Use of a semi-aromatic asymmetric polyimide film material
By introducing asymmetric diamine units into polyimide film materials to adjust the conformation, the problem of insufficient thermal stability of polymer dielectrics at high temperatures is solved, achieving high energy density and high efficiency energy storage performance, which is suitable for new energy vehicles, aerospace and deep space exploration systems.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CENT SOUTH UNIV
- Filing Date
- 2026-04-03
- Publication Date
- 2026-05-29
AI Technical Summary
Existing polymer dielectrics have insufficient thermal stability at high temperatures, resulting in a decrease in dielectric insulation and mechanical strength, making it difficult to meet the stable operation requirements of high-temperature and high-field scenarios such as new energy vehicles, advanced power electronics, and aerospace.
By using semi-aromatic asymmetric polyimide thin film materials, the conformation is adjusted by introducing asymmetric diamine units into the main chain, which suppresses carrier migration and reduces leakage current. The prepared thin film materials can maintain high energy storage density and high efficiency at temperatures above 200°C.
At 200℃ and 250℃, the discharge energy density reaches 8.34 Jcm-3 and 5.38 Jcm-3 respectively, and the charge and discharge efficiency is higher than 90%, meeting the high energy density and high efficiency energy storage requirements of the next generation of power electronics, aerospace and deep space exploration systems.
Smart Images
Figure CN122103568A_ABST