An electroplating method and an electroplating apparatus

Abstract

This invention relates to the field of electroplating technology, and more particularly to an electroplating method and an electroplating apparatus. An electroplating method includes: immersing an object in an electroplating tank via an electroplating rack, wherein the electroplating rack rotates within the electroplating tank and agitates the electroplating solution. The electroplating rack of this invention can rotate during electroplating, providing a stirring effect and resulting in more uniform electroplating.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an electroplating method and an electroplating apparatus. Background Technology

[0002] When electroplating large objects, rack plating is generally used. Multiple objects are suspended by a rack, which is then immersed in the electroplating tank. The rack is connected to the cathode, and an electroplating film is formed on the surface of the object. However, during the electroplating process, the anolyte ions around the object are consumed quickly, resulting in a low concentration, while the concentration of anolyte ions in other locations is higher. If the electroplating solution in the electroplating tank is stirred, the concentration of anolyte ions can be effectively balanced, thus accelerating the electroplating process. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing an electroplating method that can accelerate the electroplating process and improve processing efficiency.

[0004] An electroplating method comprising: The object is immersed in the electroplating tank through an electroplating rack, which rotates and stirs the electroplating solution inside the tank.

[0005] Furthermore, the electroplating rack rotates clockwise and counterclockwise alternately.

[0006] An electroplating apparatus includes: an electroplating rack, the electroplating rack including a central connecting shell, a main connecting pipe rotatably connected to the central part of the connecting shell, the connecting shell being rotatable relative to the main connecting pipe, and the main connecting pipe communicating with the internal space of the connecting shell, a hollow main connecting ring provided on the outer side of the connecting shell, a plurality of intermediate connecting pipes provided on the inner side of the main connecting ring, the intermediate connecting pipes communicating with the internal space of the main connecting ring and the internal space of the connecting shell, and a plurality of lower connecting pipes connected to the lower end of the main connecting ring, the lower connecting pipes having a plurality of vent holes on their sides.

[0007] Furthermore, the lower end of the main connecting pipe is connected to a limiting seat, which is located below the connecting shell. The lower end of the main connecting pipe is provided with an airflow hole, which is located inside the connecting shell.

[0008] Furthermore, an air intake pipe is connected to the side of the main connecting pipe, and the upper end of the main connecting pipe is a blind end or connected with a plug.

[0009] Furthermore, the main connecting ring includes two hollow arc-shaped tubes, with one arc-shaped tube's two ends connected to the other arc-shaped tube's two ends via connecting blocks; the middle part of the arc-shaped tube is connected and communicates with the connecting shell via an intermediate connecting tube; the connecting shell includes a bottom shell and a top cover, with a central ring in the middle of the bottom shell, and two partitions between the central ring and the inner surface of the connecting shell, the two partitions being located at the two ends of the central ring and dividing the interior of the connecting shell into a clockwise space and a counterclockwise space, with the two intermediate connecting tubes communicating with the clockwise space and the counterclockwise space respectively; the lower ends of both sides of the central ring are respectively provided with clockwise arc-shaped grooves and counterclockwise arc-shaped grooves, with airflow holes communicating with the clockwise space and the counterclockwise space respectively through the clockwise arc-shaped grooves and the counterclockwise arc-shaped grooves; the lower connecting tube communicating with the clockwise space has air outlets arranged clockwise; the lower connecting tube communicating with the counterclockwise space has air outlets arranged counterclockwise.

[0010] Furthermore, the lower connecting pipe is connected to multiple hanging rings, and the hanging ring located at the lower left is a hollow structure with air holes on its outer side and lower end face.

[0011] The beneficial effects of the present invention are: the electroplating rack of the present invention can rotate during electroplating, which plays a stirring role and makes the electroplating more uniform. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of one structure of the electroplating rack in this embodiment.

[0013] Figure 2 for Figure 1 A schematic diagram of the structure with the top cover open.

[0014] The reference numerals in the figures include: 1—Intake pipe; 2—Intermediate connecting pipe; 3—Limiting seat; 4—Top cover; 5—Main connecting pipe; 6—Bottom shell; 7—Main connecting ring; 8—Exhaust hole; 9—Lower connecting pipe; 10—Hanging ring; 20—Connecting shell; 61—Central ring; 62—Clockwise space; 63—Partition block; 64—Counterclockwise arc groove; 65—Counterclockwise space; 71—Connecting block; 72—Arc tube. Detailed Implementation

[0015] The invention will now be described in detail with reference to the accompanying drawings. Figures 1 to 2 As shown.

[0016] Example 1: An electroplating method, comprising: The object is immersed in the electroplating tank through an electroplating rack, which rotates and stirs the electroplating solution inside the tank.

[0017] This technical solution directly rotates the electroplating rack, causing the electroplating solution to agitate, thus ensuring a roughly uniform distribution of the electroplating solution within the electroplating tank. The electroplating rack can be driven by a rotating mechanism or other structures.

[0018] Furthermore, the electroplating rack rotates clockwise and counterclockwise alternately.

[0019] To ensure more even mixing, alternate between clockwise and counterclockwise rotation.

[0020] Example 2: See Figure 1 , Figure 2 An electroplating apparatus includes: an electroplating frame, the electroplating frame including a central connecting shell 20, a main connecting pipe 5 rotatably connected to the central part of the connecting shell 20, the connecting shell 20 being rotatable relative to the main connecting pipe 5, and the main connecting pipe 5 communicating with the internal space of the connecting shell 20, a hollow main connecting ring 7 being provided on the outer side of the connecting shell 20, a plurality of intermediate connecting pipes 2 being provided on the inner side of the main connecting ring 7, the intermediate connecting pipes 2 communicating with the internal space of the main connecting ring 7 and the internal space of the connecting shell 20, and a plurality of lower connecting pipes 9 being connected to the lower end of the main connecting ring 7, and a plurality of air outlets 8 being provided on the side of the lower connecting pipes 9.

[0021] In this embodiment, the upper end of the connecting shell 20 has a connection port, which can be connected to the main connecting pipe 5 via a bearing, allowing the connecting shell 20 to rotate relative to the main connecting pipe 5. Secondly, the main connecting pipe 5 is connected to an external air source, and airflow enters the connecting shell 20 through the main connecting pipe 5. The connecting shell 20 is connected to the main connecting ring 7 via the intermediate connecting pipe 2, so airflow enters the main connecting ring 7 through the connecting shell 20 and the intermediate connecting pipe 2. The lower end of the main connecting ring 7 is connected to the lower connecting pipe 9, and airflow then enters the lower connecting pipe 9 and flows out from the air outlet 8 of the lower connecting pipe 9. When the airflow flows out of the lower connecting pipe 9, it drives the lower connecting pipe 9 to move, thereby driving the entire electroplating rack to rotate. It can be understood that, to facilitate the rotation of the electroplating rack, the air outlet 8 on the lower connecting pipe 9 is arranged clockwise or counterclockwise.

[0022] Furthermore, the lower end of the main connecting pipe 5 is connected to a limiting seat 3, which is located below the connecting shell 20. The lower end of the main connecting pipe 5 is provided with an airflow hole (not shown in the figure), which is located inside the connecting shell 20.

[0023] In the specific configuration, a vertical through hole is provided in the middle of the connecting shell 20, and the lower end of the main connecting pipe 5 passes through the vertical through hole and connects to the limiting seat 3. When connecting with the limiting seat 3, a threaded hole can be provided on the limiting seat 3, and an external thread can be provided on the lower end of the main connecting pipe 5, so as to connect by threaded connection. When the connecting shell 20 is connected with the main connecting pipe 5, a sealing ring can be provided in the vertical through hole to prevent gas leakage; the gas inside the main connecting pipe 5 enters the connecting shell 20 through the air flow hole.

[0024] Furthermore, an air inlet pipe 1 is connected to the side of the main connecting pipe 5, and the upper end of the main connecting pipe 5 is a blind end or connected with a plug.

[0025] In actual operation, the main connecting pipe 5 needs to drive the electroplating rack body below to move; the main connecting pipe 5 also serves the dual functions of gas supply and weight support. To simplify its function and avoid conflict, this embodiment provides an air inlet pipe 1 on the side of the main connecting pipe 5, allowing gas to be input from the side and avoiding interference with other structures. The air inlet pipe 1 can be connected to high-pressure gas cylinders, air compressors, etc.

[0026] Furthermore, the main connecting ring 7 includes two hollow arc-shaped tubes 72, with the two ends of one arc-shaped tube 72 connected to the two ends of the other arc-shaped tube 72 respectively via connecting blocks 71; the middle part of the arc-shaped tube 72 is connected and communicates with the connecting shell 20 via an intermediate connecting tube 2; the connecting shell 20 includes a bottom shell 6 and a top cover 4, with a central ring 61 in the middle of the bottom shell 6, and two partitions 63 between the central ring 61 and the inner surface of the connecting shell 20, the two partitions 63 being located at the two ends of the central ring 61 and dividing the interior of the connecting shell 20 into clockwise spaces. The central ring 61 has a clockwise arc groove and a counterclockwise arc groove 64 at its lower ends on both sides. The airflow holes are connected to the clockwise space 62 and the counterclockwise space 65 respectively through the clockwise arc groove and the counterclockwise arc groove 64. The lower connecting pipe 9 connected to the clockwise space 62 has an air outlet 8 that is set clockwise. The lower connecting pipe 9 connected to the counterclockwise space 65 has an air outlet 8 that is set counterclockwise.

[0027] When the electroplating rack rotates, if it rotates continuously clockwise or counterclockwise, the concentration of the electroplating solution inside will form a ring-shaped gradient. To make the stirring more uniform, this embodiment uses a combination of clockwise and counterclockwise rotation. During operation, the airflow enters the connecting shell 20 through the main connecting pipe 5. If the airflow enters the clockwise space 62 at this time, it will enter the corresponding lower connecting pipe 9 through the middle connecting pipe 2 and the arc-shaped pipe 72. The air outlet 8 of the lower connecting pipe 9 is set clockwise. After the airflow exits from the air outlet 8, it drives the electroplating rack to rotate counterclockwise. When the airflow hole moves relative to the clockwise arc groove until it enters the partition 63, the electroplating rack continues to rotate under the action of inertial force. The airflow hole slides past the partition 63 and aligns with the counterclockwise arc groove 64, allowing the airflow to enter the counterclockwise space 65. Then, it enters the corresponding lower connecting pipe 9 along the intermediate connecting pipe 2 and the arc-shaped pipe 72. The air outlet 8 of the lower connecting pipe 9 is set counterclockwise, and the airflow drives the electroplating rack to rotate clockwise. This process repeats.

[0028] Furthermore, the lower connecting pipe 9 is connected to multiple hanging rings 10. The hanging ring 10 located at the lower left is a hollow structure, and its outer side and lower end face are provided with lower air holes (not shown in the figure).

[0029] When venting through the vent 8, not only can the electroplating rack be driven to rotate, but the rising gas can also drive the stirring of the internal electroplating solution. In order to better drive the stirring of the electroplating solution, the structure of the lowest hanging ring 10 is improved in this embodiment. It is made into a hollow structure, and vent holes are provided on its outer side and lower end face. During operation, venting causes the electroplating solution to be stirred.

[0030] The above description is only a preferred embodiment of the invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the inventive concept. The content of this specification should not be construed as a limitation of the invention.

Claims

1. An electroplating method, characterized in that: It includes: The object is immersed in the electroplating tank through an electroplating rack, which rotates and stirs the electroplating solution inside the tank.

2. The electroplating method according to claim 1, characterized in that: The electroplating rack rotates clockwise and counterclockwise alternately.

3. An electroplating apparatus, comprising: An electroplating rack, characterized in that: the electroplating rack includes a central connecting shell, a main connecting pipe is rotatably connected to the central part of the connecting shell, the connecting shell can rotate relative to the main connecting pipe, and the main connecting pipe communicates with the internal space of the connecting shell, a hollow main connecting ring is provided on the outer side of the connecting shell, a plurality of intermediate connecting pipes are provided on the inner side of the main connecting ring, the intermediate connecting pipes communicate with the internal space of the main connecting ring and the internal space of the connecting shell, and a plurality of lower connecting pipes are connected to the lower end of the main connecting ring, and a plurality of air vents are provided on the side of the lower connecting pipes.

4. The electroplating apparatus according to claim 3, characterized in that: The lower end of the main connecting pipe is connected to a limiting seat, which is located below the connecting shell. The lower end of the main connecting pipe is provided with an airflow hole, which is located inside the connecting shell.

5. The electroplating apparatus according to claim 3, characterized in that: An air intake pipe is connected to the side of the main connecting pipe, and the upper end of the main connecting pipe is a blind end or connected to a plug.

6. The electroplating apparatus according to claim 4, characterized in that: The main connecting ring includes two hollow arc-shaped tubes, with one arc-shaped tube connected to the other arc-shaped tube at both ends via connecting blocks. The middle of the arc-shaped tube is connected to and communicates with the connecting shell via an intermediate connecting tube. The connecting shell includes a bottom shell and a top cover. A central ring is provided in the middle of the bottom shell. Two partitions are provided between the central ring and the inner side of the connecting shell. The two partitions are located at both ends of the central ring and divide the interior of the connecting shell into a clockwise space and a counterclockwise space. The two intermediate connecting tubes communicate with the clockwise space and the counterclockwise space, respectively. Clockwise arc-shaped grooves and counterclockwise arc-shaped grooves are provided at the lower ends of both sides of the central ring. Airflow holes communicate with the clockwise space and the counterclockwise space, respectively, via the clockwise arc-shaped grooves and the counterclockwise arc-shaped grooves. The lower connecting tube communicates with the clockwise space, and the air outlet on the lower connecting tube is arranged clockwise. The lower connecting tube communicates with the counterclockwise space, and the air outlet on the lower connecting tube is arranged counterclockwise.

7. The electroplating apparatus according to claim 6, characterized in that: The lower connecting pipe is connected to multiple hanging rings. The hanging ring located at the lower left is a hollow structure, and its outer side and lower end face are provided with air holes.

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