Display driving circuit and its temperature control method, display panel and display device

Abstract

This application discloses a display driving circuit and its temperature control method, a display panel, and a display device, relating to the field of display technology. The circuit includes a display driving chip, a temperature sensing module, and a pixel array integrating pixel units distributed in an array. Each thermoelectric sensing unit in the temperature sensing module is disposed on the temperature sensing layer of the corresponding pixel unit. After the temperature sensing module obtains the real-time pixel temperature of the corresponding pixel unit through each thermoelectric sensing unit, the display driving chip obtains multiple initial partitions of the pixel array, determines the partition temperature threshold of each initial partition based on each real-time pixel temperature, determines the high-temperature partition based on the partition temperature threshold and a preset high-temperature limit threshold, divides the high-temperature partition into multiple high-temperature sub-partitions, and performs pixel charging on each high-temperature sub-partition according to a preset interleaved scanning sequence, so as to achieve automatic control of the temperature balance of the display driving chip while ensuring display quality.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display driving circuit and its temperature control method, a display panel, and a display device. Background Technology

[0002] With the rapid development of display technology, users are increasingly demanding higher temperature uniformity from display devices.

[0003] In current COF (Chip on Film) driver circuit designs, when displaying heavy-load H1line (one row bright, one row dark) images, the source output channel of the driver IC (Integrated Circuit, also known as the display driver chip) needs to perform significant voltage flipping for each row of pixels. This leads to a sharp increase in the power consumption of the display driver chip, causing the junction temperature of the display driver chip to rise to over 150°C. When the junction temperature exceeds the operating temperature threshold that the driver IC can withstand, it will cause malfunction of the display driver chip, seriously affecting display stability. To address this temperature rise issue, the industry typically uses traditional heat dissipation methods such as adding heat sinks or reducing the driving voltage. However, this technique, which relies on external heat dissipation structures or sacrifices display brightness, not only increases overall costs and reduces display performance, but also fails to achieve real-time monitoring and active equalization control of the display driver chip temperature from the driving mechanism perspective.

[0004] Therefore, while ensuring display quality, how to achieve automated control of the temperature balance of the display driver chip is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] The main objective of this application is to provide a display driver circuit and its temperature control method, a display panel, and a display device, which aims to achieve automated regulation of the temperature balance of the display driver chip while ensuring display quality.

[0006] To achieve the above objectives, this application provides a display driving circuit, the display driving circuit comprising: Display driver chip; A pixel array, the pixel array comprising pixel units distributed in an array; The temperature sensing module includes a thermoelectric sensing unit corresponding to each pixel unit. Each thermoelectric sensing unit is disposed on the temperature sensing layer of the corresponding pixel unit. Each thermoelectric sensing unit in the same column is electrically connected to the display driver chip through the same data line. The temperature sensing module is configured to obtain the real-time pixel temperature of the corresponding pixel unit through each thermoelectric sensing unit. The display driver chip is configured to acquire multiple initial partitions of the pixel array, determine the partition temperature threshold of each initial partition based on the real-time pixel temperature, determine a high-temperature partition based on the partition temperature threshold and a preset high-temperature limit threshold, divide the high-temperature partition into multiple high-temperature sub-partitions, and perform pixel charging on each high-temperature sub-partition according to a preset interleaved scanning sequence. The high-temperature partition is the initial partition whose partition temperature threshold exceeds the high-temperature limit threshold.

[0007] In one embodiment, the temperature sensing module further includes a temperature acquisition unit corresponding to each of the data lines, and each of the temperature acquisition units is disposed between the corresponding data line and the display driver chip. The display driver chip includes a plurality of source output channels arranged with gold finger spacing. The temperature acquisition unit's acquisition input terminal is electrically connected to the corresponding data line of each thermoelectric sensing unit, and the temperature acquisition unit's acquisition output terminal is electrically connected to the corresponding source output channel. The temperature acquisition unit is configured to acquire the thermoelectric signals output by each thermoelectric sensing unit on the corresponding data line in a row-by-row scanning order to obtain the real-time pixel temperature of the corresponding pixel unit.

[0008] In one embodiment, the pixel unit includes: An enable control layer is provided, wherein a scan switch transistor is provided, the gate of the scan switch transistor is electrically connected to the scan line of the corresponding row, and the first path terminal of the scan switch transistor is electrically connected to the data line of the corresponding column. A thermistor layer is disposed close to the enable control layer, and the thermoelectric sensing unit is disposed on the thermistor layer. The thermal junction of the thermoelectric sensing unit is connected to the second path terminal of the scanning switch tube. A pixel layer is disposed on the side of the thermosensitive layer away from the enable control layer. The pixel layer includes a pixel electrode, which is electrically connected to the cold junction of the thermoelectric sensing unit.

[0009] In one embodiment, the thermoelectric sensing unit includes a P-type semiconductor and an N-type semiconductor, wherein the P-type semiconductor and the N-type semiconductor are connected in series; The junction where the P-type semiconductor and the N-type semiconductor are interconnected forms the thermal junction of the thermoelectric sensing unit, and is electrically connected to the second path terminal of the scanning switch tube. The end of the N-type semiconductor furthest from the hot junction forms the cold junction of the thermoelectric sensing unit and is electrically connected to the pixel electrode.

[0010] Furthermore, to achieve the above objectives, this application also provides a temperature control method, which is applied to the display driving circuit described in any of the above claims, the temperature control method comprising: After the temperature sensing module obtains the real-time pixel temperature of the corresponding pixel unit through each thermoelectric sensing unit, it obtains multiple initial partitions of the pixel array through the display driver chip, and determines the partition temperature threshold of each initial partition based on the real-time pixel temperature. A high-temperature zone is determined based on the partition temperature threshold and a preset high-temperature limit threshold, and the high-temperature zone is divided into multiple high-temperature sub-zones. The high-temperature zone is the initial zone where the partition temperature threshold exceeds the high-temperature limit threshold. Each high-temperature sub-region is charged pixel by pixel according to a preset interleaved scanning sequence.

[0011] In one embodiment, the step of charging pixels in each of the high-temperature sub-regions according to a preset interleaved scanning sequence includes: Construct a sub-partition array with i rows and j columns based on all the high-temperature sub-partitions, where i is a positive even number and j is a positive integer; The current odd row and the current even row adjacent to the current odd row are driven to charge pixels according to the preset interleaved scanning timing. The next odd-numbered partition row of the current odd-numbered row is taken as the next current odd-numbered row, and the process of driving the current odd-numbered row and the current even-numbered row adjacent to the current odd-numbered row to perform pixel charging according to the preset interleaved scanning timing is repeated until all partition rows in the sub-partition array have completed pixel charging.

[0012] In one embodiment, the step of driving the current odd-numbered row and the current even-numbered row adjacent to the current odd-numbered row to perform pixel charging according to a preset interlaced scanning timing includes: In response to a preset interleaved scanning timing, a first scan signal driving the current odd-numbered row and a second scan signal driving the current even-numbered row are determined; The target sub-partition of the current odd-numbered row is activated to access the pixel data voltage for pixel charging according to the first scanning signal. The target sub-partition is the high-temperature sub-partition that is scanned first among all the high-temperature sub-partitions in the current odd-numbered row. After enabling the second scan signal to delay the preset reference time delay, the high-temperature sub-partition in the current even row that is in the same column as the target sub-partition is activated to charge the pixel by electrically connecting the single-column output channel group that outputs the pixel data voltage. Take the next high-temperature sub-partition of the target sub-partition as the next target sub-partition, and return to execute the step of activating the target sub-partition of the current odd row to access the pixel data voltage for pixel charging according to the first scan signal, and the subsequent steps, until all the high-temperature sub-partitions in the current odd row and the current even row have completed pixel charging.

[0013] In one embodiment, before the step of determining the high-temperature zone based on the zone temperature threshold and a preset high-temperature limit threshold, the temperature control method includes: Check each initial partition's partition temperature threshold to see if it exceeds a preset high-temperature limit threshold; If there is an initial partition whose partition temperature threshold does not exceed the high temperature limit threshold, the initial partition whose partition temperature threshold does not exceed the high temperature limit threshold is determined as a low temperature partition, and the low temperature partition is charged with pixels according to the preset line-by-line scanning timing.

[0014] In addition, to achieve the above objectives, this application also provides a display panel, the display panel including a timing control module and a display driving circuit as described in any of the above claims; The pixel array in the display driving circuit is disposed in the display area of ​​the display panel; The timing control module and the display driver chip in the display driver circuit are respectively disposed on a circuit board electrically connected to the display panel, and the timing control module is electrically connected to the display driver chip; The timing control module is configured to provide the display driver chip with a preset interlaced scanning timing sequence and / or a preset progressive scanning timing sequence, control the display driver chip to charge pixels in each high-temperature sub-zone according to the interlaced scanning timing sequence, and / or control the display driver chip to charge pixels in the low-temperature sub-zone according to the progressive scanning timing sequence.

[0015] In addition, to achieve the above objectives, this application also provides a display device, which includes the above-described display panel, memory, processor, and temperature control program stored in the memory and executable on the processor. When the processor executes the temperature control program, it implements the steps of the temperature control method described in any of the above claims.

[0016] The display driver circuit described in this application integrates a temperature sensing module, a display driver chip, and a pixel array. This allows for automated temperature equalization control of the display driver chip while ensuring display quality. Specifically, the pixel array comprises pixel units distributed across the array, and the temperature sensing module includes thermoelectric sensing units corresponding to each pixel unit. Since each thermoelectric sensing unit is located on the temperature sensing layer of its corresponding pixel unit, the temperature sensing module can collect the real-time pixel temperature of the corresponding pixel unit in real time. Furthermore, because thermoelectric sensing units in the same column are electrically connected to the display driver chip via the same data line, the real-time pixel temperature collected by each thermoelectric sensing unit can be transmitted to the display driver chip, providing accurate and reliable temperature sampling data for the display driver chip's dynamic zoning control of high-temperature areas. Next, the display driver chip obtains multiple initial zones of the pixel array, and based on the real-time pixel temperatures transmitted by all thermoelectric sensing units, the zone temperature threshold of each initial zone can be accurately obtained, providing a basis for subsequent high-temperature zone identification. Subsequently, the display driver chip processes each initial zone... The system compares the partition temperature threshold with a preset high-temperature limit threshold, thereby automatically and quickly identifying initial partitions whose partition temperature threshold exceeds the high-temperature limit threshold as high-temperature partitions. Next, the high-temperature partitions are automatically split into smaller high-temperature sub-partitions to achieve precise partitioning of the high-temperature partitions, providing an accurate and reliable control basis for subsequent timing optimization of the high-temperature partitions. Subsequently, the display driver chip charges the pixels of each high-temperature sub-partition according to a preset interleaved scanning sequence, which can automatically and quickly stagger the scanning start time of adjacent high-temperature sub-partitions, so that the peak power consumption time of the display driver chip is evenly distributed. This achieves real-time suppression and active balancing of peak power consumption in high-temperature partitions, effectively avoiding the cost increase and display performance loss caused by traditional solutions that rely on adding heat sinks or reducing driving voltage. Thus, while ensuring display quality, it achieves automated control of the display driver chip temperature balance. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the display driving circuit structure involved in the embodiments of this application; Figure 2This is a schematic diagram of the specific structure of the display driving circuit involved in the embodiments of this application; Figure 3 This is a schematic diagram of the pixel unit hierarchy structure involved in the embodiments of this application; Figure 4 This is a schematic diagram of the initial partitioning scheme involved in the embodiments of this application; Figure 5 This is a schematic diagram of the interleaved scanning timing waveform involved in the embodiments of this application; Figure 6 This is a schematic diagram of the current peak value comparison involved in the embodiments of this application; Figure 7 This is a schematic diagram of the interleaved timing scan involved in the embodiments of this application; Figure 8 This is a schematic diagram of the high and low temperature zone determination process involved in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of the display device involved in the embodiments of this application.

[0020] Explanation of icon numbers: 10. Display driver chip; 11. Source output channel; 20. Pixel unit; 30. Temperature sensing module; 31. Thermoelectric sensing unit; 32. Temperature acquisition unit; Si, Data line; Gi, Gate line; Ti, Scan switch transistor; Di, Pixel electrode; P1, P-type semiconductor; N1, N-type semiconductor; STV1, First scan signal; STV2, Second scan signal; 1001. Processor; 1002. Communication bus; 1003. User interface; 1004. Network interface; 1005. Memory.

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0026] COF (Chip on Film), an advanced packaging technology, directly integrates driver ICs (Integrated Circuits, also known as display driver chips) onto a flexible circuit substrate through a thermo-pressing process, enabling precise bonding between the chip bumps and the pins within the substrate. Compared to traditional COG (Chip on Glass) and TAB (Tape Automated Bonding) technologies, COF has significant structural advantages. Since the polyimide substrate of COF is typically only 35μm thick, it possesses superior thinness, stronger flexibility, and higher pin density, making it particularly suitable for the compact design of high-resolution display modules.

[0027] However, as display technology continues to advance towards higher resolutions and higher refresh rates, COF driver circuits exhibit significant temperature rise issues when handling complex scene scenarios. Especially when displaying heavy-load scenes such as H1line (one line bright, one line dark), the source output channel of the driver IC needs to perform large voltage flips for each row of pixels, leading to a sharp increase in dynamic power consumption. Actual measurement data shows that under such conditions, the junction temperature of the driver IC can rapidly rise to over 150°C. When the chip temperature consistently exceeds its normal operating threshold, it will trigger abnormal display driving functions, severely affecting image stability and display quality.

[0028] To address the challenge of rising temperatures, the industry has traditionally relied on solutions such as adding external heatsinks or reducing the source drive voltage. However, these methods have significant limitations. Adding heatsinks increases the overall module thickness and material costs, while reducing the drive voltage leads to a loss of display brightness, affecting the visual experience. More importantly, these passive cooling methods cannot achieve real-time monitoring and active balancing control of chip temperature at the drive mechanism level, making it difficult to fundamentally solve the problem of localized overheating under high loads.

[0029] To address the aforementioned technical deficiencies, this application provides a display driving circuit and its temperature control method, a display panel, and a display device.

[0030] This application provides a display driving circuit, referring to... Figure 1 As shown, Figure 1 This is a structural block diagram of a first embodiment of the display driving circuit of this application. The display driving circuit includes: Display driver chip 10.

[0031] In this embodiment, the display driver chip 10 includes at least a source driver. The source driver is electrically connected to the pixel unit 20 of the corresponding column through each data line Si, and is used to provide pixel data voltage to the pixel unit 20 to realize image display.

[0032] A pixel array, the pixel array comprising pixel units 20 arranged in an array.

[0033] In this embodiment, a pixel array is disposed in the display area of ​​the display panel, and the pixel array includes... Figure 1 The array shown comprises multiple pixel units 20, each with a temperature sensing layer equipped with a thermoelectric sensing unit 31, thereby constituting... Figure 1 The array of thermoelectric sensing units 31 arranged in a matrix form, such that one thermoelectric sensing unit 31 corresponds to one pixel unit 20, forms a temperature monitoring network covering the entire display area.

[0034] The temperature sensing module 30 includes a thermoelectric sensing unit 31 corresponding to each pixel unit 20. Each thermoelectric sensing unit 31 is disposed on the temperature sensing layer of the corresponding pixel unit 20. Each thermoelectric sensing unit 31 in the same column is electrically connected to the display driver chip 10 through the same data line Si. The temperature sensing module 30 is configured to obtain the real-time pixel temperature of the corresponding pixel unit 20 through each thermoelectric sensing unit 31.

[0035] In this embodiment, refer to Figure 1The temperature sensing module 30 establishes a point-to-point temperature monitoring network with corresponding pixel units 20 through a matrix arrangement of thermoelectric sensing units 31, thereby improving the spatial resolution of temperature monitoring to the pixel level and achieving full-coverage temperature monitoring of all pixel units 20 in the pixel array. Specifically, each thermoelectric sensing unit 31 uses a miniature thermopile sensor structure to convert the pixel temperature change of the corresponding pixel unit 20 during operation into a thermoelectric signal, and the temperature sensing module 30 converts each thermoelectric signal into a measurable real-time pixel temperature, providing accurate and reliable temperature sampling basis for the display driver chip 10 to dynamically control the high-temperature area.

[0036] The display driver chip 10 is configured to acquire multiple initial partitions of the pixel array, determine the partition temperature threshold of each initial partition based on the real-time pixel temperature, determine a high-temperature partition based on the partition temperature threshold and a preset high-temperature limit threshold, divide the high-temperature partition into multiple high-temperature sub-partitions, and perform pixel charging on each high-temperature sub-partition according to a preset interleaved scanning sequence. The high-temperature partition is the initial partition whose partition temperature threshold exceeds the high-temperature limit threshold.

[0037] In this embodiment, the display driver chip 10 acquires multiple initial partitions of the pixel array; next, it searches for the addresses of all pixel units 20 contained in each initial partition from a preset partition-pixel address mapping table to obtain all pixel units 20 contained in each initial partition; furthermore, since the temperature sensing module 30 is also provided with multiple temperature acquisition units 32 that are only activated during the horizontal blanking period of the pixel unit 20 display process, the temperature acquisition process of the temperature acquisition unit 32 will not cause any interference to the normal display of all pixel units 20 in each initial partition, ensuring complete isolation between the temperature acquisition process and normal display operation; next, after acquiring the real-time pixel temperature of all pixel units 20 in the initial partition through the temperature acquisition unit 32 set on the corresponding column data line Si in each initial partition, based on all pixel units in this initial partition... The real-time pixel temperature of the display driver chip 10 can accurately determine the temperature threshold of the initial partition, providing an accurate and reliable basis for the subsequent determination of high-temperature partitions. Subsequently, the initial partition whose partition temperature threshold exceeds the preset high-temperature limit threshold is designated as a high-temperature partition, and this high-temperature partition is further divided into smaller high-temperature sub-partitions. Then, an independent scanning timing channel is configured for each high-temperature sub-partition according to the preset interleaved scanning timing, so as to charge the pixels of each high-temperature sub-partition. This allows the activation time of adjacent high-temperature sub-partitions to be staggered by the preset interleaved scanning timing, so that the current load of the display driver chip 10 is evenly distributed throughout the entire scanning cycle. This, in turn, allows the peak power consumption time of the display driver chip 10 in the high-temperature partition to be evenly distributed, achieving real-time suppression and active balancing of the peak power consumption of the high-temperature partition, and achieving efficient temperature balance control while maintaining display quality.

[0038] It should be noted that the horizontal blanking period refers to the blanking period of each current pixel row, that is, the time interval between the completion of charging of all pixel units 20 in the current pixel row and the start of scanning the next pixel row.

[0039] The preset high temperature limit threshold can be 45℃, or it can be customized according to application requirements. This application does not impose any restrictions here.

[0040] In a specific embodiment, for each initial partition, the data line Si corresponding to each column of pixel units 20 in the initial partition is determined. During the horizontal blanking period of each column of pixel units 20 in the current pixel row, the thermoelectric signals output by the thermal sensing units corresponding to each column of pixel units 20 in the current pixel row are read in parallel by the temperature acquisition unit 32 set on the data line Si of the corresponding column. This allows for the real-time pixel temperature of all columns of pixel units 20 in the current pixel row to be obtained, thus enabling efficient acquisition of the real-time pixel temperature of the entire row of pixel units 20 within a single horizontal blanking period. Subsequently, the next pixel row of the current pixel row is taken as the next current pixel row. The process of collecting the real-time pixel temperature of all column pixel units 20 in the current pixel row is repeated until the temperature of all scan row pixel units 20 in the initial partition is collected, thus constructing a temperature distribution data map of the initial partition. The spatial structure of the temperature distribution of the initial partition can be displayed intuitively through the temperature distribution data map. Next, since the temperature distribution data map is constructed from the real-time pixel temperature of each pixel unit 20 in the array, extreme value processing is performed on the temperature distribution data map of the initial partition to accurately obtain the partition temperature threshold of the initial partition, so as to provide an accurate and reliable basis for the subsequent determination of high temperature partitions.

[0041] In addition, it should be noted that extreme value processing refers to the calculation process of extracting a representative value from the temperature distribution data map. Extreme value processing can be any one of maximum value processing, mean value processing, median value processing, and mode value processing. This application does not impose any restrictions here, and it can be customized according to application requirements.

[0042] For example, when using maximum value processing, the display driver chip 10 uses the real-time pixel temperature with the highest number of temperatures exceeding a preset invalid threshold in the temperature distribution data map of each initial partition as the partition temperature threshold for that initial partition. Specifically, all real-time pixel temperatures in the temperature distribution data map are sorted in descending order of value, and the frequency of occurrence of each real-time pixel temperature is compared with the preset invalid threshold in sequence until the first real-time pixel temperature with a frequency exceeding the invalid threshold is found. This real-time pixel temperature with a frequency exceeding the invalid threshold is then used as the partition temperature threshold for that initial partition. This avoids interference from isolated noise points caused by circuit interference on the partition temperature threshold judgment and ensures that the partition temperature threshold has effective high-temperature characteristics in a specific region.

[0043] When averaging is used, the display driver chip 10 accumulates the temperature of all real-time pixels in the temperature distribution data map of each initial partition, obtains the cumulative sum of temperature thresholds for each initial partition, and counts the total number of real-time pixel temperatures in each initial partition. Then, the average temperature obtained by dividing the cumulative sum of temperature thresholds in each initial partition by the total number is used as the partition temperature threshold of each initial partition, so as to reflect the overall heat load of the initial partition.

[0044] When median value processing is used, the display driver chip 10 sorts all real-time pixel temperatures in the temperature distribution data map of each initial partition in descending order of value. If the total number of all real-time pixel temperatures is odd, the real-time pixel temperature in the middle after sorting is used as the partition temperature threshold of the initial partition. If the total number of all real-time pixel temperatures is even, the average of the two real-time pixel temperatures in the middle after sorting is processed, and the arithmetic mean of the two real-time pixel temperatures is used as the partition temperature threshold of the initial partition, thereby providing a stable temperature center trend estimate for the initial partition.

[0045] When using mode processing, the display driver chip 10 counts the frequency of occurrence of each real-time pixel temperature in each initial partition, and uses the real-time pixel temperature with the highest frequency as the partition temperature threshold of the initial partition, thereby accurately identifying the most common temperature state in the initial partition.

[0046] Furthermore, in some other feasible embodiments, reference is made to... Figure 2 The temperature sensing module 30 further includes a temperature acquisition unit 32 corresponding to each of the data lines Si. Each temperature acquisition unit 32 is disposed between the corresponding data line Si and the display driver chip 10. The display driver chip 10 includes a plurality of source output channels 11 arranged with gold finger spacing. The acquisition input terminal of each temperature acquisition unit 32 is electrically connected to each of the thermoelectric sensing units 31 electrically connected to the corresponding data line Si, and the acquisition output terminal of each temperature acquisition unit 32 is electrically connected to the corresponding source output channel 11.

[0047] In this embodiment, refer to Figure 2Since the display driver chip 10 includes multiple source output channels 11 arranged with gold finger spacing, each temperature acquisition unit 32 set in the temperature sensing module 30 is integrated into the interface position of the corresponding data line Si electrically connected to the source output channel 11. This allows full use of the original package pin resources of the display driver chip 10, so that the acquisition output terminal of each temperature acquisition unit 32 can directly reuse the corresponding source output channel 11 during the horizontal blanking period. The digitized real-time pixel temperature is transmitted to the display driver chip 10 through the existing source output channel 11, thereby achieving efficient transmission of real-time pixel temperature without increasing the chip package size of the display driver chip 10.

[0048] It should be noted that the source output channel 11 is in display driving mode during the display scanning period, and is used to provide pixel data voltage to the pixel unit 20 in the corresponding column when it is in display scanning state; while during the horizontal blanking period, the source output channel 11 switches from data voltage output mode to temperature data receiving mode, and is used to receive the digitized real-time pixel temperature provided by the temperature acquisition unit 32 electrically connected to the source output channel 11.

[0049] The temperature acquisition unit 32 is configured to acquire the thermoelectric signals output by each thermoelectric sensing unit 31 on the corresponding data line Si in a preset row scanning order to obtain the real-time pixel temperature of the corresponding pixel unit 20.

[0050] In this embodiment, when the display driver chip 10 needs to collect temperature data, during the horizontal blanking period, the display driver chip 10 switches the shared source output channel 11 from the display driving mode to the temperature data receiving mode, and simultaneously activates the temperature acquisition unit 32 electrically connected to the source output channel 11. The design of reusing the source output channel 11 effectively improves the utilization of hardware resources and avoids additional pin overhead. At this time, the activated temperature acquisition unit 32 collects the thermoelectric signals output by the thermoelectric sensing units 31 electrically connected to all pixel units 20 in different rows of the same column in a preset row scanning order. Next, the temperature acquisition unit 32 converts each thermoelectric signal analog-to-digital into the corresponding digitized temperature digital signal, and then packages each temperature digital signal with the corresponding pixel unit 20 address in a standard digital format to obtain the real-time pixel temperature of each pixel unit 20. Thus, without affecting the normal display of the pixel unit 20, efficient acquisition of real-time pixel temperature is achieved, and the accuracy and real-time performance of the real-time pixel temperature are ensured.

[0051] It should be noted that, referring to Figure 2 Each temperature acquisition unit 32 is connected via I 2The C (Inter-Integrated Circuit) communication mode is electrically connected to the corresponding source output channel 11, providing an efficient, reliable, standardized and extremely cost-effective transmission method for digitized real-time pixel temperature, which significantly improves the stability and reliability of real-time pixel temperature transmission.

[0052] Furthermore, in some feasible embodiments, reference is made to Figure 2 The pixel unit 20 includes: An enable control layer is provided, which is equipped with a scan switch transistor Ti. The gate of the scan switch transistor Ti is electrically connected to the scan line of the corresponding row, and the first path terminal of the scan switch transistor Ti is electrically connected to the data line Si of the corresponding column. A thermistor layer is provided close to the enable control layer, and the thermoelectric sensing unit 31 is provided in the thermistor layer. The hot junction of the thermoelectric sensing unit 31 is connected to the second path terminal of the scan switch transistor Ti. A pixel layer is provided on the side of the thermistor layer away from the enable control layer. The pixel layer includes a pixel electrode Di, and the pixel electrode Di is electrically connected to the cold junction of the thermoelectric sensing unit 31.

[0053] In this embodiment, the pixel unit 20 adopts Figure 3The three-layer vertical stacked architecture consisting of the enable control layer, the thermal layer, and the pixel layer shown can realize the three-dimensional space utilization in the Z-axis direction through the three-layer vertical stacked architecture. The thermoelectric sensing unit 31 is fully integrated into the internal thermal layer of the pixel unit 20, realizing the physical separation of temperature sensing function and display function. Since the thermoelectric sensing unit 31 is set in the thermal layer in the vertical space of the pixel unit 20, it does not occupy the pixel aperture ratio in the planar direction at all, thus fully maintaining the original optical characteristics and light transmission efficiency of the display panel, ensuring that the display quality is not affected in any way. Next, since the scan switch Ti configured in the enable control layer is turned on when the scan signal provided by the gate line Gi of the corresponding row is high, the data voltage signal on the data line Si will charge and discharge the pixel electrode Di through the turned-on scan switch Ti, making the scan switch Ti the main heat source for heat generation inside the pixel unit 20. Establishing a direct electrical connection between the thermal junction of the thermoelectric sensing unit 31 and the second path terminal of the scan switch Ti through a metal interconnect structure (such as tungsten or copper-filled vias) allows the Joule heat generated by the scan switch Ti carrying the data signal current during display scanning to be directly and efficiently conducted to the thermal junction of the thermoelectric sensing unit 31 through this electrical connection path. Meanwhile, the cold junction of the thermoelectric sensing unit 31 is connected to the common electrode of the pixel unit 20 through the pixel electrode Di of the pixel layer. Since the common electrode has a large heat capacity, it provides a thermal reference reference close to the standard ambient temperature for the thermal sensing unit. This allows a temperature gradient reflecting the working state of the scanning switch tube Ti (i.e., the pixel temperature change of the pixel unit 20 during operation) to be formed at both ends of the cold and hot junction of the thermoelectric sensing unit 31. Subsequently, the thermoelectric sensing unit 31 generates a micro-voltage signal proportional to the temperature gradient based on the Seebeck effect as a thermoelectric signal. This accurately reflects the instantaneous temperature rise of the scanning switch tube Ti during operation, providing an accurate and real-time data source for pixel-level temperature monitoring.

[0054] It should be noted that since the thermoelectric sensing unit 31 is composed of P-type semiconductor P1 and N-type semiconductor N1, the Seebeck effect can be understood as a thermoelectric effect. This refers to the phenomenon where, in a circuit composed of two different materials (P-type semiconductor P1 and N-type semiconductor N1), an electromotive force (micro-voltage signal) is generated in the circuit when a temperature gradient exists between the hot junction and the cold junction. Here, the hot junction refers to... Figure 3 The junction shown is where P-type semiconductor P1 and N-type semiconductor N1 are interconnected; a cold junction refers to... Figure 3 The N-type semiconductor N1 shown is located at the end furthest from the hot junction; the temperature gradient refers to the temperature difference between the hot junction and the cold junction.

[0055] Furthermore, in some other feasible embodiments, reference is made to... Figures 2 to 3The thermoelectric sensing unit 31 includes a P-type semiconductor P1 and an N-type semiconductor N1, which are connected in series. The junction where the P-type semiconductor P1 and the N-type semiconductor N1 are connected to each other forms the hot junction of the thermoelectric sensing unit 31, which is electrically connected to the second path terminal of the scanning switch tube Ti. The end of the N-type semiconductor N1 away from the hot junction forms the cold junction of the thermoelectric sensing unit 31, which is electrically connected to the pixel electrode Di.

[0056] In this embodiment, the series-connected P-type semiconductor P1 and N-type semiconductor N1 constitute a basic thermocouple pair. To further improve the temperature detection sensitivity of the thermoelectric sensing unit 31, the thermoelectric sensing unit 31 can be provided with multiple thermocouple pairs, which are connected in series to form a miniature thermopile structure. At this time, when the scanning switch Ti is in the working state, each thermocouple pair will generate a micro voltage signal based on the temperature gradient between its own hot junction and cold junction. Since all the thermocouple pairs are connected in series, the micro voltage signals generated by each thermocouple pair will be superimposed to obtain a significantly enhanced thermoelectric signal, thereby enabling the thermoelectric sensing unit 31 to effectively detect smaller temperature changes and significantly improve the signal-to-noise ratio of the output thermoelectric signal to combat noise interference in the circuit.

[0057] In summary, the display driving circuit of this application integrates a temperature sensing module 30, a display driving chip 10, and a pixel array, enabling automated temperature equalization control of the display driving chip 10 while ensuring display quality. Specifically, the pixel array includes pixel units 20 distributed in an array, and the temperature sensing module 30 includes thermoelectric sensing units 31 corresponding to each pixel unit 20. Since each thermoelectric sensing unit 31 is located on the temperature sensing layer of the corresponding pixel unit 20, the temperature sensing module 30 can collect the real-time pixel temperature of the corresponding pixel unit 20 through each thermoelectric sensing unit 31. Furthermore, since the thermoelectric sensing units 31 in the same column are electrically connected to the display driving chip 10 through the same data line Si, the real-time pixel temperature collected by each thermoelectric sensing unit 31 can be transmitted to the display driving chip 10, providing accurate and reliable temperature sampling basis for the display driving chip 10 to dynamically partition and control high-temperature areas. Next, the display driving chip 10 obtains multiple initial partitions of the pixel array, and based on the real-time pixel temperatures sent by all thermoelectric sensing units 31, the partition temperature threshold of each initial partition can be accurately obtained, providing a judgment basis for subsequent high-temperature partition identification. Subsequently... The display driver chip 10 compares the partition temperature threshold of each initial partition with a preset high-temperature limit threshold, thereby automatically and quickly identifying the initial partitions whose partition temperature threshold exceeds the high-temperature limit threshold as high-temperature partitions. Next, the high-temperature partitions are automatically split into smaller high-temperature sub-partitions to achieve precise partitioning of the high-temperature partitions, providing an accurate and reliable control basis for subsequent timing optimization of the high-temperature partitions. Subsequently, the display driver chip 10 charges the pixels of each high-temperature sub-partition according to a preset interleaved scanning sequence, which can automatically and quickly stagger the scanning start time of adjacent high-temperature sub-partitions, so that the peak power consumption time of the display driver chip 10 is evenly distributed, realizing the instant suppression and active balancing of the peak power consumption of the high-temperature partitions. This effectively avoids the cost increase and display performance loss caused by traditional solutions that rely on adding heat sinks or reducing driving voltage. Thus, while ensuring display quality, the display driver chip 10 achieves automated control of temperature balance.

[0058] Furthermore, based on the first embodiment of the display driving circuit of this application, a second embodiment of the temperature control method of this application is proposed.

[0059] The temperature control method of this application is applied to the display driving circuit of any of the above claims. The temperature control method of this application is executed by the display device applied to the display driving circuit. The temperature control method of this application includes the following implementation steps S10 to S30.

[0060] Step S10: After the temperature sensing module 30 obtains the real-time pixel temperature of the corresponding pixel unit 20 through each thermoelectric sensing unit 31, it obtains multiple initial partitions of the pixel array through the display driver chip 10, and determines the partition temperature threshold of each initial partition based on the real-time pixel temperature.

[0061] In this embodiment, refer to Figure 1 The temperature sensing module 30 establishes a point-to-point temperature monitoring network with corresponding pixel units 20 through a matrix arrangement of thermoelectric sensing units 31, thereby improving the spatial resolution of temperature monitoring to the pixel level and achieving full-coverage temperature monitoring of all pixel units 20 in the pixel array. Specifically, each thermoelectric sensing unit 31 uses a miniature thermopile sensor structure to convert the pixel temperature change of the corresponding pixel unit 20 during operation into a thermoelectric signal, and the temperature sensing module 30 converts each thermoelectric signal into a measurable real-time pixel temperature, providing accurate and reliable temperature sampling basis for the display driver chip 10 to dynamically partition and control high-temperature areas. Next, after acquiring multiple initial partitions of the pixel array, the display driver chip 10 searches for the addresses of all pixel units 20 contained in each initial partition from a preset partition-pixel address mapping table to obtain all pixel units 20 contained in each initial partition. In addition, since the temperature sensing module 30 is also equipped with multiple A temperature acquisition unit 32 is activated only during the horizontal blanking period of the pixel unit 20 display process, so that the temperature acquisition process of the temperature acquisition unit 32 will not cause any interference to the normal display of all pixel units 20 in each initial partition, ensuring complete isolation between the temperature acquisition process and the normal display operation. Next, after the real-time pixel temperature of all pixel units 20 in the initial partition is acquired by the temperature acquisition unit 32 set on the corresponding column data line Si in each initial partition, the partition temperature threshold of the initial partition can be accurately obtained based on the real-time pixel temperature of all pixel units 20 in the initial partition, so as to provide an accurate and reliable judgment basis for the subsequent high temperature partition determination.

[0062] In a specific embodiment, with Figure 4 The pixel array shown has a resolution of 2160. Taking the 3840 display panel as an example, when the predefined standard partition size in the display driver chip 10 is Figure 4 1080 shown In 1920, since 2160 ÷ 1080 = 2 and 3840 ÷ 1920 = 2, according to this standard partition size, a resolution of 2160 can be achieved. The 3840 pixel array is divided into four initial partitions with the same pixel unit capacity of 20, which ensures the consistency of the partition temperature threshold calculation of each initial partition in the spatial dimension. It also enables pixel charging to be started only for the initial partition that is high temperature, effectively avoiding the problem of charging rate drop caused by full interlaced scanning of the entire pixel array. Thus, while achieving the best heat dissipation effect, the display performance of the entire pixel array is kept stable.

[0063] It should be noted that the partition size is only Figure 4 1080 shown 1920 is merely one feasible implementation of this application. The partition size can be customized according to application requirements, and this application does not impose any restrictions here.

[0064] Step S20: Determine a high-temperature zone based on the partition temperature threshold and the preset high-temperature limit threshold, and divide the high-temperature zone into multiple high-temperature sub-zones. The high-temperature zone is the initial zone where the partition temperature threshold exceeds the high-temperature limit threshold.

[0065] In this embodiment, the temperature threshold of each initial partition is compared with a preset high-temperature limit threshold to automatically identify... Figure 4 The partitions shown are initially designated as high-temperature partitions if their partition temperature threshold T_c exceeds the high-temperature limit threshold T_r. This allows for the scanning drive timing to be adjusted from the original line-by-line scanning timing only to the high-temperature partitions that require cooling. Figure 5 The interleaved scanning timing shown achieves optimal heat dissipation while maintaining stable display performance across the entire pixel array; next, due to Figure 5 The interleaved scanning timing shown is composed of alternately activated first scan signal STV1 and second scan signal STV2. Therefore, according to the even-row partitioning strategy, the high-temperature partition is divided into a sub-partition array containing i rows and j columns of high-temperature sub-partitions, where i is a positive even number. Figure 5 The execution of the two scan signals (i.e., the first scan signal STV1 and the second scan signal STV2) in an interleaved scan timing is provided with reliable hardware support.

[0066] Step S30: Perform pixel charging on each of the high-temperature sub-regions according to the preset interleaved scanning sequence.

[0067] In this embodiment, an independent scanning timing channel is configured for each high-temperature sub-zone according to a preset interleaved scanning sequence, so as to charge the pixels of each high-temperature sub-zone. This allows the activation time of adjacent high-temperature sub-zones to be staggered by the preset interleaved scanning sequence, so that the load of the source output channel 11 of the display driver chip 10 is evenly distributed throughout the entire scanning cycle. This effectively avoids the current peak caused by multiple high-temperature sub-zones charging at the same time, and thus the peak power consumption time of the display driver chip 10 is evenly distributed. This achieves real-time suppression and active balancing of peak power consumption in high-temperature zones, and realizes efficient temperature balance control while maintaining display quality.

[0068] Furthermore, in some other feasible embodiments, the above step S10: performing pixel charging on each of the high-temperature sub-regions according to a preset interleaved scanning sequence may also include the following implementation steps S101 to S103.

[0069] Step S101: Construct a sub-partition array with i rows and j columns based on all the high-temperature sub-partitions, where i is a positive even number and j is a positive integer.

[0070] In this embodiment, since the sub-partition array is an array structure composed of i rows and j columns of high-temperature sub-partitions, a hardware control architecture that perfectly matches the interleaved scanning signals (i.e., the first scanning signal STV1 and the second scanning signal STV2) is established by limiting i to a positive even number. This allows the first scanning signal STV1 and the second scanning signal STV2 to each bear half of the total number of pixel rows in the high-temperature partition, thereby reducing the number of simultaneously activated pixel rows to 50% of the traditional progressive scan. Next, based on the preset current peak formula, it is known that the peak current of the display driver chip 10 charging a single pixel unit 20 is positively correlated with the number of simultaneously activated pixel rows. When the number of simultaneously activated pixel rows is significantly reduced, the peak current of the display driver chip 10 charging a single pixel unit 20 is also effectively reduced. Next, according to the preset chip temperature rise algorithm, it is known that the peak current is positively correlated with the peak current. When the peak current of the display driver chip 10 charging a single pixel unit 20 decreases, the chip temperature rise of the display driver chip 10 is also effectively reduced, thereby achieving effective heat dissipation of the display driver chip 10.

[0071] It should be noted that the expression for the peak current formula is as follows: ,in, This indicates the peak current that the display driver chip 10 charges into a single pixel unit 20; This indicates the pixel capacitance of a single pixel unit 20; This indicates the voltage change when the display driver chip 10 charges / discharges the pixel capacitor of a single pixel unit 20; Indicates the row scan time; This indicates the number of pixel rows that are active simultaneously.

[0072] The expression for the chip temperature rise algorithm is: ;in, This indicates the temperature rise of the display driver chip 10; This indicates the thermal resistance of the display driver chip 10. This indicates the on-resistance of the output stage of the display driver chip 10.

[0073] Step S102: Drive the current odd row and the current even row adjacent to the current odd row to perform pixel charging according to the preset interlaced scanning timing.

[0074] In this embodiment, the first scan signal STV1 and the second scan signal STV2 are enabled according to... Figure 5 The interleaved scanning timing shown drives pixel charging in both the current odd-numbered row and the adjacent even-numbered row, achieving a dual-row collaborative power-sharing mechanism, thereby reducing power consumption. Figure 6 The peak current of the single scan signal STV0, shown in (a) in the figure, which is progressively scanned into a single pixel unit 20, is decomposed into... Figure 6 The two current peaks with halved amplitudes shown in (b) effectively improve the instantaneous power consumption and temperature rise of the display driver chip 10.

[0075] It should be noted that the single scan signal STV0 can be in the form where the first scan signal STV1 is equal to the second scan signal STV2.

[0076] Step S103: Take the next odd partition row of the current odd row as the next current odd row, and return to execute the step of driving the current odd row and the current even row adjacent to the current odd row to perform pixel charging according to the preset interlaced scanning timing, until all partition rows in the sub-partition array have completed pixel charging.

[0077] In this embodiment, the next odd-numbered partition row of the current odd-numbered row is taken as the next current odd-numbered row, and the process returns to execute the step of driving the current odd-numbered row and the current even-numbered row adjacent to the current odd-numbered row to perform pixel charging according to the preset interlaced scanning timing, until all partition rows in the sub-partition array have completed pixel charging. That is, the entire high-temperature partition is traversed and scanned through this interlaced scanning timing, which effectively reduces the peak power consumption of the entire high-temperature partition, thereby reducing the instantaneous thermal load of the display driver chip 10 in the high-temperature partition, and thus effectively reducing the peak junction temperature of the display driver chip 10, realizing the automatic control of the temperature balance of the display driver chip 10.

[0078] Furthermore, in some feasible embodiments, the above step S102: driving the current odd row and the current even row adjacent to the current odd row to perform pixel charging according to the preset interlaced scanning timing may also include the following implementation steps S1021 to S1024.

[0079] Step S1021: In response to a preset interleaved scanning timing, determine the first scan signal STV1 that drives the current odd row and the second scan signal STV2 that drives the current even row; In this embodiment, in response to the preset interlaced scanning timing, the first scanning signal STV1 driving the current odd row and the second scanning signal STV2 driving the current even row can be accurately obtained. This allows the scanning load to be evenly distributed to two independent timing channels, making the scanning load rate of a single timing channel only half that of the progressive scanning method. It also provides a precise timing control basis for the subsequent collaborative pixel charging of the current odd row and the adjacent current even row.

[0080] Step S1022: Activate the target sub-partition of the current odd row to access the pixel data voltage and charge the pixel according to the first scanning signal STV1. The target sub-partition is the high-temperature sub-partition that is scanned first among all the high-temperature sub-partitions in the current odd row. Step S1023: After enabling the second scan signal STV2 to delay for a preset reference time delay, activate the single-column output channel group that outputs the pixel data voltage in the high-temperature sub-partition in the current even row that is in the same column as the target sub-partition to charge the pixel.

[0081] In this embodiment, refer to Figure 5 When the first scan signal STV1 activates the target sub-partition in the current odd-numbered row to charge the pixel data voltage, after a preset reference delay t, the second scan signal STV2 is enabled to activate the high-temperature sub-partition in the current even-numbered row that is in the same column as the target sub-partition to charge the pixel data voltage via a single-column output channel group. This delayed activation mechanism achieves efficient multiplexing of the single-column output channel group connected to the target sub-partition by the high-temperature sub-partition in the same column but different row as the target sub-partition in the time dimension. This single-column output channel group is composed of columns from the target sub-partition. The pixel unit 20 is electrically connected to the source output channel 11, which constitutes a channel set. The thermal resistance of the display driver chip 10 refers to the sum of the path impedances from the simultaneously activated data lines Si to the pixel unit 20. This application reduces the number of simultaneously working source output channels from all source output channels opened in the progressive scan mode to only the number of source output channels corresponding to a single column output channel group by using the interleaved scanning timing. This can significantly reduce the thermal resistance value of the display driver chip 10, thereby effectively suppressing the temperature rise of the display driver chip 10 and ensuring the normal operation of the display driver chip 10.

[0082] Step S1024: Take the next high-temperature sub-partition of the target sub-partition as the next target sub-partition, return to the step of activating the target sub-partition of the current odd row to access the pixel data voltage for pixel charging according to the first scan signal STV1, and the subsequent steps, until all the high-temperature sub-partitions in the current odd row and the current even row have completed pixel charging.

[0083] In this embodiment, the next high-temperature sub-partition of the target sub-partition is taken as the next target sub-partition. The process returns to the step of activating the target sub-partition of the current odd-numbered row to access the pixel data voltage for pixel charging according to the first scan signal STV1, and the subsequent steps, until all high-temperature sub-partitions in the current odd-numbered row and all high-temperature sub-partitions in the current even-numbered row have completed pixel charging. That is, by using this interleaved scanning timing, all high-temperature sub-partitions in each partition row of the high-temperature partition are traversed and scanned, which effectively reduces the peak power consumption of the entire high-temperature partition and significantly reduces the instantaneous thermal load of the display driver chip 10 in the high-temperature partition. This effectively reduces the peak junction temperature of the display driver chip 10 and realizes the automatic control of the temperature balance of the display driver chip 10.

[0084] In a specific embodiment, Figures 5 to 6 The data1 shown is the pixel data voltage output from single-column output channel group 1. Figures 5 to 6 The data2 shown is the pixel data voltage output from single-column output channel group 2. Figures 5 to 6 The data3 shown is the pixel data voltage output from single-column output channel group 1. Figure 5 The interleaved scan timing pairs shown Figure 7 The timing scan steps for pixel charging in the 2-row, 3-column sub-partition array (i.e., high-temperature sub-partition 1 to high-temperature sub-partition 6) shown may include steps S1 to S6.

[0085] Step S1: The first scanning signal STV1 is pulled high to scan the high temperature sub-section 1, enabling the high temperature sub-section 1 to connect to the data1 output by the single column output channel group 1 for pixel charging, thereby realizing the pixel display of the high temperature sub-section 1. Step S2: After a preset reference delay t, the second scanning signal STV2 is pulled high to scan the high-temperature sub-section 4, enabling the high-temperature sub-section 4 to connect to the data1 output by the single column output channel group 1 for pixel charging, thereby realizing the pixel display of the high-temperature sub-section 4. Step S3: After completing the pixel charging of the high-temperature sub-section 4, the first scanning signal STV1 is pulled high again to scan the high-temperature sub-section 2, enabling the high-temperature sub-section 2 to connect to the data2 output by the single column output channel group 2 for pixel charging, thereby realizing the pixel display of the high-temperature sub-section 2. Step S4: After a preset reference delay t, the second scanning signal STV2 is pulled high to scan the high-temperature sub-partition 5, enabling the high-temperature sub-partition 5 to connect to the data2 output by the single-column output channel group 2 for pixel charging, thereby realizing the pixel display of the high-temperature sub-partition 5. Step S5: After completing the pixel charging of the high-temperature sub-section 5, the first scanning signal STV1 is pulled high again to scan the high-temperature sub-section 3, enabling the high-temperature sub-section 3 to connect to the data3 output by the single column output channel group 3 for pixel charging, thereby realizing the pixel display of the high-temperature sub-section 3. Step S6: After a preset reference delay t, the second scanning signal STV2 is pulled high to scan the high-temperature sub-section 6, enabling the high-temperature sub-section 6 to connect to the data2 output by the single-column output channel group 3 for pixel charging, thereby realizing the pixel display of the high-temperature sub-section 6.

[0086] Furthermore, in some other feasible embodiments, in step S20 above: determining the high-temperature zone based on the zone temperature threshold and the preset high-temperature limit threshold, the previous temperature control method may also include the following implementation steps A10 to A20.

[0087] Step A10: Check whether the partition temperature threshold of each initial partition exceeds the preset high temperature limit threshold.

[0088] In this embodiment, the temperature threshold of each initial partition is checked one by one to see if it exceeds the preset high temperature limit threshold. The comparison results between the temperature threshold of each initial partition and the high temperature limit threshold can provide a visual comparison result for the subsequent determination of high temperature partitions.

[0089] In a specific embodiment, refer to Figure 8 The system determines the partition temperature threshold for each initial partition and checks whether the partition temperature threshold of each initial partition exceeds a preset high-temperature limit threshold. If any partition temperature threshold exceeds the high-temperature limit threshold, the initial partition with the partition temperature threshold exceeding the high-temperature limit threshold is determined as a high-temperature partition, and the first scan signal STV1 and the second scan signal STV2 are activated according to the specified parameters. Figure 5 The interleaved scanning timing shown only performs cross-scanning on the high-temperature zones that need cooling, thereby maintaining the stability of the entire pixel array display performance while achieving the best heat dissipation effect.

[0090] Step A20: If there is an initial partition whose partition temperature threshold does not exceed the high temperature limit threshold, determine the initial partition whose partition temperature threshold does not exceed the high temperature limit threshold as a low temperature partition, and perform pixel charging on the low temperature partition according to the preset line-by-line scanning timing.

[0091] In this embodiment, refer to Figure 8 If there is a partition temperature threshold that does not exceed the high temperature limit threshold, the initial partition with the partition temperature threshold that does not exceed the high temperature limit threshold is determined as the low temperature partition, and the line-by-line scanning sequence is maintained. That is, the single scan signal STV0 is activated to scan all pixel rows in the low temperature partition line by line. By avoiding unnecessary interleaved scanning of the low temperature partition, the display quality loss caused by over-optimization is eliminated, and the optimal balance between energy efficiency and display quality is achieved.

[0092] In summary, the display driving circuit of this application integrates a temperature sensing module 30, a display driving chip 10, and a pixel array, enabling automated temperature equalization control of the display driving chip 10 while ensuring display quality. Specifically, the pixel array includes pixel units 20 distributed in an array, and the temperature sensing module 30 includes thermoelectric sensing units 31 corresponding to each pixel unit 20. Since each thermoelectric sensing unit 31 is located on the temperature sensing layer of the corresponding pixel unit 20, the temperature sensing module 30 can collect the real-time pixel temperature of the corresponding pixel unit 20 through each thermoelectric sensing unit 31. Furthermore, since the thermoelectric sensing units 31 in the same column are electrically connected to the display driving chip 10 through the same data line Si, the real-time pixel temperature collected by each thermoelectric sensing unit 31 can be transmitted to the display driving chip 10, providing accurate and reliable temperature sampling basis for the display driving chip 10 to dynamically partition and control high-temperature areas. Next, the display driving chip 10 obtains multiple initial partitions of the pixel array, and based on the real-time pixel temperatures sent by all thermoelectric sensing units 31, the partition temperature threshold of each initial partition can be accurately obtained, providing a judgment basis for subsequent high-temperature partition identification. Subsequently... The display driver chip 10 compares the partition temperature threshold of each initial partition with a preset high-temperature limit threshold, thereby automatically and quickly identifying the initial partitions whose partition temperature threshold exceeds the high-temperature limit threshold as high-temperature partitions. Next, the high-temperature partitions are automatically split into smaller high-temperature sub-partitions to achieve precise partitioning of the high-temperature partitions, providing an accurate and reliable control basis for subsequent timing optimization of the high-temperature partitions. Subsequently, the display driver chip 10 charges the pixels of each high-temperature sub-partition according to a preset interleaved scanning sequence, which can automatically and quickly stagger the scanning start time of adjacent high-temperature sub-partitions, so that the peak power consumption time of the display driver chip 10 is evenly distributed, realizing the instant suppression and active balancing of the peak power consumption of the high-temperature partitions. This effectively avoids the cost increase and display performance loss caused by traditional solutions that rely on adding heat sinks or reducing driving voltage. Thus, while ensuring display quality, the display driver chip 10 achieves automated control of temperature balance.

[0093] In addition, to achieve the above objectives, this application also provides a display panel, the display panel including a timing control module and a display driving circuit as described in any of the above claims; The pixel array in the display driving circuit is disposed in the display area of ​​the display panel; The timing control module and the display driver chip in the display driver circuit are respectively disposed on a circuit board electrically connected to the display panel, and the timing control module is electrically connected to the display driver chip; The timing control module is configured to provide the display driver chip with a preset interlaced scanning timing sequence and / or a preset progressive scanning timing sequence, control the display driver chip to charge pixels in each high-temperature sub-zone according to the interlaced scanning timing sequence, and / or control the display driver chip to charge pixels in the low-temperature sub-zone according to the progressive scanning timing sequence.

[0094] In addition, this application also provides a display device. Please refer to... Figure 9 , Figure 9 This is a schematic diagram of the display device involved in the embodiments of this application. Specifically, the display device in the embodiments of this application may be a device that locally operates a temperature control method.

[0095] The display device includes a display panel and a display driving circuit as described in any of the preceding claims. The display panel is electrically connected to the display driving circuit. The display device is configured to drive the display panel to display the abnormal warning information when the display driving circuit sends an abnormal voltage type abnormal warning information to the display panel. The display device also includes a memory, a processor, and a temperature control program stored in the memory and executable on the processor. When the processor executes the temperature control program, it implements the steps of the temperature control method as described in any of the preceding claims.

[0096] like Figure 9 As shown, the display device in this embodiment may include: a display panel, a display driving circuit electrically connected to the display panel, and a processor 1001, such as a CPU, a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen and an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0097] The memory 1005 is disposed on the main body of the display device. The memory 1005 stores a program that performs corresponding operations when executed by the processor 1001. The memory 1005 is also used to store parameters used by the display device. The memory 1005 can be a high-speed RAM or a stable, non-volatile memory, such as a disk drive. Optionally, the memory 1005 can also be a storage device independent of the aforementioned processor 1001.

[0098] Those skilled in the art will understand that Figure 9 The display device structure shown does not constitute a limitation on the display device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0099] like Figure 9 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and a temperature control program.

[0100] exist Figure 9 In the display device shown, the processor 1001 can be used to call the temperature control program stored in the memory 1005 and execute the steps of the temperature control method as described above.

[0101] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0102] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0103] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a display device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0104] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display driving circuit, characterized in that, The display driving circuit includes: Display driver chip; A pixel array, the pixel array comprising pixel units distributed in an array; The temperature sensing module includes a thermoelectric sensing unit corresponding to each pixel unit. Each thermoelectric sensing unit is disposed on the temperature sensing layer of the corresponding pixel unit. Each thermoelectric sensing unit in the same column is electrically connected to the display driver chip through the same data line. The temperature sensing module is configured to obtain the real-time pixel temperature of the corresponding pixel unit through each thermoelectric sensing unit. The display driver chip is configured to acquire multiple initial partitions of the pixel array, determine the partition temperature threshold of each initial partition based on the real-time pixel temperature, determine a high-temperature partition based on the partition temperature threshold and a preset high-temperature limit threshold, divide the high-temperature partition into multiple high-temperature sub-partitions, and perform pixel charging on each high-temperature sub-partition according to a preset interleaved scanning sequence. The high-temperature partition is the initial partition whose partition temperature threshold exceeds the high-temperature limit threshold.

2. The display driving circuit as described in claim 1, characterized in that, The temperature sensing module also includes a temperature acquisition unit corresponding to each of the data lines. Each of the temperature acquisition units is disposed between the corresponding data line and the display driver chip. The display driver chip includes multiple source output channels arranged with gold finger spacing. The temperature acquisition unit's acquisition input terminal is electrically connected to the corresponding data line of each thermoelectric sensing unit, and the temperature acquisition unit's acquisition output terminal is electrically connected to the corresponding source output channel. The temperature acquisition unit is configured to acquire the thermoelectric signals output by each thermoelectric sensing unit on the corresponding data line in a row-by-row scanning order to obtain the real-time pixel temperature of the corresponding pixel unit.

3. The display driving circuit as described in claim 1, characterized in that, The pixel unit includes: An enable control layer is provided, wherein a scan switch transistor is provided, the gate of the scan switch transistor is electrically connected to the scan line of the corresponding row, and the first path terminal of the scan switch transistor is electrically connected to the data line of the corresponding column. A thermistor layer is disposed close to the enable control layer, and the thermoelectric sensing unit is disposed on the thermistor layer. The thermal junction of the thermoelectric sensing unit is connected to the second path terminal of the scanning switch tube. A pixel layer is disposed on the side of the thermosensitive layer away from the enable control layer. The pixel layer includes a pixel electrode, which is electrically connected to the cold junction of the thermoelectric sensing unit.

4. The display driving circuit as described in claim 3, characterized in that, The thermoelectric sensing unit includes a P-type semiconductor and an N-type semiconductor, wherein the P-type semiconductor and the N-type semiconductor are connected in series. The junction where the P-type semiconductor and the N-type semiconductor are interconnected forms the thermal junction of the thermoelectric sensing unit, and is electrically connected to the second path terminal of the scanning switch tube. The end of the N-type semiconductor furthest from the hot junction forms the cold junction of the thermoelectric sensing unit and is electrically connected to the pixel electrode.

5. A temperature control method for a display driving circuit, characterized in that, The temperature control method shall be provided in the display driving circuit according to any one of claims 1 to 4, and the temperature control method includes: After the temperature sensing module obtains the real-time pixel temperature of the corresponding pixel unit through each thermoelectric sensing unit, it obtains multiple initial partitions of the pixel array through the display driver chip, and determines the partition temperature threshold of each initial partition based on the real-time pixel temperature. A high-temperature zone is determined based on the partition temperature threshold and a preset high-temperature limit threshold, and the high-temperature zone is divided into multiple high-temperature sub-zones. The high-temperature zone is the initial zone where the partition temperature threshold exceeds the high-temperature limit threshold. Each high-temperature sub-region is charged pixel by pixel according to a preset interleaved scanning sequence.

6. The temperature control method as described in claim 5, characterized in that, The step of charging pixels in each of the high-temperature sub-regions according to a preset interleaved scanning sequence includes: Construct a sub-partition array with i rows and j columns based on all the high-temperature sub-partitions, where i is a positive even number and j is a positive integer; The current odd row and the current even row adjacent to the current odd row are driven to charge pixels according to the preset interleaved scanning timing. The next odd-numbered partition row of the current odd-numbered row is taken as the next current odd-numbered row, and the process of driving the current odd-numbered row and the current even-numbered row adjacent to the current odd-numbered row to perform pixel charging according to the preset interleaved scanning timing is repeated until all partition rows in the sub-partition array have completed pixel charging.

7. The temperature control method as described in claim 6, characterized in that, The step of driving the current odd-numbered row and the current even-numbered row adjacent to the current odd-numbered row to charge pixels according to a preset interlaced scanning timing includes: In response to a preset interleaved scanning timing, a first scan signal driving the current odd-numbered row and a second scan signal driving the current even-numbered row are determined; The target sub-partition of the current odd-numbered row is activated to access the pixel data voltage for pixel charging according to the first scanning signal. The target sub-partition is the high-temperature sub-partition that is scanned first among all the high-temperature sub-partitions in the current odd-numbered row. After enabling the second scan signal to delay the preset reference time delay, the high-temperature sub-partition in the current even row that is in the same column as the target sub-partition is activated to charge the pixel by electrically connecting the single-column output channel group that outputs the pixel data voltage. Take the next high-temperature sub-partition of the target sub-partition as the next target sub-partition, and return to execute the step of activating the target sub-partition of the current odd row to access the pixel data voltage for pixel charging according to the first scan signal, and the subsequent steps, until all the high-temperature sub-partitions in the current odd row and the current even row have completed pixel charging.

8. The temperature control method as described in claim 5, characterized in that, Before the step of determining the high-temperature zone based on the zone temperature threshold and the preset high-temperature limit threshold, the temperature control method includes: Check each initial partition's partition temperature threshold to see if it exceeds a preset high-temperature limit threshold; If there is an initial partition whose partition temperature threshold does not exceed the high temperature limit threshold, the initial partition whose partition temperature threshold does not exceed the high temperature limit threshold is determined as a low temperature partition, and the low temperature partition is charged with pixels according to the preset line-by-line scanning timing.

9. A display panel, characterized in that, The display panel includes a timing control module and a display driving circuit as described in any one of claims 1 to 4; The pixel array in the display driving circuit is disposed in the display area of ​​the display panel; The timing control module and the display driver chip in the display driver circuit are respectively disposed on a circuit board electrically connected to the display panel, and the timing control module is electrically connected to the display driver chip; The timing control module is configured to provide the display driver chip with a preset interlaced scanning timing sequence and / or a preset progressive scanning timing sequence, control the display driver chip to charge pixels in each high-temperature sub-zone according to the interlaced scanning timing sequence, and / or control the display driver chip to charge pixels in the low-temperature sub-zone according to the progressive scanning timing sequence.

10. A display device, characterized in that, The display device includes the display panel as described in claim 9, a memory, a processor, and a temperature control program stored in the memory and executable on the processor, wherein the processor, when executing the temperature control program, implements the steps of the temperature control method as described in any one of claims 5 to 8.

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