Spiral groove gas film sealing steady-state parameter optimization method based on flow field analysis
By optimizing the spiral groove air film sealing parameters through flow field analysis and simulation software, the problem of frequent parameter changes in experiments was solved, achieving efficient experimental data analysis and parameter optimization, and reducing experimental preparation time and costs.
Patent Information
- Application Number
- CN202610087159.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-22
- Publication Date
- 2026-05-08
AI Technical Summary
In existing technologies, spiral groove air film sealing experiments require frequent changes to multiple parameters, resulting in a large number of experiments, long cycles, complex processing technology, high material costs, and long preparation time.
By using a flow field analysis-based method to optimize the steady-state parameters of the spiral groove air film seal, and employing 3D modeling, finite element analysis, and flow field simulation software, mesh generation and thermal-fluid-structure interaction calculations are performed to optimize the spiral groove parameters and reduce experimental workload.
Simulation analysis of a model without a manufactured sealing ring was achieved, air film flow field data was obtained, sealing ring parameters were optimized, the workload of subsequent experiments was reduced, and experimental efficiency and accuracy were improved.