Anti-dazzle glass for electronic blackboard and preparation method of anti-dazzle glass

Abstract

The invention relates to the technical field of display glass, in particular to anti-dazzle glass for an electronic blackboard and a preparation method of the anti-dazzle glass. The preparation method comprises the following steps: S1, cleaning and drying substrate glass to obtain clean substrate glass; s2, forming a micron-sized scattering structure (microstructure A) on the target surface of the clean substrate glass; s3, forming a nanoscale anti-reflection structure (microstructure B) on the microstructure A to obtain a dual-scale microstructure anti-dazzle layer; s4, the surface of the dual-scale microstructure anti-dazzle layer is coated with a transparent hardening material and cured, and a transparent hardening wear-resistant layer covering the dual-scale microstructure anti-dazzle layer is formed; and S5, activating the surface of the transparent hardened wear-resistant layer, and then applying anti-fingerprint treatment to form an anti-fingerprint top layer. The prepared anti-glare glass for the electronic blackboard is clear in interlayer interface, clear in function division and high in process compatibility, and the whole structure can still keep low glare, high image quality and easy maintenance for a long time under the high-frequency erasing and hard light environment.

Description

Technical Field

[0001] This application relates to the field of display glass technology, and in particular to an anti-glare glass for electronic blackboards and a method for preparing the same. Background Technology

[0002] Electronic blackboards are typically used in brightly lit environments such as classrooms and conference rooms. However, existing electronic blackboard outer glass layers suffer from the following drawbacks:

[0003] Glare is a prominent issue: light from lamps and windows creates mirror-like reflections on the glass surface, leading to decreased readability and eye strain.

[0004] Sharpness / contrast loss: Common anti-glare and anti-graining solutions can lead to increased haze, washed-out images, and decreased sharpness.

[0005] Insufficient wear resistance and ease of cleaning: Frequent touch, wiping, writing / dust pollution on electronic blackboards can easily wear down the rough anti-glare surface or fill it with oil stains, leading to anti-glare failure and difficulty in cleaning.

[0006] Anti-fingerprint and anti-glare are difficult to reconcile: Anti-fingerprint coatings are prone to uneven coverage, whitening, and poor durability on rough substrates. Summary of the Invention

[0007] This application provides an anti-glare glass for electronic blackboards and a method for preparing the same, in order to solve the above-mentioned problems.

[0008] In a first aspect, this application provides an anti-glare glass for an electronic blackboard, comprising a substrate glass and a functional layer assembly disposed on at least one surface of the substrate glass; the functional layer assembly comprises, in sequence from the side closer to the substrate glass to the side farther away from the substrate glass: a dual-scale microstructure anti-glare layer, the dual-scale microstructure anti-glare layer comprising a micron-scale scattering structure (microstructure A) formed on the surface of the substrate glass and a nanoscale anti-reflection structure (microstructure B) stacked on the microstructure A; a transparent hardened wear-resistant layer, covering the dual-scale microstructure anti-glare layer, for providing wear-resistant protection while retaining effective surface roughness; and an anti-fingerprint top layer, formed on the surface of the transparent hardened wear-resistant layer, for providing hydrophobic and oleophobic anti-fingerprint properties.

[0009] Through the above technical solutions, this application achieves the following: microstructure A scatters specular reflected light at a wide angle under incident light irradiation, significantly reducing the peak value of reflected glare; microstructure B, as a subwavelength structure, constructs a refractive index gradient transition layer on the surface of microstructure A, reducing interface Fresnel reflection, alleviating the "white haze" caused by micron-level scattering, and improving image contrast and clarity; the transparent hardened wear-resistant layer achieves "peak reinforcement and valley clearance" coverage of microstructure A through controlled rheological behavior, providing wear-resistant protection with a pencil hardness ≥3H. It retains sufficient surface micro-modulation depth to maintain anti-glare function; the anti-fingerprint top layer, through the directional arrangement of low surface energy molecules, gives the surface hydrophobic and oleophobic properties without sacrificing light transmittance, making it difficult for contaminants such as sebum and chalk dust to adhere and easy to wipe clean; each functional layer is integrated from bottom to top in the order of "substrate - microstructure A - microstructure B - hardening layer - AF layer", with clear interlayer interfaces, clear division of functions, and strong process compatibility. The overall structure can maintain low glare, high image quality and easy maintenance for a long time under high frequency writing and strong light environment.

[0010] Optionally, the microstructure A has an equivalent feature size of 1-15 μm, a peak-valley height of 0.3-3.0 μm, and an areal density of 10³-10. 6 pcs / cm²

[0011] Through the above technical solution, this application achieves a synergistic balance between optical scattering efficiency and surface morphology controllability of microstructure A: while maintaining the overall flatness of the substrate glass, a micron-scale scattering array with spatial randomness and scale gradient characteristics is constructed by using equivalent feature size, peak-valley height, and surface density within a specific window range; under incident light irradiation, this array disperses the peak energy of specular reflection to a wide angle range of ±15°–±45°, thereby significantly reducing the intensity of glare perceived by the human eye; at the same time, since all parameters are within the experimentally verified optimization range, the surge in haze and image distortion caused by excessive scattering are avoided, ensuring that the electronic blackboard still has high readability and visual comfort in typical strong ambient light scenarios such as classrooms and conference rooms; in addition, this parameter combination also provides a geometric adaptation basis for the subsequent conformal growth of nanoscale microstructure B and the "selective valley filling" of the transparent hardened wear-resistant layer.

[0012] Optionally, the microstructure B has an equivalent feature size of 20-200 nm, an equivalent thickness of 30-200 nm, and a coverage of the microstructure A of not less than 80%.

[0013] Through the above technical solution, this application achieves the following: based on the already constructed micron-level scattering structure (microstructure A), by introducing a nano-level anti-reflection structure (microstructure B) with specific size, thickness and high coverage, the two form a synergy in optical function—microstructure A is responsible for wide-angle scattering to suppress glare, while microstructure B reduces interface Fresnel reflection through gradient refractive index matching and quarter-wavelength interference effect, thereby improving overall transmittance and contrast without significantly increasing haze; high coverage ensures that the anti-reflection effect is spatially consistent, avoiding local reflection hotspots, thereby improving the image clarity, color reproduction and visual comfort of the electronic blackboard under strong ambient light.

[0014] Optionally, the thickness of the transparent hardened wear-resistant layer is 0.2-5 μm, and the pencil hardness is not less than 3H; the refractive index of the transparent hardened wear-resistant layer is 1.40-1.55; and the valley filling depth of the transparent hardened wear-resistant layer on the microstructure A does not exceed 70% of the peak-valley height of the microstructure A.

[0015] Through the above technical solution, this application achieves a synergistic effect of "protection, shape preservation, and non-flattening" of the transparent hardened wear-resistant layer in the anti-glare glass of electronic blackboards: its thickness and hardness jointly ensure long-term wear resistance stability under high-frequency erasing scenarios; its refractive index forms an optical match with microstructure B, suppressing interface reflection superposition; its controlled valley filling depth ensures that the macroscopic scattering profile of microstructure A is not buried, so that the anti-glare performance can still be maintained after multiple cleanings. The three factors work together to solve the technical contradictions in the prior art where excessive flattening of the hardened layer leads to anti-glare failure, or insufficient protection leads to microstructure wear and collapse, making it particularly suitable for the application needs of long-term, high-intensity, and multi-ambient light interference in educational scenarios.

[0016] Optionally, the anti-fingerprint top layer is formed by reacting and bonding with the hydroxyl groups on the surface of the transparent hardened wear-resistant layer, and has a thickness of 1-30 nm; the anti-fingerprint top layer ensures that the static water contact angle of the anti-glare glass is not less than 105° and the static oil contact angle is not less than 70°.

[0017] Through the above technical solutions, this application achieves the following: while retaining the anti-glare function of the dual-scale microstructure, the anti-fingerprint top layer is firmly anchored on the transparent hardened wear-resistant layer through surface hydroxyl-mediated covalent bonding, avoiding uneven coverage, whitening, or peeling of the AF layer caused by the complex microstructure morphology; by strictly controlling the thickness of the AF layer within the 1–30 nm window, the integrity of the low surface energy network is ensured, and optical interference defects are avoided; by simultaneously meeting the dual interface performance indicators of water contact angle ≥105° and oil contact angle ≥70°, the electronic blackboard surface can still maintain low fingerprint adhesion rate and high cleanability under high-frequency touch and writing environments, thereby solving the technical problems of unstable adhesion, poor optical compatibility, and insufficient stain resistance of the anti-fingerprint coating on the microstructure substrate.

[0018] Secondly, this application provides a method for preparing anti-glare glass for electronic blackboards, the method comprising:

[0019] S1. Substrate pretreatment: The substrate glass is cleaned and dried to obtain a clean substrate glass;

[0020] S2. Constructing microstructure A: Forming a micron-scale scattering structure (microstructure A) on the target surface of the clean substrate glass.

[0021] S3. Constructing microstructure B: A nanoscale anti-reflection structure (microstructure B) is formed on the microstructure A to obtain a dual-scale microstructure anti-glare layer;

[0022] S4. Forming a hardened wear-resistant layer: A transparent hardening material is coated and cured on the surface of the dual-scale microstructure anti-glare layer to form a transparent hardened wear-resistant layer covering the dual-scale microstructure anti-glare layer, and the degree of valley filling of the transparent hardened wear-resistant layer is controlled to retain effective surface roughness.

[0023] S5. Forming an anti-fingerprint top layer: After activating the surface of the transparent hardened wear-resistant layer, an anti-fingerprint treatment is applied to form an anti-fingerprint top layer.

[0024] Through the above technical solution, this application achieves a complete manufacturing chain—substrate cleansing → micron-level scattering structure construction → nano-level anti-reflective structure stacking → selective coverage of transparent wear-resistant layer → covalent anchoring of anti-fingerprint top layer—through the orderly connection and parameter coordination of five steps from S1 to S5. Specifically, S1 provides a clean interface for S2; the microstructure A formed in S2 provides a morphological template and physical support for S3; the microstructure B constructed in S3, together with S2, constitutes a dual-scale anti-glare layer; S4 imparts mechanical robustness while retaining the optical function of this layer; and S5 achieves high-quality film formation of the AF layer based on the stable platform provided by S4. There are clear input-output relationships and functional progression logic between each step: S1 outputs a clean substrate as input to S2; S2 outputs glass with microstructure A as input to S3; S3 outputs a dual-scale microstructure anti-glare layer as input to S4; S4 outputs an intermediate with a hardened layer as input to S5; and S5 ultimately outputs a functional glass with a complete four-layer structure. This method does not rely on high-precision vacuum equipment or complex masking processes. All steps can be completed under normal pressure and medium-low temperature conditions, and it has good process tolerance, equipment versatility and production line compatibility. It is particularly suitable for industrial manufacturing scenarios of large-size electronic blackboards.

[0025] Optionally, in step S2, the microstructure A is formed by any one of chemical etching, sandblasting, laser micro-engraving, or molding / imprinting transfer; in step S2, the equivalent feature size of the microstructure A is controlled to be 1-15 μm, and the peak-valley height is 0.3-3.0 μm.

[0026] Through the above technical solutions, this application achieves the substitutability of process paths and the consistency of performance output by defining four physical / chemical microstructure forming paths in S2 and uniformly constraining their key morphological parameter windows. Although the morphological details of the microstructures A formed by different methods are different, they all fall within the common definition domain of 1–15μm equivalent size and 0.3–3.0μm peak-valley height, thereby ensuring that they have equivalent functions in optical scattering behavior. On this basis, the nanostructures in S3 can grow stably on the micron substrate, and the transparent hardened wear-resistant layer in S4 can achieve controllable valley filling according to its undulating shape, ultimately ensuring the synergistic achievement of the three goals of "anti-glare - image quality - durability" in the overall process.

[0027] Optionally, in step S3, the microstructure B is formed by any one of sol-gel film formation, plasma etching, or wet secondary micro-etching; in step S3, the equivalent feature size of the microstructure B is controlled to be 20-200 nm, and the equivalent thickness is 30-200 nm, so that its coverage of the microstructure A is not less than 80%.

[0028] Through the above technical solution, this application achieves cross-scale synergy between nanoscale antireflection and micrometer-scale scattering functions by constructing a microstructure B with clearly defined size, thickness, and coverage constraints on microstructure A. On the one hand, the nanoscale morphology of microstructure B superimposes subwavelength optical modulation on the macroscopic undulations of microstructure A, causing the interface reflectivity to continuously decrease over a wide angle and wide band. On the other hand, its coverage of no less than 80% ensures that the modulation effect has no significant spatial defects, avoiding the recurrence of reflection peaks due to the partial exposure of microstructure A. On this basis, the equivalent feature size of 20–200 nm and the equivalent thickness of 30–200 nm together constitute the optical design window, enabling microstructure B to effectively suppress Fresnel reflection without introducing additional scattering loss, thereby significantly improving image contrast and transparency while maintaining low glare.

[0029] Optionally, the transparent curing material in S4 is an inorganic-organic hybrid sol-gel coating or a transparent inorganic thin film material; the curing method of the transparent curing wear-resistant layer in S4 is a combination of UV curing and post-heat curing; the film thickness of the transparent curing wear-resistant layer in S4 is controlled to be 0.2-5 μm; in S4, by adjusting the viscosity, surface tension, or coating amount of the transparent curing material, the valley filling depth of the transparent curing wear-resistant layer on the microstructure A does not exceed 70% of the peak-valley height of the microstructure A; the transparent curing material is coated by curtain coating or roller coating in S4, and the linear speed and coating amount are linked and controlled during the coating process; the linear speed of the curtain coating or roller coating is 0.2-5 m / min, and the coating amount is adjusted by feedback based on the online film thickness detection results.

[0030] Through the above technical solution, this application achieves precise coating of a dual-scale microstructure anti-glare layer by synergistically integrating six technical features: selection of transparent curing materials, combined curing paths, film thickness parameter windows, rheological property control, coating method selection, and closed-loop motion control. On the one hand, inorganic-organic hybrid sol-gel coatings or transparent inorganic thin film materials provide a film-forming substrate adapted to the microstructure morphology. On the other hand, UV initial curing quickly "freezes" the initial liquid film outline, and thermal post-curing further enhances the crosslinking density and interfacial bonding. Based on this, a film thickness setting of 0.2–5 μm provides a physical upper limit for valley-filling behavior, while the synergistic control of viscosity, surface tension, and coating amount limits the valley-filling dynamics process from two dimensions: intrinsic material properties and process input variables. Finally, the combination of curtain coating or roller coating methods with a linear velocity of 0.2–5 m / min and an online film thickness feedback adjustment mechanism ensures the stable implementation of the above-mentioned micro-control objectives on an engineering scale. This synergistic mechanism enables the transparent hardened wear-resistant layer to firmly cover the A-peak of the microstructure to resist high-frequency erasing and writing wear, while retaining ≥30% of the original depth of the valleys to maintain effective scattering capabilities, thus continuously providing both anti-glare and high-quality image functions during long-term use.

[0031] Optionally, the activation treatment in S5 is any one of plasma treatment, ultraviolet ozone treatment, or chemical activation treatment to introduce hydroxyl groups on the surface of the transparent hardened wear-resistant layer; the anti-fingerprint treatment in S5 is performed by vapor deposition or wet coating to form an anti-fingerprint top layer with a thickness of 1-30 nm; the formed anti-fingerprint top layer in S5 is subjected to low-temperature baking treatment, the conditions of which include: baking temperature of 80-120℃, baking time of 10-30 min, baking heating rate of 2-3℃ / min, and dry nitrogen atmosphere with dew point ≤−20℃.

[0032] Through the above technical solution, this application introduces hydroxyl groups on the surface of the transparent, hardened, and wear-resistant layer through activation treatment, providing chemical anchoring points for the anti-fingerprint material; a precisely controllable 1–30 nm anti-fingerprint top layer is formed through vapor deposition or wet coating, balancing functional integrity and optical compatibility; then, low-temperature baking in a dry, inert atmosphere completes interface condensation and stress release, ultimately achieving a strong and tough bond between the anti-fingerprint top layer and the bottom layer. This three-stage synergistic process overcomes the technical bottlenecks of anti-fingerprint coatings being difficult to uniformly cover rough microstructure surfaces, having weak adhesion, and being prone to failure, enabling anti-glare glass to stably maintain low glare, high image quality, easy cleaning, and durable reliability even under long-term, high-frequency use. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a flowchart illustrating an anti-glare glass for an electronic blackboard and its preparation method, provided as an embodiment of this application. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0037] The embodiments of this application will now be described in further detail with reference to the accompanying drawings.

[0038] When electronic blackboards are used for extended periods in brightly lit environments such as classrooms and conference rooms, they commonly suffer from strong specular reflections of artificial or natural light on the glass surface. This results in prominent glare, reduced readability, and increased eye strain. Furthermore, conventional surface roughening treatments used to suppress glare can easily lead to increased haze, loss of contrast, washed-out images, and reduced sharpness. In addition, frequent touch operations, wet and dry wiping, and the adhesion of chalk dust and sebum can easily wear down rough surfaces, causing contamination and reducing anti-glare performance and making cleaning difficult. Anti-fingerprint coatings on unsuitable rough substrates are also prone to uneven coverage, whitening, rainbow-like patterns, and insufficient adhesion. All these issues collectively limit the display quality and long-term reliability of electronic blackboards in real-world teaching and office settings.

[0039] This application provides an anti-glare glass for an electronic blackboard, including a substrate glass and a functional layer group disposed on at least one side surface of the substrate glass; the functional layer group includes, from the side closer to the substrate glass to the side farther away from the substrate glass, the following in sequence: a dual-scale microstructure anti-glare layer, the dual-scale microstructure anti-glare layer including a micron-scale scattering structure (microstructure A) formed on the surface of the substrate glass and a nano-scale anti-reflection structure (microstructure B) stacked on microstructure A; a transparent hardened wear-resistant layer, covering the dual-scale microstructure anti-glare layer, for providing wear-resistant protection while retaining effective surface roughness; and an anti-fingerprint top layer, formed on the surface of the transparent hardened wear-resistant layer, for providing hydrophobic and oleophobic anti-fingerprint properties.

[0040] The substrate glass is soda-lime glass, aluminosilicate glass, or tempered / semi-tempered glass with a thickness of 2–6 mm. At least one surface of the substrate glass is cleaned, dried, and optionally activated by plasma or ultraviolet ozone to obtain a clean surface with controllable surface energy to be processed. The material and thickness of the substrate glass can be selected according to the structural strength, optical transmittance, and thermal stability requirements of the electronic blackboard. For example, it can be float soda-lime glass or high-transmittance low-iron aluminosilicate glass. This application does not impose any special limitations on this.

[0041] The dual-scale microstructure anti-glare layer is directly formed on the target surface of the substrate glass. It comprises two levels: a micrometer-scale scattering structure (microstructure A) and a nanometer-scale antireflection structure (microstructure B). Microstructure A consists of randomly distributed micro-pits or micro-hills formed in situ on the substrate glass surface through chemical etching, sandblasting, laser micro-engraving, or molding / imprint transfer. Its morphology is non-periodic and disordered to avoid rainbow patterns caused by diffraction. The equivalent feature size, peak-valley height, and areal density of microstructure A are not specifically limited in this application and can be set according to actual optical and mechanical performance requirements. For example, it could have an equivalent diameter of 3–10 μm, a peak-valley height of 0.5–2.0 μm, and an areal density of 10 μm. 4 -10 5The number of particles per cm² can be any combination of parameters that satisfies the balance between anti-glare and haze. This application does not impose any special limitations on this. Microstructure B is a nanoscale structure stacked on top of microstructure A. It can be formed by sol-gel film formation, plasma etching, or wet secondary micro-etching. Its morphology includes nanoparticle stacks, porous SiO2 networks, nanopillar arrays, or subwavelength antireflection textures. The equivalent feature size and equivalent thickness of microstructure B are not specifically limited in this application. Therefore, they can be set according to the synergistic requirements of antireflection efficiency and structural stability. For example, it can be an equivalent particle size of 50–150 nm and an equivalent thickness of 80–150 nm. It can also be other forms that satisfy the requirements of interface refractive index gradient and coverage. This application does not impose any special limitations on this. Microstructure B and microstructure A are physically stacked. They do not undergo material missolution or interface alloying. The structural dependence is achieved only through van der Waals forces or weak chemical bonds.

[0042] The transparent hardened wear-resistant layer is a continuous transparent film covering the dual-scale microstructure anti-glare layer. Its material can be an inorganic-organic hybrid sol-gel coating (such as a composite precursor containing a siloxane backbone and acrylate side chains), a transparent inorganic film (such as SiOx, Al2O3, or a combination thereof), or a composite system of the latter and an organic toughening component. The thickness of the transparent hardened wear-resistant layer is not specifically limited in this application; therefore, it can be set according to the balance requirements of wear resistance and surface roughness retention. For example, it can be 0.5–3 μm, or other values ​​within the range of 0.2–5 μm. This application does not impose any special limitations on this. The curing method of the transparent hardened wear-resistant layer can be UV curing, thermal curing, or a combination of UV and thermal curing. The curing conditions must ensure dense film formation and controllable volume shrinkage to avoid… Excessive shrinkage can lead to collapse of the peaks or overfilling of the valleys in the microstructure. The transparent hardened wear-resistant layer partially covers the microstructure A: its material rheological properties (viscosity, surface tension) and coating process parameters (linear speed, coating amount) are synergistically controlled to preferentially wet and cover the peak areas of the microstructure A to provide mechanical support, while only partially filling the valley areas. This maintains the effective surface roughness Ra and Rz on a macroscopic scale, ensuring continuous scattering capability. This layer has both optical modulation and mechanical protection functions. Its refractive index is not limited in this application, so it can be set according to the refractive index matching relationship with the substrate glass and the microstructure B. For example, it can be 1.45±0.03, or other values ​​in the range of 1.40–1.55. This application does not impose any special limitations on this.

[0043] The anti-fingerprint top layer is an ultra-thin functional layer formed on the surface of the transparent hardened wear-resistant layer. It is bonded and fixed by condensation reaction or physical adsorption with the residual hydroxyl groups on the surface of the transparent hardened wear-resistant layer. The material of the anti-fingerprint top layer can be a fluorosilane compound (such as heptadecafluorodecyltriethoxysilane), a fluorinated acrylic polymer, or a diamond-like carbon-based oleophobic material. The thickness of the anti-fingerprint top layer is not specifically limited in this application. Therefore, it can be set according to the balance between hydrophobic and oleophobic effects and light transmittance consistency. For example, it can be 3–15 nm or other values ​​in the range of 1–30 nm. This application does not make any special limitation on this. The anti-fingerprint top layer can be applied by vapor deposition (such as AP-PECVD, vacuum evaporation), wet coating (such as dip coating, spin coating, spray coating), or a combination thereof. Its surface function is to reduce the adhesion of water and oil contaminants and improve the ease of cleaning, but it does not reconstruct or mask the morphology of the underlying microstructure.

[0044] In some embodiments, this application also provides anti-glare glass, wherein the equivalent feature size of microstructure A is 1–15 μm, the peak-to-valley height is 0.3–3.0 μm, and the areal density is 10³–10⁻⁶. 6 pcs / cm²

[0045] The equivalent feature size of microstructure A is 1–15 μm, which refers to the typical geometric scale of the micron-scale scattering structure on the substrate glass surface, including but not limited to the equivalent diameter, periodic spacing, or average width of the contour of the pits / protrusions. This size range covers 1.3 to 19 times the wavelength of visible light (0.38–0.78 μm), enabling it to perform wide-angle diffuse reflection of incident light. This avoids insufficient scattering efficiency and weak glare suppression due to an excessively small size (<1 μm), and also avoids strong diffraction and local high scattering caused by an excessively large size (>15 μm), resulting in image blurring or significantly increased haze. The equivalent feature size can be continuously adjusted within the range of 1–15 μm according to actual optical performance requirements and substrate glass type. For example, it can be 2 μm, 5 μm, 8 μm, 10 μm, or 12 μm. This application does not impose any special limitation on this aspect.

[0046] The peak-valley height of microstructure A is 0.3–3.0 μm, which refers to the Rz parameter measured by a surface profilometer, i.e., the vertical distance between the highest peak and the lowest valley. This peak-valley height directly determines the surface micro-modulation depth, thereby affecting the redistribution capability of specular reflection energy: when the peak-valley height is less than 0.3 μm, the surface undulations are insufficient to effectively disturb the phase of the incident light, resulting in limited glare suppression; when it is greater than 3.0 μm, it is easy to cause non-Lambertian scattering enhancement, leading to increased haze, decreased contrast, and visual graininess. This peak-valley height can be set within the range of 0.3–3.0 μm according to the flatness of the substrate glass, the adaptability of the subsequent functional layer coating process, and the light intensity of the electronic blackboard usage scenario. For example, it can be 0.5 μm, 1.2 μm, 1.8 μm, or 2.5 μm. This application embodiment does not make any special limitation on this.

[0047] The areal density of microstructure A is 10³–10 6 The areal density (number of individual microstructure units per cm²) refers to the number of independent microstructure units per unit area. This areal density ensures the spatial uniformity of scattering within the macroscopic field of view: too low an areal density (<10³ units / cm²) will result in local areas lacking scattering function, forming glare hotspots; too high an areal density (>10³ units / cm²) will result in local areas lacking scattering function, forming glare hotspots. 6 A density of (particles / cm²) may cause inter-structural interference superposition, increasing stray light and reducing transmittance; this areal density can be controlled by the aperture and coverage of the etched mask, the distribution of sandblasting particles, the laser scanning density, or the design of the imprinting mold, for example, it can be 5×10³ particles / cm², 2×10³ particles / cm², etc. 4 Units / cm², 1×10 5 pcs / cm² or 8×10 5 The number of pieces per cm² is not specifically limited in this respect in the embodiments of this application.

[0048] In some embodiments, this application also provides that the microstructure B has an equivalent feature size of 20–200 nm, an equivalent thickness of 30–200 nm, and a coverage of microstructure A of not less than 80%.

[0049] The equivalent characteristic size of microstructure B refers to its average period, average grain size, or average pit / protrusion diameter in the surface projection direction, used to characterize its optical response characteristics to visible light (wavelength 380–780 nm). This size range is set to 20–200 nm, so that microstructure B is in the subwavelength scale, which avoids the abnormal increase in haze caused by significant Mie scattering or diffraction effects, and can form an effective gradient refractive index transition with the air / coating interface. This equivalent characteristic size can be set according to the actual process selection, for example, it can be 30 nm, 80 nm, 120 nm or 180 nm, and the embodiments of this application do not make special limitations on this.

[0050] The equivalent thickness of microstructure B refers to its average physical thickness or equivalent optical thickness in the direction perpendicular to the surface of the substrate glass, and its value ranges from 30 to 200 nm. This thickness design meets the basic requirements of the quarter-wavelength anti-reflection principle in the visible light band, that is, near the center wavelength of 550 nm, the corresponding optical thickness is about 137.5 nm (n⋅d=λ / 4). Combined with its refractive index range (usually 1.20–1.45), it can achieve broadband (400–700 nm) reflection suppression. This equivalent thickness can be adaptively adjusted according to the refractive index of the selected material and the target anti-reflection band, for example, it can be 50 nm, 100 nm, 150 nm or 190 nm. The embodiments of this application do not make any special limitations on this.

[0051] The coverage of microstructure B over microstructure A is not less than 80%, meaning that when observed under a scanning electron microscope (SEM) or atomic force microscope (AFM), the area occupied by microstructure B on the surface of microstructure A is not less than 80%. This coverage ensures the uniformity of the antireflection function across the entire surface, preventing enhanced specular reflection or color difference caused by uncovered areas. Achieving this coverage depends on the control of film deposition process parameters, including sol concentration, coating method, drying rate, plasma etching energy density, or wet etching time. In actual fabrication, the coverage can reach 85%, 90%, or 95%, and this application does not impose any special limitations on this.

[0052] In some embodiments, this application also provides anti-glare glass, wherein the thickness of the transparent hardened wear-resistant layer is 0.2–5 μm, and the pencil hardness is not less than 3H; the refractive index of the transparent hardened wear-resistant layer is 1.40–1.55; and the valley filling depth of the transparent hardened wear-resistant layer for microstructure A does not exceed 70% of the peak-valley height of microstructure A.

[0053] The thickness of the transparent hardened wear-resistant layer is 0.2–5 μm. This thickness range represents an experimentally verified balance window: if the thickness is less than 0.2 μm, it is difficult to form a continuous and dense protective film, resulting in incomplete coverage of the top of the microstructure, insufficient wear resistance, and easy local wear through during erasing and writing; if the thickness exceeds 5 μm, the leveling effect is enhanced, the valley filling depth is significantly increased, which easily leads to a decrease in effective surface roughness and a reduction in anti-glare performance, and may also cause optical interference fringes or a white haze effect. This thickness can be adapted and adjusted according to the actual substrate glass size, the peak-valley height distribution of microstructure A, and the coating process type (such as curtain coating, roller coating, or spin coating). For example, when the peak-valley height of microstructure A is 0.3–1.0 μm, a thickness of 0.5–2.5 μm can be selected; when the peak-valley height is 1.5–3.0 μm, a thickness of 1.0–3.0 μm can be selected; the embodiments of this application do not impose special limitations on this.

[0054] The transparent, hardened, wear-resistant layer must have a pencil hardness of at least 3H. This pencil hardness characterizes the coating's surface scratch resistance after drying and curing, and the test is performed according to GB / T6739—2006 "Determination of Hardness of Paints and Varnishes by Pencil Method". A hardness of 3H or higher indicates that the coating has sufficient cross-linking density and mechanical strength to withstand the mechanical effects of dry erasing, wet erasing, erasing with an eraser, and frequent finger swiping during daily use of the electronic blackboard; a hardness of at least 5H can be further selected, which can be achieved by introducing inorganic nanoparticles (such as SiO2, Al2O3 sol), increasing the proportion of siloxane networks, or using UV / thermal dual curing for synergistic reinforcement. The hardness value does not depend on a single component, but rather on the synergistic matching of organic monomers, inorganic precursors, crosslinking agents, and curing processes in the overall formulation. For example, when using an inorganic-organic hybrid sol-gel system, a pencil hardness of ≥3H can be stably obtained under the conditions of UV pre-curing energy of 300–800 mJ / cm², subsequent thermal curing temperature of 80–150℃, and time of 10–30 min. The embodiments of this application do not impose special limitations on the specific combination of curing parameters.

[0055] The refractive index of the transparent hardened wear-resistant layer is 1.40–1.55. This refractive index falls between that of air (n≈1.00) and the substrate glass (soda-lime glass n≈1.52, aluminosilicate glass n≈1.54), which helps reduce Fresnel reflection at the interface and forms an optical synergy with the nano-anti-reflection function of microstructure B: on the one hand, it avoids the abrupt increase in scattering loss due to abrupt changes in refractive index, and on the other hand, it can suppress secondary reflection at the interface of the hardened layer / microstructure B, thereby suppressing the "haze" effect and improving contrast. This refractive index can be adjusted by controlling the content of inorganic phase (such as the mole fraction of SiO2), the length of organic chain segments (such as acrylate / epoxy monomer structures), or by introducing low refractive index components (such as fluorosiloxanes); for example, when the volume fraction of inorganic phase is 20%–60%, the refractive index can stably fall in the range of 1.42–1.53; the specific control path of refractive index is not specifically limited in the embodiments of this application.

[0056] In this process, the valley-filling depth of the transparent hardened wear-resistant layer in microstructure A does not exceed 70% of the peak-valley height of microstructure A. This valley-filling depth is defined as the vertical thickness of the hardened layer filling the valley bottom region of microstructure A, based on the average vertical distance from the valley bottom to the surface of the hardened layer measured by a profilometer. Its upper limit is set at 70% to ensure that at least 30% of the original peak-valley height is retained, thereby maintaining sufficiently effective surface micro-modulation and supporting continuous and stable anti-glare performance. This valley-filling depth is controlled by a combination of multiple parameters, including the viscosity of the hardened material (selectable from 10–500 cP), surface tension (selectable from 20–35 mN / m), coating line speed (0.2–5 m / min), and curing rate (UV power and thermal gradient). For example, in a curtain coating process, by dynamically adjusting the coating amount through an online film thickness feedback system and coordinating with a UV pre-curing rate of 0.5–2.0 °C / s, the valley-filling depth can be stably controlled within the range of 40%–65%. This application does not impose specific limitations on the specific implementation method of the valley-filling depth, but requires that it meet the technical limitation of not exceeding 70%.

[0057] In some embodiments, this application also provides anti-glare glass, wherein the anti-fingerprint top layer is formed by reacting and bonding with hydroxyl groups on the surface of the transparent hardened wear-resistant layer, and has a thickness of 1–30 nm; the anti-fingerprint top layer ensures that the static water contact angle of the anti-glare glass is not less than 105° and the static oil contact angle is not less than 70°.

[0058] The anti-fingerprint top layer is formed by reacting and bonding with hydroxyl groups on the surface of the transparent hardened wear-resistant layer. This means that before forming the anti-fingerprint top layer, the surface of the transparent hardened wear-resistant layer is activated to introduce hydroxyl (-OH) functional groups onto its surface. The hydroxyl groups act as active reaction sites, undergoing condensation or addition reactions with reactive groups in the anti-fingerprint material to form stable covalent bonds. The activation treatment methods include any one of plasma treatment, ultraviolet ozone treatment, or chemical activation treatment. Plasma treatment uses oxygen or argon plasma with a treatment power of 50–300W and a treatment time of 30–180s. Ultraviolet ozone treatment uses dual-band ultraviolet lamps with wavelengths of 185nm and 254nm, irradiated at normal pressure for 60–300s. Chemical activation treatment uses a dilute solution containing silane coupling agent for impregnation or spraying followed by drying to construct a hydroxyl-rich transition layer on the surface.

[0059] The thickness of the anti-fingerprint top layer is 1–30 nm, which refers to the physical thickness of the continuous or quasi-continuous ultrathin coating layer formed on the surface of the transparent hardened wear-resistant layer. This thickness range is obtained through joint verification by optical interference, X-ray photoelectron spectroscopy (XPS) depth analysis, and contact angle attenuation trend. When the thickness is less than 1 nm, it is difficult to form a complete hydrophobic and oleophobic network, resulting in insufficient contact angle and poor abrasion resistance. When the thickness exceeds 30 nm, it is easy to induce visible light interference colors (such as rainbow patterns) and may cause microcracks or local peeling due to stress accumulation. The thickness can be adjusted within the range of 1–30 nm according to the type of anti-fingerprint material used, surface energy, and activation degree. For example, it can be 3 nm, 5 nm, 10 nm, 15 nm, or 25 nm. This application does not make any special limitation on this.

[0060] The anti-fingerprint top layer ensures that the static water contact angle of the anti-glare glass is not less than 105°. This refers to the initial equilibrium contact angle θ measured by a contact angle meter when a 5μL droplet of deionized water is placed on the surface of the anti-glare glass under standard environmental conditions (temperature 23±2℃, relative humidity 50±5%). W ≥105°; This index characterizes the degree to which the surface achieves low polarity and high hydrophobicity; The static oil contact angle is not less than 70°, which refers to the initial equilibrium contact angle θ measured under the same conditions using n-hexadecane as the test oil phase. O ≥70°; This indicator reflects the ability to repel non-polar contaminants such as sebum; the synergistic achievement of the water and oil contact angle indicates that the anti-fingerprint top layer has excellent hydrophobicity and oleophobicity at the same time. The two work together to significantly reduce the amount of fingerprint residue and improve the wiping cleaning efficiency; The contact angle value can be adjusted according to the molecular structure of the anti-fingerprint material (such as fluorocarbon chain length, branching degree), crosslinking density and surface order, under the premise of meeting the above lower limit. For example, the water contact angle can be 105°, 110°, 115° or 120°, and the oil contact angle can be 70°, 75°, 80° or 85°. The embodiments of this application do not make special limitations on this.

[0061] Addressing the technical problems of electronic blackboards in strong ambient light environments, such as prominent glare, reduced clarity, insufficient wear resistance, and poor fingerprint compatibility, this application provides a method for preparing anti-glare glass for electronic blackboards, such as... Figure 1 As shown, the method includes the following steps:

[0062] Step 1: S1, Substrate Pretreatment: Clean and dry the substrate glass to obtain a clean substrate glass;

[0063] Here, "substrate glass" refers to the carrier substrate used for the electronic blackboard display surface, which can be soda-lime glass, aluminosilicate glass, or tempered / semi-tempered flat glass; "cleaning" refers to removing surface oil, particles, and organic residues by degreasing alkaline solution or organic solvent; "drying" refers to removing moisture by hot air drying or vacuum drying and avoiding watermarks; this step aims to eliminate surface contaminants and adsorbed water films, providing a chemically inert, physically clean, and uniformly surface-energy-rich starting interface for subsequent microstructure construction, thereby ensuring the consistency and adhesion stability of microstructure A in subsequent steps.

[0064] In one alternative implementation, the cleaning method may involve sequentially ultrasonically cleaning with an alkaline cleaning solution of pH=10–12 for 5–15 min, rinsing with deionized water 3 times, dehydrating with isopropanol, and drying in a hot air circulating oven at 80–120℃ for 10–30 min.

[0065] In another alternative implementation, the cleaning method may include pre-washing with a weakly acidic cleaning solution containing fluorinated surfactants to remove residual metal ions, followed by drying by pure water spraying and nitrogen purging. Furthermore, the cleaning and drying method can also employ an online continuous cleaning line with an infrared heating module to complete cleaning, rinsing, purging and drying online, in order to adapt to the industrial continuous production of large-size glass (≥1000mm×600mm).

[0066] Step 2: S2, Constructing Microstructure A: Forming a micron-scale scattering structure (microstructure A) on the target surface of a clean substrate glass.

[0067] Among them, the "micron-scale scattering structure (microstructure A)" refers to a random uneven morphology with micron-scale characteristic size and peak-valley height formed on the surface of the substrate glass. Its function is to generate non-specular scattering of incident light in the visible light band, weaken the intensity of directional reflection, and thus suppress glare. This structure usually has wide-angle light diffusion capability in the relevant technical field, and its scattering characteristics depend on the scale distribution, height undulation and spatial density of the morphology. In this embodiment, microstructure A serves as the bottom layer structure of the dual-scale microstructure anti-glare layer, providing physical support and morphological template for the subsequent microstructure B, and constituting the basic optical modulation unit of the entire anti-glare function.

[0068] In one alternative implementation, the method for constructing microstructure A can be a chemical etching method: immersing a clean substrate glass in an etching solution containing hydrofluoric acid or ammonium fluoride-buffer system, reacting at 20–60°C for 30s–5min, and adjusting the equivalent feature size and peak-valley height of microstructure A by controlling the etching time, temperature and solution concentration.

[0069] In another alternative implementation, the method for constructing microstructure A may involve a sandblasting process: using alumina or glass microspheres with a particle size of 10–100 μm, the glass surface is controlled to be sprayed at a pressure of 0.2–0.6 MPa, and the surface density and roughness profile of microstructure A are controlled by adjusting the spray distance, angle and scanning speed.

[0070] Furthermore, the method for constructing microstructure A can also employ laser micro-engraving or molding / imprinting transfer methods: using femtosecond lasers to induce local melting and resolidation on the glass surface to form a micro-pit array, or using high-precision molds to imprint and replicate microstructure patterns on the softened glass surface to achieve higher morphological fidelity and regional consistency.

[0071] Step 3: S3, Constructing microstructure B: Form a nanoscale anti-reflection structure (microstructure B) on microstructure A to obtain a dual-scale microstructure anti-glare layer;

[0072] Among them, "nanoscale antireflection structure (microstructure B)" refers to a periodic or non-periodic texture structure with a scale on the nanometer scale superimposed on the surface of microstructure A. This structure usually has the function of reducing the Fresnel reflectivity of the interface in the relevant technical field, and can achieve broadband antireflection through the gradient refractive index effect of porous media or the equivalent medium theory of subwavelength structure. In this embodiment, microstructure B does not undertake the scattering task alone, but works in synergy with microstructure A: microstructure A provides the macroscopic scattering basis, while microstructure B bridges the local reflection enhancement caused by the abrupt change in refractive index between the peaks and valleys of microstructure A, thereby suppressing the "white fog" feeling while maintaining low glare and improving contrast and image transparency.

[0073] In one alternative implementation, the method for constructing microstructure B can be a sol-gel film formation method: SiO2 precursor sol or TiO2-doped composite sol is applied to the surface of microstructure A by spin coating, spraying or dip coating, and a porous nanoparticle stack layer is formed by gradient temperature drying and low temperature heat treatment (150–300℃), the porosity and particle size distribution of which determine the anti-reflection performance;

[0074] In another alternative implementation, the method for constructing microstructure B may include plasma etching: after depositing a thin polymer mask on the surface of microstructure A, anisotropic etching is performed using Ar / O2 mixed plasma to preferentially form nanoscale peaks or depressions at the top of microstructure A, thereby constructing a composite micro / nano morphology with self-similar fractal characteristics; furthermore, the method for constructing microstructure B can also employ a wet secondary micro-etching method: immersing the glass with microstructure A already formed into a diluted weak acid or complexing agent solution, selectively dissolving in the high curvature region of microstructure A, inducing the generation of nanoscale secondary roughness, and realizing an in-situ grown micro / nano coupled structure.

[0075] Step 4: S4, Forming a hardened wear-resistant layer: Coat the surface of the dual-scale microstructure anti-glare layer with a transparent hardening material and cure it to form a transparent hardened wear-resistant layer covering the dual-scale microstructure anti-glare layer, and control the valley filling degree of the transparent hardened wear-resistant layer to retain effective surface roughness.

[0076] The "transparent hardened wear-resistant layer" refers to a functional coating with optical transparency, mechanical hardness, and chemical stability. In the relevant technical field, this layer typically has the ability to improve the surface pencil hardness, resist scratch abrasion, and block the penetration of contaminants. In this embodiment, this layer not only acts as a physical protective barrier to prevent microstructure A from being worn down during subsequent processing and use, but more importantly, its rheological behavior must meet the requirement of "selective coverage"—that is, during the curing process, it preferentially wets and covers the peaks of microstructure A to enhance wear resistance, while limiting its capillary filling depth into the valleys, so that the effective scattering profile defined by microstructure A, i.e., "effective surface roughness", is still retained under the overall smoothed appearance.

[0077] In one alternative implementation, the method for forming the hardened wear-resistant layer can be to use an inorganic-organic hybrid sol-gel coating, which is applied to the surface of a two-scale microstructure by spraying, followed by UV primary curing (365nm, 500–2000mJ / cm²) and thermal post-curing (80–150℃, 10–60min) to complete cross-linking. The valley filling depth is controlled by adjusting the sol viscosity (10–50cP), surface tension (20–30mN / m), and coating line speed (0.2–5m / min).

[0078] In another alternative implementation, the method for forming the hardened wear-resistant layer may involve using a transparent inorganic thin film material and depositing SiO2 by magnetron sputtering. x Alternatively, an Al2O3 thin film can be used. By controlling the sputtering power and oxygen partial pressure to adjust the film density and stress, the film can be continuously formed at the peaks of the microstructure and distributed in an island-like pattern at the bottom of the valleys, thus achieving a physical "non-filling" effect. Furthermore, this method for forming a hardened wear-resistant layer can also employ roller coating combined with online film thickness feedback control: during the coating process, near-infrared reflectance spectra are collected in real time to invert the current wet film thickness, and the flow rate of the feed pump and the roller speed are dynamically adjusted to ensure that the final dry film thickness is stable within the 0.2–5 μm window, and the valley filling depth does not exceed 70% of the height of the A peak valley of the microstructure.

[0079] Step 5: S5, Forming an anti-fingerprint top layer: After activating the surface of the transparent hardened wear-resistant layer, an anti-fingerprint treatment is applied to form an anti-fingerprint top layer; where, the "anti-fingerprint top layer" refers to an ultra-thin functional layer with low surface energy characteristics; this layer usually has hydrophobic and oleophobic properties in the relevant technical field, which can reduce the spreading and adhesion of organic pollutants such as sebum and sweat on the surface; in this embodiment, this layer is not directly deposited on the rough microstructure A surface, but is anchored on the transparent hardened wear-resistant layer after S4 treatment. With the help of the chemically homogeneous, hydroxyl-rich and mechanically stable platform provided by the latter, the covalent bonding and dense coverage of AF molecules are achieved, thereby taking into account both anti-fingerprint performance and optical consistency, and avoiding rainbow patterns, whitening or abnormal fluctuations in light transmittance caused by uneven coverage of the AF layer on the micro-nano structure.

[0080] In one alternative implementation, the method for forming the anti-fingerprint top layer may involve first treating the surface of the transparent hardened wear-resistant layer with atmospheric pressure plasma to introduce polar active groups such as hydroxyl (-OH), and then introducing a perfluorooctyltriethoxysilane (FOTS) precursor through vapor deposition, where a hydrolysis-condensation reaction occurs on the surface to form a covalently bonded fluorosilane monolayer with a thickness of 1–30 nm. In another alternative implementation, the method for forming the anti-fingerprint top layer may include surface activation by ultraviolet ozone treatment, followed by dip coating with a diluted fluorinated acrylate solution, and then cross-linking and curing by low-temperature baking at 80–120°C (10–30 min) to form a polymeric AF layer with controllable thickness and strong adhesion.

[0081] Furthermore, the method for forming the anti-fingerprint top layer can also employ a combination of chemical activation and wet coating: the surface of the hardened layer is wiped with an ethanol solution containing a titanate coupling agent to form a transitional active interface, and then a nano-fluorinated silica dispersion is sprayed on. After low-temperature heat treatment, a composite AF structure with both nano-reinforcement and low surface energy is obtained.

[0082] In some embodiments, this application further provides that in S2, microstructure A is formed by any one of chemical etching, sandblasting, laser micro-engraving, or embossing / imprint transfer; in S2, the equivalent feature size of microstructure A is controlled to be 1–15 μm, and the peak-valley height is 0.3–3.0 μm, including:

[0083] Step 1: Form a micron-scale scattering structure (microstructure A) on the target surface of a clean substrate glass using any of the following methods: chemical etching, sandblasting, laser micro-engraving, or molding / imprinting transfer.

[0084] Chemical etching refers to the selective dissolution of the glass surface using a fluorinated acidic etching solution or a non-fluorinated composite etching system, thereby constructing randomly distributed micron-sized pits or hillocks on the substrate. This method is suitable for the preparation of large-area, highly uniform microstructures and has the characteristics of mature technology, low cost, and easy mass production. In this embodiment, its role is to form a three-dimensional morphology on the glass surface that meets the requirements of optical scattering with a controllable etching rate and time, providing a structural basis for subsequent nanostructure growth and hardened layer coverage.

[0085] Sandblasting refers to using compressed gas to drive micron-sized abrasive particles (such as alumina, silicon carbide, or glass microspheres) to impact the glass surface, achieving micron-scale surface roughening through physical impact. This method has a fast response speed, requires no mask, and has low equipment investment, making it suitable for rapid prototyping in small to medium batches. In this embodiment, its function is to form micron-sized impact pits with a certain depth and distribution density on the glass surface. The morphology is controlled by the spray angle, pressure, distance, and abrasive particle size, thereby adapting to the scattering angle distribution required for anti-glare. Laser micro-engraving refers to using a focused pulsed laser beam to scan and ablate or induce modification on the glass surface, forming periodic or non-periodic micron-sized grooves, dot matrix, or composite textures. This method has the advantages of high spatial positioning accuracy, programmable patterns, non-contact operation, and no chemical waste. In this embodiment, its function is to achieve directional scattering design of microstructure A, such as enhancing horizontal scattering along the writing direction to suppress window light reflection, while suppressing excessive vertical scattering to maintain longitudinal contrast.

[0086] Molding / imprinting transfer refers to pressing a pre-prepared microstructure master (such as a nickel template or silicon mold) into softened glass or a thermoplastic / UV-curable functional layer coated on the glass surface under heating and pressure. After cooling or curing, the microstructure is demolded to obtain a replicated microstructure. This method is suitable for continuous roll-to-roll (R2R) or flatbed imprinting production, with good repeatability and high efficiency. In this embodiment, its function is to achieve high-fidelity, large-volume replication of microstructure A, which is especially suitable for the large-scale manufacturing of standardized electronic blackboard panels. The above four methods are independent and equivalent to each other. Any method can be implemented alone or switched in the same production line according to product specifications without mutual exclusion.

[0087] Step 2: Control the equivalent feature size of microstructure A to be 1–15 μm, and the peak-valley height to be 0.3–3.0 μm;

[0088] The "equivalent feature size" refers to the geometric scale characterizing the dominant scattering behavior of microstructure A in planar projection. It can be the average diameter of the micro-dimples, the average spacing of the micro-hills, or the reciprocal of the spatial frequency corresponding to the main peak of the power spectral density of the random structure. This parameter determines the main lobe width and angular distribution range of the scattered light. If the size is too small, the scattering will be insufficient and the glare suppression will be weak. If the size is too large, it will easily induce diffraction rainbow patterns and reduce image sharpness. In this embodiment, its function is to effectively disperse the specular reflection energy to a wide angle range (above ±30°) that the human eye is not sensitive to, while avoiding the introduction of too much stray light in the commonly used field of view (within ±15°). The "peak-valley height" refers to the maximum profile deviation (Rz) of microstructure A in the height direction, reflecting the amplitude of the surface micro-undulations. This parameter directly affects the surface roughness and scattering intensity. If the height is too low, the anti-glare effect will be insufficient. If it is too high, the haze will increase significantly and the image will appear washed out. In this embodiment, its function is to ensure that the effective modulation depth of the surface is sufficient to disturb the visible light wavefront while maintaining a total transmittance of ≥88%, thereby achieving glare suppression without sacrificing image quality.

[0089] The equivalent feature size and peak-valley height together constitute the two-dimensional morphology constraint window of microstructure A, and the two need to be controlled in a coordinated manner: when the size is at the upper limit (15μm), the peak-valley height should be controlled between 1.5 and 3.0μm to ensure scattering intensity; when the size is at the lower limit (1μm), the peak-valley height should not be lower than 0.3μm to maintain basic scattering ability; this coordinated relationship is achieved through the linkage adjustment of process parameters, such as concentration and time in etching, abrasive particle size and air pressure in sandblasting, energy density and scanning speed in laser, and mold depth and forming pressure in molding.

[0090] In some embodiments, this application further provides that in S3, microstructure B is formed using any one of sol-gel film formation, plasma etching, or wet secondary micro-etching; in S3, controlling the equivalent feature size of microstructure B to be 20–200 nm and the equivalent thickness to be 30–200 nm, and ensuring that its coverage of microstructure A is not less than 80%, includes:

[0091] Step 1: Form a nanoscale anti-reflection structure (microstructure B) on microstructure A to obtain a dual-scale microstructure anti-glare layer;

[0092] Among them, microstructure B is a nanoscale antireflection structure, which refers to a nanoscale morphology or medium structure introduced on the surface of a micron-scale scattering structure to reduce Fresnel reflection at the interface. In terms of optical function, it is used to reduce the reflectivity of the glass / air interface and the glass / hardened layer interface, thereby suppressing "white haze" and improving image contrast and clarity. In this embodiment, the structure is limited to being formed by any one of the following methods: sol-gel film formation, plasma etching, or wet secondary micro-etching. Its equivalent feature size, equivalent thickness, and coverage of microstructure A are all within the defined process window to ensure the spatial uniformity and optical stability of the antireflection effect.

[0093] In one alternative implementation, the method for forming microstructure B is a sol-gel film formation method. This method can be as follows: a silicon-containing precursor (such as tetraethyl orthosilicate TEOS) is mixed with a solvent, a catalyst and a pore-forming agent to prepare a SiO2-based sol, which is then applied to the surface of microstructure A by spin coating, spraying or dip coating. Subsequently, the sol undergoes hydrolysis and condensation through gradient heating drying and low-temperature heat treatment to form a porous nanoparticle stack layer or a continuous nanonetwork structure, thereby constructing an anti-reflection structure with controllable porosity and nanoscale undulations on the surface of microstructure A.

[0094] In another alternative implementation, the method for forming microstructure B is plasma etching. This method includes: placing the substrate glass with microstructure A already formed in a reaction chamber, applying radio frequency or microwave power to excite plasma in a mixed atmosphere of inert gas (such as Ar) and reactive gas (such as O2, CF4 or SF6), and using active particles to perform anisotropic or quasi-isotropic etching on the surface of microstructure A, simultaneously generating nanoscale pits, spikes or velvety textures on its peaks and sidewalls, thereby forming a nanoscale antireflection structure that covers continuously and whose morphology is self-adaptive to the contour of microstructure A; furthermore, the method for forming microstructure B can also adopt a wet secondary micro-etching method, that is: immersing the microstructure A sample in a weakly corrosive solution (such as a diluted HF-NH4F buffer system or an organic acid / complexing agent composite system), selectively dissolving the surface under conditions lower than the first etching intensity, preferentially etching the raised edges and grain boundary regions of microstructure A, inducing the generation of nanoscale etch pits and roughening transition regions, thereby superimposing a uniformly distributed nanoscale surface modulation while retaining the overall contour of the original micron structure.

[0095] Step 2: Control the equivalent feature size of microstructure B to 20–200 nm;

[0096] The equivalent characteristic size is a comprehensive parameter characterizing the geometric scale of the microstructure B. It can be defined as any one of the average diameter, average period, average aperture, or average protrusion width of the nanostructure unit. Its numerical range reflects the phase modulation capability and scattering cross-section matching degree of the structure in the visible light band (400–700 nm). In this embodiment, the size is limited to 20–200 nm to balance the anti-reflection bandwidth and structural stability. If the size is too small (<20 nm), the refractive index gradient will be insufficient and the anti-reflection effect will be weak. If the size is too large (>200 nm), it will easily cause enhanced Mie scattering, increased local haze, or even diffraction fringes. This parameter needs to be controlled in real time through the process and finally verified by AFM or SEM morphology analysis.

[0097] Step 3: Control the equivalent thickness of microstructure B to 30–200 nm;

[0098] The equivalent thickness refers to the effective physical extension depth or equivalent optical thickness of microstructure B along the direction perpendicular to the surface of the substrate glass. It characterizes the structure's contribution to the phase delay of incident light and its ability to support anti-reflection performance in depth. In this embodiment, the thickness is limited to 30–200 nm to meet the approximate matching of the quarter-wavelength anti-reflection condition (corresponding to a center wavelength of 550 nm, the ideal optical thickness of a single-layer anti-reflection film is 137.5 nm), while avoiding structural stress accumulation, cracking, or decreased bonding strength with the subsequent hardened layer due to excessive thickness. This thickness can be synergistically controlled by sol concentration and coating times, plasma etching time, or wet etching duration, and verified by non-destructive measurement using an ellipsometer or profilometer.

[0099] Step 4: Ensure that the coverage of microstructure B over microstructure A is no less than 80%;

[0100] Coverage refers to the proportion of the area occupied by microstructure B on the surface of microstructure A. Its value is obtained by scanning electron microscopy (SEM) images through grayscale threshold segmentation and area statistics. In this embodiment, the coverage is limited to no less than 80% to ensure the spatial consistency of the anti-reflection function throughout the entire effective display area. A coverage of less than 80% will result in local high-reflection spots in the uncovered areas, causing optical artifacts, uneven brightness, or residual glare. This indicator is directly related to the process robustness of the three formation methods: the sol-gel method depends on the wettability of the precursor and the solvent evaporation kinetics; plasma etching depends on the uniformity of discharge and the gas flow field distribution; and wet secondary micro-etching depends on the solution mass transfer rate and the selectivity of surface reaction. All three need to be guaranteed through equipment parameter calibration and batch process monitoring.

[0101] In some embodiments, this application further provides that the transparent curing material in S4 is an inorganic-organic hybrid sol-gel coating or a transparent inorganic thin film material; the curing method of the transparent curing wear-resistant layer in S4 is a combination of UV curing and post-heat curing; the film thickness of the transparent curing wear-resistant layer in S4 is controlled to be 0.2–5 μm; in S4, by adjusting the viscosity, surface tension, or coating amount of the transparent curing material, the valley filling depth of the transparent curing wear-resistant layer on microstructure A does not exceed 70% of the peak-valley height of microstructure A; S4 uses a curtain coating or roller coating method to coat the transparent curing material, and performs linkage control of linear speed and coating amount during the coating process; the linear speed of curtain coating or roller coating is 0.2–5 m / min, and the coating amount is adjusted based on the online film thickness detection results, including:

[0102] Step 1: The transparent curing material in S4 is an inorganic-organic hybrid sol-gel coating or a transparent inorganic thin film material;

[0103] Among them, "inorganic-organic hybrid sol-gel coating" refers to a transparent coating material formed by the co-hydrolysis and condensation of siloxane precursors (such as methyltriethoxysilane and phenyltrimethoxysilane) and organic functional monomers (such as acrylates and epoxysilanes), which has both the rigidity of inorganic networks and the toughness of organic segments. In the relevant technical field, it usually has the technical attributes of high light transmittance, controllable crosslinking density, good adhesion and adaptability to the wettability of various substrate surfaces. In this embodiment, the material serves as the main film-forming body of the transparent hardened wear-resistant layer. Its inorganic network provides the basis for hardness and abrasion resistance, while the organic components impart flexibility and crack resistance, and synergistically regulate the overall rheological behavior of the material, providing the physical property prerequisite for subsequent valley filling depth control.

[0104] "Transparent inorganic thin film materials" refer to dense inorganic oxide or oxynitride thin film materials that have high transmittance and no significant scattering in the visible light band, such as SiO2. x Al2O3, TiO2, or their composite systems typically possess high hardness, excellent chemical stability, and low coefficient of thermal expansion in their respective technical fields. In this embodiment, the material is formed on the surface of a dual-scale microstructure anti-glare layer by physical vapor deposition (PVD) or atomic layer deposition (ALD). Its dense structure can directly cover the A-peak region of the microstructure to provide wear-resistant protection. At the same time, due to the deposition directionality and low surface mobility, it naturally inhibits overfilling towards the valley, thereby helping to maintain effective surface roughness.

[0105] Step 2: The curing method for the transparent hardened wear-resistant layer in S4 is a combination of UV curing and post-heat curing;

[0106] "UV curing" refers to the use of ultraviolet light to initiate free radical or cationic polymerization reactions of photosensitive groups (such as acrylate double bonds and epoxy groups) in the coating, achieving rapid initial film formation and surface shaping. In this technical field, it typically possesses the technical attributes of fast reaction rate, low energy consumption, and suitability for continuous production lines. In this embodiment, this step is used to lock the coating morphology within seconds of coating application, preventing damage to the microstructure contour due to liquid film flow caused by gravity or vibration during transfer or handling. "Post-heat curing" refers to applying heat treatment at a certain temperature gradient after UV initial curing, promoting the continued cross-linking of residual unreacted groups, eliminating internal stress, and increasing network density. In this technical field, it typically possesses the technical attributes of enhanced mechanical strength, improved weather resistance, and increased interfacial adhesion. In this embodiment, this step further increases the overall pencil hardness of the hardened layer to no less than 3H and strengthens the bonding stability between it and the underlying dual-scale microstructure anti-glare layer, preventing interlayer peeling under subsequent wiping or touch stress.

[0107] Step 3: In S4, control the thickness of the transparent hardened wear-resistant layer to be 0.2–5 μm;

[0108] Here, "film thickness" refers to the average geometric thickness of the hardened layer in the macroscopically flat area. In the relevant technical field, it is a key parameter that determines optical transmittance, mechanical support capability, and surface morphology fidelity. In this embodiment, the thickness range is set to take into account three constraints: when the thickness is less than 0.2 μm, it is difficult to form a continuous and complete coverage, which is prone to pinholes or local exposure, resulting in insufficient protection of the A peak of the microstructure; when the thickness is greater than 5 μm, it significantly increases the shrinkage stress and fluidity of the material, which can easily lead to overfilling of valley areas, increased haze, and the risk of interlayer cracking; while the 0.2–5 μm range can achieve selective filling of the A peak and valley space of the microstructure through subsequent rheological control while ensuring full coverage.

[0109] Step 4: In S4, by adjusting the viscosity, surface tension, or coating amount of the transparent hardening material, the valley filling depth of the transparent hardening wear-resistant layer for microstructure A shall not exceed 70% of the peak-valley height of microstructure A;

[0110] "Viscosity" refers to the flow resistance of a material under shear stress, which directly affects coating uniformity, film thickness consistency, and the spreading behavior of the liquid film on the microstructure surface in this technical field. In this embodiment, by adding rheology modifiers (such as fumed silica or organobentonite) or adjusting the solid content, the zero-shear viscosity of the transparent hardening material is controlled within the range of 100–5000 mPa·s, ensuring sufficient fluidity to wet the peaks in the initial coating stage and maintaining a certain structural strength during the settling stage to inhibit spontaneous penetration into the deep valleys. "Surface tension" refers to the energy state exhibited by the mutual attraction between molecules on the liquid surface, which determines the wetting angle and contact line pinning ability of the liquid film on the solid surface in this technical field. In this embodiment, by introducing fluorocarbon surfactants or siloxane leveling agents, the surface tension of the material is adjusted to 22–30 mN / m, resulting in moderate wetting of the A-peak surface of the microstructure (contact angle <60°), while limited wetting of the valley bottom due to curvature effect and air retention, thus naturally limiting the valley filling depth. "Coating amount" refers to the mass of liquid material applied per unit area. In the relevant technical field, it is a direct control variable connecting process input and final film thickness. In this embodiment, this parameter, together with linear velocity, nozzle opening, pumping pressure, etc., constitutes a closed-loop adjustment object. The theoretical coating amount is calculated by back-calculating the preset valley filling target and combined with online detection for real-time correction to ensure that the final valley filling depth is stably controlled within ≤70% of the height of the valley of the microstructure A peak, so as to retain at least 30% of the original valley depth as the spatial carrier of the effective scattering unit.

[0111] Step 5: S4 applies the transparent hardening material using either curtain coating or roller coating, and controls the linear speed and coating amount in conjunction with the coating process.

[0112] "Drip coating" refers to continuously pouring a quantitative amount of coating material from a high-level tank through a slit nozzle onto the surface of a moving substrate, forming a liquid curtain. The coating is then formed by gravity and the substrate moving together. In this technical field, it is typically suitable for continuous coating of large-size, high-cycle, low-defect-rate flat glass. In this embodiment, drip coating can achieve uniform coverage of a wide (≥1.5m) glass surface, and the liquid curtain itself has buffering and homogenizing effects, helping to reduce the impact of local morphological differences in microstructure A on film thickness fluctuations. "Roller coating" refers to using a rotating coating roller to transfer coating material from the feed roller to the substrate surface, controlling the wet film thickness through the roller gap. In this technical field, it typically features high coating accuracy, high material utilization, and ease of integration with online metering. In this embodiment, roller coating is more suitable for small-to-medium-sized product batches or those requiring higher film thickness repeatability, especially for substrates with slightly lower microstructure A morphological uniformity. "Linked control of linear speed and coating amount" refers to establishing a dynamic coupling relationship between the substrate conveying linear speed and the coating supply amount per unit time. In this technical field, it is a fundamental closed-loop strategy to ensure consistent wet film thickness. In this embodiment, the linkage logic is expressed as follows: ,in Volumetric flow rate (mL / min) The coating width is in meters. The linear velocity is (m / min). The target wet film thickness (μm). The material density (g / mL) is used to calculate the required feed rate in real time based on this formula, and the system adjusts the feed rate through a servo pump or proportional valve to maintain a constant wet film thickness reference under different linear speed conditions.

[0113] Step 6: The linear speed for curtain coating or roller coating is 0.2–5 m / min, and the coating amount is adjusted based on the online film thickness detection results;

[0114] Among them, "linear velocity" refers to the running speed of the substrate along the conveying direction, which directly affects the residence time of the liquid film, the degree of solvent evaporation, and the adequacy of leveling in the relevant technical field. In this embodiment, when the linear velocity is below 0.2 m / min, it is easy to cause edge accumulation and sagging, while above 5 m / min, it shortens the liquid film leveling window and exacerbates the risk of uneven peak and valley filling. The range of 0.2–5 m / min can match the rheological window and UV curing response time of most curing materials. "Online film thickness detection" refers to the point-by-point or scanning measurement of wet film thickness using a non-contact optical interferometer or beta-ray thickness gauge during the transition period after coating and before UV curing. In its technical field, it is a core sensing method for achieving process quality feedforward / feedback control. In this embodiment, the detection signal is uploaded to the PLC control system at millisecond intervals. After being compared with a preset thickness threshold, a correction command is output to the feeding unit in real time, forming a closed-loop feedback link of "detection → comparison → adjustment → re-detection" to ensure that the standard deviation of the film thickness of the entire board is ≤±5%, thereby ensuring the uniformity of the valley filling depth in the spatial dimension and the reproducibility in the batch dimension.

[0115] In some embodiments, this application further provides that the activation treatment in S5 is any one of plasma treatment, ultraviolet ozone treatment, or chemical activation treatment, to introduce hydroxyl groups on the surface of the transparent hardened wear-resistant layer; the anti-fingerprint treatment in S5 is performed by vapor deposition or wet coating to form an anti-fingerprint top layer with a thickness of 1–30 nm; the formed anti-fingerprint top layer in S5 is subjected to a low-temperature post-baking treatment, the conditions of which include:

[0116] Step 1: The activation treatment in S5 is any one of plasma treatment, ultraviolet ozone treatment or chemical activation treatment, to introduce hydroxyl groups on the surface of the transparent hardened wear-resistant layer;

[0117] Among them, "plasma treatment" refers to the use of gas discharge such as argon, oxygen or air to generate highly active particles (such as O•, OH•, UV photons) under low pressure or normal pressure conditions, which act on the surface of the transparent hardened wear-resistant layer, causing its organic components to oxidize and break down and generate a large number of hydroxyl (-OH) functional groups; this treatment improves the surface polarity and reactivity without damaging the microstructure morphology, providing covalent bonding sites for subsequent anti-fingerprint materials;

[0118] "Ultraviolet ozone treatment" refers to irradiating the surface of a transparent, hardened, wear-resistant layer with ultraviolet light of wavelengths of 185nm and 254nm in an ambient pressure environment. This causes oxygen in the environment to generate atomic oxygen and ozone, which then react with organic matter on the surface to produce oxygen-containing polar groups such as hydroxyl and carboxyl groups. This method does not require vacuum equipment, is suitable for continuous production lines, and has no effect on the microstructure A / B or the refractive index of the hardened layer.

[0119] "Chemical activation treatment" refers to immersing or spraying a transparent, hardened, wear-resistant layer into an activation solution containing hydrogen peroxide, nitric acid, sulfuric acid, or aminosilane coupling agent, and promoting the regeneration of surface silanol groups or introducing new hydroxyl groups under mild heating (40–60°C). This method is suitable for local activation of heat-sensitive or complex-shaped glass parts.

[0120] In one alternative implementation, the activation process can be: introducing a mixture of 20% oxygen and 80% argon by volume under normal pressure, applying a radio frequency power of 100–300W, processing for 60–180s, and maintaining the chamber pressure at 5–50Pa.

[0121] In another alternative implementation, the activation process may include: using a 185 / 254nm dual-band ultraviolet lamp with a lamp power density of 1–5mW / cm², a sample distance of 5–15cm from the lamp, and an irradiation time of 120–600s.

[0122] Furthermore, the activation treatment method can also be as follows: place the transparent hardened wear-resistant layer in a 3–10 wt% hydrogen peroxide aqueous solution, immerse it at a constant temperature of 50°C for 10–30 min, then rinse it with deionized water and dry it with nitrogen.

[0123] This application achieves a controllable introduction of an areal density ≥1×10¹ onto the surface of the transparent hardened wear-resistant layer through any of the aforementioned activation treatments. 4 The presence of hydroxyl groups per cm² provides ample anchoring points for the anti-fingerprint material, ensuring a stable chemical bond between the top and bottom layers and preventing localized delamination, whitening, or wiping failure due to insufficient interfacial bonding.

[0124] Step 2: In S5, the anti-fingerprint treatment uses vapor deposition or wet coating to form an anti-fingerprint top layer with a thickness of 1–30 nm;

[0125] Among them, "vapor deposition" refers to the chemical adsorption and condensation reaction of fluorinated silane precursors (such as heptadecyltrimethoxysilane and perfluorooctyltriethoxysilane) on the surface of an activated transparent hardened wear-resistant layer after pyrolysis or plasma excitation in a vacuum or low-pressure environment, forming a dense, uniform, molecular-level hydrophobic and oleophobic film. This method can achieve conformal deposition on three-dimensional microstructure surfaces, avoiding insufficient valley coverage or peak accumulation caused by leveling effect.

[0126] "Wet coating" refers to applying a diluted fluoropolymer solution (such as fluoroacrylate copolymers or fluorosilicone modified polyurethane) to an activated surface via spin coating, dip coating, or spray coating. After the solvent evaporates and a preliminary film is formed, the coating enters the subsequent baking process. This method has low equipment cost and strong adaptability, but it requires strict control of the solution solid content (0.1–0.5 wt%) and viscosity (1–5 cP) to prevent overfilling of microstructure valleys or optical interference fringes caused by capillary action.

[0127] In one alternative implementation, the anti-fingerprint processing method may be: performing vapor deposition at a deposition rate of 0.1–0.5 nm / s in a chamber with a vacuum level better than 5 × 10⁻³ Pa, with a total deposition time corresponding to a film thickness of 1–30 nm, and maintaining the substrate temperature at 25–60 °C during the deposition process.

[0128] In another alternative implementation, the anti-fingerprint treatment method may include: uniformly spraying a 0.2 wt% heptadecafluorodecyltriethoxysilane isopropanol solution onto the activated surface at a spraying rate of 0.3 mL / cm², allowing it to stand and level for 30–60 seconds, and then proceeding to the baking process.

[0129] Furthermore, the anti-fingerprint treatment method can also be carried out by: spin-coating the above solution onto a glass substrate at a speed of 2000 rpm for 30 seconds, obtaining an initial wet film after spin coating, and then removing the residual solvent by purging with nitrogen.

[0130] The anti-fingerprint top layer formed by vapor deposition or wet coating in this application has its thickness precisely controlled within the range of 1–30 nm. This satisfies the minimum monolayer coverage threshold (≥3 nm) required for hydrophobic and oleophobic functions, while avoiding problems such as increased optical path difference, interference color, or haze caused by excessive thickness (>20 nm). Thus, while retaining the optical modulation capability of the dual-scale microstructure, it endows the surface with stable low surface energy characteristics.

[0131] Step 3: In S5, the formed anti-fingerprint top layer is subjected to low-temperature post-baking treatment. The conditions for low-temperature post-baking treatment include: baking temperature of 80–120℃, baking time of 10–30 min, baking heating rate of 2–3℃ / min, and dry nitrogen atmosphere with dew point ≤−20℃.

[0132] Among them, "low-temperature post-baking treatment" refers to applying controlled heat energy after the anti-fingerprint material has completed its initial film formation to promote the complete escape of residual solvent, the full progress of the precursor hydrolysis and condensation reaction, and the release of interfacial stress, ultimately forming a stable coating with moderate crosslinking density, strong adhesion, and excellent abrasion resistance.

[0133] The baking temperature of 80–120℃ ensures that the silanol groups (Si-OH) and the hydroxyl groups on the surface of the transparent hardened wear-resistant layer are fully dehydrated and condensed to form Si-O-Si covalent bonds, while avoiding excessively high temperatures (>120℃) that could lead to fluorocarbon chain breakage, decreased contact angle, or thermal deformation of the microstructure.

[0134] "Baking time of 10–30 min" provides sufficient reaction time to complete interfacial bonding and bulk crosslinking. If the time is too short, the bonding will be insufficient, and if it is too long, there will be no significant gain and the production line cycle time will be reduced.

[0135] "Baking heating rate of 2–3℃ / min" is used to suppress solvent boiling, film blistering or sudden change in interfacial stress caused by rapid heating;

[0136] The "atmosphere of dry nitrogen with a dew point ≤−20℃" aims to eliminate interference from water vapor and oxygen: water vapor will compete to consume surface hydroxyl groups, reducing bonding efficiency; oxygen may trigger oxidative degradation of fluorocarbon chains, weakening oleophobic properties.

[0137] In one alternative implementation, the low-temperature post-baking process can be: placing the coated glass substrate into a clean oven, raising it from room temperature to 100°C at a rate of 2.5°C / min, maintaining the temperature for 20 minutes, and introducing high-purity nitrogen gas with a dew point of −25°C at a flow rate of 1–3 L / min throughout the process.

[0138] In another alternative implementation, the low-temperature post-baking process may include: using an infrared radiation heating module to perform zoned temperature control on the glass surface, so that the actual film temperature gradient is controlled within ±2℃, and the temperature is increased to 90℃ at a slope of 2℃ / min during the heating stage, and then held for 25min.

[0139] Furthermore, this low-temperature post-baking treatment can also be carried out in a continuous tunnel furnace, with three temperature control sections (preheating section → constant temperature section → cooling section). The constant temperature section is set at 110°C, the glass belt speed is 0.3 m / min, the corresponding residence time is 18 min, and the nitrogen dew point in the furnace is monitored in real time and maintained at −22°C.

[0140] This application constructs a high-density Si-O-Si interfacial bonding network between the anti-fingerprint top layer and the transparent hardened wear-resistant layer by synergistically controlling the baking temperature, time, heating rate, and atmosphere dryness. This ensures that the static water contact angle is not less than 105° and the static oil contact angle is not less than 70°. Furthermore, after 1000 standard eraser tests, the contact angle attenuation rate is less than 15%, significantly improving the long-term service stability of the AF layer in high-frequency touch and wiping scenarios on electronic blackboards.

Claims

1. An anti-glare glass for electronic blackboards, characterized in that, Includes a base glass and a functional layer assembly disposed on at least one surface of the base glass; The functional layer group includes, from the side closest to the substrate glass to the side furthest from the substrate glass, the following: A dual-scale microstructure anti-glare layer comprising a micron-scale scattering structure (microstructure A) formed on the surface of the substrate glass and a nano-scale anti-reflection structure (microstructure B) stacked on the microstructure A. A transparent, hardened, wear-resistant layer is applied over the dual-scale microstructure anti-glare layer to provide wear-resistant protection while maintaining effective surface roughness. An anti-fingerprint top layer is formed on the surface of the transparent, hardened, and abrasion-resistant layer to provide hydrophobic and oleophobic anti-fingerprint properties.

2. The anti-glare glass according to claim 1, characterized in that, The microstructure A has an equivalent feature size of 1-15 μm, a peak-valley height of 0.3-3.0 μm, and an areal density of 10³-10. 6 pcs / cm² 3. The anti-glare glass according to claim 1, characterized in that, The equivalent feature size of the microstructure B is 20-200 nm, the equivalent thickness is 30-200 nm, and the coverage of the microstructure A is not less than 80%.

4. The anti-glare glass according to claim 1, characterized in that, The thickness of the transparent hardened wear-resistant layer is 0.2-5μm, and the pencil hardness is not less than 3H; The refractive index of the transparent hardened wear-resistant layer is 1.40-1.55; The valley filling depth of the transparent hardened wear-resistant layer for the microstructure A does not exceed 70% of the peak-valley height of the microstructure A.

5. The anti-glare glass according to claim 1, characterized in that, The anti-fingerprint top layer is formed by reacting and bonding with the hydroxyl groups on the surface of the transparent hardened wear-resistant layer, and has a thickness of 1-30 nm. The anti-fingerprint top layer ensures that the static water contact angle of the anti-glare glass is not less than 105° and the static oil contact angle is not less than 70°.

6. A method for preparing anti-glare glass for electronic blackboards, characterized in that, For preparing the anti-glare glass as described in any one of claims 1-5, comprising: S1. Substrate pretreatment: The substrate glass is cleaned and dried to obtain a clean substrate glass; S2. Constructing microstructure A: Forming a micron-scale scattering structure (microstructure A) on the target surface of the clean substrate glass. S3. Constructing microstructure B: A nanoscale anti-reflection structure (microstructure B) is formed on the microstructure A to obtain a dual-scale microstructure anti-glare layer; S4. Forming a hardened wear-resistant layer: A transparent hardening material is coated and cured on the surface of the dual-scale microstructure anti-glare layer to form a transparent hardened wear-resistant layer covering the dual-scale microstructure anti-glare layer, and the degree of valley filling of the transparent hardened wear-resistant layer is controlled to retain effective surface roughness. S5. Forming an anti-fingerprint top layer: After activating the surface of the transparent hardened wear-resistant layer, an anti-fingerprint treatment is applied to form an anti-fingerprint top layer.

7. The preparation method according to claim 6, characterized in that, The microstructure A is formed in S2 by any one of chemical etching, sandblasting, laser micro-engraving, or molding / imprinting transfer. In S2, the equivalent feature size of the microstructure A is controlled to be 1-15 μm, and the peak-valley height is 0.3-3.0 μm.

8. The preparation method according to claim 6, characterized in that, In step S3, the microstructure B is formed by any one of the following methods: sol-gel film formation, plasma etching, or wet secondary micro-etching. In step S3, the equivalent feature size of the microstructure B is controlled to be 20-200 nm, and the equivalent thickness is 30-200 nm, so that its coverage of the microstructure A is not less than 80%.

9. The preparation method according to claim 6, characterized in that, The transparent hardening material in S4 is an inorganic-organic hybrid sol-gel coating or a transparent inorganic thin film material; The curing method of the transparent hardened wear-resistant layer in S4 is a combination of UV curing and thermal post-curing. In step S4, the thickness of the transparent hardened wear-resistant layer is controlled to be 0.2-5 μm; In step S4, by adjusting the viscosity, surface tension, or coating amount of the transparent hardening material, the valley filling depth of the transparent hardening wear-resistant layer on the microstructure A does not exceed 70% of the peak-valley height of the microstructure A; The S4 method involves coating the transparent hardening material using either a spray coating or a roller coating method, and the linear speed and coating amount are controlled in conjunction during the coating process. The linear speed of the spray coating or roller coating is 0.2-5 m / min, and the coating amount is adjusted based on the online film thickness detection results.

10. The preparation method according to claim 6, characterized in that, The activation treatment in S5 is any one of plasma treatment, ultraviolet ozone treatment or chemical activation treatment, in order to introduce hydroxyl groups on the surface of the transparent hardened wear-resistant layer. The anti-fingerprint treatment in S5 uses vapor deposition or wet coating to form an anti-fingerprint top layer with a thickness of 1-30 nm. In step S5, the formed anti-fingerprint top layer is subjected to low-temperature baking treatment. The conditions for the low-temperature baking treatment include: baking temperature of 80-120℃, baking time of 10-30min, baking heating rate of 2-3℃ / min, and dry nitrogen atmosphere with dew point ≤−20℃.

Images