low cost. Their superior transparency, even surpassing that of glass, is attributed to their colorless, odorless, and non-toxic molecular properties, ensuring they do not affect the color of objects. The stable molecular chains of acrylic resins effectively resist the effects of oxidation, ultraviolet radiation, and other natural factors, making them less prone to aging and yellowing. Acrylic resins are also resistant to corrosion from acids, alkalis, and salts. Compared to other polymer materials, acrylic resins have lower processing costs and simpler production processes, resulting in a relatively lower price.

[0068] Polyurethane resin is a thermoplastic compound composed of diurethane esters. It has the characteristics of high tensile strength, good impact resistance, excellent anti-aging properties, chemical resistance, small size, and light weight.

[0069] Polyester resin is a general term for polymeric compounds formed by the condensation polymerization of diols, diacids, or polyols and polyacids. The main characteristics of polyester resin include good mechanical properties, thermal stability, and chemical stability, as well as excellent heat resistance, chemical resistance, and transparency.

[0070] Organosilicon resins, also known as polysiloxanes, are a general term for polymers whose backbone is composed of alternating silicon and oxygen atoms, with different organic groups linked to silicon atoms. The main characteristics of organosilicon resins include high temperature resistance, low temperature resistance, weather resistance, water and moisture resistance, electrical insulation, good mechanical properties, and chemical stability.

[0071] Amino resins are a general term for resins formed by the condensation polymerization of amino compounds such as urea, melamine or benzomelamine with formaldehyde and alcohols. They have advantages such as high bonding strength, good water resistance and chemical corrosion resistance.

[0072] Alkyd resins, also known as polar resins, are resins made by mixing alkyd and other organic components with collagen. Alkyd resins possess excellent chemical stability, temperature resistance, water resistance, oil resistance, acid and alkali resistance, and thermal shock resistance.

[0073] It should be noted that resin material 300 comes in various types. The resin material 300 in this invention can perform functions such as light transmission, waterproofing, oil resistance, stain resistance, and / or corrosion resistance. When selecting resin material 300, a suitable resin material 300 can be selected based on the function it performs. For example, when good light transmission is required, acrylic resin can be selected; when good waterproofing is required, amino resin can be selected. Other cases will not be illustrated here.

[0074] For the present invention, the substrate 500 is usually selected as a metal plate, wherein the metal plate can be one of galvanized carbon steel plate, stainless steel plate, galvanized aluminum-magnesium plate and aluminum alloy plate. The metal plate can be made by hot rolling or cold rolling processes, and has good surface flatness.

[0075] Optionally, continue to refer to Figure 1 As shown, the cured resin material 300 specifically includes one of the following cured resin materials 300: ultraviolet light 400 curing, heat curing and electron beam curing, to obtain a cured board, which can be used as a raw material for manufacturing the display and control panel 13.

[0076] It should be noted that UV 400 curing, also known as UV curing, is a process that uses UV 400 light to irradiate liquid UV (ultraviolet) curable materials, thus hardening them. The wavelength of UV 400 light ranges from 100 nanometers to 400 nanometers; for example, the wavelength can be 100 nanometers, 150 nanometers, 200 nanometers, 250 nanometers, 300 nanometers, 350 nanometers, or 400 nanometers, etc., and the intensity of UV 400 light can be 10 mW / cm². 2 Up to 2000mW / cm 2 For example, the intensity of ultraviolet light 400 can be 10 mW / cm². 2 50mW / cm 2 100mW / cm 2 200mW / cm 2 500mW / cm 2 1000mW / cm 2 1500mW / cm 2 1800mW / cm 2Alternatively, the curing time for UV 400 can be 2000 mW / cm², ranging from 1 second to 600 seconds. Specifically, the curing time can be 1 second, 10 seconds, 50 seconds, 100 seconds, 200 seconds, 300 seconds, 400 seconds, 500 seconds, or 600 seconds. The curing time of UV 400 is inversely proportional to its intensity; higher intensity results in a shorter curing time, and vice versa. For example, a UV 400 intensity of 100 W / cm²... 2 At that time, the curing time of UV 400 can be 100 seconds, and the intensity of UV 400 is 200 W / cm². 2 At that time, the curing time of UV 400 can be 30 seconds.

[0077] Heat curing is a process that uses heat energy as a catalyst to accelerate the chemical reaction of polymers in hydrogel materials, thereby transforming the hydrogel material from a liquid state to a solid state. The heating temperature and duration of the heat curing process depend on the specific material and process requirements. The heating curing temperature range for resin material 300 is typically between 50-130℃, and the heat curing process varies depending on the type of resin material 300. When determining the process parameters for heat curing, appropriate heating temperature and time should be selected to avoid excessively high or low heating temperatures that could lead to material deterioration or incomplete curing. A suitable heating time should be determined to ensure that the resin material 300 within the through-hole 501 can be completely cured. Secondly, suitable heating equipment should be used and adjusted according to the type of resin material 300 and the size of the through-hole 501.

[0078] Electron beam curing utilizes a high-energy electron beam generated by an electron accelerator to initiate the polymerization or cross-linking of resin material 300, thereby achieving the curing of resin material 300.

[0079] Optionally, in S23, filling the interior of the through-hole 501 with the resin material 300 from the side of the substrate 500 away from the film layer 600 specifically includes the following process:

[0080] The dispensing volume of the dispensing device 200 is determined based on the volume of the through-hole 501. The volume of the through-hole 501 can be obtained by calculation or by measuring the amount of liquid contained in the through-hole 501, which will be explained in more detail later.

[0081] The moving speed and dispensing flow rate of the dispensing head of the dispensing equipment 200 are determined based on the dispensing volume.

[0082] Specifically, the dispensing amount of the dispensing device 200 is determined based on the volume of the through-hole 501. The volume of the through-hole 501 can be obtained through calculation, such as... Figure 3 and Figure 4 As shown, where, Figure 3 A schematic diagram of the structure of the display and control panel 13 according to an embodiment of the present invention is shown. Figure 4 Another structural schematic diagram of the display and control panel 13 according to an embodiment of the present invention is shown schematically. Figure 3 Based on the shape of the through hole 501, it can be divided into two types: a first through hole 5011 and a second through hole 5012. The first through hole 5011 is a circular hole, and the second through hole 5012 is a rectangular hole. The inner diameter of the circular hole is D, and the length and width of the rectangular hole are L and W, respectively. The volume of the first through hole 5011 can be calculated based on the thickness of the substrate 500 and the inner diameter D of the circular hole, thus obtaining the volume of resin material 300 that needs to be filled in the first through hole 5011. In addition, the volume of the second through hole 5012 can also be calculated based on the length L, the width W of the rectangular hole, and the thickness of the substrate 500, thus obtaining the volume of resin material 300 that needs to be filled in the second through hole 5012. Finally, the resin material 300 corresponding to the volume of the first through hole 5011 is filled into the first through hole 5011 using the dispensing device 200, and the resin material 300 corresponding to the volume of the second through hole 5012 is filled into the second through hole 5012 using the dispensing device 200.

[0083] Specifically, the moving speed of the dispensing head of the dispensing equipment 200 is from 0.1 mm / s to 200 mm / s. For example, the moving speed of the dispensing head of the dispensing equipment 200 can be 0.1 mm / s, 15 mm / s, 20 mm / s, 50 mm / s, 100 mm / s, 150 mm / s, or 200 mm / s. The dispensing flow rate of the dispensing equipment 200 is from 0.1 μL / s to 1000 μL / s. For example, the dispensing flow rate of the dispensing equipment 200 can be 0.1 μL / s, 10 μL / s, 100 μL / s, 300 μL / s, 500 μL / s, 800 μL / s, 900 μL / s, 950 μL / s, or 1000 μL / s.

[0084] Continue to refer to Figure 4 As shown, the through hole 501 can also be irregular in shape. When the through hole 501 is irregular in shape, it is difficult to obtain the volume of the through hole 501 by calculation. In this case, the volume of the through hole 501 can be obtained by measuring the amount of liquid contained inside the through hole 501. Finally, the resin material 300 corresponding to the volume of the through hole 501 can be filled into the irregular through hole 501 by the dispensing equipment 200.

[0085] Optionally, the method for preparing the display and control panel 13 further includes placing the substrate 500 having the film layer 600 onto the work platform and making the film layer 600 adhere to the work platform. The process of placing the substrate 500 having the film layer 600 onto the work platform is set before the filling resin material 300 to facilitate the dispensing equipment 200 to fill the through hole 501 with the resin material 300.

[0086] The working platform here can be the ground or a fixed platform structure, so that the substrate 500 with the film layer 600 can be stably placed on the working platform.

[0087] Optionally, the working platform includes an ultrasonic platform, which can vibrate the resin material 300 in the through hole 501 to uniformly fill the through hole 501. At this time, the substrate 500 with the film layer 600 is placed on the ultrasonic platform, wherein the film layer 600 is in contact with the ultrasonic platform; wherein the film layer 600 is connected to the substrate 500, therefore, both the substrate 500 and the film layer 600 are located on the ultrasonic platform and can vibrate accordingly with the vibration of the ultrasonic platform.

[0088] The ultrasonic platform is designed based on the principle of ultrasound. It uses high-frequency mechanical waves to manipulate and process objects. The substrate 500 with the film layer 600 is the object manipulated and processed by the ultrasonic platform. The vibration of the ultrasonic waves acts on the resin material 300 of the through hole 501, causing the resin material 300 to flow and reducing the probability of local defects in the resin material 300 of the through hole 501.

[0089] It is important to note that the ultrasonic platform can vibrate under the action of ultrasound. During the process of filling the through-hole 501 with resin material 300 by the dispensing equipment 200, the ultrasonic platform has the following advantages: First, the vibration of the ultrasonic platform can eliminate air bubbles in the resin material 300, thereby improving the transparency of the cured resin material 300. Second, the vibration of the ultrasonic platform can fully wet the resin material 300 and fill the tiny corners in the through-hole 501, improving the adhesion of the resin material 300 to the inner wall of the through-hole 501, thereby preventing the inner wall of the through-hole 501 from being corroded by air and improving the corrosion resistance of the inner wall surface of the through-hole 501. Third, the vibration of the ultrasonic platform can make the resin material 300 in the through-hole 501 more uniform, reducing the probability of local defects during the curing process and improving the transparency of the resin material 300 inside the through-hole 501.

[0090] Alternatively, the ultrasonic platform may not require vibration, but only need to emit ultrasonic waves. The ultrasonic waves act directly on the resin material 300 inside the through hole 501, so that the resin material 300 can be uniformly filled inside the through hole 501.

[0091] The preparation method of the control panel 13 will be described below with specific embodiments.

[0092] Example 1

[0093] First, take a 0.5 mm thick galvanized sheet as the base material 500. The galvanized sheet has through holes 501 with a width of 1 mm. An acrylic film is attached to the back of the galvanized sheet as a film layer 600. The film layer 600 is located at the bottom of the galvanized sheet and can close one side of all the through holes 501 on the galvanized sheet.

[0094] Then, using a dispensing device 200, acrylic resin material 300 is filled into the through hole 501 from the front side of the galvanized sheet. The dispensing head of the dispensing device 200 moves at a speed of 50 mm / s, and the dispensing flow rate of the dispensing device 200 is 50 μL / s. Here, the front side of the galvanized sheet is the top of the galvanized sheet.

[0095] Finally, the resin material 300 inside the through hole 501 was irradiated with ultraviolet light 400 at a wavelength of 365 nm and an intensity of 1000 mW / cm². 2 The irradiation time is 60 seconds to obtain the cured galvanized sheet.

[0096] Example 2

[0097] First, take a galvanized sheet with a thickness of 8 mm as the base material 500. The galvanized sheet has through holes 501 with a width of 1 mm. An acrylic film is attached to the back of the galvanized sheet as a film layer 600. The film layer 600 is located at the bottom of the galvanized sheet and can block one side of all the through holes 501 on the galvanized sheet.

[0098] Then, using a dispensing device 200, acrylic resin material 300 is filled into the through hole 501 from the front side of the galvanized sheet. The dispensing head of the dispensing device 200 moves at a speed of 50 mm / s, and the dispensing flow rate of the dispensing device 200 is 800 μL / s. Here, the front side of the galvanized sheet is the top of the galvanized sheet.

[0099] Finally, the resin material 300 inside the through hole 501 was irradiated with ultraviolet light 400 at a wavelength of 365 nm and an intensity of 1000 mW / cm². 2 The irradiation time is 60 seconds to obtain the cured galvanized sheet.

[0100] The dispensing equipment 200 here can be a dispensing machine, which can precisely control the dispensing, coating, and filling of fluids on or inside a product surface.

[0101] Whether it is the plate prepared in Example 1 or the plate prepared in Example 2, the resin material 300 can fill the through hole 501 and completely block the side wall of the through hole 501. The amount of resin material 300 overflowing from the through hole 501 is small. It is not necessary to grind the upper surface of the substrate 500 near the through hole 501. Here, the upper surface refers to the surface of the substrate 500 away from the film layer 600.

[0102] Optionally, the substrate 500 is a metal plate. After the through hole 501 is made, the substrate 500 is electroplated so that the inner wall surface of the through hole 501 has a coating. The coating can be a zinc plating layer, thereby reducing the probability of rust appearing on the inner wall surface of the through hole 501.

[0103] A second aspect of the embodiments of the present invention provides a display control panel 13, such as Figure 3 and Figure 4 As shown, the display and control panel 13 is made using the aforementioned method. The resin material 300 is cured. Specifically, the resin material 300 filling the through hole 501 is cured to obtain the board material for making the display and control panel 13. The board material can be machined to make the display and control panel 13 of a specified specification. When the display and control panel 13 is a rectangular structure, the specified specifications include length, width and thickness. When the display and control panel 13 is a circular structure, the specified specifications include diameter or radius and thickness.

[0104] A third aspect of the present invention provides a home appliance 100, which includes the display and control panel 13 mentioned in the above embodiments. The home appliance 100 can be a clothing processing device, a refrigeration device, a water heater, or other similar products. The refrigeration device can be a refrigerator, an air conditioner, or other similar products.

[0105] The display and control panel 13 can be installed on the housing of the home appliance 100 or on the door panel 10 of the home appliance 100, and is used to display the operating parameters of the home appliance or the environmental parameters of the home appliance.

[0106] Figure 5 The schematic diagram shows the structure of a household appliance 100 according to an embodiment of the present invention. When the household appliance 100 is a refrigeration device, the refrigeration device includes refrigerators, freezers and freezers, etc., which can realize the refrigeration of yogurt and the freezing of meat and other items.

[0107] The following will combine Figure 5 The structure of the refrigeration equipment will be described in detail below:

[0108] The refrigerator provided in the embodiments of the present invention can be a fixed-frequency refrigerator or a variable-frequency refrigerator, wherein the display and control panel 13 can be provided on the cabinet 20 or the door panel 10 of the refrigeration equipment.

[0109] Specifically, the refrigeration equipment includes a cabinet 20, which includes an outer shell and a cabinet liner 30 disposed inside the outer shell. The space between the outer shell and the cabinet liner 30 is filled with insulation material (forming a foam layer). The cabinet liner 30 defines a storage compartment. The cabinet liner 30 generally includes a freezer inner liner and a refrigerator inner liner. The storage compartment includes a freezer compartment defined by the freezer inner liner and a refrigerator compartment defined by the refrigerator inner liner. A door panel 10 is also provided on the front side of the refrigerator compartment. The door panel 10 includes a refrigerator door 11 and a freezer door 12. The refrigerator door 11 is used to open or close the refrigerator compartment, and the freezer door 12 is used to open or close the freezer compartment. The refrigerator compartment is located above the freezer compartment, in which case the refrigerator door 11 is located above the freezer door 12.

[0110] Continue to refer to Figure 5 As shown, the display and control panel 13 is fixed to the refrigerator door 11 by an embedded installation method. Alternatively, the display and control panel 13 can also be set on the freezer door 12. Alternatively, there are two display and control panels 13, which are respectively set on the refrigerator door 11 and the freezer door 12, so that the temperature and other parameters of the refrigerator compartment and the freezer compartment can be displayed respectively.

[0111] Optionally, the refrigeration equipment also includes a mechanical chamber 40 and a cabinet liner 30. The cabinet liner 30 is located inside the cabinet 20 and is used to place food. The mechanical chamber 40 is located at the bottom of the refrigeration equipment and can house the compressor, electrical control box, and evaporator assembly.

[0112] Optionally, the cabinet 20 includes a back panel 21 located at the back of the refrigeration equipment, and the refrigerator door 11 and the freezer door 12 located at the front of the refrigeration equipment. In this case, the refrigerator door 11 and the freezer door 12 are located at the front end of the refrigeration equipment, and the back panel 21 is located at the rear end of the refrigeration equipment.

[0113] For the structure of other parts of this application, please refer to the prior art; further details will not be provided here.

[0114] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for manufacturing a display control panel, characterized in that, include: Provide a substrate with through holes; A film layer is disposed on one side of the substrate, wherein the film layer is used to close one side of the through hole; The dispensing equipment is controlled to fill the interior of the through-hole with resin material from the side of the substrate away from the film layer. The resin material is cured to obtain a substrate for manufacturing the display and control panel.

2. The method for preparing the display and control panel according to claim 1, characterized in that, Controlling the dispensing equipment to fill the resin material from the side of the substrate away from the film layer into the interior of the through hole specifically includes: determining the dispensing amount of the dispensing equipment according to the volume of the through hole; The moving speed of the dispensing head and the dispensing flow rate of the dispensing equipment are determined based on the dispensing volume.

3. The method for preparing the display and control panel according to claim 1 or 2, characterized in that, The substrate having the film layer is placed on the work platform, and the film layer is made to adhere to the work platform.

4. The method for preparing the display and control panel according to claim 3, characterized in that, The working platform includes an ultrasonic platform, which can cause the resin material in the through hole to vibrate, so that the resin material is uniformly filled in the through hole.

5. The method for preparing the display and control panel according to claim 1, characterized in that, The cured resin material specifically includes: The resin material is cured by one of ultraviolet light curing, heat curing, and electron beam curing.

6. The method for preparing the display and control panel according to claim 1, characterized in that, In the step of providing a substrate with through holes, the through holes are formed on the substrate by one of mechanical punching, laser drilling, chemical etching, and electrical discharge punching, wherein the through holes are arranged in a vertical direction.

7. A display control panel, characterized in that, The display and control panel is manufactured using the method described in any one of claims 1 to 6.

8. The display and control panel according to claim 7, characterized in that, The resin material includes at least one of acrylic resin, epoxy resin, polyurethane resin, polyester resin, silicone resin, amino resin, and acid alcohol resin.

9. The display and control panel according to claim 7, characterized in that, The membrane layer includes at least one of acrylic film, silicone film, polyurethane film and electrostatic film.

10. The display and control panel according to claim 7, characterized in that, The substrate includes one of metal plate, plastic plate, wood plate and composite board.

11. The method for preparing the display and control panel according to claim 7, characterized in that, The substrate is a metal plate, which includes one of galvanized carbon steel plate, stainless steel plate, galvanized aluminum-magnesium plate and aluminum alloy plate.

12. A household appliance, characterized in that, The home appliance includes a display and control panel as described in any one of claims 7 to 11.

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