Display panel, display device and manufacturing method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel is provided with a display area and a first non-display area located on at least one side of the display area, the display panel comprises a substrate, a signal line and an electrostatic discharge part, and the signal line is arranged on one side of the substrate and located in the first non-display area; the electrostatic discharge part and the signal line are arranged at an interval and located on the side, away from the display area, of the signal line, the electrostatic discharge part can receive static electricity when the display panel generates static electricity or static electricity testing is carried out, and therefore the risk that display is abnormal when the signal line receives the static electricity is reduced, the reliability of the display panel is improved, and the use performance of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Micro-LEDs, as a next-generation display technology, offer high contrast, fast refresh rates, and wide viewing angles. Compared to organic light-emitting diodes (OLEDs), Micro-LEDs boast a wider color gamut, higher brightness, lower power consumption, and longer lifespan. Therefore, Micro-LED display technology has vast potential for development.

[0003] However, the performance of current display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel having a display area and a first non-display area located on at least one side of the display area. The display panel includes: a substrate, signal lines, and an electrostatic discharge unit. The signal lines are disposed on one side of the substrate and located in the first non-display area. The electrostatic discharge unit is disposed at a distance from the signal lines and is located on the side of the signal lines away from the display area.

[0006] According to an embodiment of this application, the electrostatic discharge section includes a first subsection, which is disposed on one side of the substrate, and the first subsection and the signal line are located on the same side of the substrate.

[0007] According to the embodiments of this application, the first non-display area is located on at least one side of the display area along the first direction, the signal line extends along the second direction, and the first sub-part extends along the second direction; the first direction and the second direction intersect.

[0008] According to an embodiment of this application, the signal lines include a plurality of signal lines, which are arranged side by side along a first direction.

[0009] According to embodiments of this application, the display panel further includes a transistor located in a first non-display area, the transistor being located between a substrate and a signal line, and the electrostatic discharge section further includes a second sub-section disposed on the side of the transistor away from the display area.

[0010] According to an embodiment of this application, a first sub-part and a second sub-part are connected, and the second sub-part extends along the thickness direction of the display panel to cover the side of the transistor away from the display area.

[0011] According to an embodiment of this application, an insulating layer is provided between the transistor and the signal line, and a via is formed in the insulating layer, through which the transistor and the signal line are connected.

[0012] According to an embodiment of this application, the transistors include a plurality of transistors arranged along a second direction, and a second sub-part extends along the second direction to cover the side of each transistor away from the display area.

[0013] According to an embodiment of this application, a first non-display area is located on at least one side of the display area along a first direction, and the display panel further includes a second non-display area located on at least one side of the display area along a second direction, with the first and second directions intersecting; the second non-display area is provided with a bonding trace, and the electrostatic discharge part is electrically connected to the bonding trace;

[0014] According to an embodiment of this application, the substrate includes a first surface facing the signal line side and a second surface facing away from the signal line side. The second surface is provided with a grounding unit, and the binding trace is electrically connected to the grounding unit.

[0015] According to an embodiment of this application, the substrate further includes a first sidewall connecting the first surface and the second surface, and the bonding trace includes a first segment located on one side of the first surface, a second segment located on the first sidewall, and a third segment located on one side of the second surface. The first segment and the third segment are connected to the two ends of the second segment, and at least part of the third segment is electrically connected to a grounding unit.

[0016] According to embodiments of this application, the first sub-section is electrically connected to the first segment; and / or, the second sub-section is electrically connected to the second segment.

[0017] According to an embodiment of this application, the electrostatic discharge section further includes a third subsection, which is located on the side of the substrate away from the signal line, and a second subsection is connected between the first subsection and the third subsection.

[0018] According to an embodiment of this application, the display panel further includes a conductor portion located on the side of the substrate away from the insulating layer, and a third sub-part electrically connected to the conductor portion.

[0019] According to an embodiment of this application, the conductor portion is connected to the third sub-portion on the side away from the substrate.

[0020] An embodiment of the second aspect of this application also provides a display device, including the display panel described in any of the first aspects above.

[0021] An embodiment of the third aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area and a first non-display area located on at least one side of the display area, the manufacturing method comprising:

[0022] A transistor is formed on one side of the substrate, and the transistor is located in the first non-display area;

[0023] A signal line is formed on the side of the transistor away from the substrate, and the signal line is located in the first non-display area;

[0024] A protective layer is formed on the side of the signal line away from the substrate;

[0025] A conductive material layer is formed, which covers the side of the protective layer away from the substrate, the side of the transistor away from the display area, and the part of the substrate exposed by the protective layer.

[0026] The protective layer and a portion of the conductive material layer on top of the protective layer are peeled off to form an electrostatic discharge section.

[0027] In the embodiments of this application, the signal line is located in the first non-display area, and the electrostatic discharge part is located on the side of the signal line away from the display area, reducing the impact of the electrostatic discharge part on the light emitted from the display area. Furthermore, the electrostatic discharge part is insulated from the signal line. When the display panel generates static electricity or is undergoing electrostatic testing, the electrostatic discharge part can receive the static electricity, thereby reducing the risk of display abnormalities caused by the signal line receiving static electricity, thus improving the reliability and performance of the display panel. Attached Figure Description

[0028] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0029] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of another display panel structure provided in an embodiment of this application;

[0031] Figure 3 This is a schematic diagram of the structure of another display panel provided in the embodiments of this application;

[0032] Figure 4 This is a schematic diagram of the structure of another display panel provided in the embodiments of this application;

[0033] Figure 5 This is a schematic diagram of the structure of another display panel provided in the embodiments of this application;

[0034] Figure 6 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0035] Figures 7 to 11 This is a schematic diagram of a manufacturing process for a display panel provided in an embodiment of this application.

[0036] Explanation of reference numerals in the attached figures: 10, display area; 20, first non-display area; 30, second non-display area; 100, substrate; 110, first surface; 120, second surface; 130, first sidewall; 200, signal line; 210, transistor; 220, insulating layer; 221, via; 230, scan line; 300, electrostatic discharge section; 310, first subsection; 320, second subsection; 330, third subsection; 400, bonding trace; 401, first trace; 402, second trace; 410, first segment; 420, second segment; 430, third segment; 500, driver integrated circuit; 510, grounding unit; 600, conductor section; 700, protective layer; 800, conductive material layer; X, first direction; Y, second direction; Z, thickness direction. Detailed Implementation

[0037] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0038] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] like Figure 1 and Figure 2 As shown, a display panel provided in the first aspect embodiment of this application has a display area 10 and a first non-display area 20 located on at least one side of the display area 10. The display panel includes: a substrate 100, a signal line 200 and an electrostatic discharge part 300. The signal line 200 is disposed on one side of the substrate 100 and located in the first non-display area 20. The electrostatic discharge part 300 is disposed at a distance from the signal line 200 and is located on the side of the signal line 200 away from the display area 10.

[0041] In related technologies, to reduce the width of the display panel bezel, the signal line located in the first non-display area is spaced relatively close to the edge of the display panel. During use of the display panel or when performing discharge tests on the display panel using an electrostatic discharge chamber, the signal line may receive static electricity, leading to display abnormalities. In this embodiment, the signal line is located in the first non-display area 20, and the electrostatic discharge section 300 is located on the side of the signal line 200 away from the display area 10, reducing the impact of the electrostatic discharge section 300 on the light emitted from the display area 10. Furthermore, the electrostatic discharge section 300 is insulated from the signal line 200. When the display panel generates static electricity or during electrostatic testing, the electrostatic discharge section 300 can receive the static electricity, thereby reducing the risk of display abnormalities caused by the signal line 200 receiving static electricity, thus improving the reliability and performance of the display panel.

[0042] Optionally, signal line 200 includes a clock signal line connected to a device for transmitting a clock signal.

[0043] like Figure 1 and Figure 2 As shown, in some optional embodiments, the electrostatic discharge section 300 includes a first subsection 310, which is disposed on one side of the substrate 100 and is located on the same side of the substrate 100 as the signal line 200.

[0044] In these optional embodiments, the first sub-part 310 and the signal line 200 are located on the same side of the substrate 100, and the first sub-part 310 is located on the side of the signal line 200 away from the display area 10. The first sub-part 310 can receive static electricity on the side of the signal line 200 away from the substrate 100, and the first sub-part 310 can also receive static electricity on the side of the signal line 200 away from the display area 10, thereby improving the protection effect of the first sub-part 310 on the signal line 200.

[0045] like Figure 1 As shown, in some optional embodiments, the first non-display area 20 is located on at least one side of the display area 10 along the first direction X, the signal line 200 extends along the second direction Y, and the first sub-part 310 extends along the second direction Y; the first direction X and the second direction Y are intersected.

[0046] In these optional embodiments, the signal line 200 extends along the second direction Y, which helps to reduce the width of the first non-display area 20 along the first direction X and improves the effect of the narrow bezel of the display panel. The first sub-part 310 extends along the second direction Y. The first sub-part 310 and the signal line 200 are arranged side by side along the first direction X and extend along the second direction Y at the same time, which improves the protection effect of the first sub-part 310 on the signal line 200.

[0047] Optional, such as Figure 2 As shown, the display panel includes multiple scan lines 230 and pixel units located in the display area 10, with each scan line 230 connected to a signal line 200 and a pixel unit respectively.

[0048] Optional, such as Figure 2 As shown, the signal line 200 includes multiple signal lines 200 arranged side by side along the first direction X, so that each scan line 230 is connected to each signal line 200 respectively.

[0049] like Figure 1 and Figure 2 As shown, in some optional embodiments, the display panel further includes a transistor 210 located in the first non-display area 20, the transistor 210 being located between the substrate 100 and the signal line 200, and the electrostatic discharge section 300 further includes a second sub-section 320 disposed on the side of the transistor 210 facing away from the display area 10.

[0050] In these optional embodiments, transistor 210 is located in the first non-display area 20, and second sub-part 320 is located on the side of transistor 210 away from display area 10, reducing the influence of second sub-part 320 on light emission from display area 10. When the display panel generates static electricity or is undergoing static electricity testing, second sub-part 320 can receive static electricity, thereby reducing the risk of display abnormalities caused by transistor 210 receiving static electricity, thereby improving the reliability of the display panel and improving the performance of the display panel.

[0051] Optional, such as Figure 2 As shown, transistor 210 and signal line 200 are electrically connected to each other to transmit electrical signals.

[0052] Optionally, signal line 200 is a clock signal line, transistor 210 is used to form a scan drive unit, signal line 200 is connected to the scan drive unit to transmit clock signal to the scan drive unit, and the scan drive unit outputs scan signal according to the clock signal.

[0053] Optional, such as Figure 2As shown, the first sub-part 310 and the second sub-part 320 are connected. The second sub-part 320 extends along the thickness direction Z of the display panel to cover the side of the transistor 210 facing away from the display area 10. The first sub-part 310 is disposed on the same layer as the signal line 200, and the transistor 210 is located between the signal line 200 and the substrate 100, that is, the transistor 210 is located on the side of the first sub-part 310 facing the substrate 100. The second sub-part 320 is connected to the first sub-part 310 and extends along the thickness direction Z of the display panel, so that the second sub-part 320 can cover the side of the transistor 210 facing away from the display area 10, thereby reducing static electricity from the side of the transistor 210 facing away from the display area 10 to the transistor 210. The first sub-part 310 and the second sub-part 320 are interconnected to form a Faraday cage.

[0054] The display panel includes a light-emitting surface and a backlight surface disposed opposite to each other along the thickness direction Z of the display panel, and a side surface connecting the light-emitting surface and the backlight surface. The first sub-part 310 is located on the side of the substrate 100 facing the light-emitting surface, and the second sub-part 320 is located on the side surface of the display panel.

[0055] Optional, such as Figure 2 As shown, an insulating layer 220 is provided between transistor 210 and signal line 200. The insulating layer 220 has a via 221, through which transistor 210 and signal line 200 are connected. The insulating layer 220 reduces short circuits between transistor 210 and signal line 200. The via 221 allows signal line 200 to connect to transistor 210.

[0056] like Figure 1 and Figure 3 As shown, in some optional embodiments, transistor 210 includes a plurality of transistors arranged along the second direction Y, and a second sub-part 320 extends along the second direction Y to cover the side of each transistor 210 away from the display area 10.

[0057] In these alternative embodiments, the arrangement of multiple transistors 210 along the second direction Y can reduce the width of the first non-display area 20 along the first direction X, and the signal lines 200 extend along the second direction Y so that each transistor 210 can be electrically connected to each signal line 200. The second sub-section 320 extends along the second direction Y to cover the side of each transistor 210 away from the display area 10, thereby improving the protection effect of the second sub-section 320 on the transistors 210.

[0058] like Figure 1As shown, in some optional embodiments, the first non-display area 20 is located on at least one side of the display area 10 along the first direction X, and the display panel further includes a second non-display area 30, which is located on at least one side of the display area 10 along the second direction Y, with the first direction X and the second direction Y intersecting; the second non-display area 30 is provided with a bonding trace 400, and the electrostatic discharge part 300 and the bonding trace 400 are electrically connected.

[0059] In these optional embodiments, the second non-display area 30 is provided with a bonding trace 400, and the electrostatic discharge unit 300 is electrically connected to the bonding trace 400. The electrostatic discharge received by the electrostatic discharge unit 300 can be transferred to the bonding trace 400 located in the second non-display area 30, thereby reducing electrostatic damage to the transistor 210 and the signal line 200.

[0060] Optional, such as Figure 3 and Figure 4 As shown, the substrate 100 includes a first surface 110 facing the signal line 200 and a second surface 120 facing away from the signal line 200. A grounding unit 510 is disposed on the second surface 120, and a bonding trace 400 is electrically connected to the grounding unit 510. Metal wires, a driving transistor 210, a switching transistor 210, and pixel units are disposed on one side of the first surface 110 of the substrate 100. The grounding unit 510 is disposed on the second surface 120 of the substrate 100, thereby reducing the space occupied by the grounding unit 510 on the first surface 110. The electrostatic discharge unit 300 releases the received static electricity to the grounding unit 510 through the bonding trace 400.

[0061] Optional, such as Figure 3 and Figure 4 As shown, the substrate 100 also includes a first sidewall 130 connecting the first surface 110 and the second surface 120. The bonding trace 400 includes a first segment 410 located on one side of the first surface 110, a second segment 420 located on the first sidewall 130, and a third segment 430 located on one side of the second surface 120. The first segment 410 and the third segment 430 are connected to the two ends of the second segment 420, and at least a portion of the third segment 430 is electrically connected to the ground unit 510. The bonding trace 400 includes the first segment 410, the second segment 420, and the third segment 430. A portion of the first segment 410 of the bonding trace 400 is used to connect to the signal line 200 located in the first non-display area 20, or to connect to the data line located in the display area 10, so as to transmit the electrical signal in the signal line 200 or the data line to the driver integrated circuit 500 located on one side of the second surface 120 through the second segment 420 and the third segment 430. Another portion of the bonding trace 400 is electrically connected to the electrostatic discharge unit 300 and electrically connected to the grounding unit 510 via the third segment 430. Optionally, the grounding unit 510 can be integrated into the driver integrated circuit 500.

[0062] Optional, such as Figure 4 As shown, multiple bonding traces 400 are spaced apart along a first direction X. Each bonding trace 400 includes a first trace 401 and a second trace 402. The first traces 401 are respectively connected to signal lines 200 or data lines, and the second traces 402 are connected to an electrostatic discharge unit 300. The second traces 402 are located on at least one side of the multiple first traces 401 along the first direction X. When there are two second traces 402, the two second traces 402 are located on opposite sides of the multiple first traces 401 along the first direction X.

[0063] Optional, such as Figure 3 and Figure 4 As shown, the first sub-section 310 is electrically connected to the first segment 410. The first sub-section 310 is electrically connected to the grounding unit 510 through the first segment 410 and through the second segment 420 and the third segment 430.

[0064] Optional, such as Figures 2 to 4 As shown, the first sub-part 310 is located on the side of the insulating layer 220 away from the substrate 100 and on the side of the first surface 110 of the substrate 100, and the first segment 410 is located on the side of the first surface 110 of the substrate 100 so that the first sub-part 310 and the first segment 410 can be electrically connected.

[0065] Optional, such as Figure 3 and Figure 4 As shown, the second sub-section 320 is electrically connected to the second segment 420. The second sub-section 320 is electrically connected to the grounding unit 510 via the second segment 420 and the third segment 430.

[0066] Optionally, the second sub-part 320 is located on the side of the display panel located in the first non-display area 20, and the second segment 420 is located on the side of the second non-display area 30 so that the second sub-part 320 and the second segment 420 can be electrically connected.

[0067] Optional, such as Figures 2 to 4 As shown, a portion of the second sub-section 320 is located on the sidewall of the substrate 100 in the first non-display area 20, and the second segment 420 is located on the sidewall of the substrate 100 in the second non-display area 30 so that the second sub-section 320 and the second segment 420 are electrically connected.

[0068] like Figure 2 As shown, in some optional embodiments, the electrostatic discharge section 300 further includes a third subsection 330 located on the side of the substrate 100 away from the signal line 200, and a second subsection 320 connected between the first subsection 310 and the third subsection 330.

[0069] In these alternative embodiments, the first sub-part 310 and the third sub-part 330 are respectively connected to the two sides of the second sub-part 320 along the thickness direction Z of the display panel, and can be transmitted to the third sub-part 330 when static electricity is released to the first sub-part 310 and the second sub-part 320.

[0070] Optional, such as Figure 5 As shown, the display panel also includes a conductor portion 600, which is located on the side of the substrate 100 away from the insulating layer 220. The third sub-part 330 is electrically connected to the conductor portion 600. When the first sub-part 310 or the second sub-part 320 receives static electricity, it can be transferred to the conductor portion 600 through the third sub-part 330 to release the static electricity.

[0071] Optional, such as Figure 5 As shown, the conductor portion 600 is connected to the side of the third sub-portion 330 facing away from the substrate 100. The first sub-portion 310, the second sub-portion 320 and the third sub-portion 330 are formed in the same process, and then the conductor portion 600 is formed, covering the side of the third sub-portion 330 facing away from the substrate 100.

[0072] The second aspect of this application also provides a display device, including the display panel of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel of any of the first aspect embodiments described above, it has the beneficial effects of the display panel of any of the first aspect embodiments described above, which will not be elaborated further here.

[0073] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0074] An embodiment of the third aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area 10 and a first non-display area 20 located on at least one side of the display area 10, such as... Figure 6 As shown, the manufacturing method includes:

[0075] Step S01: As Figure 7 As shown, a transistor 210 is formed on one side of the substrate 100, and the transistor 210 is located in the first non-display area 20.

[0076] Step S02: As Figure 8 As shown, a signal line 200 is formed on the side of transistor 210 away from substrate 100, and the signal line 200 is located in the first non-display area 20.

[0077] Step S03: As Figure 9As shown, a protective layer 700 is formed on the side of the signal line 200 away from the substrate 100.

[0078] Step S04: As Figure 10 As shown, a conductive material layer 800 is formed, which covers the protective layer 700 on the side away from the substrate 100, the transistor 210 on the side away from the display area 10, and the portion of the substrate 100 exposed by the protective layer 700.

[0079] Step S05: As Figure 2 As shown, the protective layer 700 and a portion of the conductive material layer 800 located on the protective layer 700 are peeled off to form an electrostatic discharge section 300.

[0080] In this embodiment, a protective layer 700 is formed on the side of the signal line 200 away from the substrate 100. When the conductive material layer 800 is deposited, a short circuit is avoided between the conductive material layer 800 and the signal line 200. The conductive material layer 800 covers the side of the transistor 210 away from the display area 10, that is, the conductive material layer 800 covers the side of the display panel located in the first non-display area 20. The protective layer 700 and a portion of the conductive material layer 800 on the protective layer 700 are peeled off to form an electrostatic discharge section 300. The electrostatic discharge section 300 covers the portion of the substrate 100 exposed by the protective layer 700 and the side of the transistor 210 away from the display area 10, thereby receiving the static electricity emitted towards the signal line 200 and the transistor 210, thus protecting the transistor 210 and the signal line 200.

[0081] Optional, such as Figure 9 and Figure 10 As shown, the protective layer 700 protrudes from the signal line 200 in a direction away from the display area 10, so that the conductive material layer 800 covers the part of the substrate 100 exposed by the protective layer 700 and is spaced apart from the signal line 200, thereby reducing the risk of short circuit between the electrostatic discharge section 300 and the signal line 200 when the electrostatic discharge section 300 is formed.

[0082] In some optional embodiments, the display panel further includes a second non-display area 30, and step S04 further includes:

[0083] like Figure 11 As shown, the conductive material layer 800 also covers the side of the substrate 100 of the second non-display area 30 facing the signal line 200, the side of the substrate 100 away from the signal line 200, and the side of the substrate 100 located in the second non-display area 30.

[0084] like Figure 3As shown, the patterned conductive material layer 800 forms a bonding trace 400 located in the second non-display area 30. The bonding trace 400 includes a first segment 410 on the side of the substrate 100 facing the signal line 200, a third segment 430 on the side of the substrate 100 away from the signal line 200, and a second segment 420 located on the side of the second non-display area 30. The first segment 410, the second segment 420 and the third segment 430 are connected in sequence.

[0085] In these alternative embodiments, the bonding trace 400 and the static discharge section 300 are formed in the same process step, which simplifies the manufacturing process.

[0086] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel has a display area and a first non-display area located on at least one side of the display area, the display panel comprising: Substrate; The signal line is disposed on one side of the substrate and located in the first non-display area; An electrostatic discharge section is provided, which is spaced apart from the signal line and located on the side of the signal line away from the display area.

2. The display panel according to claim 1, characterized in that, The electrostatic discharge section includes a first subsection, which is disposed on one side of the substrate, and the first subsection and the signal line are located on the same side of the substrate.

3. The display panel according to claim 2, characterized in that, The first non-display area is located on at least one side of the display area along a first direction, the signal line extends along a second direction, and the first sub-part extends along the second direction; the first direction and the second direction intersect. Preferably, the signal lines include a plurality of signal lines, which are arranged side by side along the first direction.

4. The display panel according to claim 2, characterized in that, The display panel further includes a transistor located in the first non-display area, the transistor being located between the substrate and the signal line, and the electrostatic discharge section further includes a second sub-section, the second sub-section being disposed on the side of the transistor away from the display area; Preferably, the first sub-part and the second sub-part are connected, and the second sub-part extends along the thickness direction of the display panel to cover the side of the transistor away from the display area; Preferably, an insulating layer is provided between the transistor and the signal line, and the insulating layer has a via, through which the transistor is connected to the signal line.

5. The display panel according to claim 4, characterized in that, The transistors include a plurality of transistors arranged along a second direction, and the second sub-parts extend along the second direction to cover the side of each transistor away from the display area.

6. The display panel according to claim 4, characterized in that, The first non-display area is located on at least one side of the display area along a first direction, and the display panel further includes a second non-display area, which is located on at least one side of the display area along a second direction, wherein the first direction and the second direction are intersecting. The second non-display area is provided with a bonding trace, and the electrostatic discharge part is electrically connected to the bonding trace; Preferably, the substrate includes a first surface facing the signal line and a second surface facing away from the signal line, the second surface being provided with a grounding unit, and the bonding trace being electrically connected to the grounding unit; Preferably, the substrate further includes a first sidewall connecting the first surface and the second surface, and the bonding trace includes a first segment located on one side of the first surface, a second segment located on the first sidewall, and a third segment located on one side of the second surface. The first segment and the third segment are connected to both ends of the second segment, and at least a portion of the third segment is electrically connected to the grounding unit.

7. The display panel according to claim 6, characterized in that, The first sub-part is electrically connected to the first segment; And / or, the second sub-part is electrically connected to the second segment.

8. The display panel according to claim 4, characterized in that, The electrostatic discharge section further includes a third sub-section, which is located on the side of the substrate away from the signal line, and the second sub-section is connected between the first sub-section and the third sub-section; Preferably, the display panel further includes a conductor portion located on the side of the substrate opposite to the insulating layer, and the third sub-part is electrically connected to the conductor portion; Preferably, the conductor portion is connected to the side of the third sub-portion opposite to the substrate.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1-8.

10. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a first non-display area located on at least one side of the display area, and the manufacturing method includes: A transistor is formed on one side of the substrate, the transistor being located in the first non-display area; A signal line is formed on the side of the transistor away from the substrate, and the signal line is located in the first non-display area; A protective layer is formed on the side of the signal line away from the substrate; A conductive material layer is formed, which covers the side of the protective layer away from the substrate, the side of the transistor away from the display area, and the portion of the substrate exposed by the protective layer. The protective layer and a portion of the conductive material layer on the protective layer are peeled off to form an electrostatic discharge section.

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