3D printing electromagnetic shielding component preparation method based on electromagnetic signal detection
By optimizing electromagnetic radiation detection using magnetic field probes and point cloud software, and combining this with 3D printing technology, electromagnetic shielding components capable of specifically suppressing electromagnetic signals were fabricated. This solved the problems of relying on manual drawing and design and non-targeted suppression in existing technologies, thus improving the electromagnetic shielding effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LONG YOUNG ELECTRONIC (KUNSHAN) CO LTD
- Filing Date
- 2026-02-03
- Publication Date
- 2026-05-15
AI Technical Summary
The current process for manufacturing customized electromagnetic shielding components based on 3D printing relies on manual drawing and design, and cannot achieve targeted electromagnetic signal suppression based on the electromagnetic radiation intensity and frequency characteristics of electrical components.
Electromagnetic radiation intensity and frequency are detected by a magnetic field probe. Point cloud software is used to segment and optimize the gap features. Combined with fused deposition modeling 3D printers and direct-write 3D printers, electromagnetic shielding components are prepared. Conductive paste is printed at specific locations according to the intensity and frequency characteristics of electromagnetic radiation to form targeted electromagnetic shielding.
The efficient fabrication of electromagnetic shielding components has been achieved, enabling targeted suppression based on the electromagnetic radiation intensity and frequency characteristics of electrical components, thereby improving the quality and practicality of electromagnetic shielding.
Smart Images

Figure CN122033241A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electromagnetic shielding technology, and in particular to a method for preparing 3D-printed electromagnetic shielding components based on electromagnetic signal detection. Background Technology
[0002] In recent years, electromagnetic pollution and interference caused by low-frequency electromagnetic radiation generated by electronic equipment have become increasingly prominent. Low-frequency magnetic fields below 100kHz can even have significant effects on animal physiology. Electromagnetic shielding materials can effectively reduce electromagnetic radiation hazards and improve the operational stability of electronic equipment. Low-frequency electromagnetic shielding materials achieve shielding through internal absorption loss, a method that does not interfere with other devices and is considered an ideal shielding method. In precision electronic devices such as mobile phones, laptops, communication modules, new energy vehicles, and aerospace components, the application of electromagnetic shielding materials is particularly necessary to prevent electromagnetic interference between internal components and suppress the influence of external electromagnetic signals.
[0003] Traditional prefabricated shielding components have fixed shapes, high customization costs, insufficient fit with complex three-dimensional structures, and cumbersome installation procedures, making it difficult to meet the high integration, rapid R&D, and increasingly stringent EMI / EMC (electromagnetic compatibility) requirements of modern electronic products. Our company's prior application for a customized electromagnetic shielding component based on 3D printing solves the problems existing in prefabricated standard parts.
[0004] However, the aforementioned customized electromagnetic shielding components based on 3D printing still have obvious limitations: their preparation process relies on manual drawing and design, and the shielding components produced cannot achieve targeted electromagnetic signal suppression based on the differences in electromagnetic radiation intensity and electromagnetic signal frequency characteristics of different electrical components.
[0005] To address the aforementioned issues, this application discloses a method for preparing 3D-printed electromagnetic shielding components based on electromagnetic signal detection. Summary of the Invention
[0006] To overcome the shortcomings of the prior art, this invention discloses a method for preparing 3D printed electromagnetic shielding components based on electromagnetic signal detection.
[0007] To achieve the above objectives, the technical solution adopted by this invention is: a method for preparing 3D-printed electromagnetic shielding components based on electromagnetic signal detection, comprising the following steps:
[0008] S100 uses a magnetic field probe to detect the electromagnetic radiation intensity and frequency of each electrical component in the electronic carrier and transmits the data to a spectrum analyzer for analysis.
[0009] The S200 uses a laser line scanning 3D camera to scan electronic carriers and import them into point cloud software. The point cloud software then segments, filters, and purifies the mixed point cloud of electrical components, gaps, and electronic carriers, retaining only the point cloud features of the gap areas.
[0010] S300 uses point cloud software to first design and optimize the gap, perform simulation analysis, extract the two-dimensional contour of the gap, and then stretch it into a solid model. This model is then imported into three-dimensional modeling software for editing, thus forming the final electromagnetic shielding component model.
[0011] The S400 transfers the electromagnetic shielding component model to the fused deposition modeling 3D printer and loads composite filaments through the fused deposition modeling 3D printer to directly print the shielding component onto the conductive substrate or paste it onto the conductive substrate;
[0012] The S500 controls the direct-write 3D printer to print conductive paste at specific locations on the electromagnetic shielding component based on the electromagnetic radiation intensity and frequency of each electromagnetic component, thereby forming a composite structure with electromagnetic shielding function.
[0013] As a preferred embodiment of the present invention, the point cloud software has a point cloud fitting contour function for extracting the two-dimensional contour of the gaps and then stretching it into a solid model.
[0014] As a preferred embodiment of the present invention, a margin of 2-10mm is reserved between one side of the electromagnetic shielding component model and each electrical component on the electronic carrier.
[0015] As a preferred embodiment of the present invention, the 3D modeling software is either SolidWorks or Fusion 360.
[0016] In a preferred embodiment of the present invention, the composite wire is made by extruding a mixture of TPU or PLA material with conductive powder.
[0017] In a preferred embodiment of the present invention, the conductive powder is one or more of silver powder, copper powder, carbon nanotubes or graphene.
[0018] In a preferred embodiment of the present invention, the conductive paste is made of one or more of the following materials: silver powder, copper powder, carbon nanotubes, or graphene.
[0019] As a preferred embodiment of the present invention, it further includes a first conductive double-sided adhesive, which adheres the electromagnetic shielding component to the conductive substrate.
[0020] As a preferred embodiment of the present invention, it further includes a second conductive double-sided adhesive, which is applied to the bottom of the conductive substrate for attaching the electromagnetic shielding component to the electronic carrier.
[0021] In a preferred embodiment of the present invention, after the direct-write 3D printer prints conductive paste at a designated position on the electromagnetic shielding component, it needs to be dried and cured sequentially by a thermosetting device and a UV lamp.
[0022] The present invention achieves the following beneficial effects:
[0023] The electromagnetic shielding produced by the method of this application not only solves the problems of existing technologies that rely on the production of prefabricated standard parts, but also enables the shielding components to suppress electromagnetic signals in a targeted manner based on the differences in electromagnetic radiation intensity and electromagnetic signal frequency characteristics of different electrical components, thereby improving the quality of electromagnetic shielding and making it highly practical.
[0024] Other features and advantages of the invention will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention can be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description
[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this invention and, together with the description, serve to explain the principles of this disclosure.
[0026] Figure 1 This is a schematic diagram of the preparation method disclosed in this invention;
[0027] Figure 2 This is a schematic diagram of an electromagnetic shielding component structure disclosed in this invention;
[0028] Figure 3 This is a schematic diagram of the installation of an electromagnetic shielding component and a conductive substrate disclosed in this invention;
[0029] Figure 4 This is a schematic diagram of the installation of another electromagnetic shielding component and conductive substrate disclosed in this invention;
[0030] In the figure: 10, electromagnetic shielding component; 11, conductive paste; 20, conductive substrate; 30, second conductive double-sided adhesive; 40, first conductive double-sided adhesive. Detailed Implementation
[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0032] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.
[0033] Example
[0034] To address the significant limitations of current 3D-printed customized electromagnetic shielding components: their fabrication process relies on manual drawing and design, and the resulting shielding components cannot achieve targeted electromagnetic signal suppression based on the differences in electromagnetic radiation intensity and electromagnetic signal frequency characteristics of different electrical components, reference is made to... Figure 1 and Figure 2 As shown, this application discloses a method for fabricating 3D-printed electromagnetic shielding components based on electromagnetic signal detection, comprising the following steps:
[0035] S100 uses a magnetic field probe to detect the electromagnetic radiation intensity and frequency of each electrical component in the electronic carrier and transmits the data to a spectrum analyzer for analysis. The electronic carrier can be a housing or PCB board used to install electrical components.
[0036] The S200 uses a laser line-scanning 3D camera to scan electronic carriers and import them into point cloud software. The point cloud software then segments, filters, and purifies the mixed point cloud of electrical components, gaps, and electronic carriers, retaining only the point cloud features of the gap areas. The resolution / accuracy of this line-scanning 3D camera is ≤5μm in the horizontal direction and ≤0.5μm in the height direction.
[0037] The S300 uses point cloud software to first design, optimize, and simulate the gap, then extracts the two-dimensional contour of the gap and stretches it into a solid model. This model is then imported into 3D modeling software for editing, thus forming the final electromagnetic shielding component 10 model. Specifically, the point cloud software has a point cloud fitting contour function to extract the two-dimensional contour of the gap and stretch it into a solid model. The 3D modeling software can be either SolidWorks or Fusion360.
[0038] S400, the electromagnetic shielding component 10 model is transferred to the fused deposition modeling (FDM) 3D printer, and composite filament is loaded by the FDM 3D printer to directly print the shielding component onto the conductive substrate 20 or to attach it to the conductive substrate 20 (see reference). Figure 3-4 As shown in the figure, the conductive substrate 20 can be either copper foil or conductive cloth.
[0039] S500, according to the electromagnetic radiation intensity and frequency of each electromagnetic component, controls the direct-write 3D printer to print conductive paste 11 at specific positions of the electromagnetic shielding component 10 to form a composite structure with electromagnetic shielding function. After printing the conductive paste 11 at the designated position of the electromagnetic shielding component 10, the direct-write 3D printer needs to be dried and cured by passing it through a thermosetting device and a UV lamp in sequence. For example, if the electronic carrier is equipped with a CPU chip, and according to the electromagnetic radiation intensity and frequency generated by the CPU chip, the direct-write 3D printer will print conductive paste 11 at the position of the electromagnetic shielding component 10 corresponding to the CPU chip until the best suppression effect on the electromagnetic signal is achieved.
[0040] To facilitate the printing of conductive paste 11 at specific locations on the printed electromagnetic shielding component 10 and to ensure that the final composite structure can be installed on the electromagnetic carrier, a 2-10mm margin is reserved between one side of the electromagnetic shielding component 10 model and each electrical component on the electronic carrier. In some preferred embodiments, a margin of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm is reserved between one side of the electromagnetic shielding component 10 model and each electrical component on the electronic carrier.
[0041] To make the composite wire conductive, the composite wire of this application is made by extruding a mixture of TPU or PLA material with conductive powder. TPU material is elastic and suitable for parts that require shock absorption or frequent insertion and removal; PLA material has good rigidity and is suitable for parts that require structural support. Preferably, the conductive powder is one or more of silver powder, copper powder, carbon nanotubes or graphene. Of course, in actual use, the conductive powder and TPU or PLA material must be uniformly mixed together before extrusion to ensure that the resulting composite wire has uniform conductivity.
[0042] Similarly, the conductive paste 11 of this application is made of one or more of the following materials: silver powder, copper powder, carbon nanotubes or graphene. By printing the conductive paste 11 at a specific position of the electromagnetic shielding component 10 using a direct-write 3D printer, it can be printed at the corresponding position of the electromagnetic shielding component 10 according to the difference in electromagnetic radiation intensity and electromagnetic signal frequency characteristics generated by the electrical components, thereby achieving targeted electromagnetic signal suppression.
[0043] In one embodiment, the present application further includes a first conductive double-sided adhesive 40, which adheres the electromagnetic shielding component 10 to the conductive substrate 20. This applies only to fused deposition modeling 3D printers that do not directly print the electromagnetic shielding component 10 onto the conductive substrate 20, but instead use the first conductive double-sided adhesive 40 to attach the electromagnetic shielding component 10 to the conductive substrate 20.
[0044] In order to install the electromagnetic shielding component 10 onto the electronic carrier, this application also includes a second conductive double-sided adhesive 30. The second conductive double-sided adhesive 30 is attached to the bottom of the conductive substrate 20 to attach the electromagnetic shielding component 10 onto the electronic carrier. This method is relatively simple and quick to install and has strong practicality.
[0045] In summary, the electromagnetic shielding produced by the method of this application not only solves the problems existing in the prior art of producing prefabricated standard parts, but also enables the shielding components to achieve targeted electromagnetic signal suppression based on the differences in electromagnetic radiation intensity and electromagnetic signal frequency characteristics of different electrical components, thereby improving the quality of electromagnetic shielding and making it highly practical.
[0046] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0047] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent transformations or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.
Claims
1. A method for fabricating 3D-printed electromagnetic shielding components based on electromagnetic signal detection, characterized in that, Includes the following steps: S100 uses a magnetic field probe to detect the electromagnetic radiation intensity and frequency of each electrical component in the electronic carrier and transmits the data to a spectrum analyzer for analysis. The S200 uses a laser line scanning 3D camera to scan electronic carriers and import them into point cloud software. The point cloud software then segments, filters, and purifies the mixed point cloud of electrical components, gaps, and electronic carriers, retaining only the point cloud features of the gap areas. S300 uses point cloud software to first design and optimize the gap, perform simulation analysis, extract the two-dimensional contour of the gap, and then stretch it into a solid model. This model is then imported into three-dimensional modeling software for editing, thus forming the final electromagnetic shielding component model. The S400 transfers the electromagnetic shielding component model to the fused deposition modeling 3D printer and loads composite filaments through the fused deposition modeling 3D printer to directly print the shielding component onto the conductive substrate or paste it onto the conductive substrate; The S500 controls the direct-write 3D printer to print conductive paste at specific locations on the electromagnetic shielding component based on the electromagnetic radiation intensity and frequency of each electromagnetic component, thereby forming a composite structure with electromagnetic shielding function.
2. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, The point cloud software has a point cloud fitting contour function to extract the two-dimensional contour of the gaps and then stretch it into a solid model.
3. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, A 2-10mm margin is reserved between one side of the electromagnetic shielding component model and each electrical component on the electronic carrier.
4. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, The 3D modeling software is either SolidWorks or Fusion360.
5. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, The composite wire is made by extruding TPU or PLA material mixed with conductive powder.
6. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 5, characterized in that, The conductive powder is one or more of silver powder, copper powder, carbon nanotubes, or graphene.
7. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, The conductive paste is made from one or more of the following materials: silver powder, copper powder, carbon nanotubes, or graphene.
8. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, It also includes a first conductive double-sided adhesive, which adheres the electromagnetic shielding component to the conductive substrate.
9. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, It also includes a second conductive double-sided adhesive, which is applied to the bottom of the conductive substrate to attach the electromagnetic shielding component to the electronic carrier.
10. The method for preparing a 3D-printed electromagnetic shielding component based on electromagnetic signal detection according to claim 1, characterized in that, After the direct-write 3D printer prints conductive paste at the designated location on the electromagnetic shielding component, it needs to be dried and cured sequentially by a thermosetting device and a UV lamp.