Die-casting die for automobile engine connecting rod

Abstract

The invention discloses a die-casting die for an automobile engine connecting rod. Comprising a first die, a second die, a forming die cavity and a temperature control assembly. Firstly, through the synergistic effect of the installation position of the temperature control assembly and the inner wall structure of the second containing cavity, the working stability of the semiconductor refrigerating and heating piece in the high-temperature environment can be improved, and therefore preconditions are provided for temperature control of the semiconductor refrigerating and heating piece; and secondly, by means of the quick response characteristic of temperature control of the semiconductor refrigerating and heating piece, the temperature of the insert arrangement area in the forming die cavity can be consistent with the temperature of other areas in the forming die cavity in the single die-casting period, and therefore the probability of quality defects occurring in connecting rod forming is reduced.

Description

Technical Field

[0001] This application relates to the field of mold technology, and more specifically, to a die-casting mold for connecting rods of automobile engines. Background Technology

[0002] Die casting is an advanced casting technology that uses high pressure to rapidly inject molten metal into a precision mold cavity, where it solidifies under pressure. It is widely used in the automotive, electronics, aerospace, and consumer goods industries. When designing die casting molds for automotive engine connecting rods, inserts are typically placed at both ends of the mold cavity to facilitate the die casting of the connecting rod's big and small ends. To control mold costs, different materials are often used for the inserts and the mold body. This can lead to the temperature in the area where the inserts are located being the same as other areas within the mold cavity, causing quality issues in the connecting rod molding. Specifically, when the thermal conductivity of the inserts is greater than that of the mold body, according to the law of thermal conductivity, heat flux density is proportional to the thermal conductivity of the material. Under the same temperature gradient, heat will dissipate through the inserts more quickly, resulting in a lower temperature in the area where the inserts are located within the mold cavity. Consequently, during the molten metal filling stage, the viscosity of the molten metal increases sharply and its fluidity decreases as it flows through the low-temperature insert area. This can lead to quality defects in the connecting rod molding process. For example, if the temperature is below the alloy's "critical fluidity temperature," the molten metal cannot perfectly replicate the sharp contours of the insert, or the two molten metals may not fully fuse at the point where they meet. This can result in cold shuts or incomplete pouring around the mounting holes at the large and small ends of the connecting rod. When the thermal conductivity of the insert is less than that of the mold body, according to the law of thermal conductivity, heat flux density is proportional to the thermal conductivity of the material. Under the same temperature gradient, heat will dissipate more slowly through the insert, meaning that heat is "blocked" inside the insert and cannot be effectively dissipated, causing the temperature in the area where the insert is located within the molding cavity to rise. This can lead to quality defects in the connecting rod molding process during the molten metal solidification stage. For example, the large and small ends of the connecting rod are thick, hot-nozzle areas that require rapid heat dissipation to promote solidification from the outside in. When the temperature of the area where the insert is installed rises, the solidification time of that area is greatly extended and the solidification speed is slowed down. Since the surrounding area (rod body) may have already solidified, while the insert area is still in a liquid or semi-solid state due to the high temperature, it cannot be replenished by molten metal during solidification shrinkage. This can easily lead to concentrated shrinkage cavities or severe central shrinkage porosity at the root or inside of the mounting holes of the big and small ends of the connecting rod.

[0003] To address the technical problem of inconsistent temperatures between the insert area and other areas within the die cavity affecting the quality of connecting rod molding, an external water-cooling or oil-heating system is typically used to control the insert temperature. However, since this system indirectly exchanges heat between external fluids and the insert through channels, the heat transfer path is from water or heat transfer oil to stainless steel or copper pipes to the insert substrate material. Each path introduces contact thermal resistance, increasing the contact thermal resistance of the temperature control system and reducing heat transfer efficiency. This results in a lag in the response of the external temperature control system, leading to a situation where the temperature of the insert area and other areas within the die cavity cannot reach consistency within a single die-casting cycle (e.g., 10-30 seconds). This increases the probability of quality defects in the connecting rod molding process. Summary of the Invention

[0004] This application provides a die-casting mold for automotive engine connecting rods, which can reduce the probability of quality defects in connecting rod molding.

[0005] In a first aspect, this application provides a die-casting mold for an automotive engine connecting rod, comprising a first mold, a second mold, a forming cavity, and a temperature control component. A first mold core is disposed within the first mold. The second mold is disposed on the first mold, and a second mold core is disposed within the second mold. The forming cavity is disposed between the first mold core and the second mold core, and the forming cavity includes a first chamber disposed on the first mold core and a second chamber disposed on the second mold core. The first chamber includes a first cavity, and a second cavity and a third cavity are respectively disposed at both ends of the first cavity. Inserts are respectively disposed within the second cavity and the third cavity, and a first receiving cavity is disposed within the insert, and a second receiving cavity is disposed within the first receiving cavity. The temperature control component is disposed in the second receiving cavity. The temperature control component includes a semiconductor cooling heating element, heat-conducting pillars, and a heat insulation layer. The heat-conducting pillars include multiple pillars, which are arranged around the outer periphery of the semiconductor cooling heating element. One end of each heat-conducting pillar is fixedly connected to the inner wall of the first receiving cavity, and the other end of each heat-conducting pillar is fixedly connected to the semiconductor cooling heating element. The heat insulation layer is disposed on the inner wall of the second receiving cavity.

[0006] In the above technical solution, firstly, the synergistic effect of the installation position of the temperature control component and the inner wall structure of the second cavity can improve the working stability of the semiconductor cooling heating element in a high-temperature environment, thus providing the prerequisite for temperature control of the semiconductor cooling heating element; secondly, through the rapid response characteristics of the temperature control of the semiconductor cooling heating element, the temperature of the area where the insert is set in the molding cavity can be consistent with that of other areas in the molding cavity within a single die casting cycle, thereby reducing the probability of quality defects in the connecting rod molding. Attached Figure Description

[0007] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 A schematic diagram of the structure of a die-casting mold for an automobile engine connecting rod provided for some embodiments of this application; Figure 2 A schematic diagram of the structure of the first mold in a die-casting mold for an automobile engine connecting rod provided for some embodiments of this application; Figure 3 A schematic diagram of the structure of the second mold in a die-casting mold for an automotive engine connecting rod provided in some embodiments of this application; Figure 4 A schematic diagram of the structure of the first mold core in a die-casting mold for an automobile engine connecting rod provided in some embodiments of this application; Figure 5 for Figure 4 A magnified view of a portion of point A in the middle; Figure 6 A schematic diagram of the structure of the first mold core in a die-casting mold for an automobile engine connecting rod provided in some other embodiments of this application; Figure 7 for Figure 6 A magnified view of a portion of point B in the middle; Figure 8 A schematic diagram of the structure of the first mold in a die-casting mold for an automobile engine connecting rod provided for other embodiments of this application; Figure 9 for Figure 8 A magnified view of a portion of point C in the middle; Figure 10 Schematic diagrams of the structure of a die-casting mold for an automobile engine connecting rod provided for other embodiments of this application; Figure 11 A schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided for other embodiments of this application (showing ejector pins); Figure 12 for Figure 11 A magnified view of a portion of point D in the middle; Figure 13 A schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided for some embodiments of this application (showing a first guide assembly); Figure 14A schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided for some embodiments of this application (showing a second guide assembly and a positioning assembly); Figure 15 A schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided for some embodiments of this application (showing the exhaust passage).

[0009] icon: 1000 - Die-casting mold, 1 - First mold, 11 - First mold core, 111 - First channel, 2 - Second mold, 21 - Second mold core, 3 - Molding cavity, 31 - First chamber, 311 - First cavity, 312 - Second cavity, 313 - Third cavity, 32 - Second chamber, 33 - Insert, 332 - First receiving cavity, 333 - Second receiving cavity, 4 - Temperature control component, 41 - Semiconductor cooling heating element, 42 - Heat-conducting pillar, 43 - Insulation layer, 5 - Air-cooling component, 51 - Fan, 52 - Heat sink, 53 - Airflow channel, 6 - Casting component 61-Pouring cavity, 62-Pouring flow channel, 621-Outlet, 622-Inlet, 7-Ejector base plate, 71-Ejector, 711-First ejector, 712-Second ejector, 713-Third ejector, 8-First guide assembly, 81-First guide post, 82-First guide sleeve, 9-Second guide assembly, 91-Second guide post, 92-Second guide sleeve, 921-Exhaust channel, 10-Positioning assembly, 101-First positioning post, 102-First positioning hole, 103-Second positioning post, 104-Second positioning hole, 20-Foot mold. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0012] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0013] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0014] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0015] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0016] Die casting is an advanced casting technology that uses high pressure to rapidly inject molten metal into a precision mold cavity, where it solidifies under pressure. It is widely used in the automotive, electronics, aerospace, and consumer goods industries. When designing die casting molds for automotive engine connecting rods, inserts are typically placed at both ends of the mold cavity to facilitate the die casting of the connecting rod's big and small ends. To control mold costs, different materials are often used for the inserts and the mold body. This can lead to the temperature in the area where the inserts are located being the same as other areas within the mold cavity, causing quality issues in the connecting rod molding. Specifically, when the thermal conductivity of the inserts is greater than that of the mold body, according to the law of thermal conductivity, heat flux density is proportional to the thermal conductivity of the material. Under the same temperature gradient, heat will dissipate through the inserts more quickly, resulting in a lower temperature in the area where the inserts are located within the mold cavity. Consequently, during the molten metal filling stage, the viscosity of the molten metal increases sharply and its fluidity decreases as it flows through the low-temperature insert area. This can lead to quality defects in the connecting rod molding process. For example, if the temperature is below the alloy's "critical fluidity temperature," the molten metal cannot perfectly replicate the sharp contours of the insert, or the two molten metals may not fully fuse at the point where they meet. This can result in cold shuts or incomplete pouring around the mounting holes at the large and small ends of the connecting rod. When the thermal conductivity of the insert is less than that of the mold body, according to the law of thermal conductivity, heat flux density is proportional to the thermal conductivity of the material. Under the same temperature gradient, heat will dissipate more slowly through the insert, meaning that heat is "blocked" inside the insert and cannot be effectively dissipated, causing the temperature in the area where the insert is located within the molding cavity to rise. This can lead to quality defects in the connecting rod molding process during the molten metal solidification stage. For example, the large and small ends of the connecting rod are thick, hot-nozzle areas that require rapid heat dissipation to promote solidification from the outside in. When the temperature of the area where the insert is installed rises, the solidification time of that area is greatly extended and the solidification speed is slowed down. Since the surrounding area (rod body) may have already solidified, while the insert area is still in a liquid or semi-solid state due to the high temperature, it cannot be replenished by molten metal during solidification shrinkage. This can easily lead to concentrated shrinkage cavities or severe central shrinkage porosity at the root or inside of the mounting holes of the big and small ends of the connecting rod.

[0017] To address the technical problem of inconsistent temperatures between the insert area and other areas within the die cavity affecting the quality of connecting rod molding, an external water-cooling or oil-heating system is typically used to control the insert temperature. However, since this system indirectly exchanges heat between external fluids and the insert through channels, the heat transfer path is from water or heat transfer oil to stainless steel or copper pipes to the insert substrate material. Each path introduces contact thermal resistance, increasing the contact thermal resistance of the temperature control system and reducing heat transfer efficiency. This results in a lag in the response of the external temperature control system, leading to a situation where the temperature of the insert area and other areas within the die cavity cannot reach consistency within a single die-casting cycle (e.g., 10-30 seconds). This increases the probability of quality defects in the connecting rod molding process.

[0018] Based on the above considerations, in order to solve the technical problem that the delayed response of the external temperature control system increases the probability of quality defects in the connecting rod molding, this application provides a die-casting mold for automotive engine connecting rods, including a first mold, a second mold, a molding cavity, and a temperature control component. A first mold core is disposed within the first mold. The second mold is disposed on the first mold, and a second mold core is disposed within the second mold. The molding cavity is disposed between the first mold core and the second mold core, and the molding cavity includes a first chamber disposed on the first mold core and a second chamber disposed on the second mold core. The first chamber includes a first cavity, and a second cavity and a third cavity are respectively disposed at both ends of the first cavity. Inserts are respectively disposed within the second cavity and the third cavity, and a first receiving cavity is disposed within the insert. The first receiving cavity contains a second receiving cavity. The temperature control component is disposed in the second receiving cavity. The temperature control component includes a semiconductor cooling heating element, heat-conducting pillars, and a heat insulation layer. The heat-conducting pillars include multiple pillars, which are arranged around the outer periphery of the semiconductor cooling heating element. One end of each heat-conducting pillar is fixedly connected to the inner wall of the first receiving cavity, and the other end of each heat-conducting pillar is fixedly connected to the semiconductor cooling heating element. The heat insulation layer is disposed on the inner wall of the second receiving cavity.

[0019] In this die-casting mold for automotive engine connecting rods, a first receiving cavity is provided within an insert, and a second receiving cavity is provided within the first receiving cavity. The temperature control component is placed within the second receiving cavity. This ensures that the installation position of the temperature control component does not directly contact the inner wall of the first receiving cavity, thereby reducing the probability that the high temperature generated during the operation of the die-casting mold will be directly transferred to the semiconductor cooling heating element through the insert. At the same time, a heat insulation layer is provided on the inner wall of the second receiving cavity. Due to the good heat insulation effect of the heat insulation layer, the probability that the high temperature generated during the operation of the die-casting mold will enter the second receiving cavity through the insert and be transferred to the semiconductor cooling heating element can be further reduced. Therefore, through the synergistic effect of the installation position of the temperature control component and the inner wall structure of the second receiving cavity, the working stability of the semiconductor cooling heating element in high-temperature environments can be improved. Secondly, by setting the temperature control component to include a semiconductor cooling heating element and multiple heat-conducting pillars, and considering the excellent thermal conductivity of the heat-conducting pillars, the heat transfer efficiency between the semiconductor cooling heating element and the insert is improved by first connecting the multiple heat-conducting pillars to the semiconductor cooling heating element and the first receiving cavity respectively, and arranging the multiple heat-conducting pillars around the outer periphery of the semiconductor cooling heating element. Secondly, by fixing one end of each heat-conducting pillar to the inner wall of the first receiving cavity and the other end to the semiconductor cooling heating element, the installation reliability of the semiconductor cooling heating element is improved by the number and connection method of the heat-conducting pillars. Simultaneously, by changing the direction of the current flowing through the semiconductor cooling heating element, the half-wavelength can be changed. The cooling and heating states of the semiconductor cooling and heating element can be controlled by current, which improves the response speed of temperature control. Therefore, when the insert has a high thermal conductivity, heating by the semiconductor cooling and heating element during the filling stage can compensate for the temperature of the insert area within the mold cavity, thereby reducing the temperature difference within the mold cavity, increasing the fluidity of the molten metal, and reducing the probability of quality defects such as cold shuts or incomplete casting. When the insert has a low thermal conductivity, cooling by the semiconductor cooling and heating element during the molding stage can lower the temperature of the insert area within the mold cavity, thereby reducing the temperature difference within the mold cavity, promoting sequential solidification, and reducing the probability of quality defects such as concentrated shrinkage cavities or severe central shrinkage porosity. Compared to existing systems using external water cooling or oil heating heat exchangers, the semiconductor cooling and heating element's rapid temperature control response via current control allows the temperature of the insert area within the mold cavity to reach consistency with other areas within the mold cavity within a single die-casting cycle.

[0020] In summary, firstly, the synergistic effect of the installation position of the temperature control component and the inner wall structure of the second cavity can improve the working stability of the semiconductor cooling heating element in a high-temperature environment, thus providing the prerequisite for temperature control of the semiconductor cooling heating element; secondly, the rapid response characteristics of the temperature control of the semiconductor cooling heating element can ensure that the temperature of the area where the insert is located in the molding cavity is consistent with that of other areas in the molding cavity within a single die-casting cycle, thereby reducing the probability of quality defects in the connecting rod molding.

[0021] Please refer to Figure 1-5 , Figure 1 A schematic diagram of the structure of a die-casting mold for an automobile engine connecting rod provided for some embodiments of this application; Figure 2 A schematic diagram of the structure of the first mold in a die-casting mold for an automobile engine connecting rod provided for some embodiments of this application; Figure 3 A schematic diagram of the structure of the second mold in a die-casting mold for an automotive engine connecting rod provided in some embodiments of this application; Figure 4 A schematic diagram of the structure of the first mold core in a die-casting mold for an automobile engine connecting rod provided in some embodiments of this application; Figure 5 for Figure 4 A partially enlarged schematic diagram at point A. This application provides a die-casting mold 1000 for automotive engine connecting rods, including a first mold 1, a second mold 2, a forming cavity 3, and a temperature control component 4. A first mold core 11 is disposed within the first mold 1. The second mold 2 is disposed on the first mold 1, and a second mold core 21 is disposed within the second mold 2. The forming cavity 3 is disposed between the first mold core 11 and the second mold core 21. The forming cavity 3 includes a first chamber 31 disposed on the first mold core 11 and a second chamber 32 disposed on the second mold core 21. The first chamber 31 includes a first cavity 311, with a second cavity 312 and a third cavity 313 respectively disposed at both ends. Inserts 33 are respectively disposed within the second cavity 312 and the third cavity 313. Each insert 33 has a first receiving cavity 332, and the first receiving cavity 332 has a second receiving cavity 333. The temperature control component 4 is disposed in the second receiving cavity 333. The temperature control component 4 includes a semiconductor cooling heating element 41, heat-conducting pillars 42, and a heat insulation layer 43. There are multiple heat-conducting pillars 42, which are arranged around the outer periphery of the semiconductor cooling heating element 41. One end of the heat-conducting pillar 42 is fixedly connected to the inner wall of the first receiving cavity 332, and the other end of the heat-conducting pillar 42 is fixedly connected to the semiconductor cooling heating element 41. The heat insulation layer 43 is disposed on the inner wall of the second receiving cavity 333.

[0022] The first mold 1 and the first mold core 11 can be detachably fixed, for example, by screws and threaded holes.

[0023] The second mold 2 and the second mold core 21 can be detachably fixed, for example, by screws and threaded holes.

[0024] The molding cavity 3 can be the internal cavity formed by the first chamber 31 and the second chamber 32 when the first mold core 11 and the second mold core 21 are closed. The internal contour shape of the internal cavity matches the external contour shape of the connecting rod of the automobile engine.

[0025] The semiconductor cooling and heating element 41 may include a first part and a second part that are back-to-back and attached to each other. The first and second parts can be ceramic sheets. Multiple N-type and P-type semiconductors are spaced apart between the first and second parts. Adjacent N-type and P-type semiconductors are electrically connected, with the connection point located on the first and second parts. When a first current is input to the semiconductor cooling and heating element 41, heat from the second part is transferred to the first part, causing the temperature of the first part to rise and the temperature of the second part to fall. The first part transfers heat to the insert 33 through a heat-conducting pillar 42, causing the temperature of the insert 33 to rise. When a second current is input, heat from the first part is transferred to the second part, causing the temperature of the first part to fall and the temperature of the second part to rise. The insert 33 transfers heat to the first part through the heat-conducting pillar 42, causing the temperature of the insert 33 to fall. The first and second currents are in opposite directions, and their directions can be switched using circuit components. For example, the current control component may include a control circuit board and a battery electrically connected to the control circuit board. The battery can be a rechargeable battery or a regular dry cell battery, used to provide power to the control circuit board. The control circuit board may be a circuit board integrating a microcontroller or other CPU chip.

[0026] The heat-conducting pillar 42 can be made of a heat-conducting material, such as copper alloy or aluminum alloy.

[0027] The heat insulation layer 43 is disposed on the inner wall of the second receiving cavity 333. The heat insulation layer 43 may cover part of the inner wall of the second receiving cavity 333, or it may cover the entire inner wall of the second receiving cavity 333. In order to facilitate the installation of the heat-conducting column 42, the heat insulation layer 43 may also be provided with through holes for the heat-conducting column 42 to pass through.

[0028] The insulation layer 43 can be made of insulation material, which can be ceramic.

[0029] In this embodiment, firstly, a first receiving cavity 332 is provided within the insert 33, and a second receiving cavity 333 is provided within the first receiving cavity 332. The temperature control component 4 is then placed within the second receiving cavity 333. This ensures that the installation position of the temperature control component 4 does not directly contact the inner wall of the first receiving cavity 332, thereby reducing the probability that the high temperature generated during the operation of the die-casting mold 1000 will be directly transferred to the semiconductor cooling heating element 41 through the insert 33. Simultaneously, a heat insulation layer 43 is provided on the inner wall of the second receiving cavity 333. Since the heat insulation layer 43 has a good heat insulation effect, this further reduces the probability that the high temperature generated during the operation of the die-casting mold 1000 will enter the second receiving cavity 333 through the insert 33 and be transferred to the semiconductor cooling heating element 41. Therefore, through the synergistic effect of the installation position of the temperature control component 4 and the inner wall structure of the second receiving cavity 333, the working stability of the semiconductor cooling heating element 41 in a high-temperature environment can be improved. Secondly, by setting the temperature control component 4 to include a semiconductor cooling heating element 41 and multiple heat-conducting pillars 42, since the heat-conducting pillars 42 have good thermal conductivity, the multiple heat-conducting pillars 42 are first connected to the semiconductor cooling heating element 41 and the first receiving cavity 332 respectively, and arranged around the outer periphery of the semiconductor cooling heating element 41. This improves the heat transfer efficiency between the semiconductor cooling heating element 41 and the insert 33 by adjusting the number and position of the heat-conducting pillars 42. Furthermore, by fixing one end of each heat-conducting pillar 42 to the inner wall of the first receiving cavity 332 and the other end to the semiconductor cooling heating element 41, the installation reliability of the semiconductor cooling heating element 41 is improved by adjusting the number and connection method of the heat-conducting pillars 42. Simultaneously, by changing the current flowing through the semiconductor cooling heating element 41... The direction can change the cooling and heating state of the semiconductor cooling and heating element 41. The response speed of the temperature control of the semiconductor cooling and heating element 41 can be improved by current control. Therefore, when the thermal conductivity of the insert 33 is large, the temperature of the area where the insert 33 is set in the molding cavity 3 can be compensated by the heating of the semiconductor cooling and heating element 41 during the filling stage. This can reduce the temperature difference in the molding cavity 3, increase the fluidity of the molten metal, and reduce the probability of quality defects such as cold shuts or insufficient pouring. When the thermal conductivity of the insert 33 is small, the temperature of the area where the insert 33 is set in the molding cavity 3 can be reduced by the cooling of the semiconductor cooling and heating element 41 during the molding stage. This can reduce the temperature difference in the molding cavity 3, promote sequential solidification, and reduce the probability of quality defects such as concentrated shrinkage cavities or severe central shrinkage porosity. Compared to existing heat exchange systems that use external water cooling or oil heating, the semiconductor cooling heating element 41 can achieve rapid temperature control through current control, thus enabling the temperature of the area where the insert 33 is located in the molding cavity 3 to be consistent with other areas in the molding cavity 3 within a single die-casting cycle.

[0030] In summary, firstly, the synergistic effect of the installation position of the temperature control component 4 and the inner wall structure of the second receiving cavity 333 can improve the working stability of the semiconductor cooling heating element 41 in a high-temperature environment, thus providing the prerequisite for temperature control of the semiconductor cooling heating element 41; secondly, the rapid response characteristics of the temperature control of the semiconductor cooling heating element 41 can ensure that the temperature of the area where the insert 33 is set in the molding cavity 3 is consistent with that of other areas in the molding cavity 3 within a single die-casting cycle, thereby reducing the probability of quality defects in the connecting rod molding.

[0031] In some embodiments, please refer to Figure 6-7 , Figure 6 A schematic diagram of the structure of the first mold core in a die-casting mold for an automobile engine connecting rod provided in some other embodiments of this application; Figure 7 for Figure 6 A partially enlarged schematic diagram at point B. It also includes an air-cooling component 5, which comprises a fan 51, a heat sink 52, and an airflow channel 53. One end of the airflow channel 53 is connected to the semiconductor cooling heating element 41, and the other end of the airflow channel 53 is connected to the outside of the first module 1. The fan 51 and the heat sink 52 are disposed within the airflow channel 53. One side of the heat sink 52 is connected to the semiconductor cooling heating element 41, and the other side of the heat sink 52 is connected to the fan 51.

[0032] The heat sink 52 can be connected to the semiconductor cooling heating element 41 by adhesive bonding, such as using thermally conductive silicone or double-sided thermally conductive adhesive, or by threaded bonding, such as using bolts and nuts.

[0033] The heat sink 52 and the fan 51 can be connected by adhesive bonding, such as using thermally conductive silicone or double-sided thermally conductive adhesive, or by threaded bonding, such as using bolts and nuts.

[0034] The heat sink 52 can be a biomimetic fish tail fin heat sink, heat sink fin, etc., and the heat sink 52 can be made of thermally conductive materials, such as copper, aluminum, etc.

[0035] When the first current is input, the heat from the second part is transferred to the first part, causing the temperature of the first part to rise and the temperature of the second part to fall. The first part heats the insert 33. At this time, the fan 51 rotates and blows external gas (at this time, the temperature of the external gas is higher than the temperature of the second part) towards the second part, reducing the temperature difference between the first and second parts, thereby keeping the semiconductor cooling heating element 41 in a stable working state. When the second current is input, the heat from the first part is transferred to the second part, causing the temperature of the first part to fall and the temperature of the second part to rise. The first part cools the insert 33. At this time, the fan 51 rotates and blows the heat from the second part to the outside, reducing the temperature difference between the first and second parts, thereby keeping the semiconductor cooling heating element 41 in a stable working state.

[0036] The airflow channel 53 can be directly connected to the outside of the first mold 1, for example, the airflow channel 53 extends directly from the inside of the first mold 1 to the outside of the first mold 1; or it can be indirectly connected, for example, the first mold 1 has a first channel 111, one end of the first channel 111 is connected to the airflow channel 53, and the other end of the first channel 111 is connected to the outside of the first mold 1.

[0037] In this embodiment, by configuring the air-cooling component 5, which includes a fan 51, a heat sink 52, and an airflow channel 53, when it is necessary to cool the semiconductor cooling heating element 41, since one side of the heat sink 52 is connected to the semiconductor cooling heating element 41 and the other side is connected to the fan 51, the heat sink 52 can transfer the heat on the semiconductor cooling heating element 41 to the fan 51. The fan 51 then rotates to generate airflow, which in turn transfers the heat on the semiconductor cooling heating element 41 to the outside of the first module 1 through the airflow channel 53, thereby cooling the semiconductor cooling heating element. 41 Cooling is performed; when it is necessary to heat up the semiconductor cooling heating element 41, the heat outside the first module 1 can be transferred to the fan 51 through the airflow generated by the rotation of the fan 51 and through the airflow channel 53. Since one side of the heat sink 52 is connected to the semiconductor cooling heating element 41 and the other side is connected to the fan 51, the heat sink 52 can transfer the external heat introduced by the fan 51 to the semiconductor cooling heating element 41, thereby heating up the semiconductor cooling heating element 41. Therefore, the air cooling component 5 keeps the semiconductor cooling heating element 41 in a stable working state.

[0038] In some embodiments, please refer to Figure 8 , Figure 8This is a schematic diagram of the structure of the first mold in a die-casting mold for an automotive engine connecting rod provided in some other embodiments of this application. It also includes a casting assembly 6, which includes a casting cavity 61 and a casting channel 62. The casting cavity 61 is disposed on the first mold 1. The inlet 622 of the casting channel 62 communicates with the casting cavity 61, and the outlet 621 of the casting channel 62 communicates with the first chamber 31.

[0039] The bottom wall of the casting channel 62 can be inclined along the direction from the inlet 622 to the outlet 621, and the inclination angle can be 1°-3°. By inclining the above-mentioned inclination angle, the molten metal can be subjected to the gravitational component along the flow direction when it flows in the casting channel 62, providing auxiliary driving force in the slow injection stage and maintaining the molten metal in the state of "filling the channel".

[0040] In this embodiment, by setting the casting component 6 to include a casting cavity 61 and a casting channel 62, one end of the casting channel 62 is connected to the casting cavity 61 and the other end is connected to the first chamber 31. In this way, the flow of molten metal can be directionally guided by the channel formed by the wall of the casting channel 62, guiding the molten metal from the casting cavity 61 into the mold cavity in a smooth and orderly manner, effectively suppressing turbulence and splashing, significantly reducing the risk of defects such as air entrapment, cold shuts, and porosity, and improving the internal density of the casting.

[0041] In some embodiments, please refer to Figure 9 , Figure 9 for Figure 8 A partially enlarged schematic diagram at point C. The outlet 621 of the casting channel 62 is connected to the middle of the second cavity 312.

[0042] Because the outlet 621 of the casting channel 62 is located in the area with the insert 33 within the molding cavity 3, the high-speed flowing molten metal during die casting will directly impact the surface of the insert 33, accelerating its wear and loosening. Simultaneously, the edges of the insert 33 will disrupt the molten metal flow field, leading to air entrapment and cold shut-off. Therefore, in this embodiment, by positioning the outlet 621 in the middle of the second cavity 312, and since there is no insert 33 inside the second cavity 312, the initial impact point of the high-speed flowing molten metal during die casting is far from the surface of the insert 33, reducing the probability of accelerated wear and loosening of the insert 33. Furthermore, because the interior surface of the second cavity 312 is flat and continuous without inserts 33, the molten metal enters the molding cavity 3 from the flat and continuous area of ​​the second cavity 312, avoiding flow separation and eddies caused by the edges of the insert 33, thereby reducing air entrapment and cold shut-off.

[0043] In some embodiments, please refer to Figure 10 , Figure 10This is a schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided in some other embodiments of this application. The first mold 1, on the side opposite to the second mold 2, is also provided with an ejector base plate 7 that moves along the thickness direction of the first mold 1. An ejector pin 71 is provided on the ejector base plate 7, one end of which is fixedly connected to the ejector base plate 7, and the other end of which is inserted into the bottom wall of the first chamber 31.

[0044] The ejector base plate 7 can be mounted on the first mold 1 via the foot mold 20. The foot mold 20 and the first mold 1 can be detachably fixed, for example, by screws and threaded holes. Because the foot mold 20 is detachably fixed to the first mold 1, when a single ejector pin 71 is damaged, it is only necessary to remove the foot mold 20 and pull out the ejector base plate 7 to quickly replace the single ejector pin 71.

[0045] In this embodiment, a movable ejector base plate 7 is provided, and an ejector pin 71 is provided on the ejector base plate 7. One end of the ejector pin 71 is inserted into the bottom wall of the first chamber 31. In this way, when the ejector base plate 7 moves, the end of the ejector pin 71 can be driven into the first chamber 31 to eject the connecting rod mold blank in the first chamber 31, thereby improving the efficiency of die casting demolding.

[0046] In some embodiments, please refer to Figure 11-12 , Figure 11 A schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided for other embodiments of this application (showing ejector pins); Figure 12 for Figure 11 A partially enlarged schematic diagram at point D. The ejector pin 71 includes a first ejector pin 711, a second ejector pin 712, and a third ejector pin 713. One end of the first ejector pin 711 is located at the bottom edge of the first cavity 311, one end of the second ejector pin 712 is located in the middle of the bottom wall of the second cavity 312, and one end of the third ejector pin 713 is located at the bottom edge of the third cavity 313.

[0047] The number of first ejector pins 711 can be multiple, and the multiple first ejector pins 711 can be evenly arranged around the outer periphery of the first cavity 311. The number of third ejector pins 713 can be multiple, and the multiple third ejector pins 713 can be evenly arranged around the outer periphery of the third cavity 313.

[0048] The number of second ejector pins 712 can be multiple, and the multiple second ejector pins 712 can be evenly spaced along the length direction of the second cavity 312.

[0049] Since the engine connecting rod is a slender and irregularly shaped part, it is very easy to cause twisting if the ejector pin 71 is used for single-point ejection. Therefore, in this embodiment, the ejector pin 71 is set to include a first ejector pin 711, a second ejector pin 712, and a third ejector pin 713. The first ejector pin 711 is located at the bottom edge of the first cavity 311, the second ejector pin 712 is located in the middle of the bottom wall of the second cavity 312, and the third ejector pin 713 is located at the bottom edge of the third cavity 313. By setting the positions, the three ejector pins 71 provide multi-point ejection during the ejection process of the engine connecting rod, thereby reducing the probability of deformation of the connecting rod mold blank due to single-point force.

[0050] In some embodiments, please refer to Figure 13 , Figure 13 This is a schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided in some embodiments of this application (showing a first guide assembly). It also includes a first guide assembly 8, which comprises a first guide sleeve 82 disposed on the ejector pin base plate 7 and a first guide post 81 disposed on the first mold 1, the first guide sleeve 82 and the first guide post 81 being in a guiding engagement.

[0051] The first guide assembly 8 may also include a first guide post 81 disposed on the ejector base plate 7 and a first guide sleeve 82 disposed on the first mold 1.

[0052] In the first guide assembly 8, there are first guide sleeves 82 disposed on the ejector base plate 7 and first guide posts 81 disposed on the first mold 1. In the embodiment where the first guide sleeves 82 and the first guide posts 81 are guided and engaged, the number of first guide sleeves 82 can be four, and the positions of the four first guide sleeves 82 can be distributed at the four corners of the ejector base plate 7. There can also be four first guide posts 81, and the positions of the four first guide posts 81 on the first mold 1 correspond one-to-one with the positions of the four first guide sleeves 82.

[0053] In this embodiment, since the first guide post 81 and the first guide sleeve 82 form a high-precision sliding pair, the five degrees of freedom of the ejector base plate 7 can be constrained, retaining only a single degree of freedom along the thickness direction of the first mold 1. Under the drive of the ejector force of the die-casting machine, the ejector base plate 7 moves strictly along the axis of the first guide post 81, reducing the probability of casting scratches or hole deformation caused by the tilting of the ejector pin 71.

[0054] In some embodiments, please refer to Figure 14 , Figure 14 This is a schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided in some embodiments of this application (showing a second guide assembly and a positioning assembly). It also includes a second guide assembly 9, which comprises a second guide post 91 disposed on the first mold 1 and a second guide sleeve 92 disposed on the second mold 2, the second guide sleeve 92 and the second guide post 91 engaging in a guiding fit.

[0055] The second guide assembly 9 may further include a second guide sleeve 92 disposed on the first mold 1 and a second guide post 91 disposed on the second mold 2.

[0056] In the second guide component 9, there are two guide posts 91 disposed on the first mold 1 and two guide sleeves 92 disposed on the second mold 2. In the embodiment where the second guide sleeves 92 and the second guide posts 91 are guided and engaged, there can be four second guide sleeves 92, and the positions of the four second guide sleeves 92 can be distributed at the four corners of the second mold 2. There can also be four second guide posts 91, and the positions of the four second guide posts 91 on the first mold 1 correspond one-to-one with the positions of the four second guide sleeves 92.

[0057] In this embodiment, since the second guide post 91 and the second guide sleeve 92 form a high-precision sliding pair, the five degrees of freedom of the first mold 1 can be constrained, retaining only a single degree of freedom along the mold closing direction. This ensures that the first mold 1 moves strictly along the axis of the second guide post 91 under external force, reducing the probability of misalignment between the first chamber 31 and the second chamber 32, thereby reducing the probability of flash in the casting.

[0058] In some embodiments, please refer to Figure 15 , Figure 15 This is a schematic diagram of the structure of a die-casting mold for an automotive engine connecting rod provided in some embodiments of this application (showing an exhaust channel). An exhaust channel 921 is provided at the end of the second guide sleeve 92 away from the first mold 1. One end of the exhaust channel 921 communicates with the interior of the second guide sleeve 92, and the other end of the exhaust channel 921 communicates with the exterior of the second mold 2.

[0059] When the mold closes, the rapid insertion of the second guide post 91 into the second guide sleeve 92 compresses the air inside the second guide sleeve 92. Without an exhaust channel 921, this air compression causes an air cushion effect (i.e., hindering the complete insertion of the guide post, affecting mold closing accuracy and speed). Therefore, in this embodiment, an exhaust channel 921 is provided on the second guide sleeve 92. One end of the exhaust channel 921 is connected to the inside of the second guide sleeve 92, and the other end is connected to the outside of the second mold 2. This allows the gas generated by the rapid insertion of the second guide post 91 into the second guide sleeve 92 to be released to the outside of the second mold 2, enabling the second guide post 91 to be smoothly inserted into the second guide sleeve 92 and reducing the probability of the air cushion effect.

[0060] In some embodiments, please refer to Figure 14It also includes a positioning component 10, which includes a first positioning post 101 disposed on the first mold 1 and a first positioning hole 102 disposed on the first mold core 11, wherein the first positioning post 101 and the first positioning hole 102 are positioned and engaged, and / or the positioning component 10 includes a second positioning post 103 disposed on the second mold 2 and a second positioning hole 104 disposed on the second mold core 21, wherein the second positioning post 103 and the second positioning hole 104 are positioned and engaged.

[0061] The positioning component 10 may include a first positioning hole 102 disposed on the first mold 1 and a first positioning post 101 disposed on the first mold core 11.

[0062] The positioning component 10 may include a second positioning hole 104 disposed on the second mold 2 and a second positioning post 103 disposed on the second mold core 21.

[0063] The first mold 1 and the first mold core 11, the second mold 2 and the second mold core 21 are fixedly connected by screws and threaded holes. Because there are gaps between the screws and threaded holes, the positions of the mold and the mold core may shift during installation of the first mold 1 and the first mold core 11, or the second mold 2 and the second mold core 21, thus affecting the mold closing accuracy. Therefore, in this embodiment, a positioning component 10 is provided. The positioning component 10 includes a first positioning post 101 disposed on the first mold 1 and a first positioning hole 102 disposed on the first mold core 11; and / or the positioning component 10 includes a second positioning post 103 disposed on the second mold 2 and a second positioning hole 104 disposed on the second mold core 21. This allows for accurate positioning of the mold and mold core before installation through the positioning cooperation of the positioning post and the positioning hole, thereby reducing the probability of positional shift during installation and improving the mold closing accuracy.

[0064] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0065] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit this application. For those skilled in the art, this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A die-casting mold for connecting rods in automobile engines, characterized in that, include: The first mold, wherein a first mold core is provided inside the first mold; The second mold is disposed on the first mold, and a second mold core is disposed inside the second mold. A molding cavity is disposed between a first mold core and a second mold core. The molding cavity includes a first chamber disposed on the first mold core and a second chamber disposed on the second mold core. The first chamber includes a first cavity, and a second cavity and a third cavity are respectively disposed at both ends of the first cavity. Inserts are respectively disposed in the second cavity and the third cavity. A first receiving cavity is disposed in the insert, and a second receiving cavity is disposed in the first receiving cavity. A temperature control component is disposed within a second receiving cavity. The temperature control component includes a semiconductor cooling heating element, heat-conducting pillars, and a heat insulation layer. The heat-conducting pillars include multiple pillars arranged around the outer periphery of the semiconductor cooling heating element. One end of each heat-conducting pillar is fixedly connected to the inner wall of the first receiving cavity, and the other end is fixedly connected to the semiconductor cooling heating element. The heat insulation layer is disposed on the inner wall of the second receiving cavity.

2. The die-casting mold for automobile engine connecting rods according to claim 1, characterized in that, It also includes an air-cooling component, which includes a fan, a heat sink, and an airflow channel. One end of the airflow channel is connected to the semiconductor cooling and heating element, and the other end of the airflow channel is connected to the outside of the first module. The fan and the heat sink are disposed in the airflow channel. One side of the heat sink is connected to the semiconductor cooling and heating element, and the other side of the heat sink is connected to the fan.

3. The die-casting mold for automobile engine connecting rods according to claim 1, characterized in that, It also includes a casting assembly, which includes a casting cavity and a casting channel. The casting cavity is disposed on the first mold, the inlet of the casting channel is connected to the casting cavity, and the outlet of the casting channel is connected to the first chamber.

4. The die-casting mold for automobile engine connecting rods according to claim 3, characterized in that, The outlet of the casting channel is connected to the middle of the second cavity.

5. The die-casting mold for automobile engine connecting rods according to claim 1, characterized in that, The first mold is also provided with an ejector base plate that moves along the thickness direction of the first mold on the side opposite to the second mold. An ejector pin is provided on the ejector base plate, one end of the ejector pin is fixedly connected to the ejector base plate, and the other end of the ejector pin is inserted into the bottom wall of the first chamber.

6. The die-casting mold for automobile engine connecting rods according to claim 5, characterized in that, The ejector pin includes a first ejector pin, a second ejector pin, and a third ejector pin. One end of the first ejector pin is located at the bottom edge of the first cavity, one end of the second ejector pin is located at the middle of the bottom wall of the second cavity, and one end of the third ejector pin is located at the bottom edge of the third cavity.

7. The die-casting mold for automobile engine connecting rods according to claim 5, characterized in that, It also includes a first guide assembly, which includes a first guide sleeve disposed on the ejector pin base plate and a first guide post disposed on the first mold, wherein the first guide sleeve and the first guide post are guided and engaged.

8. The die-casting mold for automobile engine connecting rods according to claim 1, characterized in that, It also includes a second guide component, which includes a second guide post disposed on the first mold and a second guide sleeve disposed on the second mold, wherein the second guide sleeve and the second guide post are guided and engaged.

9. The die-casting mold for automobile engine connecting rods according to claim 8, characterized in that, The second guide sleeve has an exhaust channel at its end away from the first mold. One end of the exhaust channel is connected to the interior of the second guide sleeve, and the other end of the exhaust channel is connected to the exterior of the second mold.

10. The die-casting mold for automobile engine connecting rods according to claim 1, characterized in that, It also includes a positioning component, the positioning component including a first positioning post disposed on the first mold and a first positioning hole disposed on the first mold core, the first positioning post and the first positioning hole being positioned and engaged; and / or the positioning component including a second positioning post disposed on the second mold and a second positioning hole disposed on the second mold core, the second positioning post and the second positioning hole being positioned and engaged.

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